Expert IC Package Design Lead

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09/08/2026

Senior/ Staff Package Design Engineer

חברה חסויה

Location:

Job Type: Full Time

we are establishing a strategic R&D center in Israel to drive the development of complex semiconductor chips that solve the critical 'data bottlenecks' enabling the future of AI at scale. As we expand our presence in Israel, we're seeking a visionary Package Design Engineer to help build our local engineering powerhouse from the ground up. This is a unique opportunity to take on meaningful product ownership in a new site, Driving the physical implementation strategy for chips that power the world's largest AI clusters.
As a Package Design Engineer, you will be a core technical contributor in the development of advanced IC packaging solutions for high-performance connectivity silicon. You will execute the package flow, design, and qualification from concept through production, working closely with silicon, signal integrity, power integrity, mechanical, manufacturing, and external OSAT partners. You will be responsible for implementing package technologies that meet aggressive electrical, thermal, mechanical, and cost targets, enabling our company products to operate reliably in the worlds most demanding AI and cloud environments.
Key Responsibilities
Execute end-to-end IC package design, from early feasibility and detailed design through to qualification and high-volume manufacturing
Implement package architecture and utilize advanced technologies (organic substrates, advanced laminate, interposers, multi-die/chiplet packaging, CoWoS - 2.5D/3D integration)
Drive signal integrity (SI), power integrity (PI), and thermal considerations at the package level for high-speed, high-power devices
Perform package layout, substrate routing, bump/ball maps, stack-ups, materials selection, and apply mechanical constraints
Collaborate closely with silicon design, SerDes, system, SI/PI, and reliability teams to optimize overall product performance
Interface directly with OSATs, substrate vendors, and manufacturing partners to ensure design-for-manufacturability (DFM), yield, and cost targets are met
Conduct package-related risk assessments, failure analysis, and corrective actions during bring-up and production ramp
Support NPI, qualification, and product sustainment activities, including vendor technical reviews.

Requirements:
5+ years of hands-on IC package design experience for high-performance semiconductor products, with full technical ownership from concept through tape-out
Expert proficiency in IC package design tools (Cadence APD / SiP or equivalent) and hands-on experience designing complex packages (BGA, FCBGA, FCCSP)
Strong package integration expertise, including stack-ups, ball/bump maps, constraints, SMT integration, and package BOM ownership
Deep understanding of signal, power, and thermal integrity at the package level, with the ability to execute design tradeoffs based on analysis
Proven manufacturing and release experience, including running DRC/LVS/DFM, OSAT engagement, and delivering production-ready package designs
Preferred Qualifications
Experience with AI, networking, PCIe, CXL, or other high-speed data center interfaces
Familiarity with package reliability standards and qualification (JEDEC, IPC, thermal cycling, HTOL, etc.)
Experience supporting chiplet-based architectures and heterogeneous integration
Demonstrated track record of complete technical package ownership on high-volume products.

This position is open to all candidates.

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11/08/2026

IC Package Design Engineer

חברה חסויה

Location: Tel Aviv-Yafo and Caesarea

Job Type: Full Time and Hybrid work

we are looking for a IC Package Design Engineer.
In this role, you will contribute to the development of complex ASIC package designs from early planning and exploration through implementation and tapeout. You will collaborate across package design, layout, SI/PI, and silicon teams to help deliver high‑speed, robust, and manufacturable package solutions.
You will participate in package architecture activities, design tradeoff discussions, and technical problem solving while growing your expertise in advanced packaging technologies and system-level integration. This role provides an opportunity to work on some of the most advanced networking silicon products in the industry within a highly collaborative engineering environment.
Responsibilities:
As a member of the Package Design team, you will:
Lead the package design activities including planning, floorplanning, pinout optimization, stack‑up definition, and high‑speed routing suport.
Collaborate with SI/PI, silicon floorplanning, layout, and manufacturing teams to ensure high‑quality package solutions.
Support package implementation activities and work closely with layout designers to ensure alignment between design intent and physical implementation.
Participate in technical investigations, design reviews, and tradeoff discussions involving performance, manufacturability, and schedule considerations.
Assist in developing and improving package design methodologies, flows, and best practices.
Contribute to debugging, issue resolution, and package bring‑up activities as needed.

