לוח משרות דרושים, לחיפוש זה נמצאו 503 משרות

we are establishing a strategic R&D center in Israel to drive the development of complex semiconductor chips that solve the critical 'data bottlenecks' enabling the future of AI at scale. As we expand our presence in Israel, we're seeking a highly skilled Chip Top Physical Design Engineer focusing on implementation to join our local engineering powerhouse from the ground up.
If you thrive on solving complex, unnamed challenges in deep-submicron processes, your place is with us.
As a Physical Design Engineer, you will be a key hands-on member of our PD Team in the Israel R&D center. You will execute the physical design of the SoC Top level for chips that drive the worlds largest AI clusters. You will be deeply involved in all PD disciplines of the chip, driving the tape-out (T.O.) GDS to meet strict signoff criteria (Timing, LVS, EMIR, DRC, PV, etc.), ensuring our silicon meets the extreme performance, power, and area (PPA) targets required for AI scale.
Key Responsibilities
Execute SoC Top-level physical design and actively drive full-chip convergence
Perform Top-Level physical implementation, including floor-planning, Place & Route (P&R), Clock Tree Synthesis (CTS), Power/Clock distribution, Power Integrity, and Timing/Physical signoff
Work closely with the Architecture, Design, DFT, and Product teams to achieve optimal Power, Performance, and Area (PPA). This involves participating in feasibility studies for new architectures and optimizing runs to ensure the best Quality of Results (QoR)
Resolve complex signal integrity, thermal, and power challenges inherent in high-speed connectivity silicon
Collaborate closely with the Package team on Bump-map-to-Ballout design, taking all signal integrity aspects into consideration.

Nuvoton Israel is a leading supplier of custom SoC and security hardware solutions for the computing and server markets. As a well-established and independent design center, we collaborate closely with top-tier customers such as HP, Dell, Qualcomm, Microsoft, and Google to develop advanced solutions that secure, control, and manage our customers platforms. We are seeking a talented and experienced Chip Architect to join our team. The ideal candidate is a self-motivated, fast learner with a strong background in hardware and system architecture. This role requires a technology leader capable of driving multidisciplinary programs and working closely with customers and internal teams across the entire product lifecycle. Responsibilities:
* Translate customer and marketing requirements into detailed SoC architectural specifications
* Provide functional specifications for chip hardware design and embedded software development
* Lead architectural decisions and serve as a technical authority across cross-functional teams
* Collaborate with customers and marketing to refine product requirements and align on technical solutions
* Support design, implementation, and verification processes throughout development
* Participate in system debugging, root-cause analysis, and issue resolution
* Support post-silicon bring-up, system integration, and software enablement

Required Senior Silicon Physical Design Engineer
About the job
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
As a SoC Physical Design Engineer, you will collaborate with functional design, Design for Testing (DFT), architecture, and packaging engineers. In this role, you will solve technical problems with innovative micro-architecture and practical logic circuits solutions, while evaluating design options with optimized performance, power, and area in mind.
The AI and Infrastructure team is redefining whats possible. We empower customers with breakthrough capabilities and insights by delivering AI and Infrastructure at unparalleled scale, efficiency, reliability and velocity.
We're the driving force behind our groundbreaking innovations, empowering the development of our cutting-edge AI models, delivering unparalleled computing power to global services, and providing the essential platforms that enable developers to build the future. From software to hardware our teams are shaping the future of world-leading hyperscale computing, with key teams working on the development of our TPUs, Vertex AI for Cloud, Global Networking, Data Center operations, systems research, and much more.
Responsibilities
Use problem-solving and simulation techniques to ensure performance, power, and area (PPA) are within defined requirements.
Collaborate with cross-functional teams to debug failures or performance shortfalls and meet program goals in lab or simulation.
Design chips, chip-subsystems, or partitions within subsystems from synthesis through place and route, and sign off convergence, ensuring that the design meets the architecture goals of power, performance, and area.
Develop, validate, and improve Electronic Design Automation (EDA) methodology for a specialized sign off or implementation domain to enable cross-functional teams to build and deliver blocks that are correct by construction and ease convergence efforts.

We are now looking for a motivated Chip Architect to use your creativity to work on the ConnectX network adapter with the highly inventive and knowledgeable team.

What you'll be doing:

Define the Network Adapter chip architecture end to end from the market requirements through design and all product life cycles (post/pre-silicon, on deployments). Work with related industry standards & customers on deploying your tech.

Collaborate with teams across teams (physical design, logic design, system software, firmware, applications)

Work on proof of concepts and advance development projects.

Perform research and analysis for current and future architectures.

Craft product design specifications.

