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2 ימים
Location: Ra'anana
Job Type: Full Time
Our HW team in Israel is looking for an experienced System Engineer to join the Hardware Switch Group. The team leads the development of networking infrastructure for our next-generation data centers focusing on accelerated performance while enabling optimized end to end GPU connectivity.

What you'll be doing:
CPO (Co Package Optic) Switch System architecture and design from concept to mass production.
Define the HW requirement, HW arch, board partition and lead electro-optic-mech concept. In addition - design/review HW aspects such as schematics, component selection, layout, opto-mechanics, DFM/T.
Collaborate and integrate with all HW project fields: Board Design, Mechanics, Thermal, Production, Software/Firmware, RTL and more.
The position consists of hands-on testing in lab environment for electrical and optical integration & validation, including problem solving while accompany production and qualification process.
Requirements:
What we need to see:
B.Sc. in Electrical Engineering (or equivalent experience).
8+ years as a System/Hardware Engineer, experience in design and integration of complex HW projects execution.
Hands-on lab and HW & SW Tools skills.
Proven experience as technical leading multi-disciplinary projects.
Comprehensive understanding of RTL implementations (CPLD/FPGA).
Excellent interpersonal relationship and demonstrated ability taking ownership.

Ways to stand out from the crowd:
Experience in data-center switches products design and validation & verification for high volume manufacturing.
Experience in optic system, design, debug and testing.
This position is open to all candidates.
 
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2 ימים
חברה חסויה
Location: Ra'anana and Yokne`am
Job Type: Full Time
Our HW team designs innovative end-to-end connectivity solutions for GPU servers. Our products optimize data center performance and deliver industry-leading bandwidth and scalability. Our products are focused on delivering the most optimized power - performance communication solutions for industries like AI, ML, Cloud, Media and Entertainment as well as any other industry that can benefit from our Datastream acceleration.



What you'll be doing:

Lead Pioneering Switch System design from concept to mass production.

Collaborate and integrate with all HW project fields: Board Design, Mechanics, Thermal, PCB Layout, Production, Software/Firmware, RTL and more.

Project decision maker - Technical focal point.

The position consists of product specification definitions, electrical schematics, component selection, layout guidance, hands-on testing in a lab environment, accompanying production and qualification processes.
Requirements:
What we need to see:

B.Sc. in Electrical Engineering (or equivalent experience).

10+ years as a board designer, experience in complex HW projects execution.

Proven experience in leading multi-disciplinary projects.

Hands-on lab skills.

Multi layer PCB design knowledge.

Experience in high current power delivery design.

Comprehensive understanding of RTL implementations (CPLD/FPGA).

Personal: Project management skills, independent, excellent interpersonal relationship.


Ways to stand out from the crowd:

Experience in data-center switches products design for high volume manufacturing.

Proven knowledge in high speed design (25Gb/s and above).

Experience in HW team lead.

Knowledge in advanced PCB technology.

Experience in leading customers conversations, understanding product requirements.
This position is open to all candidates.
 
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23/07/2026
חברה חסויה
Location: Ra'anana
Job Type: Full Time and Hybrid work
We are looking for a motivated Hardware Engineer to join our Hardware team in Raanana.

You will have the chance to develop your own skills in a flexible and energetic work atmosphere with friendly and experienced colleagues. You will have helpful supervision, opportunity to learn, modern tools and flexible work culture.

If you want to be a part of our growing company that is driven by innovation and is focused on building a future together with our employees, consider applying.

Principle duties and responsibilities:

Design hardware modules, subsystems and systems for synchronization products.

Develop schematics and guide PCB layout (high-speed, mixed-signal, power).

Select and evaluate components (ICs, power devices, oscillators, interfaces).

Design high-speed interfaces (e.g., 10G/25G Ethernet) with signal integrity considerations.

Contribute to hardware design specifications (HDS) and documentation.

Support system-level integration (HW, FPGA, SW).

