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חברה חסויה
Location: Haifa
Job Type: Full Time
we're seeking a visionary Expert IC Package Design Lead to help build our local engineering powerhouse from the ground up. This is a unique opportunity to take on meaningful product ownership in a new site, leading the physical implementation strategy for chips that power the world's largest AI clusters.

As an Expert IC Package Design Lead, you will be a core technical contributor in the development of advanced IC packaging solutions for high-performance connectivity silicon.
You will own package flow, architecture, design, and qualification from concept through production, working closely with silicon, signal integrity, power integrity, mechanical, manufacturing, and external OSAT partners.You will be responsible for defining package technologies that meet aggressive electrical, thermal, mechanical, and cost targets, enabling products to operate reliably in the worlds most demanding AI and cloud environments.

Key Responsibilities

Own end-to-end IC package design, from early architecture and feasibility through detailed design, qualification, and high-volume manufacturing
Define package architecture and technology selection (organic substrates, advanced laminate, interposers, multi-die/chiplet packaging, CoWoS - 2.5D/3D integration)
Lead signal integrity (SI), power integrity (PI), and thermal considerations at the package level for high-speed, high-power devices
Drive package layout, substrate routing, bump/ball maps, stack-ups, materials selection, and mechanical constraints
Collaborate closely with silicon design, SerDes, system, SI/PI, and reliability teams to optimize overall product performance
Interface with OSATs, substrate vendors, and manufacturing partners to ensure design-for-manufacturability (DFM), yield, and cost targets
Lead package-related risk assessment, failure analysis, and corrective actions during bring-up and production ramp
Support NPI, qualification, and product sustainment activities, including vendor audits and technical reviews
Requirements:
10+ years of hands-on IC BIG package design experience for high-performance semiconductor products, with full ownership from concept through tape-out
Expert proficiency in IC package design tools (Cadence APD / SiP or equivalent) and experience designing complex packages (BGA, FCBGA, FCCSP)
Strong package architecture & integration expertise, including stack-ups, ball/bump maps, constraints, SMT integration, and package BOM ownership
Deep understanding of signal, power, and thermal integrity at the package level, with ability to drive design tradeoffs based on analysis
Proven manufacturing and release experience, including DRC/LVS/DFM, OSAT engagement, and delivering production-ready package designs
This position is open to all candidates.
 
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לפני 4 שעות
Location: Haifa
Job Type: Full Time
we're seeking a visionary Package Design Engineer to help build our local engineering powerhouse from the ground up. This is a unique opportunity to take on meaningful product ownership in a new site, Driving the physical implementation strategy for chips that power the world's largest AI clusters.

As a Package Design Engineer, you will be a core technical contributor in the development of advanced IC packaging solutions for high-performance connectivity silicon. You will execute the package flow, design, and qualification from concept through production, working closely with silicon, signal integrity, power integrity, mechanical, manufacturing, and external OSAT partners. You will be responsible for implementing package technologies that meet aggressive electrical, thermal, mechanical, and cost targets, enabling products to operate reliably in the worlds most demanding AI and cloud environments.

Key Responsibilities


Execute end-to-end IC package design, from early feasibility and detailed design through to qualification and high-volume manufacturing
Implement package architecture and utilize advanced technologies (organic substrates, advanced laminate, interposers, multi-die/chiplet packaging, CoWoS - 2.5D/3D integration)
Drive signal integrity (SI), power integrity (PI), and thermal considerations at the package level for high-speed, high-power devices
Perform package layout, substrate routing, bump/ball maps, stack-ups, materials selection, and apply mechanical constraints
Collaborate closely with silicon design, SerDes, system, SI/PI, and reliability teams to optimize overall product performance
Interface directly with OSATs, substrate vendors, and manufacturing partners to ensure design-for-manufacturability (DFM), yield, and cost targets are met
Conduct package-related risk assessments, failure analysis, and corrective actions during bring-up and production ramp
Support NPI, qualification, and product sustainment activities, including vendor technical reviews
Requirements:
5+ years of hands-on IC package design experience for high-performance semiconductor products, with full technical ownership from concept through tape-out
Expert proficiency in IC package design tools (Cadence APD / SiP or equivalent) and hands-on experience designing complex packages (BGA, FCBGA, FCCSP)
Strong package integration expertise, including stack-ups, ball/bump maps, constraints, SMT integration, and package BOM ownership
Deep understanding of signal, power, and thermal integrity at the package level, with the ability to execute design tradeoffs based on analysis
Proven manufacturing and release experience, including running DRC/LVS/DFM, OSAT engagement, and delivering production-ready package designs
This position is open to all candidates.
 
