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We are looking for a junior Embedded Software Engineer, to join us in building the next generation of networking products. Youll have the opportunity to work on the technologies that power the worlds largest cloud provider, in a dynamic, open, fast-paced environment. Working for Annapurna Labs is thrilling and a constant learning experience. As an embedded SW development engineer, you will be responsible for developing features for Annapurna Labs next-generation hardware, to enable high network bandwidth and packets-per-seconds (PPS) performance, with consistently low latency. You will work to bring up a broad selection of instance types, optimized for various use cases, to suit each of our customers needs, such as varying combinations of CPU, memory, storage, and networking capabilities. As a SW development engineer, you will play a key role in shaping architecture definitions and SW system designs, and help to resolve complex customer issues. You will continuously evolve technically, while working to monitor AWS cloud health, maintain high quality standards, develop highly-optimized code, and provide exceptional customer satisfaction.

Key job responsibilities
We will be conducting a unique onboarding training program, where you will be studying the following with our technical experts and team leaders:
* Embedded systems basics.
* Annapurna technologies in EC2.
* Cloud compute development.
* Networking 101.

we are looking for a IC Package Design Engineer.
In this role, you will contribute to the development of complex ASIC package designs from early planning and exploration through implementation and tapeout. You will collaborate across package design, layout, SI/PI, and silicon teams to help deliver high‑speed, robust, and manufacturable package solutions.
You will participate in package architecture activities, design tradeoff discussions, and technical problem solving while growing your expertise in advanced packaging technologies and system-level integration. This role provides an opportunity to work on some of the most advanced networking silicon products in the industry within a highly collaborative engineering environment.
Responsibilities:
As a member of the Package Design team, you will:
Lead the package design activities including planning, floorplanning, pinout optimization, stack‑up definition, and high‑speed routing suport.
Collaborate with SI/PI, silicon floorplanning, layout, and manufacturing teams to ensure high‑quality package solutions.
Support package implementation activities and work closely with layout designers to ensure alignment between design intent and physical implementation.
Participate in technical investigations, design reviews, and tradeoff discussions involving performance, manufacturability, and schedule considerations.
Assist in developing and improving package design methodologies, flows, and best practices.
Contribute to debugging, issue resolution, and package bring‑up activities as needed.

We are looking for exceptional engineers to join the top-tier team developing the next generation semiconductor platform based on a revolutionary architecture. You will participate in design activities, working on the next generation of our products.

As a Chip Design Engineer and a member of the Nitro project, you will have an impact over the device through its entire lifecycle, from the product definition stage to mass production. You will work in close collaboration with multiple groups, including Architecture, Software, Verification, Backend, and DFT.

Key job responsibilities:
* Full ownership of one or more IPs within the product:
-Micro-architecture.
-RTL coding and debug.
-Synthesis and timing closure.
-Sign-off.
* Supporting the Verification and Emulation teams: Test plan, Coverage review.
* Ensuring that the chip meets quality and reliability standards.
* Collaborating with cross-functional teams, including Product Definition, Verification, Software, and Physical design.

we are looking for a ASIC Engineer.
Your Impact:
Review micro-architecture specifications
Implement Verification environment UVM based
Collaborate with Design engineers to resolve bugs and achieve coverage closure
Work with the firmware/Lab teams to verify chip flows
Perform debug, root-cause analysis, and post-silicon validation in the lab

