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26/07/2026
משרה זו סומנה ע"י המעסיק כלא אקטואלית יותר
מיקום המשרה: תל אביב יפו
סוג משרה: משרה מלאה
משרות דומות שיכולות לעניין אותך
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08/09/2026
Location: Tel Aviv-Yafo
Job Type: Full Time and Hybrid work
We are seeking an experienced HW Team Leader to drive the engineering efforts behind our electronic systems. This role will focus on enhancing the testability, production efficiency, and quality of our products by defining Design for Testability (DFT) strategies, developing production test solutions, and leading failures investigation and correction.
What You'll Do:
Lead and mentor a team of highly skilled hardware engineers.
Drive execution in a fast-paced, multi-project environment.
Own and evolve our Design for Testability (DFT) strategy and guidelines.
Lead end-to-end development of production test solutions and test facilities.
Drive root-cause investigations, failure analysis, and product improvement initiatives.
Collaborate closely with R&D, manufacturing, and quality teams to ensure product reliability and production readiness.
Requirements:
B.Sc. or M.Sc. in Electrical Engineering, Electronics Engineering, or a related field. - Must
5+ years of leadership experience in Hardware Engineering, System Design, or Product Engineering.-Must
Strong experience with board design and complex multidisciplinary systems.- Must
Deep understanding of DFT methodologies and production test strategies.
Hands-on experience with debugging, failure analysis, and lab equipment.
Strong leadership, communication, and problem-solving skills.
Ways to stand out:
Experience with automated test equipment (ATE).
Scripting and automation experience (Python, LabVIEW, etc.).
Knowledge in FPGA Design and Verilog coding.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
עדכון קורות החיים לפני שליחה
עדכון קורות החיים לפני שליחה
8814817
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מודים לך שלקחת חלק בשיפור התוכן שלנו :)
Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
Required Senior SoC Hardware Quality and Reliability Engineer
About the job
In this role, youll work to shape the future of AI/ML hardware acceleration. You will have an opportunity to drive cutting-edge TPU (Tensor Processing Unit) technology that powers our most demanding AI/ML applications. Youll be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our TPU. You'll contribute to the innovation behind products loved by millions worldwide, and leverage your design and verification expertise to verify complex digital designs, with a specific focus on TPU architecture and its integration within AI/ML-driven systems.
We're the driving force behind our groundbreaking innovations, empowering the development of our cutting-edge AI models, delivering unparalleled computing power to global services, and providing the essential platforms that enable developers to build the future. From software to hardware our teams are shaping the future of world-leading hyperscale computing, with key teams working on the development of our TPUs, Vertex AI for Cloud, Global Networking, Data Center operations, systems research, and much more.
Responsibilities
Own technical specifications, architectural definitions, and physical power-on of custom qualification vehicles (HTOL load boards, ESD fixtures, latch-up rigs). Drive external layout vendors to achieve seamless electrical correlation with ATE environments.
Govern execution quality of applied stresses, define electrical, thermal, and telemetry parameters on test vehicles to ensure uniform, valid stress profiles without unintended overstress or setup artifacts.
Lead the end-to-end engineering delivery lifecycle for qualification hardware, map and drive critical cross-functional dependencies across internal validation and product engineering teams to ensure on-time readiness.
Serve as the primary technical interface for external PCB layout houses, fabrication shops, and component suppliers; manage design reviews, track lead times, and enforce delivery schedules.
Lead laboratory troubleshooting for qualification hardware anomalies; isolate setup/socket faults from true silicon failures and drive supplier corrective actions (CAPA) when board excursions occur.
Requirements:
Minimum qualifications:
Bachelor's degree in Electrical Engineering, related fields, or equivalent practical experience.
8 years of experience in hardware engineering, with a focus on authoring technical specifications, reviewing electrical layouts, and driving verification of semiconductor tests or validation platforms.
Experience driving deliverables and managing quality standards with external layout vendors, board design houses, or hardware component suppliers across multiple global geographies.