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חברה חסויה
Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
Required Senior Board Design Engineer
About the job
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of םור direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
As a Hardware Board Design Engineer, you will own the electrical design of complex High Performance Computing (HPC) systems. You will drive the development of next-generation AI accelerator boards, ensuring they meet signal integrity, power delivery, and thermal requirements. You will work cross-functionally with Silicon (ASIC), Signal Integrity, Power, Mechanical, and Manufacturing teams to bring products from concept to mass production.
Responsibilities
Lead the schematic capture and component selection for high-density, multi-layer Printed Circuit Boards (20+ layers) incorporating high-power ASICs (TPUs/CPUs), FPGAs, and high-speed memory (High Bandwidth Memory/DDR5).
Design and validate high-speed interfaces including Peripheral Component Interconnect Express (PCIe) Gen 6.0/7.0, 400G/800G/1.6T ethernet (PAM4). Collaborate with Signal Integrity (SI) engineers to define routing constraints and stack-up.
Design multi-phase power regulators (VRMs) capable of delivering 1000A currents with fast transient response for AI processors.
Work closely with PCB layout designers to guide placement and routing of critical signals and power planes.
Lead the lab bring-up of first-silicon/first-board. Debug complex hardware issues using oscilloscopes, Time-Domain Reflectometers (TDRs), and logic analyzers. Root-cause failures to component, assembly, or design issues.
Requirements:
Minimum qualifications:
Bachelor's degree in Electrical Engineering, or equivalent practical experience.
5 years of experience in board design (schematic and layout supervision) for server, networking, or high performance computing products.
Experience in designing with serial interfaces (e.g., SerDes, PCIe, Ethernet, DDR) and signal integrity (insertion loss, crosstalk, impedance matching).
Preferred qualifications:
Experience with DC-DC power converter design and power integrity concepts.
Experience bringing up complex SoCs and debugging interaction between hardware, firmware, and software.
Proficiency with Electronic Design Automation (EDA) tools (Cadence Concept/Allegro, or similar).
This position is open to all candidates.
 
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לפני 4 שעות
Location: Haifa
Job Type: Full Time
we're seeking a highly skilled Static Timing Analysis (STA) Engineer to join our local engineering powerhouse from the ground up.

This is a unique opportunity to take on meaningful technical ownership in a new site, executing the sign-off methodology for chips that power the world's most advanced AI clusters. As an STA Engineer, you will be deeply involved in the STA activities from chip partition and time budgeting through to final sign-off. You will bridge the gap between Architecture, Design, DFT, and Physical Design to ensure our high-performance silicon meets the aggressive timing targets required for next-generation connectivity.

Key Responsibilities


Execute the STA flow and sign-off methodologies, ensuring our products meet rigorous timing criteria for the most demanding data center environments
Collaborate closely with Architecture, Design, DFT, and Backend teams, participating in timing reviews and working with block owners to navigate the path to sign-off convergence
Develop, optimize, and manage complex SDC constraints, ensuring they are accurate and robust across multi-scenario environments
Analyze and resolve challenges related to cross-chip clock distribution networks and apply sophisticated margining techniques to ensure robust silicon across all process corners
Participate in design methodology improvements and tool automation, utilizing both industry-standard EDA tools and custom scripts to make our sign-off process faster and more efficient
Requirements:
B.Sc. in Electrical Engineering or Computer Engineering
5+ years of hands-on experience in Static Timing Analysis (STA) at semiconductor companies, specifically working on advanced process technologies. (Note: Adjust years of experience based on the exact level you are targeting)
Deep expertise in multi-scenario STA, as well as timing and SDC constraint development and verification at the block and subsystem levels
Solid understanding of advanced margining methodologies, including OCV, AOCV, and POCV, from synthesis through to final sign-off
Solid knowledge of physical design flows (Synthesis, P&R, Physical Verification) and how they intersect with timing closure
This position is open to all candidates.
 
