דרושים » חשמל ואלקטרוניקה » Expert IC Package Design Lead

Requirements:
5+ years of hands-on IC package design experience for high-performance semiconductor products, with full technical ownership from concept through tape-out
Expert proficiency in IC package design tools (Cadence APD / SiP or equivalent) and hands-on experience designing complex packages (BGA, FCBGA, FCCSP)
Strong package integration expertise, including stack-ups, ball/bump maps, constraints, SMT integration, and package BOM ownership
Deep understanding of signal, power, and thermal integrity at the package level, with the ability to execute design tradeoffs based on analysis
Proven manufacturing and release experience, including running DRC/LVS/DFM, OSAT engagement, and delivering production-ready package designs
Preferred Qualifications
Experience with AI, networking, PCIe, CXL, or other high-speed data center interfaces
Familiarity with package reliability standards and qualification (JEDEC, IPC, thermal cycling, HTOL, etc.)
Experience supporting chiplet-based architectures and heterogeneous integration
Demonstrated track record of complete technical package ownership on high-volume products.

Requirements:
Bachelors degree in Electrical Engineering or a related field.
5+ years of experience in package, PCB, or high‑speed design engineering.
Strong understanding of high-speed signal design and power distribution networks (PDN).
Familiarity with industry-standard EDA tools for layout and design.
Strong communication skills with the ability to collaborate and coordinate effectively with cross-functional teams
Preferred Qualifications:
Masters degree in Electrical Engineering
Experience with advanced packaging technologies, interposers, or multi‑die systems
Knowledge of silicon floor planning, signal integrity (SI), and power integrity (PI) considerations
Proven track record to drive design improvements and lead stakeholder coordination throughout the design process

Requirements:
Required
B.Sc. in Electrical Engineering, Computer Engineering, or equivalent experience.
8+ years of proven experience as a board designer executing complex high-speed digital hardware projects through complete manufacturing cycles.
Deep, hands-on experience designing with Intel processors and implementing COM Express (COMe) architectures, alongside modern GPUs, FPGAs, or SoCs.
Proven track record routing and debugging a wide variety of hardware interfaces (Ethernet, PCIe, USB, MIPI, high-speed memory architectures).
Expertise leading multi-layer PCB design involving fine-pitch BGAs, high-density interconnects (HDI), via-in-pad structures, and strict layout subcontractor management.
Strong foundation in SI/PI fundamentals, simulation workflows, and hands-on laboratory debugging using high-bandwidth scopes and logic/protocol analyzers.
Personal Attributes: Exceptional independent project execution skills, strong problem-solving mindset, and excellent interpersonal skills to lead multi-disciplinary alignments.
Preferred
High proficiency with Altium Designer and advanced simulation toolsets (HyperLynx, Ansys, or equivalent).
Experience managing configuration and manufacturing parameters within Arena PLM.
Familiarity with regulatory frameworks and test standards (FCC/CE/MIC compliance, EMI/EMC shielding validation).
A foundational understanding of RF fundamentals to assist with mixed-signal isolation planning.

Requirements:
Basic Qualifications
- B.Sc. in Electrical Engineering from a recognized university.
- At least 10 years of proven hands-on experience in high-speed digital, power, and embedded system board design.
- Extensive experience in schematic capture and PCB layout reviews.
- Strong hands-on experience with laboratory equipment, including oscilloscopes, spectrum analyzers, and network analyzers.
- Deep system-level understanding with strong analytical and troubleshooting skills.
- Ability to work effectively in a multidisciplinary environment and collaborate across engineering disciplines.
- Self-driven and capable of making independent technical decisions within areas of expertise.
- Proactive and adaptable, with the ability to thrive in a fast-paced environment while maintaining high-quality deliverables.

Preferred Qualifications
- Experience with DDR4 and DDR5 memory subsystem design and validation.
- Experience with PCI Express Gen5 and newer standards.
- Familiarity with signal integrity and power integrity analysis methodologies.
- HDL (Verilog/VHDL/SystemVerilog) development or debugging experience.
- Experience with high-speed interfaces, FPGA-based systems, and complex embedded platforms.