Experience working within specialized semiconductor reliability or test laboratories including configuring component Burn-In ovens, high-power stress load boards, ESD simulators, and Latch-Up test setups.
Experience managing engineering hardware delivery schedules, tracking cross-functional milestones, and meeting New Product Introduction (NPI) timelines.
Preferred qualifications:
Master's degree in Electrical Engineering, Materials Science, or related fields.
Experience managing the design execution cycle of complex multi-layer test vehicles through third-party design houses or layout vendors from concept sign-off to laboratory delivery.
Experience defining and verifying electrical correlation baselines between environmental stress setups and High-Volume Manufacturing (HVM) ATE environments.
Deep familiarity with JEDEC silicon qualification hardware standards and how they dictate physical board testing constraints.
Strong background analyzing the quality of stress factors, including power distribution networks (PDN), signal integrity degradation across extended thermal loops, and transient load behavior during reliability cycles.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
עדכון קורות החיים לפני שליחה
עדכון קורות החיים לפני שליחה
8783531
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תודה על שיתוף הפעולה
מודים לך שלקחת חלק בשיפור התוכן שלנו :)
Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
Required Silicon Test and DFT Engineer, Cloud
About the job
In this role, youll work to shape the future of AI/ML hardware acceleration. You will have an opportunity to drive cutting-edge TPU (Tensor Processing Unit) technology that powers our most demanding AI/ML applications. Youll be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our TPU. You'll contribute to the innovation behind products loved by millions worldwide, and leverage your design and verification expertise to verify complex digital designs, with a specific focus on TPU architecture and its integration within AI/ML-driven systems.The AI and Infrastructure team is redefining whats possible. We empower customers with breakthrough capabilities and insights by delivering AI and Infrastructure at unparalleled scale, efficiency, reliability and velocity.
We're behind groundbreaking innovations, empowering the development of AI models, delivering unparalleled computing power to global services, and providing the essential platforms that enable developers to build the future. From software to hardware our teams are shaping the future of world-leading hyperscale computing, with key teams working on the development of our TPUs, Vertex AI for Cloud, Global Networking, Data Center operations, systems research, and much more.
Responsibilities
Collaborate with Architecture, Design and Verification teams to develop new product bring-up, validation, characterization, and qualification strategies and manufacturing test solutions for new High Performance Computing (HPC) products in advanced process technologies.
Verify test solutions on pre-silicon models (simulation or emulation) and develop Automated Test Equipment (ATE) test modules and binning flows.
Develop and validate test programs on Automated Test Equipment (ATE) platforms for new product integration (NPI) in preparation for high-volume manufacturing (HVM), working with ATE vendors and internal cross-functional teams.
Manage product sustainment support, including analyzing volume data, improving test time and yield, assessing test escapees and return merchandise authorizations (RMAs), localizing failures, implementing containment measures, and partnering with design, manufacturing, and quality and reliability teams to identify root causes and implement corrective actions.
Build tools, flows and methodologies to continuously improve and automate the testing life-cycle.
Requirements:
Minimum qualifications:
Bachelor's degree in Engineering, Computer Science, a related field, or equivalent practical experience.
10 years of experience in test engineering.
Experience in pre-silicon validation, test content generation, automatic test equipment (ATE) program development, and post-silicon enabling from new product introduction (NPI) through high-volume manufacturing.
Experience with ASIC test methodologies (MBIST, ATPG, DFT, SerDes, and sensors).
Experience with Python, Java, C# or C/C++ and Advantest or Teradyne ATE platforms.
Preferred qualifications:
Masters in Electrical Engineering, Computer Engineering, Computer Science, or a related field.
10 years of experience in test engineering, including product engineering.
Experience with CPU/GPU SoC architecture, design, validation and debug.
Experience in advanced testing methodologies and data analysis, including system to tester correlation, yield and test time analysis and improvement, etc.
