דרושים » הנדסה » Junior SI/PI and Packaging Engineer

We are seeking a Package Layout Design Engineer to join our hardware team and contribute to the physical design of advanced IC packages for next-generation machine learning and data center ASICs.
In this role, you will execute package layout tasks from floor planning through tape out and manufacturing release, working closely with senior engineers, SI/PI, thermal, and manufacturing teams to deliver production-ready designs that meet performance, density, and reliability targets.

Key job responsibilities
- Execute package layout tasks across the design cycle: die floor planning, bump/pad assignment, RDL routing, substrate design, verification, and tape out release.
- Implement physical designs for advanced packaging architectures including 2.5D interposer, 3D-IC, fan-out wafer-level packaging, and silicon bridge technologies (e.g., CoWoS, EMIB, or similar).
- Support package floorplan development considering die placement, bump maps, power/ground distribution, signal escape routing, and decoupling capacitor placement.
- Perform RDL and substrate routing for high-density interconnects including microbumps, C4 bumps, TSVs, microvias, and PTH vias across multi-layer organic substrates or silicon interposers.
- Support die-level RDL routing and bump planning in coordination with ASIC physical design teams to help co-optimize the die-package interface.
- Contribute to cross-level layout co-optimization across die RDL, interposer/substrate, and PCB levels under guidance from senior engineers.
- Assist in maintaining package stack-up definitions in collaboration with SI/PI and materials engineering teams.
- Run physical verification checks (DRC, connectivity, shorts/opens) and support design closure.
- Follow and help refine package design rules and guidelines, working with OSAT partners and foundries to ensure DFM compliance.
- Collaborate with SI/PI engineers to incorporate electrical constraints into the physical layout - impedance-controlled routing, power plane optimization, and critical net shielding.

Required Power and Signal Integrity Engineer
About the job
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
Our mission is to organize the world's information and make it universally accessible and useful. Our team combines the best of AI, Software, and Hardware to create radically helpful experiences. We research, design, and develop new technologies and hardware to make computing faster, seamless, and more powerful. We aim to make people's lives better through technology.
As a Power and Signal Integrity Engineer, you will be responsible for the design and characterization of signal and power integrity of our IC designs. You will design the external electrical interfaces of the device, from their Signal/Power-integrity and electrical usage perspectives.
You'll set up methodologies, perform simulations, silicon characterization and correlations to ensure our IC designs meet systems design budgets and achieve the highest performance. You will work with systems architects, ASIC design, systems engineers, and partner cross-functionally with teams and external vendors/partners.
The ML, Systems, & Cloud AI (MSCA) organization designs, implements, and manages the hardware, software, machine learning, and systems infrastructure for all services (Search, YouTube, etc.) and Cloud.
We prioritize security, efficiency, and reliability across everything we do - from developing our latest TPUs to running a global network, while driving towards shaping the future of hyperscale computing. Our global impact spans software and hardware, including Clouds Vertex AI, the leading AI platform for bringing Gemini models to enterprise customers.
Responsibilities:
Design and optimize power distribution networks (PDN) across chip, package, and board levels. This includes managing power/ground planes, decoupling capacitors, and power gating strategies.
Conduct both pre-layout and post-layout power integrity simulations to analyze power and ground noise (SSN/SSO), voltage drops (IR drop), and electromagnetic interference (EMI).
Implement and verify low-power design methodologies, such as multi-voltage designs and clock gating, using power intent formats like UPF/CPF.
Generate precise electrical models (e.g., S-parameters, SPICE models) for components such as packages, PCBs, and connectors for use in simulations.
Execute lab measurements utilizing test equipment like oscilloscopes, Vector Network Analyzers (VNA), Time Domain Reflectometers (TDR), Spectrum analyzers to validate simulation outcomes and debug signal and power-related issues on silicon prototypes and boards.

As we expand our presence in Israel, we're seeking a visionary Expert IC Package Design Lead to help build our local engineering powerhouse from the ground up. This is a unique opportunity to take on meaningful product ownership in a new site, leading the physical implementation strategy for chips that power the world's largest AI clusters.

As an Expert IC Package Design Lead, you will be a core technical contributor in the development of advanced IC packaging solutions for high-performance connectivity silicon.
You will own package flow, architecture, design, and qualification from concept through production, working closely with silicon, signal integrity, power integrity, mechanical, manufacturing, and external OSAT partners. You will be responsible for defining package technologies that meet aggressive electrical, thermal, mechanical, and cost targets, enabling our products to operate reliably in the worlds most demanding AI and cloud environments.