Define and execute validation and integration test plans.

Debug complex board and system-level issues (mixed-signal, high-speed).

Perform lab bring-up, measurements, and performance characterization.

Support product transfer to manufacturing (NPI).

Collaborate with manufacturing and test teams for production readiness.

Investigate and resolve issues during production and field operation.

Ensure product reliability, quality, and compliance with applicable standards.

Functional Collaboration.

Work closely with FPGA, software, system, SIT/SVT and mechanical teams.

Participate in design reviews and technical discussions.

Interface with suppliers and external partners as required.

Evaluate and introduce new technologies and components.

Drive improvements in performance, power efficiency, and cost.

Contribute to system architecture discussions and design trade-offs.
Requirements:
B.Sc. in Electrical Engineering.

3+ years of hands-on hardware design experience - High advantage.


Experience with:

Schematic design and PCB layout guidance.

High-speed digital and mixed-signal design.

Power design (DC/DC, PoE or similar).

Experience in debugging hardware at board and system level.

Familiarity with lab equipment (oscilloscope, spectrum analyzer, etc.).

Strong analytical and problem-solving skills.
This position is open to all candidates.
 
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Location: Ra'anana
Job Type: Full Time
We are seeking a talented, high-speed board design expert to own the detailed implementation and industrialization of our next-generation Counter-UAS (C-UAS) processing units.
As we scale to a complex, multi-product ecosystem featuring deep multi-sensor fusion, you will actively participate in shaping digital hardware architectures while leading the hands-on engineering from schematic design to mass production.
This position demands deep expertise in complex, multi-layer carrier board design specifically utilizing Intel processors and COM Express (COMe) architectures, as well as robust simulation and production methodologies.
Key Responsibilities:
Hardware Design Execution: Own the full lifecycle of complex digital hardware boards from schematic capture, component selection, and power distribution network (PDN) design through to high-yield mass production.
Architecture Collaboration: Actively participate in defining the digital hardware architecture, collaborating closely on modular computing strategies, baseboard optimizations, and multi-sensor integration.
Intel & COM Express Integration: Lead the detailed layout and integration of high-performance Intel processors and COM Express (COMe) form factors, managing complex, dense high-speed buses (PCIe Gen 4/5, DDR4/DDR5, 10GbE, USB4).
Simulation & Signal Integrity: Execute rigorous pre- and post-layout Signal Integrity and Power Integrity (SI/PI) simulations to guarantee precise timing margins, stable power delivery, and low-noise performance on dense, fine-pitch BGA footprints.
Production Scale-Up & DFx: Champion Design for Excellence (DFM, DFA, DFT) methodologies, boundary-scan testability, and detailed verification hardware documentation to ensure flawless transfer to manufacturing lines and eliminate field escalations.
Cross-Discipline Collaboration: Work closely with subcontractors (layout) and other R&D disciplines-including FPGA, Embedded SW, Cyber, and Mechanical engineering-to resolve interdisciplinary space, thermal, and noise constraints.
Requirements:
Required
B.Sc. in Electrical Engineering, Computer Engineering, or equivalent experience.
8+ years of proven experience as a board designer executing complex high-speed digital hardware projects through complete manufacturing cycles.
Deep, hands-on experience designing with Intel processors and implementing COM Express (COMe) architectures, alongside modern GPUs, FPGAs, or SoCs.
Proven track record routing and debugging a wide variety of hardware interfaces (Ethernet, PCIe, USB, MIPI, high-speed memory architectures).
Expertise leading multi-layer PCB design involving fine-pitch BGAs, high-density interconnects (HDI), via-in-pad structures, and strict layout subcontractor management.
Strong foundation in SI/PI fundamentals, simulation workflows, and hands-on laboratory debugging using high-bandwidth scopes and logic/protocol analyzers.
Personal Attributes: Exceptional independent project execution skills, strong problem-solving mindset, and excellent interpersonal skills to lead multi-disciplinary alignments.
Preferred
High proficiency with Altium Designer and advanced simulation toolsets (HyperLynx, Ansys, or equivalent).
Experience managing configuration and manufacturing parameters within Arena PLM.
Familiarity with regulatory frameworks and test standards (FCC/CE/MIC compliance, EMI/EMC shielding validation).
A foundational understanding of RF fundamentals to assist with mixed-signal isolation planning.
This position is open to all candidates.
 
