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לפני 8 שעות
Location: Ra'anana
Job Type: Full Time
We are looking for an experienced Senior Signal Integrity Engineer to join our Hardware Engineering team. This role focuses on ensuring optimal signal integrity for high-speed interfaces, including Ethernet, PCIe, DDR5, and other next-generation technologies. As part of the team, you will be responsible for performing signal integrity analysis, developing signal integrity models, and ensuring electrical compliance for high-speed SERDES I/Os.
Responsibilities:
Conduct signal integrity analysis and simulations for high-speed interfaces such as 112Gbps Ethernet, PCIe Gen5, and DDR5 interfaces.
Develop and implement signal integrity guidelines for PCB design, ensuring high-performance and low-loss signal paths.
Analyze and resolve signal integrity issues related to high-speed interfaces, including reflection, crosstalk, and power delivery network (PDN) issues.
Collaborate with PCB layout engineers to optimize design for signal integrity, ensuring compliance with electrical standards and high-speed design best practices.
Perform time-domain and frequency-domain analysis, including loss, jitter, and eye-diagram analysis.
Utilize EDA tools such as Ansys SIWAVE, HFSS, or similar for simulation and validation of signal integrity designs.
Work closely with cross-functional teams to integrate signal integrity considerations into the overall hardware design process.
Develop behavioural models based on measured signal integrity data to inform future design and simulation work.
Conduct pre- and post-layout simulations and measurements for high-speed signal interfaces.
Requirements:
Bachelor's or Masters degree in Electrical/Electronics Engineering with 10+ years of relevant experience.
Strong understanding of electromagnetic (EM) concepts and transmission line theory.
Extensive experience in signal integrity analysis for high-speed serial interfaces, including Ethernet, PCIe, and DDR5.
Proficiency in using EDA tools like Ansys SIWAVE, HFSS, or similar.
Hands-on expertise in time-domain and frequency-domain analysis, jitter, loss, and eye-diagram analysis.
Strong background in HSPICE simulations and model development.
Experience with PCB layout techniques for high-speed designs.
Excellent communication skills and the ability to work effectively in a collaborative team environment.
Advantages:
Experience with advanced simulation tools and techniques.
Experience with high-speed interfaces such as 112Gbps PAM4 Ethernet, PCIe Gen5, and DDR5.
In-depth knowledge of high-speed PCB design and layout principles.
Familiarity with power integrity and power noise simulations.
This position is open to all candidates.
 
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לפני 8 שעות
חברה חסויה
Location: Ra'anana
Job Type: Full Time
we are seeking a highly motivated Power Integrity Engineer to join our Hardware Engineering team. In this role, you will be responsible for defining, analyzing, simulating, and validating power delivery networks (PDNs) for next-generation networking platforms supporting high-performance ASICs, advanced SerDes interfaces, optical modules, and AI-scale networking systems.
You will work closely with hardware architects, PCB designers, ASIC teams, signal integrity engineers, mechanical engineers, and manufacturing partners to ensure robust power delivery, optimal system performance, and successful product deployment.
Responsibilities
Lead Power Integrity (PI) activities throughout the hardware development lifecycle, from architecture through production.
Define and optimize board-level and package-level Power Delivery Networks (PDNs) for high-current networking ASICs and supporting devices.
Perform pre-layout and post-layout PI simulations using industry-standard tools.
Establish target impedance requirements and validate compliance across all power rails.
Analyze DC voltage drop, AC impedance, transient response, and power distribution performance.
Collaborate with PCB layout engineers to optimize stackups, plane structures, decoupling strategies, and power routing.
Work closely with Signal Integrity engineers to ensure SI/PI co-optimization of high-speed interfaces.
Develop power integrity design guidelines and best practices for next-generation networking products.
Support schematic reviews, layout reviews, and design sign-off activities.
Perform laboratory measurements and correlation using oscilloscopes, VNAs, power analyzers, current probes, and related equipment.
Investigate and resolve PI-related issues during board bring-up, validation, and production.
Collaborate with ASIC, FPGA, memory, optics, and power component vendors to optimize overall system performance.
Drive continuous improvement of PI methodologies, simulation flows, and validation processes.
Requirements:
B.Sc. or M.Sc. in Electrical Engineering.
5+ years of experience in Power Integrity, Hardware Design, or related disciplines.
Strong understanding of power delivery networks, decoupling methodologies, and target impedance concepts.
Hands-on experience with PI simulation tools such as:
Cadence Sigrity PowerSI / OptimizePI
Ansys SIwave
Ansys HFSS
PowerDC or equivalent
Experience designing high-layer-count PCBs for networking, telecom, server, or data-center products.
Knowledge of high-speed digital systems and interaction between Signal Integrity and Power Integrity.
Experience with multi-phase voltage regulators, power sequencing, and power management architectures.
Strong understanding of PCB materials, stackups, and manufacturing constraints.
Experience performing lab validation and correlation measurements.
Excellent problem-solving, communication, and teamwork skills.
Preferred Qualifications
Experience with high-performance networking ASICs and switch silicon.
Familiarity with 112G/224G/448G PAM4 SerDes technologies.
Experience with Ethernet systems ranging from 400G to 1.6T and above.
Understanding of package-level PI and advanced packaging technologies.
Familiarity with optical networking platforms and co-packaged optics.
Experience with thermal and mechanical effects on PDN performance.
Knowledge of EMI/EMC considerations in high-density networking systems.
Experience working with ODMs, CMs, and global manufacturing partners.
This position is open to all candidates.
 
