We are seeking an experienced and self-driven Senior Mechanical Engineer to join our Ultrasound Point of Care (POC) R&D team. In this role, you will be responsible for leading the mechanical design, development, verification, and transition to manufacturing (NPI) of compact ultrasound systems, consoles, and system accessories.
This position emphasizes complete end-to-end mechanical ownership-from initial conceptual design, detailed CAD modeling, and DFM to collaborating with external subcontractors, managing tooling approvals, and ensuring seamless integration on the manufacturing line.
Job Description
Key Responsibilities
Mechanical Design & Engineering: Drive the mechanical design and electronics packaging of compact ultrasound hardware, consoles, suspended masses, sheet metal structures, and custom system accessories from initial concept through mass production.
Subcontractor & Vendor Collaboration: Collaborate with external subcontractors, injection molding suppliers, tooling vendors, and design agencies (including overseas suppliers in China and globally) to ensure design feasibility and quality.
DFM & Production Readiness: Oversee Design for Manufacturability (DFM) reviews, tool design approvals, sample inspections, and root-cause analysis for plastic injection parts, metal forming, castings, and extrusions.
Design Control & Documentation: Author and maintain technical documentation, including System/Mechanical Requirements Specifications (DRS), Verification Protocols (VPR, VRS), Engineering Change Requests/Orders (ECR/ECO), assembly drawings, and Bill of Materials (BOM).
Compliance & Standards: Ensure mechanical design compliance with medical device standards, cleaning & disinfection guidelines (ISO 17664), system labeling, and environmental/regulatory requirements.
Testing & Assembly Line Support: Design test fixtures, write verification plans, execute mechanical testing, and provide real-time engineering support to assembly floors and production lines.

we are looking for a Senior Mechanical Engineer.
In this role, you will lead all mechanical aspects of the product in R&D projects, taking it from concept to full scale development while working with multidisciplinary teams that include system engineering, physics, electronics, software, project managers, and others. You will serve as a technical focal point for mechanical design decisions, balancing performance, manufacturability, reliability, and cost.
Your role:
Lead the mechanical design including 3D models, drawings, prototype manufacturing, and production transfer.
Provide solutions that optimize performance, service, manufacturability, and cost.
Perform required analysis, testing, troubleshooting, and documentation.
Work with local and global teams inside and outside Philips to answer design, service, and production challenges.
Own mechanical risk identification, mitigation plans, and design reviews
Operate in a multidisciplinary environment under conflicting constraints of performance, reliability, cost, and development schedule.

We are looking for a Mechanical Design Engineer to join our Electronic Warfare R&D team and work on mechanical development of advanced counter-UAV detection and jamming systems.

Key Responsibilities
Lead full-cycle mechanical design of electronic and RF system assemblies - from initial architectural concept, thermal and structural analysis, and PCB integration to volume serial production
Perform structural, thermal, and modal analyses.
Select suitable materials, components, and manufacturing technologies.
Manage development and engineering processes end-to-end: from concept, through prototyping, to full production implementation, ensuring quality and supply chain standards.
Prepare drawings, production files, and BOMs according to ISO standards.
Develop mechanical solutions for multidisciplinary systems (mechanics, RF, electronics, aeronautics).
Define and design cable assemblies, including cable routing and integration within the system
Conduct verification and validation testing.
Work with advanced CAD tools: SolidWorks for design and PDM for production document management.

We are looking for a highly skilled Senior Thermal-Mechanical Engineer to join our mechanical engineering team as a key player in the development of next-generation high-performance compute platforms for autonomous driving systems.
This key position includes leading the thermal-mechanical design and cooling architecture of advanced electronic systems throughout all lifecycle stages-from concept to mass production-while working closely with hardware, PCB layout, mechanical, validation, manufacturing, suppliers, and customers.
What will your job look like?
Lead the thermal-mechanical design process from concept through validation, NPI, and production.
Define cooling architectures and optimize air- and liquid-cooling solutions for high-power electronic systems.
Perform thermal simulations and analyses using tools such as Icepak, FloTHERM, Fluent, or equivalent.
Perform mechanical simulations and analyses using tools such as ANSYS Mechanical, Abaqus, Nastran, or equivalent.
Correlate simulation results with lab measurements and drive solutions that meet system requirements.
Lead thermal validation, prototyping, environmental testing, and reliability activities.
Collaborate closely with cross-functional teams, suppliers, subcontractors, and customers.
Support mechanical design and serve as a technical focal point for complex thermal-mechanical challenges.

As an R&D Mechanical Engineer at Augury, you will own the design of new parts and assemblies, design parts for machining and injection molding, perform analytical calculations and V&V tests.

Youll work closely with mechanical, hardware, V&V, sustain, manufacturing, and external sub contractors, to deliver innovative, reliable, and scalable IoT devices.

A Day In Your Life
Design mechanical parts and mechanisms, for highly challenging environments, from initial concepts, through all design phases, until transfer to production.
Master 3D CAD models and drawings for mechanical components, assemblies, jigs, and fixtures (including release management and GD&T).
Design for plastics: mostly parts for injection molding, compression and other classical manufacturing methods.
Run prototype validation: mechanical inspection, stress testing, sealing, field testing and support high level system validation procedures.
Cooperate with multidisciplinary teams (HW, V&V, FW, Algo), utilizing analytical thinking and strong theoretical background.
Transfer parts for production, in collaboration with the engineering team, and following product lifecycle methodologies.
Work with subcontractors and vendors in Israel and internationally.

