דרושים » הנדסה » Experienced board & FPGA designer

Requirements:
B.Sc. in Electrical Engineering.
5+ years of experience in board-level hardware design.
Strong experience in analog and digital design, simulations, and component selection.
Hands-on experience with hardware bring-up, testing, and integration.
Experience with OrCAD design tools (mandatory).
Familiarity with EMC/EMI standards.
Experience with STM32 microcontrollers (an advantage).
Fluent in Hebrew and English.
Preferred Qualifications
Experience with MIL-STD standards.
Knowledge of programmable devices (CPLD / FPGA).
Ability to work with software teams and read embedded code.
Customer-facing experience and willingness to travel abroad.
Experience with Nvidia, Qualcomm, or similar SOM platforms.

Requirements:
Must-Haves:
3+ years of experience in FPGA design and digital system development.
Strong proficiency in Verilog/SystemVerilog RTL design.
Hands-on experience with Xilinx FPGA families (UltraScale+, Zynq, or Versal).
Experience implementing and debugging high-speed interfaces (PCIe, Ethernet, JESD, or similar).
Solid understanding of FPGA development flows, including synthesis, place & route, and timing closure.
Experience with lab debugging tools (e.g., ILA/ChipScope, oscilloscopes, logic analyzers).
Experience with simulation and verification methodologies (RTL and gate-level).
Strong problem-solving skills and attention to detail.
B.Sc. or higher in Electrical Engineering, Computer Engineering, or equivalent.
Strong communication skills and ability to collaborate across teams.
Advantages:
Experience with Versal architecture, including NoC design and integration.
Background in ASIC design or verification.
Familiarity with FPGA backend flows and static timing analysis (STA).
Scripting experience (Python, TCL, Makefile) and/or C/C++ knowledge.

Requirements:
* Actively participate in hands on PCB design including schematics creation and layout work using industry standard EDA tools.
* Participate in the development of next-generation electro-optical (EO) devices and sub-systems for high-speed communication.
* Support electro-optic sub-systems and evaluation boards through schematic design, component selection, characterization, layout considerations, and implementation. Provide guidance on fabrication and assembly.
* Utilize advanced PCB technologies including mSAP, high-density HDI, and state-of-the-art PCB materials optimized for high-speed signal integrity supporting speeds up to 224 Gbps.
* Lead board bring-up, characterization, and debug, including high-speed scope and VNA measurements.
* Collaborate with hardware project teams, including Production, Software/Firmware, Photonics, and system.
* Support customers by reviewing schematics and PCB layouts, providing guidance to ensure robust design and high-speed performance.
* Utilize state-of-the-art laboratory equipment. Requirements What Were Looking For:
* B.Sc. in Electrical Engineering.
* 8+ years as a board designer with experience in executing complex hardware projects.
* Extensive experience designing high-speed PCBs, covering impedance control, length matching, and SI/PI best practices for standards such as Gigabit Ethernet and PCIe.
* Hands-on experience with Cadence tools (Allegro, OrCAD) for schematic capture and PCB layout.
* Experience in design ownership on major blocks/clusters from definition through implementation phases.
* Strong hands-on laboratory skills and debugging capabilities.
* Skilled in working with advanced PCB materials and high-density PCB technologies, including complex stackups and fine-pitch routing.
* Strong project management skills, independence, and excellent interpersonal abilities.
* Strong understanding of transmission lines, impedance control, crosstalk, and return-path design.
* Familiarity with lab equipment such as oscilloscopes, VNAs, and spectrum analyzers. What Will Make You a Star Candidate:
* Proven proficiency in ANSYS HFSS / SIwave / 3D Layout for electromagnetic, SI, and PI simulations.
* Ability to interpret and simulate S-parameters, eye diagrams, and frequency-domain models.
* Experience in PCB design involving high-speed DSPs, including power integrity, signal-integrity constraints, and high-speed interface routing.
* Practical experience with high-speed sampling oscilloscopes and optical spectrum analyzers.
* Experience with optical transceivers.
* Knowledge of photonic integration technology and its ecosystem.
* Experience in lab automation using Python -based tools.

Requirements:
B.Sc. in Electrical Engineering or a related field.
Hands-on experience in hardware development and board-level design.
Strong lab experience: debugging, measurements, and use of lab equipment (oscilloscopes, power supplies, etc.).
Experience with digital hardware and power systems (power supplies, regulators, etc.).
Experience writing and executing test plans and analyzing results.
Familiarity with schematic design tools and managing design environments/databases- an advantage.
Ability to work independently, set priorities, and operate in a hands-on, fast-paced environment.
Strong teamwork and communication skills, especially in lab-oriented collaboration.

Requirements:
B.Sc. or M.Sc. in Electrical Engineering, Electronics Engineering, or a related field. - Must
5+ years of leadership experience in Hardware Engineering, System Design, or Product Engineering.-Must
Strong experience with board design and complex multidisciplinary systems.- Must
Deep understanding of DFT methodologies and production test strategies.
Hands-on experience with debugging, failure analysis, and lab equipment.
Strong leadership, communication, and problem-solving skills.
Ways to stand out:
Experience with automated test equipment (ATE).
Scripting and automation experience (Python, LabVIEW, etc.).
Knowledge in FPGA Design and Verilog coding.

Requirements:
Bachelors degree in Electrical Engineering or a related field.
5+ years of experience in package, PCB, or high‑speed design engineering.
Strong understanding of high-speed signal design and power distribution networks (PDN).
Familiarity with industry-standard EDA tools for layout and design.
Strong communication skills with the ability to collaborate and coordinate effectively with cross-functional teams
Preferred Qualifications:
Masters degree in Electrical Engineering
Experience with advanced packaging technologies, interposers, or multi‑die systems
Knowledge of silicon floor planning, signal integrity (SI), and power integrity (PI) considerations
Proven track record to drive design improvements and lead stakeholder coordination throughout the design process

Requirements:
Minimum qualifications:
Bachelor's degree in Electrical Engineering, related fields, or equivalent practical experience.
8 years of experience in hardware engineering, with a focus on authoring technical specifications, reviewing electrical layouts, and driving verification of semiconductor tests or validation platforms.
Experience driving deliverables and managing quality standards with external layout vendors, board design houses, or hardware component suppliers across multiple global geographies.
Experience working within specialized semiconductor reliability or test laboratories including configuring component Burn-In ovens, high-power stress load boards, ESD simulators, and Latch-Up test setups.
Experience managing engineering hardware delivery schedules, tracking cross-functional milestones, and meeting New Product Introduction (NPI) timelines.
Preferred qualifications:
Master's degree in Electrical Engineering, Materials Science, or related fields.
Experience managing the design execution cycle of complex multi-layer test vehicles through third-party design houses or layout vendors from concept sign-off to laboratory delivery.
Experience defining and verifying electrical correlation baselines between environmental stress setups and High-Volume Manufacturing (HVM) ATE environments.
Deep familiarity with JEDEC silicon qualification hardware standards and how they dictate physical board testing constraints.
Strong background analyzing the quality of stress factors, including power distribution networks (PDN), signal integrity degradation across extended thermal loops, and transient load behavior during reliability cycles.