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29/09/2026
Location: Ra'anana and Yokne`am
Job Type: Full Time
Our HW team in Israel is looking for an experienced system/board designer to join the Hardware Switch Group. The team leads the development of networking infrastructure for our next-generation data centers focusing on accelerated performance while enabling optimized end to end GPU connectivity.

What you'll be doing:

Perform board bring-up, hardware validation, characterization, and system-level debugging in the lab.

Debug issues involving power, signal integrity, interfaces, components, firmware interactions, and system behavior.

Support productization, production-line stabilization, and hardware-related issues during mass production.

Read and analyze schematics, PCB layouts, component specifications, design documentation, and manufacturing data.

Define test strategies, develop validation plans, execute test procedures, and improve coverage and efficiency.

Collaborate closely with electrical, mechanical, thermal, firmware, software, system, manufacturing, and quality teams throughout the product lifecycle.

Provide technical leadership and hands-on support for critical hardware issues.
Requirements:
What we need to see:

B.Sc. in Electrical Engineering (or equivalent experience).

At least 8 years of hands-on experience in hardware bring-up, validation, debugging, or product engineering.

Proven board-level and system-level debugging capabilities.

Strong ability to read and understand electrical schematics and PCB layouts.

Experience using laboratory equipment and applying structured troubleshooting methodologies.

Strong problem-solving skills, technical curiosity, and attention to detail.

Ability to work effectively in a dynamic, multidisciplinary environment and manage several activities in parallel.

Strong communication and teamwork skills.

Ways to stand out from the crowd:

Experience with high-speed interfaces such as Ethernet, PCIe, SerDes, I²C, SPI, or similar technologies and supporting NPI, manufacturing lines, production stabilization, failure analysis, or yield-improvement activities.

Familiarity with manufacturing processes, test stations, boundary scan, ICT, or functional testing.

Experience working with contract manufacturers, suppliers, or component vendors.

Familiarity with bug-tracking, failure-analysis, or PLM tools.

Experience developing networking, server, data-center, or high-performance computing hardware.
This position is open to all candidates.
 
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29/09/2026
Location: Ra'anana and Yokne`am
Job Type: Full Time
Our Hardware team in Israel is looking for a highly experienced System and Board Design Technical Leader to join our Hardware Switch Group. The team leads the development of networking infrastructure for our next-generation data centers, focusing on accelerated performance and optimized end-to-end GPU connectivity. In this role, you will combine deep hands-on board-design expertise with broad technical leadership across multiple switch programs. You will lead products from architecture and concept definition through detailed design, validation, qualification, and mass production, while driving technical alignment, design reuse, and risk management across the project portfolio. Our Networking division is a leading supplier of innovative end-to-end InfiniBand and Ethernet connectivity solutions for servers, storage, and accelerated data centers. Our products deliver industry-leading performance, bandwidth, and scalability across AI, machine learning, cloud computing, and high-performance computing applications.

What youll be doing:

Lead complex switch system and board designs from concept through qualification, production ramp, and mass production, serving as the technical focal point and key decision-maker.

Maintain a broad technical view across multiple projects, identifying common risks, cross-project dependencies, opportunities for reuse, and long-term architectural needs.

