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Required Power and Signal Integrity Engineer
About the job
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
Our mission is to organize the world's information and make it universally accessible and useful. Our team combines the best of AI, Software, and Hardware to create radically helpful experiences. We research, design, and develop new technologies and hardware to make computing faster, seamless, and more powerful. We aim to make people's lives better through technology.
As a Power and Signal Integrity Engineer, you will be responsible for the design and characterization of signal and power integrity of our IC designs. You will design the external electrical interfaces of the device, from their Signal/Power-integrity and electrical usage perspectives.
You'll set up methodologies, perform simulations, silicon characterization and correlations to ensure our IC designs meet systems design budgets and achieve the highest performance. You will work with systems architects, ASIC design, systems engineers, and partner cross-functionally with teams and external vendors/partners.
The ML, Systems, & Cloud AI (MSCA) organization designs, implements, and manages the hardware, software, machine learning, and systems infrastructure for all services (Search, YouTube, etc.) and Cloud.
We prioritize security, efficiency, and reliability across everything we do - from developing our latest TPUs to running a global network, while driving towards shaping the future of hyperscale computing. Our global impact spans software and hardware, including Clouds Vertex AI, the leading AI platform for bringing Gemini models to enterprise customers.
Responsibilities:
Design and optimize power distribution networks (PDN) across chip, package, and board levels. This includes managing power/ground planes, decoupling capacitors, and power gating strategies.
Conduct both pre-layout and post-layout power integrity simulations to analyze power and ground noise (SSN/SSO), voltage drops (IR drop), and electromagnetic interference (EMI).
Implement and verify low-power design methodologies, such as multi-voltage designs and clock gating, using power intent formats like UPF/CPF.
Generate precise electrical models (e.g., S-parameters, SPICE models) for components such as packages, PCBs, and connectors for use in simulations.
Execute lab measurements utilizing test equipment like oscilloscopes, Vector Network Analyzers (VNA), Time Domain Reflectometers (TDR), Spectrum analyzers to validate simulation outcomes and debug signal and power-related issues on silicon prototypes and boards.

Required Senior Edge-AI SoC Design Verification Engineer, Cloud
About the job
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
In this role, you will work as part of a Research and Development team. You will build verification components, constrained-random testing, system testing, and drive verification closure. You will verify digital designs, collaborate closely with design and verification engineers on projects, and perform direct verification. You will build constrained-random verification environments that exercise designs through their corner-cases and expose all types of bugs. You will manage the full life-cycle of verification, which can range from verification planning, test execution, to collecting and closing coverage.
The AI and Infrastructure team is redefining whats possible. We empower customers with breakthrough capabilities and insights by delivering AI and Infrastructure at unparalleled scale, efficiency, reliability and velocity.
We're the driving force behind groundbreaking innovations, empowering the development of our cutting-edge AI models, delivering unparalleled computing power to global services, and providing the essential platforms that enable developers to build the future. From software to hardware our teams are shaping the future of world-leading hyperscale computing, with key teams working on the development of our TPUs, Vertex AI for Cloud, Global Networking, Data Center operations, systems research, and much more.
Responsibilities
Plan the verification of digital design blocks by fully understanding the design specification and interacting with design engineers to identify important verification scenarios.
Create and enhance constrained-random verification environments using SystemVerilog and Universal Verification Methodology (UVM), or formally verify designs with SystemVerilog Assertions (SVA) and industry leading formal tools.
Identify and write all types of coverage measures for corner-cases.
Debug tests with design engineers to deliver functionally correct design blocks.
Close coverage measures to identify verification holes and to show progress towards tape-out.

Required CPU Core Micro Architect
Job Description
Our goal is to design cutting-edge CPUs for smartphones, servers, and desktops, and we need the very best talent to help us achieve it!
The CPU Micro architect will take charge in defining a processor Micro architecture features that will improve the performance and reduce the power consumption of the CPU core. This architect will use a performance simulator to explore his ideas and will analyze implementability of these features: Power, Timing, Area. This architect will utilize his processor and VLSI design experience to develop many advanced features for Huawei processors.