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Location: Ra'anana
Job Type: Full Time
Required RF/HW & System Validation Engineer
Scope:
As an RF/HW Validation Engineer, you will bridge the gap between HW/RF validation and complex system-level testing. You will design, develop, and execute automated and manual test plans to verify the performance, reliability, and compliance of our SDR (Software Defined Radio) architectures and multi-layered tactical systems (including integration with other systems).
Key Responsibilities:
System-Level Testing: Execute end-to-end system testing of counter-drone platforms, verifying the integration of RF hardware, firmware, and complex software-defined radio algorithms under real-world scenarios.
Hardware Product Testing: Test and validate various HW products, including antennas, radar systems, jammers, and related peripherals.
Failure Analysis & Troubleshooting: Debug complex RF anomalies, signal integrity issues, and system bugs down to the component/board level, working closely with RF Design, Board Design, and SW teams.
Documentation: Create comprehensive test plans (ATP/DTP), write test reports, and present data-driven analysis to cross-functional R&D teams to impact the next generation of hardware.
Requirements:
B.Sc. in Electrical Engineering / Electronic Engineering or a related technical discipline.
5+ years of experience in RF system testing and validation.
RF Technical Skills: Deep understanding of RF parameters and concepts: S-parameters, EVM, BER, NF, P1dB, Phase Noise, Link Budget. Hands-on experience with high-end RF test equipment (Keysight, Rohde& Schwarz, Anritsu).
Strong troubleshooting skills in multi-disciplinary systems involving RF, HW, Embedded SW, and Linux environments.
Creative, hands-on approach with a strong troubleshooting orientation.
Fluent in English (written and verbal).
Advantages (Nice to Have):
Experience with SDR (Software Defined Radio) architectures and FPGA-based RF systems.
Experience with regulatory compliance testing (FCC, CE, ETSI, MIL-STD).
Knowledge of digital signal processing (DSP) and wireless protocols (Wi-Fi, Bluetooth, LTE/5G).
Test Automation: Develop, optimize, and maintain automated RF test
environments and scripts using Python to streamline chip validation and
production testing.
Background in the defense-tech, electronic warfare (EW), or telecommunications industries.
This position is open to all candidates.
 
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2 ימים
Location: More than one
Job Type: Full Time
We are seeking a highly motivated High-Performance System Architect to join our team of experts and help shape the future of high-performance and ML / AI computing. Our next-generation NVL systems will be at the forefront of connecting and powering the world's most advanced compute clusters, from supercomputers used in AI research to high-performance clusters used at almost every industry today, such as car and Pharmaceutical. As a high-performance system architect, you will have the opportunity to work on some of the most cutting-edge technology and help to drive the innovation of our next generation networks that will be used by top researchers and engineers around the world.

What youll be doing:

Define the NVL system architecture end-to-end, by internal requirements and customers requirements through all product life cycles (post/pre silicon, on deployments).

Research of various solutions to enable the next large-scale-high-performance computing clusters. The position spans over various layers from algorithms, software, firmware, and HW.

Developing models for simulations and performance testing, analysing the results and development of future HW and SW.

Collaborate with cross-functional teams, including other architecture teams, logic design, system software, firmware, and research teams, to ensure the successful execution of the project.
Requirements:
What we need to see:

B.Sc, M.Sc, or Ph. D degree in Computer Science, Computer Engineer, or Electrical Engineer.

At least 5 years of industry or research experience in computer networks.

Excellent understanding of large-scale networks behaviour and the effect of distributed computing workloads effect on the network.