Define product, system, and board-level requirements, architectures, interfaces, and technical tradeoffs.

Own and guide the detailed electrical design, including schematics, component selection, power architecture, connectivity, and CPLD/FPGA implementation.

Lead multidisciplinary collaboration across board design, mechanics, thermal, signal and power integrity, PCB layout, software, firmware, RTL, validation, manufacturing, and quality.

Guide and review complex multilayer PCB layouts, ensuring signal integrity, power integrity, reliability, manufacturability, cost, and performance requirements are met.

Perform hands-on board bring-up, integration, validation, and debugging using advanced laboratory equipment, and lead complex root-cause investigations.

Drive qualification, NPI, production-line stabilization, and mass-production support, ensuring technical issues are resolved and lessons learned are applied across projects.
דרישות:
What we need to see:

B.Sc. in Electrical Engineering or equivalent relevant experience.

10+ years of experience in complex board design and hardware-system development, preferably across the complete product lifecycle.

Proven ability to maintain a system-level and portfolio-level perspective while successfully driving the execution of detailed hardware designs.

Demonstrated experience leading multidisciplinary projects, technical reviews, architecture decisions, and complex problem-solving activities.

Deep knowledge of electrical schematics, component selection, advanced multilayer PCB design, and layout implementation.

Strong experience with high-current power-delivery design and a comprehensive understanding of CPLD/FPGA and RTL implementations.

Strong hands-on laboratory skills, including board bring-up, system integration, validation, debugging, and root-cause analysis.

Independent and proactive leadership, with strong project-management, communication, mentoring, and interpersonal skills.

Ways to stand out from the crowd

Experience developing data-center switches or other high-performance networking systems and taking complex hardware products from concept through high-volume manufacturing.

Proven high-speed design experience with interfaces operating at 25 Gb/s and above.

Experience defining reusable architectures and driving technical alignment across multiple products.

Strong knowledge of embedded systems, advanced PCB technologies, signal integrity, and power integrity.

Experience working with ODMs, contract manufacturers, silicon vendors, and compone המשרה מיועדת לנשים ולגברים כאחד.
 
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הגשת מועמדותהגש מועמדות
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28/09/2026
חברה חסויה
Location: Ra'anana and Yokne`am
Job Type: Full Time
We have continuously reinvented itself over two decades. Our invention of the GPU in 1999 sparked the growth of the PC gaming market, redefined modern computer graphics, and revolutionized parallel computing. More recently, GPU deep learning ignited modern AI - the next era of computing. we are a learning machine that constantly evolves by adapting to new opportunities that are hard to seek, that only we can pursue, and that matter to the world. This is our lifes work, to amplify human creativity and intelligence. Make the choice to join us today.

What youll be doing:

Working closely with product design engineers, you'll perform PCB layout of high speed/high-density value-conscious PCBs for all business units in our company (GPU Desktop, Notebook, Automotive, Professional, Data Center, Deep Learning, and AI), all using Cadence PCB design tools.

Focus will be on the complete development of CAD layout from symbol creation, floor planning, and detailed component placement, constraints management, with a concept of topology and signal/trace integrity.

You will be responsible for the design releases required generation of artwork files, ODB++, and electronic PCB documentation.

Your designs will need to follow SI constraints, EMI/RFI control and FCC, UL and European regulations, IPC specifications and NRC regulations.
Requirements:
What we need to see:

B.Sc. in Electronic Engineer degree or equivalent experience.

2+ years of experience in high-speed design.

Having a detailed knowledge of circuit design and consideration for layout, routing, and timing constraints, DFM, DFA, DFT constraints in volume manufacturing is needed for this role.

Be an authority in using Cadence Allegro PCB design tools.

Have a deep understanding of High-Density Interconnect PCB layout and PCB Signal Integrity.

Knowledge in PCB manufacturing processes for HDI, Standard Thru-Hole, and Back-drilling.

Proven ability to work with a team while taking personal responsibility for your own contributions.

Agility in changing focus as the needs of our effort evolve.

Strong leadership, communication, and presentation abilities.


Ways to stand out from the crowd:

Experience in crafting PCBs in the 25gbps + range using back-drilling technology.