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לפני 2 שעות
חברה חסויה
Location: Haifa
Job Type: Full Time
we're seeking a talented Senior ASIC Design Engineer to help build our local engineering powerhouse from the ground up. This is an exciting opportunity to take on meaningful product ownership in a new site, designing the digital blocks that sit at the heart of our most ambitious connectivity projects.

As a Senior ASIC Design Engineer, you won't just build chips-you will be part of a team defining the next generation of AI infrastructure main components. The complex digital blocks under your micro-architecture and implementation responsibilities will power the world's largest AI clusters. You will own the journey from high-level definition through RTL implementation and backend support, transforming complex logic challenges into elegant, high-performance hardware. If you thrive on solving challenging problems in deep-submicron processes and want to contribute to the digital design foundation for AI infrastructure connectivity, this is your opportunity.

Key Responsibilities

Design Ownership & Implementation

Own the journey from high-level definition through micro-architecture, coding, and debug to backend implementation support
Tackle complex logic challenges and transform them into elegant, high-performance hardware solutions
Serve as the point of contact for your logic blocks, interacting with Architecture, Verification, and Backend teams
Quality Assurance & Design Optimization

Utilize industry-leading EDA tools (Lint, CDC, Synthesis, Timing, Power) and in-house quality assurance tools to ensure designs are robust, scalable, and power-efficient
Apply design techniques to meet PPA (Power, Performance, Area) targets
Contribute to design quality through verification and validation activities
Methodology Innovation & Collaboration