Experience in development of simulation environments.

Possess strong managerial, problem solving and critical thinking skills.

Ability to work and operate in a highly dynamic environment.

Partner with multiple groups in the organization.


Ways to stand out of the crowd:

Strong understanding in network protocols - such as InfiniBand, IP, TCP and RoCE and network topologies.

Good knowledge in Python, C++.

Good knowledge with AI models.

Familiarity with HPC environments, routing algorithms, Omnet++ and NS3 simulation environments.
This position is open to all candidates.
 
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Location: Ra'anana
Job Type: Full Time
We are seeking a high-caliber, multidisciplinary Hardware Systems Architect & Tech Lead to serve as the technical cornerstone of our hardware development and system integration.
In this role, you will bridge high-level system requirements with physical deployment reality, acting as the designated "Tech Lead" driving day-to-day engineering execution.
This role demands a "System of Systems" mindset. Beyond engineering our core SDR and RF hardware architectures, you will orchestrate the physical, logical, and electrical integration of complex tactical sensor suites - incorporating software-defined radios, active/passive radar arrays, electro-optical (EO/IR) cameras, and jamming payloads.
You will steer the hardware through its entire lifecycle (PLCM) while implementing flawless Design for Excellence (DFx) frameworks.
KEY RESPONSIBILITIES:
System of Systems Integration: Architect, model, and define hardware-level interfaces and high-speed data flow paths for multi-sensor integration (SDR, Active/Passive Radar, EO/IR Cameras, and RF Jamming payloads).
Requirements Definition: Translate high-level operational and product demands into detailed, actionable hardware and system-level requirements, Interface Control Documents (ICDs), and structural specifications.
System Modeling: Establish and manage rigorous physical power, thermal, high-speed data bandwidth, and RF link budgets for deeply integrated tactical configurations.
Technical Ownership: Direct day-to-day engineering activities, lead comprehensive design reviews, and serve as the final authority on architectural and hardware design trade-offs.
Product Lifecycle Management (PLCM): Guide hardware products smoothly through the entire lifecycle-from early concept and prototyping to mass production, validation, field deployment, and subsequent obsolescence management.
Cross-Functional Orchestration: Align and coordinate specialized teams across RF/Analog, high-speed digital, FPGA, embedded software, and mechanical engineering to achieve seamless hardware/software synergy.
Test Strategy Definition: Architect and define the end-to-end testing, verification, and validation (V&V) strategy for complex hardware-software systems.
Progressive Integration: Design and oversee methodical integration plans, successfully migrating subsystems from standalone bench testing to full "System of Systems" integration.
System Verification: Oversee high-reliability Hardware-in-the-Loop (HIL) testing, RF performance verification, and automated test regression setups.
Operational Validation: Partner with field testing and QA teams to design real-world tactical validation scenarios (including drone flight trials and complex RF interference environments) to ensure top performance in the field.
DFx Implementation: Drive critical design decisions optimizing for manufacturability (DFM), automated testing (DFT), reliability (DFR), and target cost (DFC) without sacrificing tactical performance.
Requirements:
Education: B.Sc. in Electrical Engineering, Electronic Engineering, Systems Engineering, or a related discipline. M.Sc. is highly preferred.
Experience: 10+ years of hardware and systems engineering experience, including a minimum of 4+ years
leading complex technical projects or driving system architecture.
Industry: Proven track record of shipping defense, aerospace, or advanced commercial telecom/tactical rugged systems to market.
SDR & Core Hardware Foundations: Strong hands-on background in high-performance digital and RF design.
Proficient in selecting, configuring, and integrating SoCs, FPGAs (e.g., AMD/Xilinx Zynq UltraScale+, RFSoC), RF transceivers, and high-speed converters.
Multi-Sensor Systems: Deep practical experience integrating diverse hardware subsystems (e.g., SDR sensors, active radar systems, EO/IR cameras, tactical communication networks, and RF jamming architectures).
This position is open to all candidates.
 
