לוח משרות דרושים, לחיפוש זה נמצאו 6,301 משרות

We are seeking a Software Embedded Development Engineer to design, develop, and optimize mission-critical embedded software for cloud infrastructure. You will join teams focused on networking, machine learning acceleration, and high-performance computing (HPC), impacting millions of AWS services globally.

Cutting-Edge Technology: Work on custom silicon (e.g., Graviton, ML accelerators) and innovative networking solutions at the intersection of hardware and software.

Growth & Innovation: Benefit from AWSs resources, mentorship programs, and opportunities to publish technical content.

We are seeking a Package Layout Design Engineer to join our hardware team and contribute to the physical design of advanced IC packages for next-generation machine learning and data center ASICs.
In this role, you will execute package layout tasks from floor planning through tape out and manufacturing release, working closely with senior engineers, SI/PI, thermal, and manufacturing teams to deliver production-ready designs that meet performance, density, and reliability targets.

Key job responsibilities
- Execute package layout tasks across the design cycle: die floor planning, bump/pad assignment, RDL routing, substrate design, verification, and tape out release.
- Implement physical designs for advanced packaging architectures including 2.5D interposer, 3D-IC, fan-out wafer-level packaging, and silicon bridge technologies (e.g., CoWoS, EMIB, or similar).
- Support package floorplan development considering die placement, bump maps, power/ground distribution, signal escape routing, and decoupling capacitor placement.
- Perform RDL and substrate routing for high-density interconnects including microbumps, C4 bumps, TSVs, microvias, and PTH vias across multi-layer organic substrates or silicon interposers.
- Support die-level RDL routing and bump planning in coordination with ASIC physical design teams to help co-optimize the die-package interface.
- Contribute to cross-level layout co-optimization across die RDL, interposer/substrate, and PCB levels under guidance from senior engineers.
- Assist in maintaining package stack-up definitions in collaboration with SI/PI and materials engineering teams.
- Run physical verification checks (DRC, connectivity, shorts/opens) and support design closure.
- Follow and help refine package design rules and guidelines, working with OSAT partners and foundries to ensure DFM compliance.
- Collaborate with SI/PI engineers to incorporate electrical constraints into the physical layout - impedance-controlled routing, power plane optimization, and critical net shielding.

Were searching for sharp engineers to lead cutting edge products, re:inventing super computers and deploy our new EFA (Elastic Fabric Adapter) network protocol into the largest public cloud on the planet! starting from the identification and definition of project requirement, defining SW and HW interfaces, feature development and deployment, to operation support on a very large scale.

We're looking for a Design Verification Team Lead - a design verification technical lead that is responsible for complex SoC sub-system, with cutting edge technology for Nitro system SoC, the foundation of AWS's virtualization, networking, and storage offload infrastructure.

It starts at product definition - we engage from day one, shaping requirements and translating product intent into verification strategies before a single line of RTL is written.

It extends into software - we work side-by-side with SW teams, verifying hardware-software interfaces and ensuring seamless integration across the stack, with particular emphasis on networking workloads such as ENA and EFA.

It reaches into physical design - we verify physical design aspects within functional verification, bridging the gap between logical correctness and silicon reality.

It closes the loop - from spec to silicon, our verification touches every team and every stage of chip development.

Key job responsibilities

- Develop and execute verification plans for IO sub-systems - covering interconnect protocols, peripheral interfaces, and system-level integration with a strong connection to networking flows (ENA/EFA).

- Verify IO sub-system features, including interconnect protocols and various accelerator engines.

- Develop and debug C embedded SW as part of hardware-software integration verification.

- Build and maintain UVM-based verification environments for various clusters and sub-systems.

- Verify ARM advanced interconnect protocols (AMBA CHI/ACE/AXI) ensuring correct coherency transactions, performance verification, and protocol compliance.

- Verify the IO virtualization SMMU/TLB operations, page table walks, translation granules, and memory attributes (cache-ability, share-ability).

- Develop constrained-random and directed test strategies targeting corner cases in IO protocol hazards, coherency races, and system boundary conditions.

- Drive coverage closure using functional coverage models, assertion-based verification, and formal methods where applicable.

- Contribute to performance verification - ensuring micro-architectural implementations meet performance targets alongside correctness.

We are looking for a Nitro System Manufacturing Integration Lead Engineer to be part of defining, shaping, and implementing manufacturing flows, test definitions, and card-to-server integration processes for Nitro-based platforms. This includes to be part of the manufacturing flow architecture, production test strategy, process stabilization, and yield optimization bridging system design intent with high-volume manufacturing execution.

Key job responsibilities
As a System Manufacturing Integration Lead Engineer, in the Nitro team, you will own the end-to-end manufacturing flows for accelerator card-to-server integration across manufacturing partner facilities driving the process from initial definition through stabilization into a scalable, high-yield mass production operation.