Participate in design methodology improvements and tool automation initiatives
Leverage AI assistance tools and contribute to in-house automation development to make engineering workflows faster and smarter
Collaborate effectively across teams to ensure seamless integration
Requirements:
Bachelor's degree in Electrical Engineering or related technical field
3+ years of experience in logic design at semiconductor companies
Knowledge and experience in Verilog and/or SystemVerilog
Excellent communication skills with ability to work effectively across teams
Understanding of digital design principles and RTL coding best practices
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
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עדכון קורות החיים לפני שליחה
8652213
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חברה חסויה
Location: Haifa
Job Type: Full Time
Required Senior Board Designer
Role Summary:
Serve as a key contributor within a hardware design team developing advanced ultrasound systems.
Lead and execute high‑quality PCB design with a focus on performance, reliability, manufacturability, and cost.
Collaborate with internal engineering groups and external partners to develop complex system modules.
Provide ongoing support, maintenance, and continuous improvement for legacy hardware platforms.
Job Responsibilities:
Drive the design and development of digital and analog circuitry across the full product lifecycle - from concept and prototyping through mass production.
Perform circuit analysis, simulations, and signal integrity verification for both analog and high‑speed digital designs.
Apply critical thinking and problem‑solving skills to identify issues, propose solutions, and communicate findings clearly.
Utilize Cadence/OrCAD tools for schematic capture and PCB layout.
Work effectively with cross‑functional teams, including mechanical, firmware, manufacturing, and external ODM partners.
Lead electrical design activities with external teams, ensuring technical alignment and high‑quality delivery of system sub‑modules.
Produce clear, thorough engineering documentation and communicate design decisions effectively.
Requirements:
Preferred Qualifications
Experience designing circuit boards for medical-grade devices.
Knowledge of thermal management techniques for PCB‑based systems.
Background in compact, high‑density electronics design.
Familiarity with common communication interfaces: PCIe, USB, SPI, I²C, UART
Minimum Qualifications
B.Sc. in Electrical Engineering or equivalent.
5+ years of hands-on board design experience.
Strong verbal and written communication skills in English.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
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8629892
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חברה חסויה
Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
In this role, you can lead our teams to deliver fully functional "first silicon" IP designs, from defining initial constraints through high-quality tape-out. You will have the rare and rewarding privilege of crafting upcoming products that will delight and inspire millions of customers every single day.
Responsibilities
Own the entire IP-level netlist generation and timing convergence journey, from synthesis and UPF power intent to final sign-off.
Architect and manage complex timing constraints (SDC) for both standard and custom designs, ensuring sign-off quality from day one.
Drive Full Chip and block-level timing/noise convergence, including hierarchical timing flows and power optimizations.
Collaborate closely with RTL designers to understand clock architecture, DFT teams on mode constraints, and PNR teams to achieve flawless physical convergence.
Develop and support automated block and chip-level sign-off flows, working with CAD teams to shape cutting-edge methodologies that eliminate pessimism and accelerate convergence.
Perform deep-dive signal integrity (SI) and noise analysis, drive custom IP integration, and generate block-level budgets to ensure correlation with the Full Chip.
Requirements:
B.Sc / M.Sc in Electrical Engineering.
5+ years of experience in the field, with at least 2-4 years specifically focused on ASIC timing constraints and Static Timing Analysis (STA).
Expertise in commercial STA tools (e.g., PrimeTime) and flow generation.
Deep understanding of the ASIC design flow, including hierarchical top-down design, timing closure, and backend sign-off.
Solid understanding of AC timing (from specs to implementation) and DFT modes.
Strong communication skills and a team-player mindset, with the ability to learn new flows and methods quickly.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
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8607810
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חברה חסויה
Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
Required Senior SOC DFT Engineer, Cloud
About the job
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
In this role, you will play a crucial role in Design for Testing (DFT) Architecture and DFT design, and support devices of extreme complexity to production. You will be responsible for providing technical leadership in DFT, developing flows, automation, and methodology, planning DFT activities, tracking the DFT quality matrix throughout the project life-cycle, and providing sign-off DFT to tapeout.
Responsibilities
Lead and execute activities in the design, implementation, and verification of DFT solutions for large-scale ASICs.
Develop DFT strategy and architecture, including hierarchical DFT, Memory Built-In Self Test (MBIST), and Automatic Test Pattern Generation (ATPG).
Work with other Engineering teams (e.g., Design, Verification, Physical Design) to ensure that DFT requirements are met and mutual dependencies are managed.
Manage the DFT team's workload and deliverables, provide technical leadership and guidance to the team.
Lead DFT execution of a silicon project (e.g., planning, execution, tracking, quality, and signoff).
Requirements:
Minimum qualifications:
Bachelor's degree in Electrical Engineering, Computer Engineering, or a related field, or equivalent practical experience.
8 years of experience in Automatic Test Pattern Generation (ATPG) methods.
Experience with multiple projects in DFT design and verification, DFT specification, definition, architecture, and insertion.
Experience with DFT techniques and tools, ASIC DFT synthesis, simulation, and verification flow.
Experience in leading DFT activities throughout an ASIC development flow.
Preferred qualifications:
Master's degree in Electrical Engineering or a related field.
Experience in JTAG and iJTAG protocols and architectures.
Experience in post-silicon test or product engineering.
Experience in SoC cycles, silicon bring-up, and silicon debug activities.
Knowledge of fault modeling techniques.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
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Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
Required RTL Design Technical Lead, Networking, Cloud
About the job
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