Demonstrated expertise in developing automations for pre-silicon verification and post-silicon test-generation/test-program domains.
Inquisitive and motivated to venture into, and improve, all aspects of post-silicon testing from definition to realization.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
עדכון קורות החיים לפני שליחה
עדכון קורות החיים לפני שליחה
8783563
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תודה על שיתוף הפעולה
מודים לך שלקחת חלק בשיפור התוכן שלנו :)
5 ימים
חברה חסויה
Location: Tel Aviv-Yafo
Job Type: Full Time
We are looking for a hands-on FPGA Design Engineer, specialized in high-performance digital design and FPGA-based system development, as part of the QM-Platform team.

This role involves ownership of FPGA interfaces and connectivity logic, including high-speed communication blocks, platform integration, and close collaboration with embedded and hardware teams. You will work on complex FPGA/SoC platforms, enabling robust and scalable solutions for quantum control systems.

Responsibilities

Own the design and implementation of FPGA-based interfaces such as PCIe, I2C, SPI, and high-speed GT communication.
Develop and integrate FPGA logic on advanced platforms, including Xilinx UltraScale+ and Versal.
Collaborate closely with embedded, hardware, and system teams to ensure seamless HW/SW/FPGA integration.
Drive FPGA bring-up, debugging, and validation at both lab and system levels.
Participate in system architecture definition and cross-team design decisions.
Requirements:
3+ years of experience in FPGA design and digital system development.
Strong proficiency in Verilog/SystemVerilog RTL design.
Hands-on experience with Xilinx FPGA families (UltraScale+, Zynq, or Versal).
Experience implementing and debugging high-speed interfaces (PCIe, Ethernet, JESD, or similar).
Solid understanding of FPGA development flows, including synthesis, place & route, and timing closure.
Experience with lab debugging tools (e.g., ILA/ChipScope, oscilloscopes, logic analyzers).
Experience with simulation and verification methodologies (RTL and gate-level).
Strong problem-solving skills and attention to detail.
B.Sc. or higher in Electrical Engineering, Computer Engineering, or equivalent.
Strong communication skills and ability to collaborate across teams.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
עדכון קורות החיים לפני שליחה
עדכון קורות החיים לפני שליחה
8826212
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תודה על שיתוף הפעולה
מודים לך שלקחת חלק בשיפור התוכן שלנו :)
Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
Required CPU Design for Test Engineer, Cloud
In this role, you will be part of a varied team that pushes boundaries, developing custom silicon solutions that power the future of our direct-to-consumer products. You will contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next-generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
As a Design-for-Test (DFT) Engineer, you will play a crucial role in DFT design, and support devices of extreme complexity to production. You will be responsible for developing flows, automation, and methodology, executing DFT activities. You will be responsible for test vectors end-to-end, from generating DFT content on complex design, debugging to coverage goals, simulating it at gate level, sign-off DFT to tapeout, and debugging Si results.The AI and Infrastructure team is redefining whats possible. We empower our customers with breakthrough capabilities and insights by delivering AI and Infrastructure at unparalleled scale, efficiency,
We're behind our groundbreaking innovations, empowering the development of AI models, delivering unparalleled computing power to global services, and providing the essential platforms that enable developers to build the future. From software to hardware our teams are shaping the future of world-leading hyperscale computing, with key teams working on the development of our TPUs, Vertex AI for Cloud, Global Networking, Data Center operations, systems research, and much more.
Responsibilities
Execute activities in the design, implementation, and verification of Design for Testing solutions for Application-Specific Integrated Circuit (ASICs).
Develop DFT strategy for array DFT, hierarchical DFT, Scan, and Automatic Test Pattern Generation (ATPG).
Perform ATPG, scan coverage debug and drive design fixes for coverage and quality improvements.
Perform DFT verification at RTL and gate level.
Work with other Engineering teams (e.g., Design, Verification, Physical Design) to ensure that DFT design requirements are met and mutual dependencies are managed.
