דרושים » חשמל ואלקטרוניקה » IC Package Layout Designer

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לפני 6 שעות
חברה חסויה
Location: Caesarea and Tel Aviv-Yafo
Job Type: Full Time and Hybrid work
Required IC Package Layout Designer
Job Description
Meet the Team
Join the Package Design Team at Silicon One in Israel, a group leading the way in developing our groundbreaking silicon solutions for next-generation networking. As a collaborative team at the center of our silicon development, we design and optimize advanced package solutions for some of the industrys most sophisticated ASICs. Youll work directly with experts in layout, signal integrity, and power distribution, shaping innovative methodologies and driving the evolution of high-performance networking technologies.
Your Impact
This role offers a unique opportunity to make a significant impact on the future of networking innovation within the Silicon One initiative. As a layout engineer, you will drive the entire package design layout process-from planning and optimization to execution-ensuring the delivery of high-speed, robust, and scalable solutions for global networks. You will work closely with engineers, define strategies, and collaborate across multi-functional teams to accelerate the creation of industry-leading packages. Youll join a passionate community dedicated to changing how the world connects, works, and learns, while building strong partnerships and fostering collective success.
Responsibilities:
Lead package layout design while planning and driving schedules from initial concept through full implementation.
Optimize package pinouts, stack-ups, power distribution, and high-speed routing, balancing performance and manufacturability
Collaborate with signal integrity (SI) and power integrity (PI) teams to ensure design quality and efficiency
Enhance design methodologies and partner with vendors to improve product quality and efficiency
Drive innovation in package solutions for our next-generation ASICs.
Requirements:
Minimum Qualifications
3+ years of experience with industry-standard EDA layout and design tools, including APD+ and Allegro.
Experience in PCB or Package layout design, with strong understanding of high-speed signals and power distribution networks (PDN)
Ability to work with and support multiple staff members at the same time
Preferred Qualifications
Bachelor's degree in electrical engineering or a related field
Experience in ASIC layout package design (in APD+), including pinout optimization and high-speed routingץ
Proven ability to lead design improvements and coordinate with stakeholdersץ
Excellent verbal and written communication skills in English.
Scripting experience (Python, Perl, TCL, shell programming) is highly valuable.
This position is open to all candidates.
 
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10/05/2026
Location: More than one
Job Type: Full Time
We are looking for best-in-class Physical Design Engineers to join our outstanding Networking Silicon engineering team, developing the industry's best high-speed communication devices, delivering the highest throughput and lowest latency! Come and take a part in designing our groundbreaking and innovating chips, enjoy working in a meaningful, growing and highly professional environment where you make a significant impact in a technology-focused company.
What you'll be doing:
You will be responsible for chip floorplan and pin placement, ensuring integration within our innovative builds.
We expect you to run, debug, and approve Physical Verification flows across multiple projects, ensuring strict adherence to our high standards.
You will perform physical layout implementation, planning and optimization, contributing to the development of our groundbreaking chips.
Requirements:
What we need to see:
B.SC./ M.SC. in Electrical Engineering
You should have at least 5+ years of hands-on layout experience, demonstrating your proven expertise.
A strong background in Physical Verification methodology, including ERC, LVS and DRC, is necessary.
In-depth knowledge of advanced silicon process technologies.
Familiarity with physical build EDA tools, including Synopsys and Cadence.
A great teammate who thrives in a collaborative environment.
AI tools orientation or alternatively a desire to learn.
Ways to stand out from the crowd:
Experience in Linux environments.
TCL, Python, shell scripting abilities.
Experience with data collection and analysis
Understanding of the chip and die verification process.
This position is open to all candidates.
 
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