Requirements:
Bachelors degree in Electrical Engineering or a related field.
5+ years of experience in package, PCB, or high‑speed design engineering.
Strong understanding of high-speed signal design and power distribution networks (PDN).
Familiarity with industry-standard EDA tools for layout and design.
Strong communication skills with the ability to collaborate and coordinate effectively with cross-functional teams
Preferred Qualifications:
Masters degree in Electrical Engineering
Experience with advanced packaging technologies, interposers, or multi‑die systems
Knowledge of silicon floor planning, signal integrity (SI), and power integrity (PI) considerations
Proven track record to drive design improvements and lead stakeholder coordination throughout the design process

This position is open to all candidates.

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03/08/2026

Senior Digital Hardware Design Engineer

חברה חסויה

Location: Ra'anana

Job Type: Full Time

We are seeking a talented, high-speed board design expert to own the detailed implementation and industrialization of our next-generation Counter-UAS (C-UAS) processing units.
As we scale to a complex, multi-product ecosystem featuring deep multi-sensor fusion, you will actively participate in shaping digital hardware architectures while leading the hands-on engineering from schematic design to mass production.
This position demands deep expertise in complex, multi-layer carrier board design specifically utilizing Intel processors and COM Express (COMe) architectures, as well as robust simulation and production methodologies.
Key Responsibilities:
Hardware Design Execution: Own the full lifecycle of complex digital hardware boards from schematic capture, component selection, and power distribution network (PDN) design through to high-yield mass production.
Architecture Collaboration: Actively participate in defining the digital hardware architecture, collaborating closely on modular computing strategies, baseboard optimizations, and multi-sensor integration.
Intel & COM Express Integration: Lead the detailed layout and integration of high-performance Intel processors and COM Express (COMe) form factors, managing complex, dense high-speed buses (PCIe Gen 4/5, DDR4/DDR5, 10GbE, USB4).
Simulation & Signal Integrity: Execute rigorous pre- and post-layout Signal Integrity and Power Integrity (SI/PI) simulations to guarantee precise timing margins, stable power delivery, and low-noise performance on dense, fine-pitch BGA footprints.
Production Scale-Up & DFx: Champion Design for Excellence (DFM, DFA, DFT) methodologies, boundary-scan testability, and detailed verification hardware documentation to ensure flawless transfer to manufacturing lines and eliminate field escalations.
Cross-Discipline Collaboration: Work closely with subcontractors (layout) and other R&D disciplines-including FPGA, Embedded SW, Cyber, and Mechanical engineering-to resolve interdisciplinary space, thermal, and noise constraints.

Requirements:
Required
B.Sc. in Electrical Engineering, Computer Engineering, or equivalent experience.
8+ years of proven experience as a board designer executing complex high-speed digital hardware projects through complete manufacturing cycles.
Deep, hands-on experience designing with Intel processors and implementing COM Express (COMe) architectures, alongside modern GPUs, FPGAs, or SoCs.
Proven track record routing and debugging a wide variety of hardware interfaces (Ethernet, PCIe, USB, MIPI, high-speed memory architectures).
Expertise leading multi-layer PCB design involving fine-pitch BGAs, high-density interconnects (HDI), via-in-pad structures, and strict layout subcontractor management.
Strong foundation in SI/PI fundamentals, simulation workflows, and hands-on laboratory debugging using high-bandwidth scopes and logic/protocol analyzers.
Personal Attributes: Exceptional independent project execution skills, strong problem-solving mindset, and excellent interpersonal skills to lead multi-disciplinary alignments.
Preferred
High proficiency with Altium Designer and advanced simulation toolsets (HyperLynx, Ansys, or equivalent).
Experience managing configuration and manufacturing parameters within Arena PLM.
Familiarity with regulatory frameworks and test standards (FCC/CE/MIC compliance, EMI/EMC shielding validation).
A foundational understanding of RF fundamentals to assist with mixed-signal isolation planning.