Requirements:
Minimum qualifications:
Bachelor's degree in Electrical Engineering, Computer Engineering, or a related field, or equivalent practical experience.
4 years of experience with Design For Test (DFT) methodologies, DFT verification, and industry-standard DFT tools.
Experience with industry-standard Automatic Test Pattern Generation (ATPG) methods, fault modeling, and scan coverage debug.
Experience validating Memory Built-In Self-Test (MBIST) structures and Joint Test Action Group (JTAG)/ Test Access Port (TAP) controllers.
Experience running structural verification, debugging testbenches, or simulation tracking utilizing simulators.
Preferred qualifications:
Master's degree in Electrical Engineering.
Experience with the Tessent shell environment, specifically extracting Instrument Connectivity Language (ICL) networks.
Familiarity with Silicon bring-up and validation on Automatic Test Equipment (ATE) testers, including debugging hardware execution patterns.
Proficiency using Python or Tcl to manage complex Electronic Design Automation (EDA) design and sign-off flows.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
עדכון קורות החיים לפני שליחה
עדכון קורות החיים לפני שליחה
8782511
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דיווח על תוכן לא הולם או מפלה
מה השם שלך?
תיאור
שליחה
סגור
v נשלח
תודה על שיתוף הפעולה
מודים לך שלקחת חלק בשיפור התוכן שלנו :)
Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
Required SoC Quality and Reliability Engineer, Cloud
About the job
In this role, youll work to shape the future of AI/ML hardware acceleration. You will have an opportunity to drive cutting-edge TPU (Tensor Processing Unit) technology that powers our most demanding AI/ML applications. Youll be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our TPU. You'll contribute to the innovation behind products loved by millions worldwide, and leverage your design and verification expertise to verify complex digital designs, with a specific focus on TPU architecture and its integration within AI/ML-driven systems.
Our data centers are the most advanced in the world. In this role, you will help build the state-of-the art SoCs that power these data centers by driving quality and reliability processes from the Integrated Circuit perspective. This is an opportunity to create silicon and follow it into the field (and back!) to drive improvements for the next-generations of chips.
In this role, you will understand Integrated circuit (IC) flows, wafer processing, testing, qualification, yield, reliability, and failure analysis. You will work with various cross-functional teams to develop quality and reliability specifications, develop and deploy design guidelines, and develop and execute and test plans. Within the larger organization you will collaborate with global hardware quality and reliability teams, silicon design, validation and engineering teams.The AI and Infrastructure team is redefining whats possible. We empower customers with breakthrough capabilities and insights by delivering AI and Infrastructure at unparalleled scale, efficiency, reliability and velocity.
Responsibilities
Drive the strategic definition and development of Design-for-Reliability (DfR) guidelines, collaborating with cross-functional subject matter experts to integrate reliability into early design stages.
Define and lead the development of qualification hardware and test methodologies, managing internal teams and external vendors to ensure robust silicon and package verification.
Execute comprehensive silicon and package qualification programs (including HTOL, ELFR, ESD/LU, b/HAST, etc.) and conduct in-depth failure analysis to resolve quality issues.
Extract and analyze large-scale data from qualification programs, high-volume manufacturing, and field returns to identify failure mechanisms and trends for yield and reliability optimization.
Develop and implement physics-based statistical Quality and Reliability models (e.g., ELF, TDDB, NBTI) to predict device failure mechanisms and lifetime behaviors.
Requirements:
Minimum qualifications:
Bachelor's degree in Electrical Engineering, Materials Science, Physics, or a related field or equivalent practical experience.
8 years of experience in IC silicon quality or reliability.
Experience leading the product reliability life-cycle from post-tapeout through manufacturing.
Experience with semiconductor Complementary Metal-Oxide-Semiconductor (CMOS) technology, device physics, and failure mechanisms.
Preferred qualifications:
Master's degree in Electrical Engineering, Materials Science, or related fields.