As part of our Server Chip Design team, you will use your ASIC design experience to be part of a team that creates the SoC VLSI design cycle from start to finish. You will collaborate closely with design and verification engineers in active projects, creating architecture definitions with RTL coding, and running block level simulations.
In this role, you will contribute in all phases of Application-Specific Integrated Circuit (ASIC) designs from design specification to production. You will collaborate with members of architecture, software, verification, power, timing, synthesis, etc. to specify and deliver high quality SoC/RTL. You will solve technical problems with innovative micro-architecture and practical logic solutions, and evaluate design options with complexity, performance, power and area in mind.
Responsibilities
Define the block level design documents such as interface protocol, block diagram, transaction flow, pipeline, and more.
Perform RTL development (e.g., coding and debug in Verilog, SystemVerilog, VHDL), function/performance simulation debug, and Lint/CDC/FV/UPF checks.
Participate in synthesis, timing/power, and FPGA/silicon bring-up.
Participate in test plan and coverage analysis of the block and SOC-level verification.
Communicate and work with multi-disciplined and multi-site teams.
Requirements:
Minimum qualifications:
Bachelor's degree in Electrical Engineering, Computer Engineering, Computer Science, a related field, or equivalent practical experience.
10 years of experience architecting networking ASICs from specification to production.
8 years of experience in technical leadership.
Experience in one of the following areas: arithmetic units, bus architectures, processor design, accelerators, or memory hierarchies.
Experience developing RTL for ASIC subsystems.
Preferred qualifications:
Experience working with design networking like: Remote Direct Memory Access (RDMA) or packet processing and system design principles for low latency, high throughput, security, and reliability.
Experience in TCP, IP, Ethernet, PCIE and DRAM including Network on Chip (NoC) principles and protocols (AXI, ACE, and CHI).
Experience architecting networking switches, end points, and hardware offloads.
Understanding of packet classification, processing, queuing, scheduling, switching, routing, traffic conditioning, and telemetry.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
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עדכון קורות החיים לפני שליחה
8642044
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Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
Required Senior SoC Design Verification Engineer, Cloud
About the job
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
In this role, you will work as part of a Research and Development team. You will build verification components, constrained-random testing, system testing, and drive verification closure. You will verify digital designs, collaborate closely with design and verification engineers on projects, and perform direct verification. You will build constrained-random verification environments that exercise designs through their corner-cases and expose all types of bugs. You will manage the full life-cycle of verification, which can range from verification planning, test execution, to collecting and closing coverage.
Responsibilities
Plan the verification of digital design blocks by fully understanding the design specification and interacting with design engineers to identify important verification scenarios.
Create and enhance constrained-random verification environments using SystemVerilog and UVM, or formally verify designs with SVA and industry leading formal tools.
Identify and write all types of coverage measures for corner-cases.
Debug tests with design engineers to deliver functionally correct design blocks.
Close coverage measures to identify verification holes and to show progress towards tape-out.
Requirements:
Minimum qualifications:
Bachelor's degree in Electrical Engineering or equivalent practical experience.
8 years of experience with creating and using verification components and environments in standard verification methodology.
Experience verifying digital logic at RTL level using SystemVerilog or Specman/E for FPGAs or ASICs.
Preferred qualifications:
Master's degree or PhD in Electrical Engineering, or a related field.
3 years of experience with creating and using verification components and environments in standard verification methodology.
Experience with verification techniques, and the full verification life cycle.
Experience with performance verification of ASICs and ASIC components.
Experience with Application-Specific Integrated Circuit (ASIC) standard interfaces and memory system architecture.
Experience in four or more System on a chip (SOC) cycles.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
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עדכון קורות החיים לפני שליחה
8642040
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חברה חסויה
Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
Required SoC DFT Engineer, Cloud
About the job
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
As a System on a Chip (SoC) Design for Test (DFT) Engineer, you will be responsible for defining, implementing, and deploying advanced DFT methodologies for digital or mixed-signal chips. You will define silicon test strategies, DFT architecture, and create DFT specifications for next generation SoCs. You will design and verify the DFT logic and prepare for post silicon and co-work/debug with test engineers.
Responsibilities
Develop DFT strategy and architecture (e.g., Memory Built-In Self Test (MBIST), Automatic Test Pattern Generation (ATPG), hierarchical DFT).
Complete all Test Design Rule Checks (TDRC) and design changes to fix TDRC violations to achieve high-test quality.
Insert DFT logic, boundary scan, scan chains, DFT Compression, Logic Built-In Self Test, Test Access Point (TAP) controller, clock control block, and other DFT IP blocks.
Insert MBIST logic including test collar around memories, MBIST controllers, eFuse logic, and connect to core and TAP interfaces.
Document DFT architecture, test sequences, and boot-up sequences associated with test pins.
Requirements:
Minimum qualifications:
Bachelor's degree in Electrical Engineering, a related field, or equivalent practical experience.
4 years of experience with Design For Test (DFT) methodologies, DFT verification, and industry-standard DFT tools.
Experience with ASIC DFT synthesis, simulation, and verification flow.
Experience in DFT specification, definition, architecture, and insertion.
Preferred qualifications:
Master's degree in Electrical Engineering, or a related field.
Experience working with ATE engineers (e.g., silicon bring-up, patterns generation, debug, validation on automatic test equipment, debug of silicon issues).
Experience in IP integration (e.g., memories, test controllers, Test Access Point (TAP), and Memory Built-In Self Test (MBIST)).
Experience in SoC cycles, silicon bringup, and silicon debug activities.
Experience in fault modeling.
This position is open to all candidates.
 
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עדכון קורות החיים לפני שליחה
עדכון קורות החיים לפני שליחה
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