Serve as a focal point within the organization and distribute the knowledge that you acquire.

we are establishing a strategic R&D center in Israel to drive the development of complex semiconductor chips that solve the critical 'data bottlenecks' enabling the future of AI at scale. As we expand our presence in Israel, we're seeking a visionary Expert IC Package Design Lead to help build our local engineering powerhouse from the ground up. This is a unique opportunity to take on meaningful product ownership in a new site, leading the physical implementation strategy for chips that power the world's largest AI clusters.
As an Expert IC Package Design Lead, you will be a core technical contributor in the development of advanced IC packaging solutions for high-performance connectivity silicon.
You will own package flow, architecture, design, and qualification from concept through production, working closely with silicon, signal integrity, power integrity, mechanical, manufacturing, and external OSAT partners.You will be responsible for defining package technologies that meet aggressive electrical, thermal, mechanical, and cost targets, enabling our companys products to operate reliably in the worlds most demanding AI and cloud environments.
Key Responsibilities
Own end-to-end IC package design, from early architecture and feasibility through detailed design, qualification, and high-volume manufacturing
Define package architecture and technology selection (organic substrates, advanced laminate, interposers, multi-die/chiplet packaging, CoWoS - 2.5D/3D integration)
Lead signal integrity (SI), power integrity (PI), and thermal considerations at the package level for high-speed, high-power devices
Drive package layout, substrate routing, bump/ball maps, stack-ups, materials selection, and mechanical constraints
Collaborate closely with silicon design, SerDes, system, SI/PI, and reliability teams to optimize overall product performance
Interface with OSATs, substrate vendors, and manufacturing partners to ensure design-for-manufacturability (DFM), yield, and cost targets
Lead package-related risk assessment, failure analysis, and corrective actions during bring-up and production ramp
Support NPI, qualification, and product sustainment activities, including vendor audits and technical reviews.

Technical Lead, Custom Digital Circuit Design, Mixed Signal
About the job
In this role, youll work to shape the future of AI/ML hardware acceleration. You will have an opportunity to drive cutting-edge TPU (Tensor Processing Unit) technology that powers our most demanding AI/ML applications. Youll be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our TPU. You'll contribute to the innovation behind products loved by millions worldwide, and leverage your design and verification expertise to verify complex digital designs, with a specific focus on TPU architecture and its integration within AI/ML-driven systems.
As the Lead Architect for our custom back-end solutions for high-speed internal connections, you will set the design standards for our custom silicon. You will ensure our physical design methods can support data speeds of 1.6T and above while maintaining high manufacturing reliability and performance. You will create the design framework for our future hardware, solving complex engineering challenges in the latest manufacturing processes.
Responsibilities
Define the global back-end and custom Physical Design methodology, driving the transition to automated Analog and Mixed-Signal (AMS) flows and "Layout-Aware" design.
Lead full custom digital circuit design at the transistor level optimized for low power.
Evaluate and de-risk new process features in GAA (Gate-All-Around) nodes (e.g., Backside Power Delivery, Buried Power Rails) for high-speed analog use cases.
Drive the long-term Roadmap for Area and Power density, ensuring our PHYs remain the most efficient in the industry.
Act as the primary liaison with foundries to optimize Design for Manufacturing (DFM) and maximize yield for massive TPU-scale chips.

Our Board Design Team is growing! Youll collaborate with top industry engineers within the fast-growing Cisco Silicon One group worldwide.
You will be part of a team driving our groundbreaking next-generation network devices-Cisco Silicon One. Our team operates in a startup-like atmosphere within a global, leading corporation.
Our design center is unique, hosting all silicon hardware and software development fields under one roof. Our Networking Chips deliver high speed without compromising programmability, buffering, power efficiency, scale, or feature flexibility. They are strategically placed in critical AI infrastructure, powering next-generation network devices and supporting advanced AI workloads. They deliver high speed without compromising programmability, buffering, power efficiency, scale, or feature flexibility.
Your Impact:
Spearhead innovative silicon architecture for AI infrastructure, guiding board design from concept through to mass production.
Act as the technical decision-maker for the project and collaborate with cross-functional teams in mechanics, thermal, PCB layout, and software/RTL.
Define product specifications, develop electrical schematics, and guide component selection.
Conduct hands-on testing in a lab environment and drive the PCB bring-up, characterization, and debugging stages.