Required Power Supply Expert
About the Role
Get a deep understanding and perfect knowledge of the project documentation, especially about the Power Supply system (High Voltage substations, Medium Voltage distribution network, Traction power simulation, Traction and Auxiliary substations) and the interfaced systems: Requirements (MDSM, Owner Requirements, Project Program), Interfaces & integration (NSA), and lists of Deliverables & Tasks (DTG).
Be able to verify the Design that the designers, called Line Managers (LM) will submit, to answer to their questions and to analyze their proposals.
Provide technical, and program feedback and advice on challenges, possible areas of improvement as well as possible alternatives, innovations.
Provide analyses of the LM designs and change proposals to perform Multiple Criteria Analyses to justify decisions for accepting or rejection.
Be able to decide to apply one LM proposal to the other lines for uniformity of the metro network, leading to reduce costs (for construction, integration, operation), to improve operation, make maintenance easier, or to enhance reliability, availability, and safety.
Carry out the studies to change some points of the metro tender documents and manage the LM to apply them.
Coordinate with the other technical disciplines (Rail Systems, CW, external stakeholders) for interfaces and be able to provide all required information for the success of the integration, Testing & Commissioning to get approval on power Supply and lead to the metro operation.
Serve as the Programs technical, process and professional expert on behalf of the Client, to make engineering decisions, accept design proposals or technical solutions, make recommendations, resolve technical clashes, etc., instruct and monitor the implementation and adherence to the Client Metro Network (MN) Power Supply documentation by Metro Line managers/designers and relevant Program participants.
Support, as necessary, the Client in providing technical support in relation to the management of Program statutory approval of designs.
Develop, when needed to be designed/procured at Network Level, the power Supply Programs reference design and/or performance specifications.

we are establishing a strategic R&D center in Israel to drive the development of complex semiconductor chips that solve the critical 'data bottlenecks' enabling the future of AI at scale. As we expand our presence in Israel, we're seeking a visionary DFT Engineer to help build our local engineering powerhouse from the ground up. This is a unique opportunity to take on meaningful product ownership in a new site, ensuring the reliability and testability of chips that power the world's largest AI clusters.
As a DFT Engineer at our company, you will be at the intersection of architecture, design, and production. You won't just run tools-you will be a foundational member of the team responsible for the entire lifecycle of our silicon's reliability. From defining initial DFT architecture to supporting post-silicon bring-up, your work ensures that the backbone of AI infrastructure connectivity is flawless and scalable. If you thrive on solving complex challenges in deep-submicron processes and want to establish world-class DFT methodologies, this is your opportunity.
Key Responsibilities
DFT Architecture & Strategy
Be part of the DFT journey from high-level architecture definition and RTL design to backend implementation and post-production support
Develop comprehensive Design-for-Testability (DFT) strategies for next-generation connectivity platforms, ensuring chips meet the highest quality standards
Design and implement DFT architectures including JTAG/iJTAG, MBIST, Scan, and ATPG for high-end devices
Test Pattern Development & Optimization
Generate and optimize high-quality test and debug patterns for production
Perform Static Timing Analysis (STA) for DFT modes and conduct gate-level simulations to ensure robust performance
Drive test coverage and quality metrics to meet stringent manufacturing requirements
Cross-Functional Collaboration & Methodology Innovation
Act as a multidisciplinary bridge, collaborating closely with Architecture, Verification, and Backend teams to ensure seamless integration and optimal QoR
Participate in developing and maintaining cutting-edge DFT implementation flows
Automate and improve methodologies using advanced scripting and tools.

We are a global leader in LiDAR technology. Beyond automotive, we provide off-the-shelf LiDAR solutions for defense and homeland security, intelligent traffic management, mobility, robotics, and aerial applications. The ATE Systems Group leads the development of complex, multi-disciplinary capital equipment (software, hardware, optics, mechanics), automated machines designed for the calibration, testing and production of the cutting-edge LiDAR technology.
We are looking for a hands-on ATE system Technician to join our team.
As part of the team, youll:
* Bring-up multi-disciplinary setups & testers.
* Execute complex system integration testing and experiments.
* Support testing a variety of company's products.
* Tester validation, verification, qualification, and certification.
* Interact with multi-disciplinary systems and teams.
* Write documentation, TEST plans, and results (English).
Sub Department:
ATE
City:
Rosh HaAyin