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חברה חסויה
Location: Ra'anana
Job Type: Full Time and Hybrid work
we are seeking a highly motivated Power Integrity Engineer to join our Hardware Engineering team. In this role, you will be responsible for defining, analyzing, simulating, and validating power delivery networks (PDNs) for next-generation networking platforms supporting high-performance ASICs, advanced SerDes interfaces, optical modules, and AI-scale networking systems.
You will work closely with hardware architects, PCB designers, ASIC teams, signal integrity engineers, mechanical engineers, and manufacturing partners to ensure robust power delivery, optimal system performance, and successful product deployment.
Responsibilities:
Lead Power Integrity (PI) activities throughout the hardware development lifecycle, from architecture through production.
Define and optimize board-level and package-level Power Delivery Networks (PDNs) for high-current networking ASICs and supporting devices.
Perform pre-layout and post-layout PI simulations using industry-standard tools.
Establish target impedance requirements and validate compliance across all power rails.
Analyze DC voltage drop, AC impedance, transient response, and power distribution performance.
Collaborate with PCB layout engineers to optimize stackups, plane structures, decoupling strategies, and power routing.
Work closely with Signal Integrity engineers to ensure SI/PI co-optimization of high-speed interfaces.
Develop power integrity design guidelines and best practices for next-generation networking products.
Support schematic reviews, layout reviews, and design sign-off activities.
Perform laboratory measurements and correlation using oscilloscopes, VNAs, power analyzers, current probes, and related equipment.
Investigate and resolve PI-related issues during board bring-up, validation, and production.
Collaborate with ASIC, FPGA, memory, optics, and power component vendors to optimize overall system performance.
Drive continuous improvement of PI methodologies, simulation flows, and validation processes.
Requirements:
B.Sc. or M.Sc. in Electrical Engineering.
5+ years of experience in Power Integrity, Hardware Design, or related disciplines.
Strong understanding of power delivery networks, decoupling methodologies, and target impedance concepts.
Hands-on experience with PI simulation tools such as:
Cadence Sigrity PowerSI / OptimizePI
Ansys SIwave
Ansys HFSS
PowerDC or equivalent
Experience designing high-layer-count PCBs for networking, telecom, server, or data-center products.
Knowledge of high-speed digital systems and interaction between Signal Integrity and Power Integrity.
Experience with multi-phase voltage regulators, power sequencing, and power management architectures.
Strong understanding of PCB materials, stackups, and manufacturing constraints.
Experience performing lab validation and correlation measurements.
Excellent problem-solving, communication, and teamwork skills.
Preferred Qualifications:
Experience with high-performance networking ASICs and switch silicon.
Familiarity with 112G/224G/448G PAM4 SerDes technologies.
Experience with Ethernet systems ranging from 400G to 1.6T and above.
Understanding of package-level PI and advanced packaging technologies.
Familiarity with optical networking platforms and co-packaged optics.
Experience with thermal and mechanical effects on PDN performance.
Knowledge of EMI/EMC considerations in high-density networking systems.
Experience working with ODMs, CMs, and global manufacturing partners.
This position is open to all candidates.
 
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2 ימים
Job Type: Full Time
We are looking for an outstanding Senior Networking Software Architect to join the NIC/DPU Software and Firmware Architecture group. In this role, you will help define the next generation of our datacenter and AI networking platforms, with focus on DPU management, QoS, performance, telemetry, and software architecture across stacks. You will work closely with hardware designers, firmware/kernel driver teams, system engineers, validation, product management and customers. The role spans early architecture definition, pre-silicon design, bring-up, and production readiness for large-scale AI and cloud datacenter deployments.

What Youll Be Doing:

Own software and system architecture for next-generation DPU management, QoS, performance, telemetry, and observability features.

Define end-to-end control and management flows across DOCA, host drivers, embedded firmware, BMC, management controllers and external management systems.