Designing sophisticated multi-layer HDI PCB's for very dense placement and routing is helpful.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
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תודה על שיתוף הפעולה
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1 ימים
Location: Ra'anana and Yokne'Am Illit
Job Type: Full Time
we have continuously reinvented ourselves over two decades. our invention of the gpu in 1999 sparked the growth of the pc gaming market, redefined modern computer graphics, and revolutionized parallel computing. more recently, gpu deep learning ignited modern ai - the next era of computing. we are a learning machine that constantly evolves by adapting to new opportunities that are hard to seek, that only we can pursue, and that matter to the world. this is our life's work, to amplify human creativity and intelligence. make the choice to join us today.
what you'll be doing:
working closely with product design engineers, you'll perform pcb layout of high speed/high-density value-conscious pcbs for all business units at the company (gpu desktop, notebook, automotive, professional, data center, deep learning, and ai), all using cadence pcb design tools.
focus will be on the complete development of cad layout from symbol creation, floor planning, and detailed component placement, constraints management, with a concept of topology and signal/trace integrity.
you will be responsible for the design releases required generation of artwork files, odb++, and electronic pcb documentation.
your designs will need to follow si constraints, emi/rfi control and fcc, ul and european regulations, ipc specifications and nrc regulations.
Requirements:
what we need to see:
b.sc. in Electronic Engineer degree or equivalent experience.
5+ years of experience in high-speed design.
having a detailed knowledge of circuit design and consideration for layout, routing, and timing constraints, dfm, dfa, dft constraints in volume manufacturing is needed for this role.
be an authority in using cadence allegro pcb design tools.
have a deep understanding of high-density interconnect pcb layout and pcb signal integrity.
knowledge in pcb manufacturing processes for hdi, standard thru-hole, and back-drilling.
proven ability to work with a team while taking personal responsibility for your own contributions.
agility in changing focus as the needs of our effort evolve.
strong leadership, communication, and presentation abilities.
ways to stand out from the crowd:
experience in crafting pcbs in the 25gbps + range using back-drilling technology.
designing sophisticated multi-layer hdi pcb's for very dense placement and routing is helpful.
we are widely considered to be one of the technology world's most desirable employers. we have some of the most forward-thinking and hardworking people in the world working for us. if you're creative and autonomous, we want to hear from you!
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
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8883044
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28/09/2026
Location: Ra'anana and Yokne`am
Job Type: Full Time
We are seeking experienced electrical engineers with a passion for system-level thinking and innovation in high-performance optical switch development. This role offers a unique opportunity to shape and deliver next-generation products that push the boundaries of high-speed optical communication.

What Youll Be Doing:

Lead and serve as the technical focal point for the integration of PHY system aspects and optical (CPO) electrical subsystems, ensuring their performance.

Hands on cross-disciplinary testing efforts and lab work, collaborating with system architecture, optics, silicon, thermal, mechanical, signal/power integrity, and software teams.

Characterization and testing of optical links using lab equipment (e.g., oscilloscopes, BER testers, optical spectrum analyzers and simulation tools).

Driving product scalability, working with internal partners-qualification teams to transition designs from prototype to high-volume production.

Documentation and reporting of design specifications, test results, and performance metrics.
Requirements:
What we need to see:

B.Sc. in Electrical Engineering from a leading university or equivalent experience.

8+ years of relevant experience.

Strong analytical and problem-solving skills.

Excellent communication and collaboration abilities.

Enthusiasm for working on multidisciplinary projects.

Solid engineering intuition and understanding of physical trade-offs.

Ability to thrive in a fast-paced development environment.


Ways to stand out from the crowd :

M.Sc./PhD degree in electrical engineering.

Experience in high-speed Transceiver and PHY design is highly valued.

Strong knowledge and experience in electro-optic communication or high-speed signals and analog circuits.

Hands on experience with optoelectrical lab work and validation.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
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29/09/2026
חברה חסויה
Location: Ra'anana
Job Type: Full Time
The team leads the development of networking infrastructure for NVIDIA's next-generation data centers, focusing on accelerated performance while enabling optimized end-to-end GPU connectivity, focusing on datacenter-level optimized solutions for AI.

As a leader of our switch Hardware Engineering team, you'll guide, encourage, and drive a team of highly skilled hardware engineers, providing them with stimulating and ambitious assignments and enabling them to stay creative and motivated while delivering products on schedule.

What You'll Be Doing:

Build the best team to design and execute high-performance switch system from concept to mass production.

Be a key member of the technical leadership team developing world-class switch designs.

