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Join a team developing next-generation AI accelerators, working at the intersection of AI algorithms, software, and hardware.

*Part-Time or Full-Time Opportunity

Responsibilities:
The research focuses on designing next-generation rack and SuperPod architectures that combine elasticity through resource pooling with optimal performance enabled by holistic co-design across applications, parallel programming models, interconnect fabrics, and compute, memory, and switch chip architectures. On the communication side, the work architects scalable, high-bandwidth, and low-latency scale-up fabrics across multiple chips at rack and SuperPod scale. On the memory side, it explores richer protocol semantics beyond traditional load/store operations to reduce unnecessary data movement and rethinks memory hierarchies to expose large-scale capacity with near-local latency. On the compute side, it analyzes the requirements of General Compute and Generative AI workloads and their parallel programming models to fully leverage large-scale system resources.
Investigate and prototype new architectural features, including but not limited to:
o Tiered Memory: Explore advanced memory organizations, including hardware-managed caching, to enable software-transparent, fine-grained promotion and demotion of cache lines across the memory hierarchy.
o Prefetching/Speculation: Evaluate and design existing and next-generation hardware prefetching and speculation mechanisms to effectively hide local and remote memory latencies at rack and SuperPod scale.
o Near-Memory/Network Processing: Develop support for key primitives executed at the memory and network layers to minimize unnecessary data movement across sparse, dense, and pointer-based data structures.
o Workload-Centric Co-Design: Study optimal parallelization strategies at rack and SuperPod scale for both General Compute and Generative AI workloads, and design dedicated hardware support for widely used parallel programming primitives such as RPCs and collective communication.
Write reports and papers on the research results and present them.

we are looking for a Release Engineering Intern.
As a Release Engineering Intern in our Tel Aviv office, youll help improve the systems that build, test and release software across .
The group is moving the R&D to an agent-ready CI/CD platform, aiming for up to 10x faster delivery with less manual build, test and release work.
Youll also work on our internal AI app-building platform, which lets employees create and deploy applications from natural-language prompts (Base44 style).
The team supports 600+ R&D engineers, around 1,300+ modules and 500+ service types across Java, JavaScript/TypeScript, Python and Go.

*Part-Time or Full-Time Opportunity

In this job opening, we are seeking a highly motivated and visionary researcher to join our team focused on chiplet-based computing systems. This role involves research and development in chiplet-based architectures, aiming to overcome performance and scalability limits of traditional compute platforms.

Responsibilities:
Conduct cutting-edge research on the co-design of communication and computation for wafer-scale systems. On the communication side, the work focuses on architecting Networks-on-Chip, providing scalable, high-bandwidth, and ultra-low-latency interconnects that efficiently span multiple dies and support fine-grained data movement. On the computation side, the research emphasizes optimizing and mapping training and inference workloads to fully exploit wafer-scale resources, improving performance, scalability, and energy efficiency through intelligent task placement and scheduling.
Investigate various aspects of system design, including:
Network-on-Chip design, further including Topology exploration, routing algorithms, and protocol/flow-control design to support high-throughput collective communication, low-latency synchronization, and efficient model/data parallelism
Expressing and Mapping LLM Parallelism to Wafer-Scale System that simplify LLM parallelism (e.g., tensor, pipeline, and data parallelism) and efficiently map training and inference workloads onto wafer-scale system