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In this role, you will be managing the MBBU projects involving multiple domains including: VLSI architecture, VLSI Design, VLSI verification, VLSI backend, Algorithms and Software. These projects include development of products like cellular modems, Communication Digital Signal Processors and Radar/Lidar baseband with a total of up to 100 R&D engineers involved.

This role is reporting to the MBBU General Manager.

Responsibilities

Full ownership on all R&D projects of the Mobile Business Unit, including Software, VLSI and Algorithms tasks.

Direct management for the PMO

We are seeking a highly skilled and motivated VLSI Backend Team Leader to join and lead our dynamic team.

As part of this position, you will lead a team of experienced engineers working on parallel projects, and play a crucial role in the design and implementation of complex designs, flow development, and the latest technology node bring-up and integration.

The Backend team leader will be required to do 50% hands on work and 50% managerial work.

What youll be doing:
Working closely with product design engineers, you'll perform PCB layout of high speed/high-density value-conscious PCBs for all our business units (GPU Desktop, Notebook, Automotive, Professional, Data Center, Deep Learning, and AI), all using Cadence PCB design tools.
Focus will be on the complete development of CAD layout from symbol creation, floor planning, and detailed component placement, constraints management, with a concept of topology and signal/trace integrity.
You will be responsible for the design releases required generation of artwork files, ODB++, and electronic PCB documentation.
Your designs will need to follow SI constraints, EMI/RFI control and FCC, UL and European regulations, IPC specifications and NRC regulations.

What youll be doing:
Working closely with product design engineers, you'll perform PCB layout of high speed/high-density value-conscious PCBs for all business units at NVIDIA (GPU Desktop, Notebook, Automotive, Professional, Data Center, Deep Learning, and AI), all using Cadence PCB design tools.
Focus will be on the complete development of CAD layout from symbol creation, floor planning, and detailed component placement, constraints management, with a concept of topology and signal/trace integrity.
You will be responsible for the design releases required generation of artwork files, ODB++, and electronic PCB documentation.
Your designs will need to follow SI constraints, EMI/RFI control and FCC, UL and European regulations, IPC specifications and NRC regulations.

Change the world. Love your job.
Do you strive to understand how electronics work, and enjoy debugging, coding and/or solving technical problems? Here's your chance to innovate for the future! Applications Engineer Interns at our company are technical experts who are focused on leading-edge digital, mixed signal and analog products. We have a strong customer commitment and a great team spirit. If you are looking for an interesting and challenging position with a wide range of exciting responsibilities, you've come to the right place.
In this position, you'll work directly with TI customers to determine their major design challenges and partner with them on creating solutions that focus on ease-of-use and add value to their solution. You may also spend hands-on time in a TI lab tackling problems and delivering innovative development solutions that support our products and drive revenue.
Some of your responsibilities will include, but are not limited to:
Working with design, marketing, sales, and product definition teams to successfully launch new products into the market
Promoting TI products and providing appropriate technical solutions to customers to solve their design challenges
Providing technical support to customers by reviewing designs, debugging problems, and answering questions.