This position is open to all candidates.

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8766200

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22/07/2026

Senior Board Design Engineer, SIP

חברה חסויה

Location: Haifa

Job Type: Full Time

We are seeking a highly experienced and passionate Senior Board Design Engineer to spearhead the development of next-generation hardware platforms built around Annapurna's state-of-the-art devices. The ideal candidate thrives on tackling complex technical challenges and brings extensive expertise in high-speed digital, power, and embedded system board design.

In this role, you will lead the design and development of complex electronic boards - from system architecture and component selection, through schematic capture, PCB layout oversight, board bring-up, validation, and debugging.
You will collaborate closely with cross-functional teams - including software, ASIC, mechanical, and system engineering - to ensure seamless integration and successful product delivery. As the technical focal point for your projects, you will provide technical leadership, make key design decisions, and drive engineering excellence.

Key job responsibilities
Lead the architecture, design, and development of complex high-speed and mixed-signal boards.
Define board-level architectures and select appropriate components based on system requirements.
Create detailed schematics and guide PCB layout activities, ensuring signal integrity, power integrity, manufacturability, and reliability requirements are met.
Perform board bring-up, debugging, validation, and root-cause analysis using advanced laboratory equipment.
Drive technical decision-making and act as the primary hardware design authority for assigned projects.
Review designs and provide technical mentorship to other engineers.
Ensure designs meet performance, quality, schedule, and cost objectives.

Requirements:
Basic Qualifications
- B.Sc. in Electrical Engineering from a recognized university.
- At least 10 years of proven hands-on experience in high-speed digital, power, and embedded system board design.
- Extensive experience in schematic capture and PCB layout reviews.
- Strong hands-on experience with laboratory equipment, including oscilloscopes, spectrum analyzers, and network analyzers.
- Deep system-level understanding with strong analytical and troubleshooting skills.
- Ability to work effectively in a multidisciplinary environment and collaborate across engineering disciplines.
- Self-driven and capable of making independent technical decisions within areas of expertise.
- Proactive and adaptable, with the ability to thrive in a fast-paced environment while maintaining high-quality deliverables.

Preferred Qualifications
- Experience with DDR4 and DDR5 memory subsystem design and validation.
- Experience with PCI Express Gen5 and newer standards.
- Familiarity with signal integrity and power integrity analysis methodologies.
- HDL (Verilog/VHDL/SystemVerilog) development or debugging experience.
- Experience with high-speed interfaces, FPGA-based systems, and complex embedded platforms.

This position is open to all candidates.

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20/08/2026

Senior Board Design Engineer

חברה חסויה

Location: Haifa

Job Type: Full Time

We are looking for an experienced Board Design Engineer to support the design and development of complex mixed-signal and high-speed digital boards for advanced medical systems. You will join our multidisciplinary team in CT organization.

Your role :
Design and develop multi-layer high-speed PCBs and define layout constraints.
Perform component selection and schematic design.
Design power management circuits (including DC-DC converters and power distribution).
Design and support analog circuits and boards.
Support EMC/EMI tests.
Lead board bring-up, validation, and lab debugging. Troubleshoot system-level HW/FW issues.
Support high-speed interfaces such as DDR4/DDR5, PCIe, and Ethernet.
Support Install Base (IB) activities , field investigations, and NPI activities.
Support Lifecycle Management (LCM) tasks, including EOL handling.
Work with PCBA vendors on production, manufacturing issues, and yield improvements.
Search for component alternatives, test and approve replacements.
Work with PLM (Product lifecycle Management) system and support ECO creation and release.

Requirements:
You're the right fit if:
Bachelor's degree in Electrical Engineering.
7+ years of experience in board design working on multidisciplinary products.
Experience in board design tools, preferably Siemens EDM / Xpedition.
Deep understanding of Signal Integrity (SI) and Power Integrity (PI).
Experience in digital circuits design, power design, and analog circuit design.
Strong lab debugging & root-cause analysis skills using tools such as oscilloscopes and signal analyzers for problem solving.
Experience with DDR design constraints and validation.
Familiarity with PLM tools, especially Windchill.