Requirements:
* Actively participate in hands on PCB design including schematics creation and layout work using industry standard EDA tools.
* Participate in the development of next-generation electro-optical (EO) devices and sub-systems for high-speed communication.
* Support electro-optic sub-systems and evaluation boards through schematic design, component selection, characterization, layout considerations, and implementation. Provide guidance on fabrication and assembly.
* Utilize advanced PCB technologies including mSAP, high-density HDI, and state-of-the-art PCB materials optimized for high-speed signal integrity supporting speeds up to 224 Gbps.
* Lead board bring-up, characterization, and debug, including high-speed scope and VNA measurements.
* Collaborate with hardware project teams, including Production, Software/Firmware, Photonics, and system.
* Support customers by reviewing schematics and PCB layouts, providing guidance to ensure robust design and high-speed performance.
* Utilize state-of-the-art laboratory equipment. Requirements What Were Looking For:
* B.Sc. in Electrical Engineering.
* 8+ years as a board designer with experience in executing complex hardware projects.
* Extensive experience designing high-speed PCBs, covering impedance control, length matching, and SI/PI best practices for standards such as Gigabit Ethernet and PCIe.
* Hands-on experience with Cadence tools (Allegro, OrCAD) for schematic capture and PCB layout.
* Experience in design ownership on major blocks/clusters from definition through implementation phases.
* Strong hands-on laboratory skills and debugging capabilities.
* Skilled in working with advanced PCB materials and high-density PCB technologies, including complex stackups and fine-pitch routing.
* Strong project management skills, independence, and excellent interpersonal abilities.
* Strong understanding of transmission lines, impedance control, crosstalk, and return-path design.
* Familiarity with lab equipment such as oscilloscopes, VNAs, and spectrum analyzers. What Will Make You a Star Candidate:
* Proven proficiency in ANSYS HFSS / SIwave / 3D Layout for electromagnetic, SI, and PI simulations.
* Ability to interpret and simulate S-parameters, eye diagrams, and frequency-domain models.
* Experience in PCB design involving high-speed DSPs, including power integrity, signal-integrity constraints, and high-speed interface routing.
* Practical experience with high-speed sampling oscilloscopes and optical spectrum analyzers.
* Experience with optical transceivers.
* Knowledge of photonic integration technology and its ecosystem.
* Experience in lab automation using Python -based tools.

Requirements:
Bachelor's degree in Electrical Engineering
7+ years of experience in board design working on multidisciplinary products
Experience in board design tools, preferably Siemens EDM / Xpedition
Deep understanding of Signal Integrity (SI) and Power Integrity (PI)
Experience in digital circuits design, power design, and analog circuit design
Strong lab debugging & root-cause analysis skills using tools such as oscilloscopes and signal analyzers for problem solving.
Experience with DDR design constraints and validation
Familiarity with PLM tools, especially Windchill
Advantages
Experience with FPGA-based systems
Experience in medical devices or other regulated industries
Background in thermal design and power optimization

Requirements:
B.Sc. or M.Sc. in Electrical Engineering or a related field.
2+ years of hands-on experience in VLSI backend design or a relevant physical design domain.
Strong understanding of the Place & Route flow.
Hands-on experience with physical synthesis, place and route, optimization, timing closure, or design floor planning.
Preferred Qualifications:
Understanding of physical construction and integration concepts across backend implementation.
Knowledge of physical design verification methodology, including LVS and DRC.
Familiarity with physical design EDA tools such as Synopsys, Cadence, or similar platforms.
Ability to learn independently, take ownership of assigned tasks, and work effectively with teammates.
Strong problem-solving skills and attention to detail in complex technical environments.

Requirements:
* B.Sc. in Electrical Engineering.
* 5+ years of experience in board-level hardware design.
* Strong experience in analog and digital design, simulations, and component selection.
* Hands-on experience with hardware bring-up, testing, and integration.
* Experience with OrCAD design tools (mandatory).
* Familiarity with EMC/EMI standards.
* Experience with STM32 microcontrollers (an advantage).
* Fluent in Hebrew and English. Preferred Qualifications
* Experience with MIL- STD standards.
* Knowledge of programmable devices (CPLD / FPGA).
* Ability to work with software teams and read Embedded code.
* Customer-facing experience and willingness to travel abroad.
* Experience with Nvidia, Qualcomm, or similar SOM platforms.

Requirements:
B.Sc. in Electrical Engineering or equivalent practical experience.
3+ years of experience as a hardware/board design engineer, with a strong background in executing complex hardware projects.
Experience in high-speed and multi-layer PCB design.
Hardware-oriented, with experience in measurements, characterization, and using lab equipment and hands-on experience in PCB bring-up and systematic debugging.
Preferred Qualifications:
Demonstrated success in leading multi-disciplinary projects.
Strong project management abilities, self-driven, with excellent interpersonal skills.
System orientation with a multi-disciplinary approach and multitasking capabilities.

Requirements:
B.Sc. in Electrical Engineering.
5+ years of experience in board-level hardware design.
Strong experience in analog and digital design, simulations, and component selection.
Hands-on experience with hardware bring-up, testing, and integration.
Experience with OrCAD design tools (mandatory).
Familiarity with EMC/EMI standards.
Experience with STM32 microcontrollers (an advantage).
Fluent in Hebrew and English.
Preferred Qualifications
Experience with MIL-STD standards.
Knowledge of programmable devices (CPLD / FPGA).
Ability to work with software teams and read embedded code.
Customer-facing experience and willingness to travel abroad.
Experience with Nvidia, Qualcomm, or similar SOM platforms.