Experience in statistical data analysis using tools such as JMP, Python, or JSL.
Familiarity with Electrical Failure Analysis (EFA) and Physical Failure Analysis (PFA) techniques.
Knowledge of Design-for-Reliability (DfR) rules and implementation techniques.
Track record with silicon reliability on process nodes and advanced packaging technologies.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
עדכון קורות החיים לפני שליחה
עדכון קורות החיים לפני שליחה
8783569
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דיווח על תוכן לא הולם או מפלה
מה השם שלך?
תיאור
שליחה
סגור
v נשלח
תודה על שיתוף הפעולה
מודים לך שלקחת חלק בשיפור התוכן שלנו :)
Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
Required SOC Quality and Reliability Engineer, Cloud
About the job
In this role, youll work to shape the future of AI/ML hardware acceleration. You will have an opportunity to drive cutting-edge TPU (Tensor Processing Unit) technology that powers our most demanding AI/ML applications. Youll be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our TPU. You'll contribute to the innovation behind products loved by millions worldwide, and leverage your design and verification expertise to verify complex digital designs, with a specific focus on TPU architecture and its integration within AI/ML-driven systems.
Our data centers are the most advanced in the world. In this role, you will help build the SoCs that power these data centers by driving quality and reliability processes from the integrated circuit perspective. You will create silicon and follow it into the field (and back) to drive improvements for the next generations of chips.
You will have an understanding of IC flows, wafer processing, testing, qualification, yield, reliability, and failure analysis. You will work with various cross functional teams to develop quality and reliability specifications, develop and deploy design guidelines, and develop and execute and test plans. Within the larger organization you will collaborate with global hardware quality and reliability teams, silicon design, validation and engineering teams.

Responsibilities
Drive the strategic definition and development of design-for-reliability (DfR) guidelines, collaborating with cross-functional subject matter experts to integrate reliability into early design stages.
Define and lead the development of qualification hardware and test methodologies, managing internal teams and external vendors to ensure silicon and package verification.
Execute comprehensive silicon and package qualification programs (including high-temperature operating life (HTOL), early life failure rate (ELFR), electrostatic discharge/latch-up (ESD/LU), biased highly accelerated stress test (b/HAST), etc.) and conduct failure analysis to resolve quality issues.
Extract and analyze data from qualification programs, high-volume manufacturing, and field returns to identify failure mechanisms and trends for yield and reliability optimization.
Develop and implement physics-based statistical Quality and Reliability models (e.g., ELF, time-dependent dielectric breakdown (TDDB), negative bias temperature instability (NBTI) to predict device failure mechanisms and lifetime behaviors.
Requirements:
Minimum qualifications:
Bachelor's degree in Electrical Engineering, Materials Science, Physics, or a related field or equivalent practical experience.
8 years of experience in IC silicon quality or reliability.
Experience leading the product reliability lifecycle from post-tapeout through high-volume manufacturing.
Experience with semiconductor complementary metal-oxide-semiconductor (CMOS) technology, device physics, and failure mechanisms.

Preferred qualifications:
Master's degree in Electrical Engineering, Materials Science, or related field.
Expertise in statistical data analysis using tools such as JMP, Python, or JSL.
Knowledge of design-for-reliability (DfR) rules and implementation techniques.
Familiarity with electrical failure analysis (EFA) and physical failure analysis (PFA) techniques.
Track record with silicon reliability on process nodes and advanced packaging technologies.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
עדכון קורות החיים לפני שליחה
עדכון קורות החיים לפני שליחה
8785632
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דיווח על תוכן לא הולם או מפלה
מה השם שלך?