we are establishing a strategic R&D center in Israel to drive the development of complex semiconductor chips that solve the critical 'data bottlenecks' enabling the future of AI at scale. As we expand our presence in Israel, we're seeking a visionary Expert IC Package Design Lead to help build our local engineering powerhouse from the ground up. This is a unique opportunity to take on meaningful product ownership in a new site, leading the physical implementation strategy for chips that power the world's largest AI clusters.
As an Expert IC Package Design Lead, you will be a core technical contributor in the development of advanced IC packaging solutions for high-performance connectivity silicon.
You will own package flow, architecture, design, and qualification from concept through production, working closely with silicon, signal integrity, power integrity, mechanical, manufacturing, and external OSAT partners.You will be responsible for defining package technologies that meet aggressive electrical, thermal, mechanical, and cost targets, enabling our companys products to operate reliably in the worlds most demanding AI and cloud environments.
Key Responsibilities
Own end-to-end IC package design, from early architecture and feasibility through detailed design, qualification, and high-volume manufacturing
Define package architecture and technology selection (organic substrates, advanced laminate, interposers, multi-die/chiplet packaging, CoWoS - 2.5D/3D integration)
Lead signal integrity (SI), power integrity (PI), and thermal considerations at the package level for high-speed, high-power devices
Drive package layout, substrate routing, bump/ball maps, stack-ups, materials selection, and mechanical constraints
Collaborate closely with silicon design, SerDes, system, SI/PI, and reliability teams to optimize overall product performance
Interface with OSATs, substrate vendors, and manufacturing partners to ensure design-for-manufacturability (DFM), yield, and cost targets
Lead package-related risk assessment, failure analysis, and corrective actions during bring-up and production ramp
Support NPI, qualification, and product sustainment activities, including vendor audits and technical reviews.

we are establishing a strategic R&D center in Israel to drive the development of complex semiconductor chips that solve the critical 'data bottlenecks' enabling the future of AI at scale. As we expand our presence in Israel, we're seeking a talented Junior ASIC Design Engineer to help build our local engineering powerhouse from the ground up. This is an exciting opportunity to take on meaningful product ownership in a new site, designing the digital blocks that sit at the heart of our most ambitious connectivity projects.
As a Junior ASIC Design Engineer, you won't just build chips - you will be part of a team defining the next generation of AI infrastructure main components. The complex digital blocks under your micro-architecture and implementation responsibilities will power the world's largest AI clusters. You will own the journey from high-level definition through RTL implementation and backend support, transforming complex logic challenges into elegant, high-performance hardware. If you thrive on solving challenging problems in deep-submicron processes and want to contribute to the digital design foundation for AI infrastructure connectivity, this is your opportunity.
Key Responsibilities
Design Ownership & Implementation
Own the journey from high-level definition through micro-architecture, coding, and debug to backend implementation support
Tackle complex logic challenges and transform them into elegant, high-performance hardware solutions
Serve as the point of contact for your logic blocks, interacting with Architecture, Verification, and Backend teams
Quality Assurance & Design Optimization
Utilize industry-leading EDA tools (Lint, CDC, Synthesis, Timing, Power) and in-house quality assurance tools to ensure designs are robust, scalable, and power-efficient
Apply design techniques to meet PPA (Power, Performance, Area) targets
Contribute to design quality through verification and validation activities
Methodology Innovation & Collaboration
Participate in design methodology improvements and tool automation initiatives
Leverage AI assistance tools and contribute to in-house automation development to make engineering workflows faster and smarter
Collaborate effectively across teams to ensure seamless integration.

we are establishing a strategic R&D center in Israel to drive the development of complex semiconductor chips that solve the critical 'data bottlenecks' enabling the future of AI at scale. As we expand our presence in Israel, we're seeking a talented Junior Design Verification Engineer to help build our local engineering powerhouse from the ground up. This is an exciting opportunity to take on meaningful ownership in a new site, developing the verification environments that ensure our next-generation AI silicon performs flawlessly.
As a Junior Design Verification Engineer, you will be a vital contributor to the quality and reliability of our Israel R&D center. You will work on the front lines of functional verification, developing testbenches and environments that validate high-performance digital blocks, subsystems, and full-chip designs. You will tackle complex verification challenges that ensure our connectivity solutions meet the rigorous demands of the world's largest AI clusters. If you thrive on solving technical puzzles and want to play a key role in delivering cutting-edge AI infrastructure connectivity, this is your opportunity.
Key Responsibilities
Verification Environment Development
Contribute to the design and development of ASIC verification environments, focusing on unit-level and subsystem functional blocks
Develop and maintain SystemVerilog/UVM-based components including traffic generators, monitors, and checkers to ensure robust testing
Execute detailed verification plans for challenging digital designs, ensuring all functional requirements are met and verified
Coverage & Quality Assurance
Implement functional coverage models and analyze results to identify gaps in the verification process
Drive designs toward 100% verification closure through comprehensive test development
Contribute to verification methodology improvements and best practices
Debug & Cross-Functional Collaboration
Work closely with design engineers to identify, root-cause, and resolve complex hardware bugs early in the development cycle
Apply analytical skills and debugging techniques to solve intricate verification challenges
Collaborate effectively in a fast-paced, team-oriented R&D environment.