Advantages
Experience with FPGA-based systems.
Experience in medical devices or other regulated industries.
Background in thermal design and power optimization.

This position is open to all candidates.

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16/08/2026

Board Design Engineer

חברה חסויה

Location: Haifa

Job Type: Full Time

We are looking for
we are looking for a Board Design Engineer for our Haifa site within the Aerospace Division. Join a leading global technology company developing advanced mission-critical systems and cutting-edge solutions across a wide range of defense applications. As part of our multidisciplinary engineering teams, you will take part in the development of advanced hardware platforms while working with cutting-edge technologies and complex engineering challenges
In this role you will
Support the development lifecycle of printed circuit boards (PCBs), from requirements capture and board-level architecture definition through design, integration, and testing of advanced digital hardware systems
Work closely with Software, FPGA, Mechanical, and Environmental Engineering teams throughout the development process
Lead PCB layout reviews, high-speed design activities, and signal integrity considerations
Perform debugging, validation, and engineering problem-solving activities during development and integration phases
Collaborate across teams and contribute to technical discussions and engineering solutions.

Requirements:
Bachelor's degree in electrical engineering
At least 3 years of experience in digital electronic board design
Experience with requirements capture and top-level architecture
Understanding of PCB layout methodologies and high-speed PCB design concepts
Experience working with signal integrity simulation tools such as Hyperlynx, Ansys, or similar tools
Experience with PCB design tools such as Altium Designer, Mentor Expedition, or Cadence
Experience in Voltage Regulated Modules DC/DC (VRM) design - Advantage
Background in retimers and redrivers - Advantage
Experience in Analog Circuit Design (amplifiers, filters, etc.) - Advantage
Problem-solving skills, teamwork abilities, and effective communication skills.

This position is open to all candidates.

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8782920

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11/08/2026

ASIC Physical Design Engineer

חברה חסויה

Location: Caesarea

Job Type: Full Time and Hybrid work

we are seeking a Physical Design Engineer.
Meet the Team:
The Physical Design team owns backend methodology and flow development from RTL to GDS. The team plays a critical role in developing high-quality VLSI designs for some of most advanced silicon products.
We work with the latest silicon technologies and processes to build large-scale, complex devices that push the boundaries of feasibility. You will collaborate with experienced engineers across architecture, design, verification, and implementation to deliver high-performance silicon.
Your Impact:
You will be part of the team, which is at the heart of software and ASIC design efforts. As a Physical Design Engineer, you will contribute to backend implementation work across key stages of chip design, helping move complex designs from RTL toward GDS.
You will work on physical synthesis, place and route, optimization, timing closure, and floor planning activities. Success in this role means delivering high-quality implementation results, learning quickly from senior engineers, and helping improve the flow and methodology used by the team.

Requirements:
B.Sc. or M.Sc. in Electrical Engineering or a related field.
2+ years of hands-on experience in VLSI backend design or a relevant physical design domain.
Strong understanding of the Place & Route flow.
Hands-on experience with physical synthesis, place and route, optimization, timing closure, or design floor planning.
Preferred Qualifications:
Understanding of physical construction and integration concepts across backend implementation.
Knowledge of physical design verification methodology, including LVS and DRC.
Familiarity with physical design EDA tools such as Synopsys, Cadence, or similar platforms.
Ability to learn independently, take ownership of assigned tasks, and work effectively with teammates.
Strong problem-solving skills and attention to detail in complex technical environments.

This position is open to all candidates.

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8777641

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19/08/2026

Board Design Engineer

חברה חסויה

Location: Ramat Gan

Job Type: Full Time

we are looking for a talented Hardware Engineer to join our development team. If you enjoy designing complex electronic boards, solving real-world system challenges, and working on cutting-edge defense technologies, we would love to hear from you.
Responsibilities:

* Design and develop electronic boards and system hardware architecture.
* Lead the full product lifecycle: concept, schematic, layout guidance, bring-up, and production.
* Collaborate with cross-functional teams (software, mechanical, system, and integration).
* Work with subcontractors and support performance analysis.
* Participate in design reviews, system validation, and field testing.
* Support the transition from development to manufacturing.

