Requirements:
Required
B.Sc. in Electrical Engineering, Computer Engineering, or equivalent experience.
8+ years of proven experience as a board designer executing complex high-speed digital hardware projects through complete manufacturing cycles.
Deep, hands-on experience designing with Intel processors and implementing COM Express (COMe) architectures, alongside modern GPUs, FPGAs, or SoCs.
Proven track record routing and debugging a wide variety of hardware interfaces (Ethernet, PCIe, USB, MIPI, high-speed memory architectures).
Expertise leading multi-layer PCB design involving fine-pitch BGAs, high-density interconnects (HDI), via-in-pad structures, and strict layout subcontractor management.
Strong foundation in SI/PI fundamentals, simulation workflows, and hands-on laboratory debugging using high-bandwidth scopes and logic/protocol analyzers.
Personal Attributes: Exceptional independent project execution skills, strong problem-solving mindset, and excellent interpersonal skills to lead multi-disciplinary alignments.
Preferred
High proficiency with Altium Designer and advanced simulation toolsets (HyperLynx, Ansys, or equivalent).
Experience managing configuration and manufacturing parameters within Arena PLM.
Familiarity with regulatory frameworks and test standards (FCC/CE/MIC compliance, EMI/EMC shielding validation).
A foundational understanding of RF fundamentals to assist with mixed-signal isolation planning.

Requirements:
B.Sc. or M.Sc. in Electrical Engineering.
5+ years of experience in Power Integrity, Hardware Design, or related disciplines.
Strong understanding of power delivery networks, decoupling methodologies, and target impedance concepts.
Hands-on experience with PI simulation tools such as:
Cadence Sigrity PowerSI / OptimizePI
Ansys SIwave
Ansys HFSS
PowerDC or equivalent
Experience designing high-layer-count PCBs for networking, telecom, server, or data-center products.
Knowledge of high-speed digital systems and interaction between Signal Integrity and Power Integrity.
Experience with multi-phase voltage regulators, power sequencing, and power management architectures.
Strong understanding of PCB materials, stackups, and manufacturing constraints.
Experience performing lab validation and correlation measurements.
Excellent problem-solving, communication, and teamwork skills.
Preferred Qualifications:
Experience with high-performance networking ASICs and switch silicon.
Familiarity with 112G/224G/448G PAM4 SerDes technologies.
Experience with Ethernet systems ranging from 400G to 1.6T and above.
Understanding of package-level PI and advanced packaging technologies.
Familiarity with optical networking platforms and co-packaged optics.
Experience with thermal and mechanical effects on PDN performance.
Knowledge of EMI/EMC considerations in high-density networking systems.
Experience working with ODMs, CMs, and global manufacturing partners.

Requirements:
Basic Qualifications
- B.Sc. in Electrical Engineering from a recognized university.
- At least 10 years of proven hands-on experience in high-speed digital, power, and embedded system board design.
- Extensive experience in schematic capture and PCB layout reviews.
- Strong hands-on experience with laboratory equipment, including oscilloscopes, spectrum analyzers, and network analyzers.
- Deep system-level understanding with strong analytical and troubleshooting skills.
- Ability to work effectively in a multidisciplinary environment and collaborate across engineering disciplines.
- Self-driven and capable of making independent technical decisions within areas of expertise.
- Proactive and adaptable, with the ability to thrive in a fast-paced environment while maintaining high-quality deliverables.

Preferred Qualifications
- Experience with DDR4 and DDR5 memory subsystem design and validation.
- Experience with PCI Express Gen5 and newer standards.
- Familiarity with signal integrity and power integrity analysis methodologies.
- HDL (Verilog/VHDL/SystemVerilog) development or debugging experience.
- Experience with high-speed interfaces, FPGA-based systems, and complex embedded platforms.

Requirements:
Bachelor's degree in Electrical Engineering
7+ years of experience in board design working on multidisciplinary products
Experience in board design tools, preferably Siemens EDM / Xpedition
Deep understanding of Signal Integrity (SI) and Power Integrity (PI)
Experience in digital circuits design, power design, and analog circuit design
Strong lab debugging & root-cause analysis skills using tools such as oscilloscopes and signal analyzers for problem solving.
Experience with DDR design constraints and validation
Familiarity with PLM tools, especially Windchill
Advantages
Experience with FPGA-based systems
Experience in medical devices or other regulated industries
Background in thermal design and power optimization