This position is hands-on and will require a deep understanding of all technical/engineering aspects of the project with intimate familiarity with the entire development flow. From a technical standpoint, you will lead and support engineering teams in the following areas: specification definition, electrical schematics, opto-mechanical design, component selection, layout guidance, hands-on lab testing, production processes, qualification workflows, micro-architecture development, verification, characterization, design for testability, cost optimization, reliability, and more.

Collaborate with and integrate all HW project disciplines: Board Design, Assembly Process, Mechanics, Thermal, PCB Layout, Process , Production Engineering, Software/Firmware, Procurement, NPI, and more.

Plan and oversee your teams work on multiple simultaneous development projects in coordination with the broader leadership team. Manage direct reports, set goals, provide coaching, conduct performance appraisals, plan careers, and make compensation recommendations.

Collect, examine, and filter requirements from internal customers such as marketing, software, and systems engineering to assemble a comprehensive plan of record for next-generation switches while planning resource allocation for projects and assign team members effectively.

Schedule projects, create realistic outcome estimates, and drive timely, successful execution for high-volume manufacturing.
Requirements:
What We Need to See:

A Bachelor's or Master's degree in Electrical Engineering.

10+ overall years of industry experience in architecture, design, and methodology for cutting-edge board design development.

6+ years of technical design management experience.

Proven experience in leading multi-disciplinary projects, multi-layer, high density PCB design.

A deep understanding of broadband high-speed ICs.

The ability to provide insight and guidance on trade-offs between power, performance, manufacturability, thermals, cost to meet product requirements.

Proven experience with leading execution of highly complex and innovative designs in tight schedule with risk mitigations and detailed planning for first time success.

Strong interpersonal and communication skills, with the ability to quickly build relationships, prioritize conflicting needs, and align teams effectively.

Ways to Stand Out From the Crowd:

Experience in designing data-center networking products for high-volume manufacturing.

Experience with optoelectronics and optical communication systems.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
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28/09/2026
Location: Ra'anana and Yokne`am
Job Type: Full Time
We are looking for an Engineering Manager to join our Network System Validation group. You will work on system validating advanced networking solutions across our complex AI cluster environments. The group is a high-performance engineering force that treats validation as a first-class software problem. We build systems, frameworks, and benchmarks that prove our network's correctness and performance at scale. In this role you will lead the validation direction and engineering excellence of one of our technology validation teams. This is a management role for a technology leader who can own the technical roadmap and execution, mentoring a team of high-performance engineers, and push our network to its speed-of-light limits. This role combines the development of methodologies and automation tools with system validation, performance analysis, and investigation of cutting-edge AI networking technologies at scale.

What youll be doing:

Lead, mentor, and coach a team of software development and system validation engineers.

Review system and product requirements, design validation methodologies, develop comprehensive test plans, functional and performance, for networking technologies in large-scale AI cluster solutions.

Develop and maintain benchmarks, automation tools and scripts for test execution, environment setup, log collection, and data analysis.

Lead end-to-end investigation of complex issues by reproducing real-world scenarios, analyzing logs, telemetry, packet captures, and system metrics to identify functional issues and performance bottlenecks, triaging problems across the hardware and software stack, and driving them to root cause and resolution.

Collaborate deeply with software and hardware development teams to debug networking technologies, including NCCL, RoCE, RDMA, and related software components using targeted experiments and code inspection.

Profile and research AI training and inference workloads, correlating application behavior with network and system telemetry to identify scalability and performance limitations.

Document findings, communicate technical results, and continuously improve validation methodologies, automation environments, and engineering processes.

Foster a team culture centered on software quality, accountability, and technical excellence.
Requirements:
What we need to see:

B.Sc. / B.A. in Computer Science, Electrical Engineering, or equivalent experience.

8+ overall years of experience in networking, system validation, or related domains.

3+ years of experience leading software or system development team.

Proven experience debugging complex production systems by forming hypotheses, designing experiments, and driving issues to root cause.

Strong scripting and automation experience using Python, Bash, and/or Ansible.

Ability to read, debug, and reason about C/C++ code (Rust or Go a plus).

Ability to drive technical alignment across teams, communicate tradeoffs clearly, and make high-quality architectural decisions at speed.

Advance AI-driven approaches to test automation: intelligent scenario generation, LLM-augmented root-cause analysis, and autonomous validation pipelines.


Ways to stand out from the crowd:

Experience with large-scale clusters or distributed systems.