Key Responsibilities
Own end-to-end IC package design, from early architecture and feasibility through detailed design, qualification, and high-volume manufacturing.
Define package architecture and technology selection (organic substrates, advanced laminate, interposers, multi-die/chiplet packaging, CoWoS - 2.5D/3D integration).
Lead signal integrity (SI), power integrity (PI), and thermal considerations at the package level for high-speed, high-power devices.
Drive package layout, substrate routing, bump/ball maps, stack-ups, materials selection, and mechanical constraints.
Collaborate closely with silicon design, SerDes, system, SI/PI, and reliability teams to optimize overall product performance.
Interface with OSATs, substrate vendors, and manufacturing partners to ensure design-for-manufacturability (DFM), yield, and cost targets.
Lead package-related risk assessment, failure analysis, and corrective actions during bring-up and production ramp.
Support NPI, qualification, and product sustainment activities, including vendor audits and technical reviews.

Required Staff Signal Integrity Engineer
About the job
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
Our mission is to organize the world's information and make it universally accessible and useful. Our team combines the best of AI, Software, and Hardware to create radically helpful experiences. We research, design, and develop new technologies and hardware to make computing faster, seamless, and more powerful. We aim to make people's lives better through technology.
Responsibilities
Lead end-to-end signal integrity definition, channel budgeting, and stackup optimization for complex multi-die packages, including 2.5D (CoWoS, EMIB, InFO), 3D vertical stacking, and high-density organic substrates.
Architect and optimize multi-terabit interconnects across Die-to-Die (UCIe/BoW), host links (PCIe Gen6/7, PAM4/# SerDes), and memory subsystems (HBM3/4, DDR5, LPDDR6) in close collaboration with PHY and silicon design teams.
Build high-accuracy 3D full-wave electromagnetic models (HFSS) for micro-bumps, C4 bumps, TSVs, interposers, and BGA transitions, establishing automated flows for statistical eye/BER margin analysis.
Define high-frequency test vehicles, fixtures, and measurement methodologies; execute multi-port VNA, TDR, and real-time scope characterizations to correlate lab measurements with predictive simulations.
Collaborate closely with Silicon Design, Package Layout, Board/System, and external foundry/OSAT partners to resolve design trade-offs

Required Signal/Power Integrity Engineer, PhD Graduate
About the job
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
Responsibilities:
Simulate high speed interface electrical behavior using HSPICE or other circuit simulators.
Generate precise electrical models (e.g., S-parameters, SPICE models) for components such as packages, PCBs, and connectors for use in simulations.
Collaborate extensively with cross-functional teams, including ASIC architects, digital/analog designers, physical design/layout engineers, and system engineers, to define specifications and resolve integration challenges.
Execute lab measurements utilizing test equipment like oscilloscopes, Vector Network Analyzers (VNA), Time Domain Reflectometers (TDR) , Spectrum analyzers to validate simulation outcomes and debug signal and power-related issues on silicon prototypes and boards.
Establish robust design rules and guidelines for optimal signal/power integrity during PCB and package layout, ensuring high production yield and reliability.

As we expand our presence in Israel, we're seeking a visionary Physical Design Engineer to help build our local engineering powerhouse from the ground up. This is a unique opportunity to take on meaningful product ownership in a new site, defining the backend execution and methodologies for chips that power the world's largest AI clusters.

As a Physical Design Engineer, you will be a key architect of our silicon's physical reality. You won't just execute a flow-you will help establish our local execution culture and technical standards, owning the transformation of complex logic into high-performance silicon. You will drive the physical implementation journey from synthesis through signoff, ensuring our connectivity solutions meet the extreme performance, power, and area targets required for next-generation AI infrastructure. If you thrive on solving complex challenges in deep-submicron processes and want to shape the backend methodology for AI infrastructure connectivity, this is your opportunity.

