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Requirements:
all you need is:
b.sc. or m.sc. in electrical engineering, materials science, or a related field.
3+ years of experience in semiconductor package design and assembly.
deep knowledge of package design, substrate engineering, and simulation methodologies.
hands-on experience with package layout tools such as cadence allegro package designer or xpedition package designer.
solid understanding of high-speed layout constraints (e.g., crosstalk, emi, rfi) and proven experience with interfaces like ddr, pcie, mipi, and ufs.
strong background in schematic review, capture, and system -level integration.
proficiency in scripting for automation and design optimization with tools like matlab or Python - advantage.
proficiency in layout design verification tool such as cam350- advantage.
experience working directly with osats - advantage.
proven experience with sipi simulation tools like ansys siwave, ansys hfss, cadence sigrity and siemens hyperlynx - advantage.
proven experience with thermal or thermo-mechanical simulation tools like cadence celsius, ansys icepak, ansys mechanical and flotherm - advantage.

Requirements:
all you need is:
b.sc. or m.sc. in electrical engineering, materials science, or a related field.
3+ years of experience in semiconductor package design and assembly.
deep knowledge of package design, substrate engineering, and simulation methodologies.
hands-on experience with package layout tools such as cadence allegro package designer or xpedition package designer.
solid understanding of high-speed layout constraints (e.g., crosstalk, emi, rfi) and proven experience with interfaces like ddr, pcie, mipi, and ufs.
strong background in schematic review, capture, and system -level integration.
proficiency in scripting for automation and design optimization with tools like matlab or Python - advantage.
proficiency in layout design verification tool such as cam350- advantage.
experience working directly with osats - advantage.
proven experience with sipi simulation tools like ansys siwave, ansys hfss, cadence sigrity and siemens hyperlynx - advantage.
proven experience with thermal or thermo-mechanical simulation tools like cadence celsius, ansys icepak, ansys mechanical and flotherm - advantage.

Requirements:
all you need is:
bsc or msc degree in electrical engineering.
7+ years of experience as ic product/ TEST engineer.
hands on experience in bring-up & productization of complex ic products.
prior experience with teradyne ultraflex/ultraflexplus is - significant advantage.
deep understanding of structural dft methods (scan, mbist, jtag,).
proficiency in C / C ++ and scripting language ( PERL, Python,) in Unix environment.
experience with data and yield analysis using known statistical methods and tools (e.g. jmp).
familiarity with verilog and rtl behavioral simulations - an advantage
strong sense of ownership, commitment, and responsibility.
team player, with the ability to work in a rapidly evolving environment.
good interpersonal communication skills.

Requirements:
all you need is:
bsc/msc in electrical engineering, physics, materials engineering or related field.
5+ years of experience in semiconductor q&r, preferably with socs, asics, vlsi, or RF ics.
strong knowledge of semiconductor physics, packaging technologies, materials and reliability mechanisms.
knowledge and experience with RF reliability concerns.
experience with advanced packaging q&r (e.g., fccsp, fcbga).
hands-on experience with q&r TEST design and environmental stress testing.
deep understanding of failure prediction models, reliability simulations, and statistical analysis.
high proficiency in english, including strong verbal, reading, and writing skills.
expertise in automotive q&r standards, including aec-q100, iatf 16949, and jedec/iso/ieee protocols -advantage.
exposure to radar or adas/av automotive systems q&r - advantage.

Requirements:
all you need is:
bsc/msc in electrical engineering, physics, materials engineering or related field.
5+ years of experience in semiconductor q&r, preferably with socs, asics, vlsi, or RF ics.
strong knowledge of semiconductor physics, packaging technologies, materials and reliability mechanisms.
knowledge and experience with RF reliability concerns.
experience with advanced packaging q&r (e.g., fccsp, fcbga).
hands-on experience with q&r TEST design and environmental stress testing.
deep understanding of failure prediction models, reliability simulations, and statistical analysis.
high proficiency in english, including strong verbal, reading, and writing skills.
expertise in automotive q&r standards, including aec-q100, iatf 16949, and jedec/iso/ieee protocols -advantage.
exposure to radar or adas/av automotive systems q&r - advantage.