Specify telemetry and observability requirements, including counters, logs, traces, events, health monitoring, debug data, and streaming telemetry.

Define management interfaces and APIs for configuration, provisioning, lifecycle operations, diagnostics, and field serviceability.

Write clear architecture specifications, interface definitions, flow diagrams, and design documents for software, firmware, and system teams.

Partner with R&D teams to translate high-level architecture into implementable designs and guide features through development, validation, silicon bring-up, and production.

Analyze system performance bottlenecks, interoperability issues, telemetry gaps, and customer-reported issues, then feed learnings into future architecture.

Collaborate with system and cluster architects to ensure NIC/DPU features fit end-to-end AI datacenter and cloud networking designs.
Requirements:
What We Need To See:

B.Sc. or M.Sc. in Computer Engineering, Computer Science, Electrical Engineering, or equivalent experience.

9+ years of experience in networking, system software, embedded software, firmware, or datacenter infrastructure.

Proven experience in software architecture, or technical leadership roles.

Deep understanding of networking concepts and protocols such as Ethernet, TCP/IP, RDMA/RoCE, congestion control, QoS, virtualization overlays, and traffic management.

Strong background with DPUs, SmartNICs, or other high-performance networking devices.

Experience with system management, provisioning, monitoring, telemetry, diagnostics, or lifecycle-management flows.

Familiarity with management protocols and frameworks such as Redfish, PLDM, MCTP, IPMI, gNMI, SNMP, Netconf, REST, or gRPC-based APIs.

Ability to lead cross-functional architecture discussions across software, firmware, hardware, validation, product, and customer-facing teams.

Excellent written and verbal communication skills, including the ability to create clear architecture documents and present trade-offs.


Ways To Stand Out From The Crowd:

Experience defining software architecture for DPU products, including management, telemetry, QoS, performance, security, virtualization, or offload features.

Hands-on background with Linux networking, device drivers, firmware, embedded Linux, BMC software, DOCA, DPDK, OVS or Kubernetes networking.

Experience with performance counters, profiling tools, eBPF, Prometheus, Grafana, dashboards, heat maps, or large-scale telemetry systems.

Experience in defining and developing GAI-based analysis tools to extract insights from telemetry data and streams.

Background in RAS, diagnosability, serviceability, field failure analysis, production debug, or customer escalation handling.
This position is open to all candidates.
 
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6 ימים
Location: Ra'anana
Job Type: Full Time
We are looking for a Distinguished Engineer to help shape the future of AI infrastructure. As part of our advanced development and research efforts, you will drive technical vision and innovation across the AI software stack, spanning GPU computing, RDMA, NVLink, storage, and large-scale distributed systems. You will research next-generation system designs, influence product and platform direction, and help define how massive-scale AI environments are built, optimized, and operated through hardware-software co-design.

What youll be doing:

Research, define, and drive co-design solutions across AI software stacks involving GPU computing, RDMA networking, NVLink interconnects, storage, and large-scale distributed infrastructure.

Lead deep technical investigations and proof-of-concept development in areas related to distributed AI, deep learning systems, high-performance computing, virtualization, memory management, and large-scale systems design.

Work closely with multiple teams across us to advance next-generation AI infrastructure technologies and influence cross-stack co-design decisions.

Analyze end-to-end system bottlenecks and opportunities across compute, networking, memory, and storage layers to improve performance, scalability, and efficiency.

Guide the design of environments that support massive-scale AI training and inference workloads in production.
Requirements:
What we need to see:

M.S. or Ph.D. in Computer Science, Electrical Engineering, Computer Engineering, or equivalent experience.

20+ years of industry experience in systems design, distributed systems, system software, or related fields.

Chief Scientist, CTO, or equivalent senior technical leadership experience in smaller companies is highly desirable.

Deep background in distributed systems, parallel computation, networking, storage, virtualization, and memory management.

Experience building, scaling, and supporting environments for massive AI workloads.