Required Wafer-Scale System: Computation (LLM) and Communication (NoC) Co-Design
In this job opening, we are seeking a highly motivated and visionary researcher to join our team focused on chiplet-based computing systems. This role involves research and development in chiplet-based architectures, aiming to overcome performance and scalability limits of traditional compute platforms.
Responsibilities:
Conduct cutting-edge research on the co-design of communication and computation for wafer-scale systems. On the communication side, the work focuses on architecting Networks-on-Chip, providing scalable, high-bandwidth, and ultra-low-latency interconnects that efficiently span multiple dies and support fine-grained data movement. On the computation side, the research emphasizes optimizing and mapping training and inference workloads to fully exploit wafer-scale resources, improving performance, scalability, and energy efficiency through intelligent task placement and scheduling.
Investigate various aspects of system design, including:
Network-on-Chip design, further including Topology exploration, routing algorithms, and protocol/flow-control design to support high-throughput collective communication, low-latency synchronization, and efficient model/data parallelism
Expressing and Mapping LLM Parallelism to Wafer-Scale System that simplify LLM parallelism (e.g., tensor, pipeline, and data parallelism) and efficiently map training and inference workloads onto wafer-scale system.

In this student role you will work within a segment of our Engineering team responsible for various fields, focusing on hardware. We are recruiting will work together with you and lines of business in order to find the best possible match for both sides!

We are seeking a Package Layout Design Engineer to join our hardware team and contribute to the physical design of advanced IC packages for next-generation machine learning and data center ASICs.
In this role, you will execute package layout tasks from floor planning through tape out and manufacturing release, working closely with senior engineers, SI/PI, thermal, and manufacturing teams to deliver production-ready designs that meet performance, density, and reliability targets.

Key job responsibilities
- Execute package layout tasks across the design cycle: die floor planning, bump/pad assignment, RDL routing, substrate design, verification, and tape out release.
- Implement physical designs for advanced packaging architectures including 2.5D interposer, 3D-IC, fan-out wafer-level packaging, and silicon bridge technologies (e.g., CoWoS, EMIB, or similar).
- Support package floorplan development considering die placement, bump maps, power/ground distribution, signal escape routing, and decoupling capacitor placement.
- Perform RDL and substrate routing for high-density interconnects including microbumps, C4 bumps, TSVs, microvias, and PTH vias across multi-layer organic substrates or silicon interposers.
- Support die-level RDL routing and bump planning in coordination with ASIC physical design teams to help co-optimize the die-package interface.
- Contribute to cross-level layout co-optimization across die RDL, interposer/substrate, and PCB levels under guidance from senior engineers.
- Assist in maintaining package stack-up definitions in collaboration with SI/PI and materials engineering teams.
- Run physical verification checks (DRC, connectivity, shorts/opens) and support design closure.
- Follow and help refine package design rules and guidelines, working with OSAT partners and foundries to ensure DFM compliance.
- Collaborate with SI/PI engineers to incorporate electrical constraints into the physical layout - impedance-controlled routing, power plane optimization, and critical net shielding.

Were searching for sharp engineers to lead cutting edge products, re:inventing super computers and deploy our new EFA (Elastic Fabric Adapter) network protocol into the largest public cloud on the planet! starting from the identification and definition of project requirement, defining SW and HW interfaces, feature development and deployment, to operation support on a very large scale.

We're looking for a Design Verification Team Lead - a design verification technical lead that is responsible for complex SoC sub-system, with cutting edge technology for Nitro system SoC, the foundation of AWS's virtualization, networking, and storage offload infrastructure.

It starts at product definition - we engage from day one, shaping requirements and translating product intent into verification strategies before a single line of RTL is written.

It extends into software - we work side-by-side with SW teams, verifying hardware-software interfaces and ensuring seamless integration across the stack, with particular emphasis on networking workloads such as ENA and EFA.

It reaches into physical design - we verify physical design aspects within functional verification, bridging the gap between logical correctness and silicon reality.