Required CPU Design Integration Engineer, Cloud
About the job
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
We prioritize security, efficiency, and reliability across everything we do - from developing our latest TPUs to running a global network, while driving towards shaping the future of hyperscale computing. Our global impact spans software and hardware, including our Clouds Vertex AI, the leading AI platform for bringing Gemini models to enterprise customers.
Responsibilities
Define and implement solutions for design, integration and verification problems using in-house and external technical solutions or tools.
Involve in project development and convergence with the highest quality, agreement with issues as they arise through design and implementation, or equivalent relevant experience.
Connect between RTL design, physical design, DFT, external IPs and SoC while maintaining project priorities.
Maintain project infrastructure and stability.
Ensure chip quality by implementing best practices and implementing quality control measures.

we are establishing a strategic R&D center in Israel to drive the development of complex semiconductor chips that solve the critical 'data bottlenecks' enabling the future of AI at scale. As we expand our presence in Israel, we're seeking a talented Staff/ Principal Design Verification Engineer to help build our local engineering powerhouse from the ground up. This is an exciting opportunity to take on meaningful ownership in a new site, developing the verification environments that ensure our next-generation AI silicon performs flawlessly.
As a Staff/ Principal Design Verification Engineer, you will be a vital contributor to the quality and reliability of our Israel R&D center. You will work on the front lines of functional verification, developing testbenches and environments that validate high-performance digital blocks, subsystems, and full-chip designs. You will tackle complex verification challenges that ensure our connectivity solutions meet the rigorous demands of the world's largest AI clusters. If you thrive on solving technical puzzles and want to play a key role in delivering cutting-edge AI infrastructure connectivity, this is your opportunity.
Key Responsibilities
Verification Environment Development
Contribute to the design and development of ASIC verification environments, focusing on unit-level and subsystem functional blocks
Develop and maintain SystemVerilog/UVM-based components including traffic generators, monitors, and checkers to ensure robust testing
Execute detailed verification plans for challenging digital designs, ensuring all functional requirements are met and verified
Coverage & Quality Assurance
Implement functional coverage models and analyze results to identify gaps in the verification process
Drive designs toward 100% verification closure through comprehensive test development
Contribute to verification methodology improvements and best practices
Debug & Cross-Functional Collaboration
Work closely with design engineers to identify, root-cause, and resolve complex hardware bugs early in the development cycle
Apply analytical skills and debugging techniques to solve intricate verification challenges
Collaborate effectively in a fast-paced, team-oriented R&D environment.

we are establishing a strategic R&D center in Israel to drive the development of complex semiconductor chips that solve the critical 'data bottlenecks' enabling the future of AI at scale. As we expand our presence in Israel, we're seeking a talented Senior Design Verification Engineer to help build our local engineering powerhouse from the ground up. This is an exciting opportunity to take on meaningful ownership in a new site, developing the verification environments that ensure our next-generation AI silicon performs flawlessly.
As a Senior Design Verification Engineer, you will be a vital contributor to the quality and reliability of our Israel R&D center. You will work on the front lines of functional verification, developing testbenches and environments that validate high-performance digital blocks, subsystems, and full-chip designs. You will tackle complex verification challenges that ensure our connectivity solutions meet the rigorous demands of the world's largest AI clusters. If you thrive on solving technical puzzles and want to play a key role in delivering cutting-edge AI infrastructure connectivity, this is your opportunity.
Key Responsibilities
Verification Environment Development
Contribute to the design and development of ASIC verification environments, focusing on unit-level and subsystem functional blocks
Develop and maintain SystemVerilog/UVM-based components including traffic generators, monitors, and checkers to ensure robust testing
Execute detailed verification plans for challenging digital designs, ensuring all functional requirements are met and verified
Coverage & Quality Assurance
Implement functional coverage models and analyze results to identify gaps in the verification process
Drive designs toward 100% verification closure through comprehensive test development
Contribute to verification methodology improvements and best practices
Debug & Cross-Functional Collaboration
Work closely with design engineers to identify, root-cause, and resolve complex hardware bugs early in the development cycle
Apply analytical skills and debugging techniques to solve intricate verification challenges
Collaborate effectively in a fast-paced, team-oriented R&D environment.

This is an opportunity for you to integrate with end customers in both hands-on and advisory roles to solve technical challenges with various test cell set ups. To work on the bleeding edge of semi-test technology and to sharpen your relationship management skills while developing strategic partnerships that will round out your arsenal of 3rd party vendor provided products that enhance our solutions.

Key Responsibilities:
Influence next generation ATE tester and Test Cell product roadmaps
Work directly with leading edge semiconductor companies supporting their efforts to develop Test Cells to enable advanced chip designs to market
Responsible for the mastering of Teradyne Test Cell products, product applications and policies.
Provide expert advice to customers, Sales, FAEs and support staff while working closely with sales/marketing management and test cell staff to ensure that relevant technical information is promptly and accurately communicated.
Develop strategic relationships throughout our sales team and customer's key technical decision makers.
Work with marketing on technical differentiation and generation of technical proofs for use by the customer team.
Develop, present, and respond to proposals for specific customer requirements.
Coordinate, develop and deliver product demonstrations which display the value of our solutions.
Works closely with customers to define new test cell opportunities and support existing sustainment activities. Travel requirements could be 25% or greater.
Lead in new product introduction with integration at customer sites with project management, hands-on integration, and training activities.
Support emerging markets, acting as a liaison between customers and the engineering, marketing, and operations teams to help with their product development.
Keep informed and present updates on competitors, industry news and trends, products services, relevant information about legacy, existing, emerging technologies, and the latest product-line development.