we are establishing a strategic R&D center in Israel to drive the development of complex semiconductor chips that solve the critical 'data bottlenecks' enabling the future of AI at scale. As we expand our presence in Israel, we're seeking a visionary Junior Physical Design Engineer to help build our local engineering powerhouse from the ground up. This is a unique opportunity to take on meaningful product ownership in a new site, defining the backend execution and methodologies for chips that power the world's largest AI clusters.
As a Junior Physical Design Engineer, you will be a key architect of our silicon's physical reality. You won't just execute a flow-you will help establish our local execution culture and technical standards, owning the transformation of complex logic into high-performance silicon. You will drive the physical implementation journey from synthesis through signoff, ensuring our connectivity solutions meet the extreme performance, power, and area targets required for next-generation AI infrastructure. If you thrive on solving complex challenges in deep-submicron processes and want to shape the backend methodology for AI infrastructure connectivity, this is your opportunity.
Key Responsibilities
Physical Implementation & Execution
Be part of the founding Backend team in Israel, playing a critical role in establishing local execution culture and technical standards
Take full responsibility for physical implementation journey including Synthesis, Floorplanning, Place & Route, and Clock-Tree Synthesis (CTS)
Own macro-level implementation with deep hands-on experience in floorplanning and complex routing
Signoff & Design Integrity
Drive final stages of design integrity, owning Timing signoff (STA), Physical Verification (DRC/LVS), and Reliability analysis (EMIR)
Ensure first-pass silicon success through rigorous signoff flows and analysis
Apply Logic Equivalence Checking (LEC) and other verification techniques to guarantee design correctness
Methodology Development & Cross-Functional Collaboration
Participate in defining and refining Backend methodologies with autonomy to improve workflows and tool automation
Work closely with Architecture, Design, and DFT teams to navigate challenges of advanced process nodes and high-speed connectivity
Leverage scripting and automation to make engineering environment faster and more robust.

we are establishing a strategic R&D center in Israel to drive the development of complex semiconductor chips that solve the critical 'data bottlenecks' enabling the future of AI at scale. As we expand our presence in Israel, we are seeking a motivated Physical Design Student to join our founding local engineering team.
This is a unique opportunity to kickstart your career in the semiconductor industry. Working alongside senior industry veterans, you will gain hands-on experience in backend execution and advanced methodologies for cutting-edge chips that power the world's largest AI clusters. If you are passionate about silicon hardware, eager to learn, and thrive on solving complex engineering challenges, this role offers the perfect bridge between your academic studies and a high-impact career.
Key Responsibilities
Guided Implementation & Learning
Partner with and learn from senior engineers to support the physical implementation journey, including synthesis, floorplanning, Place & Route (P&R), and Clock-Tree Synthesis (CTS)
Assist in macro-level implementation and develop hands-on skills in complex layout routing
Participate in deep-submicron process challenges under close professional mentorship
Signoff & Design Integrity Support
Assist in running engineering checks for design integrity, including Static Timing Analysis (STA), Physical Verification (DRC/LVS), and Reliability analysis (EMIR)
Learn to apply Logic Equivalence Checking (LEC) to help guarantee design correctness
Gain exposure to the rigorous flows required to ensure first-pass silicon success
Scripting & Cross-Functional Collaboration
Leverage and develop scripting tools to automate repetitive tasks and optimize the engineering environment
Collaborate with Architecture, Design, and DFT teams to understand how different chip design disciplines intersect
Actively participate in team reviews and technical discussions to ramp up backend methodologies.