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v נשלח
תודה על שיתוף הפעולה
מודים לך שלקחת חלק בשיפור התוכן שלנו :)
23/08/2026
חברה חסויה
Location: Tel Aviv-Yafo
Job Type: Full Time
We are a rapidly growing startup company, developing the next-generation smart-infrastructure solution based on novel fiber-sensing technology (smart roads, smart cities, perimeters, and grid monitoring, etc). The company offers an award-winning disruptive solution; a sensor free approach to smart infrastructure. The company is VC backed and in the revenues stage. Combining pioneering technology in optical fiber sensing with state-of-the-art Machine Learning, we help prevent environmental disasters, protect human lives, and keep critical energy and transportation backbones running smoothly.
We are looking for a talented, self-driven, and hands-on Electro Optics Systems Engineer to join Photonics R&D team. In this role, you will develop and advance next-generation distributed fiber-optic acoustic sensing (DAS) systems, combining electro-optic system design, performance modeling, simulations, experimental validation, and field data analysis. You will tackle complex physical and engineering challenges, contribute to next-generation product development, and collaborate closely with multidisciplinary teams to bring innovative sensing technologies from concept to real-world deployment. This role is ideal for someone who thrives in a fast-paced, hands-on R&D environment, enjoys working across disciplines, and wants to see their work translate into real-world impact.
What Youll Do:
* Lead experimental and theoretical R&D efforts for the development of Prismas next-generation distributed fiber-optic acoustic sensing systems.
* Design, evaluate, and optimize electro-optic interrogation systems for distributed acoustic sensing applications.
* Develop system -level models and simulations for optical signal generation, fiber propagation, coherent detection, system noise, SNR, and sensing performance.
* Build software tools and simulations in Python, C ++, or similar languages for system evaluation, signal processing, field data analysis, and performance modeling.
* Plan, execute, and analyze laboratory and field experiments to validate system performance and support product development.
* Gain unique end-to-end expertise across the full sensing system pipeline, spanning fiber optics, electro-optics, coherent detection, DSP algorithms, and advanced data analysis.
* Lead product development activities from ideation and proof of concept through design, qualification, validation, and deployment.
* Collaborate closely with multidisciplinary R&D teams, including physicists, software engineers, algorithm developers, and hardware engineers.
* Communicate effectively with both technical and non-technical stakeholders, translating complex system behavior into clear insights and actionable recommendations.
Requirements:
What You Bring:
* BSc or MSc in Physics, Optical Engineering, Electrical Engineering, system engineering or a related field.
* At least 4 years of experience in multidisciplinary electro-optic systems, either as a Systems Engineer or in hands-on electro-optic, fiber-optic system design, integration, testing, or performance evaluation.
* Experience with noise analysis, including phase noise, detector noise, amplifier noise, SNR, and related system performance metrics.
* Experience with advanced optical measurement techniques, laboratory setups, and system characterization.
* Strong programming skills in Python, C ++, or similar languages.
* Excellent analytical and problem-solving skills, with the ability to connect physical phenomena, system behavior, and data -driven insights.
* Strong communication skills and the ability to work effectively both independently and as part of a multidisciplinary team.
* Ability to manage multiple projects and priorities in a dynamic, fast-paced environment.
Great to Have:
* Knowledge in Digital Signal Processing.
* Experience with telecom optical systems.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
עדכון קורות החיים לפני שליחה
עדכון קורות החיים לפני שליחה
8726953
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דיווח על תוכן לא הולם או מפלה
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סגור
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תודה על שיתוף הפעולה
מודים לך שלקחת חלק בשיפור התוכן שלנו :)
24/08/2026
חברה חסויה
Location: Tel Aviv-Yafo
Job Type: Full Time
We are looking for a Hardware Team Lead to own our electrical hardware from the first rough prototype all the way to a product that holds up in the field. You will lead a team of hardware engineers who work across most of what we build: board design and hands-on investigation, ultra-sensitive sensors, power circuits for our transmitters, RF and noise-sensitive systems, high-speed digital and communication, ADCs, DACs, and more.