Strong understanding of large-scale systems operational aspects, including performance, reliability, scalability, and supportability.

Excellent communication, collaboration, and technical leadership skills in a multi-national, multi-time-zone environment.


Ways to stand out from the crowd:

Proven research track record in AI systems, large-scale infrastructure, or advanced systems co-design.

Deep expertise in GPU systems, RDMA, NVLink, and storage technologies for AI and HPC workloads.

Strong record of cross-functional influence spanning hardware, system software, networking, and infrastructure.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
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עדכון קורות החיים לפני שליחה
8768266
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v נשלח
תודה על שיתוף הפעולה
מודים לך שלקחת חלק בשיפור התוכן שלנו :)
Location: Ra'anana
Job Type: Full Time
We are seeking a Senior RF Systems & Design Engineer to join our RF team and help architect and industrialize our next-generation Counter-UAS (C-UAS) multi-product hardware ecosystem. In this role, you will bridge the gap between high-level Software-Defined Radio (SDR) concepts and high-yield mass production. You will guide modular architectural layouts, define core interfaces for internal and external sensors, implement critical DFx methodologies, and mentor junior talent within an evolving, fast-paced technical landscape
Key Responsibilities
1. Architecture & System-Level Design
Architect modular, RF transceiver systems and define cascading link budgets (NF, Gain, IP3, P1dB) from antenna to converter.
Design advanced wideband SDR front-ends and direct RF sampling topologies tailored to defeat dynamic threats.
Establish Interface Control Documents (ICDs) and hardware abstraction standards to seamlessly integrate 3rd-party subsystems (Radar, EO/RF).
2. Detailed HW Design, Simulation & Validation
Lead schematic capture, high-frequency/high-density PCB layout supervision, and component choices (PAs, LNAs, synthesis filters).
Perform electromagnetic and circuit-level modeling (ADS, HFSS, or equivalent) to resolve structural EMI/EMC and co-site isolation issues.
Formulate strict engineering Verification & Validation (V&V) plans, overseeing environmental and compliance certifications.
3. DFx & Production Scale-Up
Champion Design for Manufacturing/Assembly/Test (DFM/DFA/DFT) workflows to ensure stable, repeatable high-yield production loops.
Define line-calibration algorithms, built-in self-tests (BIST), and leverage Statistical Process Control (SPC) data to reduce production and field escalations.
4. Leadership & Mentorship
Collaborate across disciplines (Mechanical, Digital, Cyber-Software) to systematically resolve thermal, power, and high-speed noise friction points.
Act as a primary technical mentor for junior engineers, implementing standard product lifecycle (PLC) gating and best practices.
Requirements:
Experience: 7+ years of hands-on professional RF/Microwave hardware design and architecture experience (Defense, Aerospace, or Telecom preferred).
Education: Bachelor's or Master's degree in Electrical Engineering, RF Engineering, or a highly related discipline.
Radio Architecture: Deep knowledge of modern SDR structures, direct RF sampling frameworks, high-speed ADCs/DACs, and discrete active/passive components.
Production Track Record: Demonstrated success taking at least two multi-layered RF products through full PLC gates from initial concept into mass production.
Tool Mastery: Proficiency with industry simulation suites (ADS, HFSS, CST) and standard schematic/layout platforms (Altium, Cadence, or equivalent).
Lab Capabilities: Expertise with core diagnostic tools (Vector Network Analyzers, Spectrum/Signal Analyzers, digital signal generators, noise figure meters).
Preferred Qualifications
Proven competency navigating complex co-site isolation and spectrum management parameters in highly congested environments.
Familiarity with RFI/EMI compliance standards (MIL-STD, CE, FCC) and mitigating failures early in layout.
An agile, structured mindset with an eagerness to introduce robust, proactive engineering workflows to a growing team.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
עדכון קורות החיים לפני שליחה
עדכון קורות החיים לפני שליחה
8766203
סגור
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