Requirements:
* B.Sc. in Electrical Engineering.
* 5+ years of experience in board-level hardware design.
* Strong experience in analog and digital design, simulations, and component selection.
* Hands-on experience with hardware bring-up, testing, and integration.
* Experience with OrCAD design tools (mandatory).
* Familiarity with EMC/EMI standards.
* Experience with STM32 microcontrollers (an advantage).
* Fluent in Hebrew and English. Preferred Qualifications
* Experience with MIL- STD standards.
* Knowledge of programmable devices (CPLD / FPGA).
* Ability to work with software teams and read Embedded code.
* Customer-facing experience and willingness to travel abroad.
* Experience with Nvidia, Qualcomm, or similar SOM platforms.

This position is open to all candidates.

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02/08/2026

Board Design Engineer

חברה חסויה

Location: Ramat Gan

Job Type: Full Time

we are looking for a talented Hardware Engineer to join our development team. If you enjoy designing complex electronic boards, solving real-world system challenges, and working on cutting-edge defense technologies, we would love to hear from you.
Why Join us?
This is a unique opportunity to be at the heart of a defense-tech startup during its most exciting growth phase.
Responsibilities
Design and develop electronic boards and system hardware architecture.
Lead the full product lifecycle: concept, schematic, layout guidance, bring-up, and production.
Collaborate with cross-functional teams (software, mechanical, system, and integration).
Work with subcontractors and support performance analysis.
Participate in design reviews, system validation, and field testing.
Support the transition from development to manufacturing.

Requirements:
B.Sc. in Electrical Engineering.
5+ years of experience in board-level hardware design.
Strong experience in analog and digital design, simulations, and component selection.
Hands-on experience with hardware bring-up, testing, and integration.
Experience with OrCAD design tools (mandatory).
Familiarity with EMC/EMI standards.
Experience with STM32 microcontrollers (an advantage).
Fluent in Hebrew and English.
Preferred Qualifications
Experience with MIL-STD standards.
Knowledge of programmable devices (CPLD / FPGA).
Ability to work with software teams and read embedded code.
Customer-facing experience and willingness to travel abroad.
Experience with Nvidia, Qualcomm, or similar SOM platforms.

This position is open to all candidates.

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8764626

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11/08/2026

Hardware Engineer- HW Board Design

חברה חסויה

Location: Caesarea

Job Type: Full Time

Our Board Design Team is growing! Youll collaborate with top industry engineers within the fast-growing Cisco Silicon One group worldwide.
You will be part of a team driving our groundbreaking next-generation network devices-Cisco Silicon One. Our team operates in a startup-like atmosphere within a global, leading corporation.
Our design center is unique, hosting all silicon hardware and software development fields under one roof. Our Networking Chips deliver high speed without compromising programmability, buffering, power efficiency, scale, or feature flexibility. They are strategically placed in critical AI infrastructure, powering next-generation network devices and supporting advanced AI workloads. They deliver high speed without compromising programmability, buffering, power efficiency, scale, or feature flexibility.
Your Impact:
Spearhead innovative silicon architecture for AI infrastructure, guiding board design from concept through to mass production.
Act as the technical decision-maker for the project and collaborate with cross-functional teams in mechanics, thermal, PCB layout, and software/RTL.
Define product specifications, develop electrical schematics, and guide component selection.
Conduct hands-on testing in a lab environment and drive the PCB bring-up, characterization, and debugging stages.

Requirements:
B.Sc. in Electrical Engineering or equivalent practical experience.
3+ years of experience as a hardware/board design engineer, with a strong background in executing complex hardware projects.
Experience in high-speed and multi-layer PCB design.
Hardware-oriented, with experience in measurements, characterization, and using lab equipment and hands-on experience in PCB bring-up and systematic debugging.
Preferred Qualifications:
Demonstrated success in leading multi-disciplinary projects.
Strong project management abilities, self-driven, with excellent interpersonal skills.
System orientation with a multi-disciplinary approach and multitasking capabilities.

This position is open to all candidates.

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