We move fast, and that is a big part of the fun here. Quick prototypes and rough bring-ups are how we learn. Your job is to keep that speed, but make sure that when something proves itself it stops being a prototype and becomes real engineered hardware: reviewed, testable, documented, and built to be manufactured. You set the engineering bar, make the calls on design, and own the work we send to external design houses and suppliers, so that outsourced never means unowned.
Requirements:
Bachelor's degree in Electrical Engineering.
7-10 years of hardware / electronics engineering experience (analog and digital board design, layout, bring-up, and debug), including 2-3 years managing hardware or multidisciplinary engineering teams.
You have taken hardware all the way to manufacturing, not just to a working prototype.
Hands-on proficiency with the team's board design tools (Altium).
Experience directing and managing external design houses or hardware suppliers.
A systems mindset, and comfort working across embedded, mechanical, and sensing.
Strong communication and leadership. You can push for speed without letting quality slide.
Hebrew and English.
Nice to have:
Experience scaling hardware from low-volume prototypes to volume manufacturing.
Background in sensing, RF/EM, or other signal-intensive systems.
Experience in a fast-paced startup or high-growth environment.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
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עדכון קורות החיים לפני שליחה
8794613
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Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
Required ChipDev CAD Engineer, Hardware, Cloud
About the job
Cloud's software engineers develop the next-generation technologies that change how billions of users connect, explore, and interact with information and one another. We're looking for engineers who bring fresh ideas from all areas, including information retrieval, distributed computing, large-scale system design, networking and data storage, security, artificial intelligence, natural language processing, UI design and mobile; the list goes on and is growing every day. As a software engineer, you will work on a specific project critical to our Cloud's needs with opportunities to switch teams and projects as you and our fast-paced business grow and evolve. You will anticipate our customer needs and be empowered to act like an owner, take action and innovate. We need our engineers to be versatile, display leadership qualities and be enthusiastic to take on new problems across the full-stack as we continue to push technology forward.
You will have the opportunity to find the perfect blend of software design practices and hardware development complexity. Whether your strength is in software coding, with a good understanding of hardware, or you are a hardware engineer with software proficiency, this balanced role will let you shine in both disciplines at the same time.
Cloud accelerates every organizations ability to digitally transform its business and industry. We deliver enterprise-grade solutions that leverage our technology, and tools that help developers build more sustainably. Customers in more than 200 countries and territories turn to Cloud as their trusted partner to enable growth and solve their most critical business problems.
Responsibilities
Manage project priorities, deadlines, and deliverables. Design, develop, test, deploy, maintain, and enhance software solutions.
Create software solutions that improve the hardware design process through automation. Propose, design, and implement software automation that directly addresses bottlenecks in today's ASIC and SoC EDA flow.
Work directly with the hardware team on projects prototype and then deploy tools to make a positive impact on our chip hardware development process. Participate in, or lead design reviews with peers and stakeholders to decide amongst available technologies.
Review code developed by other developers and provide feedback to ensure best practices (e.g., style guidelines, checking code in, accuracy, testability, and efficiency).
Triage product or system issues and debug/track/resolve by analyzing the issues and the impact on hardware and quality.
Requirements:
Minimum qualifications:
Bachelors degree or equivalent practical experience.
4 years of experience building developer tools that improve developer velocity, code quality, and code health (e.g., compilers, automated).
4 years of experience with software development in one or more programming languages, and with data structures and algorithms.
3 years of experience testing, maintaining, or launching software products, and 1 year of experience with software design and architecture.
Preferred qualifications:
3 years of industry experience with high performance, large-scale systems, and debugging.
Experience in chip design and related EDA tools and flows.
Deep understanding of object oriented programming and functional programming.
Proficiency in code and system health, diagnosis and resolution, and software test engineering.
Ability to write and understand SystemVerilog register transfer level (RTL) code.
Excellent software skills and design practices.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
עדכון קורות החיים לפני שליחה
עדכון קורות החיים לפני שליחה
8785585
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שירות זה פתוח ללקוחות VIP בלבד