Requied SoC and IP Design Engineer, Cloud
About the job
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
In this role, you will use your ASIC design experience to be part of a team that develops the ASIC SoC from Plan of Record (POR) to Production. You will be creating SoC Level micro architecture definitions, Register-Transfer Level (RTL) coding and will do all RTL quality checks. You will also have the opportunity to contribute to design flow and methodologies. You will collaborate with members of architecture, software, verification, power, timing, synthesis design for test (dft) etc. You will face technical tests and develop/define design options for performance, power and area.
Responsibilities
Define the SoC/block level design document such as interface protocol, block diagram, transaction flow, pipeline, etc.
Perform RTL development (e.g., coding and debug in Verilog, System Verilog), function/performance simulation debug and Lint/Cyber Defense Center/Formal Verification/Unified Power Format checks.
Participate in synthesis, timing/power closure, and Application-Specific Integrated Circuit (ASIC) silicon bring-up.
Participate in test plan and coverage analysis of the block and SOC-level verification.
Participate in architecture feedback.

Semi Conductor Devices (SCD), a leading worldwide supplier of high-end Infrared Detectors and thermal imaging cores, is looking for an Analog / Mixed-Signal VLSI Designer to join its VLSI R&D group. The role involves design and validation of custom analog and mixed-signal ASICs (ROICs) for advanced IR imaging systems, working closely with experienced analog, digital, system, and hardware teams.
Responsibilities:
Design and verify Analog and Mixed-Signal circuit blocks for IR image sensors (ROICs) under the guidance of senior designers Participate in the full ASIC development flow: specification review circuit design verification integration silicon bring-up lab validation Contribute to block-level simulations, documentation, and design reviews Work closely with digital designers, layout engineers, electronics, and system teams to support chip integration Support post-silicon validation and lab measurements, including debug and correlation to simulations Gain exposure to advanced CMOS processes, image sensor architectures, and system -driven design constraints.

Are you passionate about systems programming at the intersection of hardware and software? Do you want your code to directly accelerate the world's largest AI training and inference workloads? The Elastic Fabric Adapter (EFA) Drivers team is looking for Software Development Engineers to design and implement the kernel drivers and userspace libraries that power high-performance networking for AWS's AI/ML and HPC infrastructure.

EFA is the custom network interface that enables thousands of GPUs and accelerators to communicate at near-wire-speed bandwidth and low latency, making it a critical enabler of both foundation model training and real-time inference serving at unprecedented scale. When customers train the next generation of large language models or serve billions of inference requests with tight latency SLAs on our EC2 P5, P6, or Trn instances, it's our driver stack that moves the data.

Key job responsibilities
- Design, develop, and optimize Linux kernel drivers (RDMA/EFA) and userspace provider libraries (rdma-core) that ship to millions of EC2 instances.
- Work directly with custom hardware - collaborate with chip designers to bring new silicon capabilities to life in software.
- Contribute to the upstream Linux kernel RDMA subsystem and rdma-core open-source project.
- Architect solutions for next-generation networking features: GPU-direct RDMA, adaptive routing, collective offloads, and multi-path transport.
- Build monitoring and automation tools to enhance driver testing for functionality, reliability, and performance.
- Own the full lifecycle: from initial hardware bring-up and feature enablement through testing, deployment, and production troubleshooting across the global AWS fleet.

we are looking for a IC Package Design Engineer.
In this role, you will contribute to the development of complex ASIC package designs from early planning and exploration through implementation and tapeout. You will collaborate across package design, layout, SI/PI, and silicon teams to help deliver high‑speed, robust, and manufacturable package solutions.
You will participate in package architecture activities, design tradeoff discussions, and technical problem solving while growing your expertise in advanced packaging technologies and system-level integration. This role provides an opportunity to work on some of the most advanced networking silicon products in the industry within a highly collaborative engineering environment.
Responsibilities:
As a member of the Package Design team, you will:
Lead the package design activities including planning, floorplanning, pinout optimization, stack‑up definition, and high‑speed routing suport.
Collaborate with SI/PI, silicon floorplanning, layout, and manufacturing teams to ensure high‑quality package solutions.
Support package implementation activities and work closely with layout designers to ensure alignment between design intent and physical implementation.
Participate in technical investigations, design reviews, and tradeoff discussions involving performance, manufacturability, and schedule considerations.
Assist in developing and improving package design methodologies, flows, and best practices.
Contribute to debugging, issue resolution, and package bring‑up activities as needed.