This position refers to leading the design of parts and assemblies for the company imaging systems (PET, SPECT). The position includes working inside an NPI project or supporting the systems in the field (Install Base). The mechanical design of parts and assemblies includes working with multi-disciplinary teams including electronics, system engineering, service engineering and involves transfer of designs to production, support of high-level-assembly lines, etc. This position involves the writing of safety files, planning and execution of V&V tests, engineering calculations and FEA simulations, writing specifications and failure analysis.
Job Description
Essential responsibilities:
Mechanical design derived from specifications (as well as writing specifications), as part of a multi-disciplinary team of parts and assemblies while using off-the-shelf components, using 3D CREO CAD design package. Presenting the design in technical design reviews at the levels of concept and detail design is a part of this position,
Developing creative design solutions in response to the product requirements of functionality, reliability, cost, manufacturability, etc.,
Support of company products at hospital and customer sites via the Service Teams as needed,
Building safety files for products, including strength calculations, failure modes analysis (FMEA), compliance with safety and medical industrial standards as well as internal company standards,
Supporting transfer to production, defining basic assembly and service instructions, working with parts suppliers,
Defining verification and validation test procedure, tests execution and report writing.
Essential qualifications /requirements:
Mandatory: 1st degree in mechanical engineering
Mandatory: Good personal, teamwork and communication skills, enthusiasm from study, self-motivated, results oriented,
Work experience of 2 years in mechanical design, with experience in at least 2 of the following: design of motion systems, large welded or cast structures and frames, mechanisms, electronic packaging, large sculptured FRP covers, electrical design support (DXF, cables routing),
Experience in machining and sheet metal technologies,
Experience in prototype building (hands on), testing execution per test plan and failures troubleshooting
Fluent English at presentation level in technical design reviews, Zoom/Teams calls and in writing.
Desired Characteristics by priority:
Leading tasks from requirements to engineering change finalization,
System level understanding in multi-disciplinary project environment,
Definition of testing and report writing,
Experience in design for cost, reliability, serviceability and for manufacturability.
Ability to perform finite-element analysis and Excel level technical calculations,
we are a leading global medical technology and digital solutions innovator. Our mission is to improve lives in the moments that matter. Unlock your ambition, turn ideas into world-changing realities, and join an organization where every voice makes a difference, and every difference builds a healthier world.

As we expand our presence in Israel, we're seeking a visionary Expert IC Package Design Lead to help build our local engineering powerhouse from the ground up. This is a unique opportunity to take on meaningful product ownership in a new site, leading the physical implementation strategy for chips that power the world's largest AI clusters.

As an Expert IC Package Design Lead, you will be a core technical contributor in the development of advanced IC packaging solutions for high-performance connectivity silicon.
You will own package flow, architecture, design, and qualification from concept through production, working closely with silicon, signal integrity, power integrity, mechanical, manufacturing, and external OSAT partners. You will be responsible for defining package technologies that meet aggressive electrical, thermal, mechanical, and cost targets, enabling our products to operate reliably in the worlds most demanding AI and cloud environments.

Key Responsibilities
Own end-to-end IC package design, from early architecture and feasibility through detailed design, qualification, and high-volume manufacturing.
Define package architecture and technology selection (organic substrates, advanced laminate, interposers, multi-die/chiplet packaging, CoWoS - 2.5D/3D integration).
Lead signal integrity (SI), power integrity (PI), and thermal considerations at the package level for high-speed, high-power devices.
Drive package layout, substrate routing, bump/ball maps, stack-ups, materials selection, and mechanical constraints.
Collaborate closely with silicon design, SerDes, system, SI/PI, and reliability teams to optimize overall product performance.
Interface with OSATs, substrate vendors, and manufacturing partners to ensure design-for-manufacturability (DFM), yield, and cost targets.
Lead package-related risk assessment, failure analysis, and corrective actions during bring-up and production ramp.
Support NPI, qualification, and product sustainment activities, including vendor audits and technical reviews.

We are looking for a highly experienced Senior Thermal Engineer to join our Architecture engineering team and take a key role in the development of next-generation SoCs, ECUs, and high-performance compute platforms for autonomous driving systems.
The position combines SoC/package thermal development, ECU cooling architecture, thermal simulation, characterization, validation, and vehicle-level thermal integration, working across multiple next-generation programs from early concept through qualification and production.
Please note: This position is also relevant for our other sites in Haifa, Petah Tikva, and Jerusalem.
What will your job look like?
Work on thermal development of next-generation SoCs and air/liquid-cooled ECU platforms, covering product requirements, thermal architecture, design, simulation, characterization, testing and qualification.
Perform detailed thermal performance assessment and CFD analysis of next-generation SoC/package designs, including die/package temperature distribution, heat spreading, thermal interfaces, material and stack-up optimization, and thermal resistance evaluation
Develop and evaluate advanced cooling solutions, including air cooling, liquid cooling, heat pipes, and advanced heat-spreading technologies.
Support vehicle-level cooling architecture and ECU integration for next-generation autonomous driving and Robotaxi platforms.
Define cooling requirements including coolant temperature, flow rate, pressure drop, thermal interfaces, and system thermal margins.
Correlate simulation results with laboratory and product measurements, drive thermal optimization and troubleshooting throughout development and qualification.
Work closely with silicon Arch, package, HW, mechanical, electrical, validation, suppliers, Tier-1s and OEM customers.