Requirements:
all you need is:
b.sc in electronic engineering or equivalent experience
5+ years experience in high-speed design
having a detailed knowledge of circuit design and consideration for layout, routing, and timing constraints, dfm, dfa, dft constraints in volume manufacturing is needed for this role.
be an authority in using pcb design tools (mentor - a must, more tools - advantage)
have a deep understanding of pcb signal integrity and power integrity.
knowledge in pcb manufacturing processes for hdi, standard thru-hole, and back-drilling.
strong verbal and written communication skills in english

Requirements:
what we need to see
bsc in electrical engineering, computer engineering, Computer Science, or equivalent; msc is an advantage or equivalent experience.
10+ overall years of experience in networking, fw phy, serdes, or system -level development / application engineering
4+ years of team management experience
proven technical leadership and people management experience ( team lead or manager).
strong understanding of high-speed networking, ethernet, infiniband, nvlink and pcie and system bring-up.
experience working directly with customers, oems/odms, or large-scale deployments.
high-level communication and presentation skills, including the ability to present to executives and customers.
strong interpersonal skills and a collaborative mindset in a multi-site, multicultural environment.
proven record of leading critical customer escalations to successful resolution.
ways to stand out from the crowd
experience with nvidia networking products (spectrum switches, bluefield dpus, connectx adapters).
hands-on work with transceivers, cables, and high-speed signal integrity.
firmware development experience in a networking or semiconductor company.
knowledge of networking protocols, scripting languages ( Python, bash, etc.), and deep problem-solving in complex systems.
demonstrated ability to build and scale application engineering or field teams and improve processes.

Requirements:
what we need to see:
bachelors or masters degree in electrical engineering, computer engineering, or a related field.
8+ years of experience in hardware/ system TEST engineering, preferably in the semiconductor, computing, or high-performance systems industries.
deep understanding of system architecture, including cpus, gpus, memory subsystems, i/o, and power delivery.
proven experience developing and executing validation plans for complex hardware systems.
strong debugging skills and experience with hardware TEST equipment (oscilloscopes, logic analyzers, etc.).
familiarity with firmware, bios, and low-level software stack interactions.
proficient in scripting and automation ( Python, PERL, bash, etc.).
ways to stand out from the crowd:
excellent communication, collaboration, and leadership skills.
experience working in cross-functional environments and managing validation efforts across global teams.

Requirements:
what we need to see:
bsc or equivalent experience in mechanical engineering / materials engineering / physics or similar
10+ years of experience,at least 5 years of experience with complex asic package development and manufacturing
experience co-working with subcontractors and vendors
vision and focus for projects and team
curious and creative problem solver as well as organized and multi-tasker
team oriented, able to move and motivate peers. strong interpersonal skills (verbal and written)
high awareness of quality, manufacturability and project schedule
ways to stand out of the crowd:
hands-on fea mechanical simulation experience
team / group / project management - advantage
experience with manufacturing environment and manufacturing statistics tools (for example - jmp)
background in semiconductor manufacturing processes

Requirements:
what we need to see:
bsc in electrical/computer engineering or msc in mathematics, or equivalent experience.
5+ years of relevant experience.
excellent analytical, logical reasoning and problem-solving skills.
strong debugging and analytical skills.
strong communication and interpersonal skills are required.

Requirements:
what we need to see:
b.sc. in Computer Science / computer engineering / electrical engineering
5+ years of professional experience
strong C / C ++ capabilities
excellent understanding of data structures and algorithms fundamentals
strong analytical, debugging and problem-solving skills
motivated and independent with strong interpersonal skills
ways to stand out from the crowd:
knowledge of network protocols
prior verification experience
real time programming
knowledge in Storage protocols
experience with agile methods

Requirements:
what we need to see:
a minimum of 5 years of meaningful experience and a relevant education
experience with cadence custom circuit design tools and skill language.
experience running and debugging drc and lvs with verification tools such as icv, calibre.
effectively teamwork, good interpersonal skills, passion, and positive energy.
very good english.

Requirements:
what we need to see:
b.sc. or above in electrical engineering or computer engineering.
5+ years of validated experience.
professional verification experience, knowledge in advanced verification methodologies and tools.
a team player with excellent communication and interpersonal skills.
strong debugging, problem solving and analytical skills.
demonstrates deep understanding in design and verification logic.
self-motivated, ability to work independently and drive tasks to completion. 
ways to stand out from the crowd:
prior design or verification experience of high-speed interconnects, smart nic and/or SOC.
experience in developing verification environments in Specman and/or prior knowledge in verilog.
knowledge in network protocols.

Requirements:
what we need to see:
b.sc. in electrical engineering, materials engineering, or equivalent
5+ years of relevant industry experience
strong background in statistics and Big Data analysis (jmp, Python, power BI, sql)
solid understanding of electronic circuits
strong software and scripting skills
excellent presentation and communication skills
proven problem solving and prioritization abilities
ability to communicate effectively across diverse teams and functions
ways to stand out from the crowd:
experience with optical networking technologies
physical layer (phy / layer 1) networking verification experience
hands-on experience designing and executing reliability experiments