It closes the loop - from spec to silicon, our verification touches every team and every stage of chip development.

Key job responsibilities

- Develop and execute verification plans for IO sub-systems - covering interconnect protocols, peripheral interfaces, and system-level integration with a strong connection to networking flows (ENA/EFA).

- Verify IO sub-system features, including interconnect protocols and various accelerator engines.

- Develop and debug C embedded SW as part of hardware-software integration verification.

- Build and maintain UVM-based verification environments for various clusters and sub-systems.

- Verify ARM advanced interconnect protocols (AMBA CHI/ACE/AXI) ensuring correct coherency transactions, performance verification, and protocol compliance.

- Verify the IO virtualization SMMU/TLB operations, page table walks, translation granules, and memory attributes (cache-ability, share-ability).

- Develop constrained-random and directed test strategies targeting corner cases in IO protocol hazards, coherency races, and system boundary conditions.

- Drive coverage closure using functional coverage models, assertion-based verification, and formal methods where applicable.

- Contribute to performance verification - ensuring micro-architectural implementations meet performance targets alongside correctness.

We are looking for a Nitro System Manufacturing Integration Lead Engineer to be part of defining, shaping, and implementing manufacturing flows, test definitions, and card-to-server integration processes for Nitro-based platforms. This includes to be part of the manufacturing flow architecture, production test strategy, process stabilization, and yield optimization bridging system design intent with high-volume manufacturing execution.

Key job responsibilities
As a System Manufacturing Integration Lead Engineer, in the Nitro team, you will own the end-to-end manufacturing flows for accelerator card-to-server integration across manufacturing partner facilities driving the process from initial definition through stabilization into a scalable, high-yield mass production operation.

Key responsibilities include:
- Architect manufacturing flows - be part of the complete card-to-server integration sequence, including every process step, quality gate, and decision point from sub-assembly through system integration and tests.
- Define test strategy - be part of determining what to test, when, and at which station, covering card-level functional tests, post-integration validation, firmware provisioning, and first power-up diagnostics.
- Establish classification criteria - be part of determining pass/fail thresholds and test exit gates to maximize yield and minimize material waste.
- Drive process stabilization - work directly and on-site with manufacturing partners to implement, debug, and iterate on manufacturing flows from early builds through a locked, repeatable production process.
- Design alternative flows - develop parallel manufacturing paths to address real-world constraints such as component availability gaps, deferred card integration, and hub-based assembly models.
- Own process documentation & KPIs - maintain manufacturing flow baselines, drive process change control, and track yield, first-pass rate, cycle time, and defect Pareto.
- Lead cross-functional coordination - serve as the single point of ownership across hardware engineering, firmware, test/vetting, thermal, mechanical, and operations teams for Nitro-based accelerator servers built at scale.

Were searching for a Lab Technion Student who will be responsible for the installation, configuration, maintenance, and troubleshooting of our Linux-based server infrastructure, as well as managing various network services and components.

Student will have at least 4 semesters remaining in their degree. The ideal candidate will posses a strong passion for learning new things and the ability to quickly put that new knowledge and skills into practice. You will have the ability to perform basic troubleshooting for hardware, software, and networking issues without guidance.

We're looking for Electrical Engineering graduates to join the Pre-Silicon Verification Team based in Haifa.

As a Junior Pre-Silicon Verification Engineer, you'll work at the heart of chip development, collaborating across teams to ensure our semiconductor platforms meet the highest standards before they reach production.
IO verification team will expose you to the most advanced technologies , as we lead the market with our leaving devices - youll soon have to expertise most advance protocols

A day in the life
In this role, you'll engage in pre-silicon verification work that connects every phase of our product development journey- from initial product definition through firmware and software development.
You'll collaborate with hardware designers, software engineers, and cross-functional teams to validate complex semiconductor architectures and protocols.
Your days might include developing and executing verification test plans, analyzing simulation results, troubleshooting design issues, and participating in design reviews.
You'll work with advanced verification methodologies and tools, gaining exposure to cutting-edge technologies that define the next generation of cloud infrastructure.