Requirements:
* Actively participate in hands on PCB design including schematics creation and layout work using industry standard EDA tools.
* Participate in the development of next-generation electro-optical (EO) devices and sub-systems for high-speed communication.
* Support electro-optic sub-systems and evaluation boards through schematic design, component selection, characterization, layout considerations, and implementation. Provide guidance on fabrication and assembly.
* Utilize advanced PCB technologies including mSAP, high-density HDI, and state-of-the-art PCB materials optimized for high-speed signal integrity supporting speeds up to 224 Gbps.
* Lead board bring-up, characterization, and debug, including high-speed scope and VNA measurements.
* Collaborate with hardware project teams, including Production, Software/Firmware, Photonics, and system.
* Support customers by reviewing schematics and PCB layouts, providing guidance to ensure robust design and high-speed performance.
* Utilize state-of-the-art laboratory equipment. Requirements What Were Looking For:
* B.Sc. in Electrical Engineering.
* 8+ years as a board designer with experience in executing complex hardware projects.
* Extensive experience designing high-speed PCBs, covering impedance control, length matching, and SI/PI best practices for standards such as Gigabit Ethernet and PCIe.
* Hands-on experience with Cadence tools (Allegro, OrCAD) for schematic capture and PCB layout.
* Experience in design ownership on major blocks/clusters from definition through implementation phases.
* Strong hands-on laboratory skills and debugging capabilities.
* Skilled in working with advanced PCB materials and high-density PCB technologies, including complex stackups and fine-pitch routing.
* Strong project management skills, independence, and excellent interpersonal abilities.
* Strong understanding of transmission lines, impedance control, crosstalk, and return-path design.
* Familiarity with lab equipment such as oscilloscopes, VNAs, and spectrum analyzers. What Will Make You a Star Candidate:
* Proven proficiency in ANSYS HFSS / SIwave / 3D Layout for electromagnetic, SI, and PI simulations.
* Ability to interpret and simulate S-parameters, eye diagrams, and frequency-domain models.
* Experience in PCB design involving high-speed DSPs, including power integrity, signal-integrity constraints, and high-speed interface routing.
* Practical experience with high-speed sampling oscilloscopes and optical spectrum analyzers.
* Experience with optical transceivers.
* Knowledge of photonic integration technology and its ecosystem.
* Experience in lab automation using Python -based tools.

Requirements:
What we need to see:

B.Sc. in Electrical Engineering (or equivalent experience).

5+ years of industry experience in signal and/or power integrity for high-speed board or system designs.

Strong understanding of electromagnetics, transmission line theory, PDN behavior and their application.

Expert-level proficiency with EM and PI tools (for example, Ansys HFSS/Q3D/SIwave, CST, or equivalent) and SPICE-based time-domain simulations.

Proven experience in PDN analysis, including model generation, impedance targets, resonance mitigation and time-domain noise simulations.

Hands-on lab experience with VNA, TDR and oscilloscopes for PI/SI validation, de-embedding and model correlation.

Ability to work independently in an intense, multi-disciplinary environment with strong ownership and excellent interpersonal skills.


Ways to stand out from the crowd:

Deep experience designing PDNs for complex multilayer boards with high-current, low-voltage rails supporting advanced networking or compute ASICs.

Demonstrated background in PI co-simulation flows, PSIJ analysis and end-to-end system modeling (die-package-board).

Experience with scripting and data analysis using MATLAB, Python or C for simulation automation and large-signal data processing.

Exposure to advanced packaging and interconnect technologies (for example, TSV, high-speed connectors, advanced laminates).

Practical knowledge of PCB fabrication, product qualification flows and lab debug of complex high-speed boards.

Requirements:
5+ years of hands-on IC package design experience for high-performance semiconductor products, with full technical ownership from concept through tape-out
Expert proficiency in IC package design tools (Cadence APD / SiP or equivalent) and hands-on experience designing complex packages (BGA, FCBGA, FCCSP)
Strong package integration expertise, including stack-ups, ball/bump maps, constraints, SMT integration, and package BOM ownership
Deep understanding of signal, power, and thermal integrity at the package level, with the ability to execute design tradeoffs based on analysis
Proven manufacturing and release experience, including running DRC/LVS/DFM, OSAT engagement, and delivering production-ready package designs
Preferred Qualifications
Experience with AI, networking, PCIe, CXL, or other high-speed data center interfaces
Familiarity with package reliability standards and qualification (JEDEC, IPC, thermal cycling, HTOL, etc.)
Experience supporting chiplet-based architectures and heterogeneous integration
Demonstrated track record of complete technical package ownership on high-volume products.

Requirements:
Basic Qualifications
- Bachelor's degree in Electrical Engineering, Computer Engineering, or related field.
- 5+ years of experience in hardware design or development.
- Strong understanding of digital circuit design fundamentals and PCB design.
- Experience with high-speed interfaces (PCIe, DDR, SerDes, Ethernet, or similar) and hands-on lab equipment.

Preferred Qualifications
- Familiarity with SI/PI simulation tools (HFSS, PowerSI, ADS, or similar).
- Understanding of transmission line theory, impedance concepts, and S-parameters.
- Experience with scripting (Python, MATLAB, or similar) for data analysis.
- Knowledge of PCB stackup design, material properties, and power delivery networks.
- Experience with hardware validation and production testing.
- Experience working on complex multi-layer PCB designs.

Requirements:
B.Sc. in Electrical Engineering.

3+ years of hands-on hardware design experience - High advantage.


Experience with:

Schematic design and PCB layout guidance.

High-speed digital and mixed-signal design.

Power design (DC/DC, PoE or similar).

Experience in debugging hardware at board and system level.

Familiarity with lab equipment (oscilloscope, spectrum analyzer, etc.).

Strong analytical and problem-solving skills.