Familiarity with NVIDIA networking solutions (ConnectX, SpecX, BlueField).

Background in performance analysis, Kubernetes, or cloud environments.

Background in chaos testing, fault injection, or simulation systems.
This position is open to all candidates.
 
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חברה חסויה
Location: Ra'anana
Job Type: Full Time
As a Wireless Platform Architect, you will play a key role in defining the architecture of our company's next-generation Radio Subsystem (RSS) platforms for wireless technologies including Wi-Fi, Bluetooth and UWB. You will take end-to-end responsibility on the system-level architecture of a complete wireless communication subsystem, including system spec, requirements for implementation teams, definition of interfaces and testing concept.
You will work closely with multidisciplinary development teams and directly with customers, from early system architecture and trade-off analysis through implementation, integration, validation and productization.
Responsibilities:
Define the RSS end-to-end architecture and HW/SW partitioning, including interfaces between the radio, PHY, MAC, CPU/MCU, memories, PMU, clock and reset management (CRM) and other subsystem components.
Define architecture and operational mechanisms for multi-protocol operation and interoperability, including HW interfaces, state machines, control flows and operation sequences.
Define sleep/wake-up modes, testability, security and debug.
Drive PPA optimization and competitive benchmarking of the RSS, with particular focus on low-power operation, silicon area and overall system efficiency.
Work closely with RF, PHY/algorithm, HW, SW/firmware, verification and integration teams, from early system studies and architecture definition through RTL/FPGA validation and system bring-up.
Work directly with customers during technical engagements to define the RSS integration into their SoC and support customers throughout SoC integration, validation and productization, addressing system-level architecture, interoperability and integration challenges.
Requirements:
B.Sc. or M.Sc in Electrical Engineering
Proven experience in system and architecture definition for hardware based wireless communication systems
Experience in wireless communication standards (such as WiFi/BT/Cellular/UWB etc.)
Strong understanding of low-power design and system architecture
Good understanding of SoC architecture and IPs integration, including system interfaces, memory, interrupts, clocks, resets and power domains
Deep understanding of VLSI/ASIC development processes and methodologies
Good understanding of ASIC productization and system bring-up flows
Strong technical leadership skills with the ability to drive architectural decisions
Team player with good communication skills
Strong customer-facing technical skills, with the ability to translate customer requirements and SoC constraints into system architecture
Flexibility and innovation mindset
Advantages
Knowledge in RF integration, control and calibrations
Knowledge in Signal Processing and PHY architecture
Knowledge in MAC layer Architecture
Experience with embedded processors/MCUs and low-level firmware architecture
Experience in lab work, Silicon validation and bring-up.
This position is open to all candidates.
 
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8846939
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מה השם שלך?
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סגור
v נשלח
תודה על שיתוף הפעולה
מודים לך שלקחת חלק בשיפור התוכן שלנו :)
Location: Ra'anana
Job Type: Full Time
The System team defines and develops cutting-edge 5G technology. In this role, you will lead the system team responsible for defining our next-generation modem products and developing modem algorithms, working at the intersection of research, system design, and implementation.
Responsibilities
Lead a team of senior system and algorithm engineers responsible for developing innovative 5G modems.
Partner closely with VLSI and SW teams implementing the modem HW and SW and align on system definitions with implementation constraints.
Develop and maintain deep expertise in cellular standards and their implications for modem design.
Lead system and algorithmic research, balancing trade-offs between DSP/SW/HW implementations, performance, implementation cost, real-time constraints, and time-to-market.
Own system definitions, requirements, and implementation from initial research through simulation to official release, including MATLAB/C/C++/SystemC modeling and specification documentation.
Mentor and grow team members, fostering technical excellence and professional development.
Requirements:
B.Sc. in Electrical Engineering.
At least 10 years of experience developing communication algorithms and defining modem systems.
Strong knowledge of digital signal processing implementation using MATLAB, C, and embedded coding.
An independent problem solver with excellent system-level understanding.
Strong interest in continued learning and professional growth in wireless communications and system engineering.
Excellent communication skills and the ability to thrive in a global, multi-site environment.
Solid modem design skills.
At least 2 years of experience in a managerial or leadership position.
Advantage
M.Sc. or Ph.D. in Communication Theory and Systems, Signal Processing, or a related field.
Experience with the 4G or 5G-NR standard.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
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עדכון קורות החיים לפני שליחה
8847578
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