Key responsibilities include:
- Architect manufacturing flows - be part of the complete card-to-server integration sequence, including every process step, quality gate, and decision point from sub-assembly through system integration and tests.
- Define test strategy - be part of determining what to test, when, and at which station, covering card-level functional tests, post-integration validation, firmware provisioning, and first power-up diagnostics.
- Establish classification criteria - be part of determining pass/fail thresholds and test exit gates to maximize yield and minimize material waste.
- Drive process stabilization - work directly and on-site with manufacturing partners to implement, debug, and iterate on manufacturing flows from early builds through a locked, repeatable production process.
- Design alternative flows - develop parallel manufacturing paths to address real-world constraints such as component availability gaps, deferred card integration, and hub-based assembly models.
- Own process documentation & KPIs - maintain manufacturing flow baselines, drive process change control, and track yield, first-pass rate, cycle time, and defect Pareto.
- Lead cross-functional coordination - serve as the single point of ownership across hardware engineering, firmware, test/vetting, thermal, mechanical, and operations teams for Nitro-based accelerator servers built at scale.

Were searching for a Lab Technion Student who will be responsible for the installation, configuration, maintenance, and troubleshooting of our Linux-based server infrastructure, as well as managing various network services and components.

Student will have at least 4 semesters remaining in their degree. The ideal candidate will posses a strong passion for learning new things and the ability to quickly put that new knowledge and skills into practice. You will have the ability to perform basic troubleshooting for hardware, software, and networking issues without guidance.

We're looking for Electrical Engineering graduates to join the Pre-Silicon Verification Team based in Haifa.

As a Junior Pre-Silicon Verification Engineer, you'll work at the heart of chip development, collaborating across teams to ensure our semiconductor platforms meet the highest standards before they reach production.
IO verification team will expose you to the most advanced technologies , as we lead the market with our leaving devices - youll soon have to expertise most advance protocols

A day in the life
In this role, you'll engage in pre-silicon verification work that connects every phase of our product development journey- from initial product definition through firmware and software development.
You'll collaborate with hardware designers, software engineers, and cross-functional teams to validate complex semiconductor architectures and protocols.
Your days might include developing and executing verification test plans, analyzing simulation results, troubleshooting design issues, and participating in design reviews.
You'll work with advanced verification methodologies and tools, gaining exposure to cutting-edge technologies that define the next generation of cloud infrastructure.

We're looking for exceptional engineers to join our Signal/Power-Integrity and Packaging team. A team that sits where the Silicon meets the Board, bridging the gap between what happens internally at the DIE and the overall system interconnect and the external memories and peer devices.
What sets us apart:
Small team, yet a one stop shop for IP electrical integration at the DIE level, Package design, SI/PI simulations, Layout, Board-design and advanced lab characterization.
Combining Signal-Integrity and Layout, to come up with optimized Package and PCB designs.
Holistic view of the entire interconnect, from the DIEs metals, through the Package, to the PCB traces, and all the way to the peer device.
In-depth post-silicon characterization, using advanced measurement techniques, far exceeding traditional compliance measurements.
Deep dive mentality, in both theory and the bolts and nuts that make the internal circuitry of the electrical interfaces.

The SIP (Signal-Integrity & Packaging) team is part of Annapurna-Labs Chip development team.
The team is dealing with the external electrical interfaces of the device, from their Signal/Power-integrity and electrical usage perspectives.
The teams work includes close work with the BackEnd team on integrating these interfaces to the Die, the package layout design of the BGAs substrate, Signal and power integrity simulations, and working with the system team to come up with optimal pin-out and optimal PCB breakout schemes.
We are looking for highly motivated Electrical Engineering graduates, or engineers with up to 3 years' experience in related fields, to join our growing team specializing in Signal Integrity and IC Package Design. The position offers a unique entry point into a diverse and multidisciplinary domain.

Key job responsibilities
Work on advanced high-speed interfaces such as PCIe, DDR and Ethernet.
End-to-end solution of high-speed interfaces; from floor-planning at the DIE level, through Package and PCB routing, addressing both robust SI/PI considerations as well as optimizing layout routing.
Signal and power integrity modeling and simulation of high-speed interconnects using advanced SI/PI simulation tools.

Were searching for sharp engineers to lead cutting edge products, re:inventing super computers and deploy our new SRD (Scalable Reliable Datagram) network protocol into the largest public cloud on the planet! starting from the identification and definition of project requirement, defining SW and HW interfaces, feature development and deployment, to operation support on a very large scale.

We are developing leading edge products, manufactured on leading edge technologies. We offer a dynamic, open, teamwork environment operating at high pace mode.

Key job responsibilities
Primary responsibilities:
- Development of DfX (DfM, DfT, DfQ&R, etc.) methodologies and BKMs (Best Known Methods).
- DfX activities during the product design stage.
- Product quality & reliability validation (QRV) and ongoing quality & reliability monitoring (OQRM).
- Q&R engineering of volume manufacturing: auditing, monitoring, risk assessment and disposition of non-conformance events/non-conforming material, defining and implementing corrective actions.
- RMAs: investigation, disposition, reporting and follow-up.

We are developing leading edge products, manufactured on leading edge technologies.
We offer a dynamic, open, teamwork environment operating at high pace mode.

Key job responsibilities
Assume full ownership of mechanical and thermal design of Annapurna ICs.
Engage with product architect and design teams on future products package and assembly needs
Perform package level thermal simulations.
Perform package level mechanical simulations.
Lead and design thermal and mechanical measurements of ICs.
Explore and provide recommendations on both available and future packaging and assembly technologies for Annapurnas products.
Engage with substrate and assembly vendors on future technologies roadmap.
In collaboration with HW Dev team optimize mechanical vs. thermal tradeoffs.
Ensure testability of the ICs in collaboration with Test Engineer team.