Key Responsibilities

Physical Implementation & Execution
Be part of the founding Backend team in Israel, playing a critical role in establishing local execution culture and technical standards
Take full responsibility for physical implementation journey including Synthesis, Floorplanning, Place & Route, and Clock-Tree Synthesis (CTS)
Own macro-level implementation with deep hands-on experience in floorplanning and complex routing

Signoff & Design Integrity
Drive final stages of design integrity, owning Timing signoff (STA), Physical Verification (DRC/LVS), and Reliability analysis (EMIR)
Ensure first-pass silicon success through rigorous signoff flows and analysis
Apply Logic Equivalence Checking (LEC) and other verification techniques to guarantee design correctness

Methodology Development & Cross-Functional Collaboration
Participate in defining and refining Backend methodologies with autonomy to improve workflows and tool automation
Work closely with Architecture, Design, and DFT teams to navigate challenges of advanced process nodes and high-speed connectivity
Leverage scripting and automation to make engineering environment faster and more robust

we are looking for a talented Hardware Board Designer to join our multidisciplinary R&D team. This is an exciting opportunity to take part in the design and development of advanced electronic systems, working alongside hardware, firmware, software, and system engineers from concept through integration.
We are looking for a creative, hands-on engineer with a passion for hardware design and a desire to work on cutting-edge technologies.
Responsibilities
Design and develop complex electronic boards from concept to production.
Perform hands-on schematic design and component selection.
Support and guide PCB layout activities.
Prepare and present design reviews.
Collaborate closely with firmware, software, RF, and system engineering teams to ensure successful system integration.
Develop advanced multidisciplinary systems incorporating:
CPUs / SoCs
FPGA-based designs
Analog and mixed-signal circuits
High-speed interfaces (DDR, PCIe, Ethernet, LVDS, etc.)
RF transmit and receive chains
Filters and amplifier circuits
Power supply and power management circuits
Support board bring-up, debugging, validation, and troubleshooting.

Required Senior Verification Engineer, Digital Signal Processing, Cloud
About the job
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
In this role, you own the verification strategy for high-speed Physical Layer (PHY). You aren't just looking for RTL bugs, you are looking for system-level failures. You will lead the effort to verify how the digital DSP interacts with the analog front-end.
We prioritize security, efficiency, and reliability across everything we do - from developing our latest TPUs to running a global network, while driving towards shaping the future of hyperscale computing. Our global impact spans software and hardware, including Clouds Vertex AI, the leading AI platform for bringing Gemini models to enterprise customers.
Responsibilities
Lead the verification strategy for high-speed PHYs (112G/224G), defining the test plan for top-level integration and mixed-signal boundaries.
Architect and implement mixed-signal verification flows using Real Number Modeling (RNM) or SystemVerilog-AMS to verify the interaction between Analog Front Ends (AFE) and digital DSP.
Design specialized testbenches to verify the stability, convergence time, and tracking capabilities of adaptive algorithms (e.g., LMS, Zero-Forcing) across Process, Voltage, Temperature (PVT) corners.
Develop tests that simulate real-world data center conditions, including link bring-up, auto-negotiation, and error-recovery protocols.
Act as the primary verification interface for the Signal integrity and Power Integrity (SI/PI) and Analog teams, ensuring that physical channel impairments (loss, crosstalk, reflections) are accurately reflected in the Design Verification (DV) environment.

Requred SoC Power Architect, Cloud, Silicon
About the job
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
As a Power Architect, you will not just design chips; you will define the energy efficiency of the infrastructure that powers our services worldwide.
In this role, you will be at the intersection of architecture, logic design, physical implementation, and system software. You will own the power architecture for next-generation custom SoCs (System on Chips), making critical trade-offs between performance, thermal constraints, and power delivery to build the most efficient computing platforms on the planet.
Responsibilities
Define and own the SoC power architecture, including complex power domains, clocking structures, and power delivery network (PDN) solutions to achieve optimal performance-per-watt.
Architect sophisticated power management policies, including dynamic voltage and frequency scaling (DVFS), power gating, and state strategies. Define the hardware/software interface for the Power management unit (PMU) and provide power management specifications.
Lead collaboration across architecture, RTL, physical design, packaging and validation teams to establish power budgets and specifications. Ensure power requirements are met from concept to tape-out.
Develop high-fidelity power and performance models to evaluate architectural features early in the design cycle. Drive pre-silicon power estimation and analysis to guide design decisions.
Lead post-silicon power analysis, correlating lab measurements with pre-silicon models to close the loop and improve future methodologies.

As we expand our presence in Israel, we're seeking a visionary System Validation Engineer to help build our local engineering powerhouse from the ground up. This is a unique opportunity to take on meaningful product ownership in a new site, ensuring the reliability and testability of chips that power the world's largest AI clusters.


Job Description
The mission of this role is to perform system validation for our highly advanced devices, that includes defining strategy, develop tools, innovate, be creative to make sure devices are performing as they should in all aspects, logical, performance, durability, stress and more.

You will be part of the site located at Israel (Haifa - Matam), surrounded with highly experienced and professional engineers who will escort, mentor and support you on your journey in our company.