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1 ימים
דרושים באלביט מערכות
Job Type: Full Time
We are looking for
A Flight TEST Engineer for a unique and challenging role at our company sites in Haifa and Modiin, responsible for end-to-end flight testing of unmanned aerial systems
You will work at the forefront of UAS technology in a dynamic environment and make a direct impact on fielding breakthrough systems. Come be part of a high-performing team in a leading defense organization

In this role you will
Plan and lead flight tests in collaboration with engineering development teams
Define instrumentation and data acquisition, and author TEST plans, flight cards, debriefs and TEST reports
Manage TEST execution in the field, including analysis and interpretation of recorded data
Requirements:
B.Sc. in Engineering in one of the following: Aeronautics and Space / Mechanical / Electrical / Electronics
M.Sc. degree - advantage
Proven experience in the UAS domain (operational / technical / training / administrative) - advantage
High-level English proficiency - speaking, reading and writing
Willingness to travel abroad for periods of a week or more
Willingness to work in the field and during non-standard hours
Ability to work under pressure and make decisions under uncertainty, with excellent interpersonal skills and teamwork

*Only relevant applications will be answered
This position is open to all candidates.
 
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8643814
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1 ימים
דרושים באלביט מערכות
Job Type: Full Time
We are looking for
A Flight TEST team lead at our company sites in Haifa and Modiin
Join us to lead flight tests for unmanned aerial systems (UAS), work at the technological forefront and drive breakthrough systems in a dynamic, hands-on environment. Be part of a team that plans, executes and debriefs complex trials with real impact

In this role you will
Lead a team in planning, executing and debriefing flight tests
Own the professional development of flight TEST engineers
Work in a matrix with program managers and R D teams
Engage with authorities and customers to obtain flight approvals in Israel and abroad
Lead delivery flights in Israel and at customer sites worldwide
Manage multi- system field trials
Requirements:
B.Sc. in Engineering - Aerospace, Mechanical or Electrical
M.Sc. - advantage
Engineering experience in the UAS domain
High-level English - speaking, reading and writing
Willingness to travel abroad
Willingness for field work and non-standard hours
Ability to work under pressure and make decisions under uncertainty, with excellent interpersonal skills and teamwork

*Only relevant applications will be answered
This position is open to all candidates.
 
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הגשת מועמדות
עדכון קורות החיים לפני שליחה
8643832
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1 ימים
דרושים באלביט מערכות
Job Type: Full Time
We are looking for
For our site in Modiin we are looking for an experienced Structural Analysis
Engineer to join the Aircraft Division analysis team. If you are passionate about aerostructure development, and want to be part of designing and justifying advanced aircraft structures- come and join a team that shapes tomorrows flight capabilities through innovative engineering and cutting edge technologies

In this role you will
Perform static and dynamic analyses for metallic and composite airframe structures in new aircraft development
Build high level FEM models using industry standard tools
Prepare analysis and justification reports and lead certification processes with local and global aviation authorities
Lead and perform static and dynamic proof tests for aircraft components
Requirements:
B.Sc. in Mechanical / Aeronautical / Civil Engineering
M.Sc. in Mechanical / Aeronautical Engineering - Advantage
At least 5 years of experience in structural analysis including manual strength calculations using analytical methods
Experience in finite element analysis
Experience with NASTRAN / PATRAN / APEX software
Familiarity with aircraft and UAV specification requirements - Advantage
Experience in dynamic / vibration analyses and composite materials behavior - Advantage
Experience in fatigue and damage tolerance analyses - Advantage
Practical experience in mechanical design - Advantage
Ability to work and learn independently, manage tasks effectively, maintain excellent interpersonal relations and teamwork
High proficiency in English, both verbal and written

Only relevant applications will be answered
This position is open to all candidates.
 
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הגשת מועמדות
עדכון קורות החיים לפני שליחה
8585306
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1 ימים
דרושים באלביט מערכות
Location: Haifa
Job Type: Full Time
We are looking for
For our Haifa site, we are looking for an Algorithmics team lead in the field of tracking and inertial navigation
You will join the Algorithmics group in the Aerospace division - a team of leading researchers and engineers developing cutting-edge capabilities for some of the world's most advanced airborne systems. Come lead the development of algorithms that directly contribute to national security, in a challenging and meaningful technological environment

In this role you will
Initiate and develop end-to-end advanced algorithms for navigation systems, with an emphasis on UAVs
Lead and provide technical and professional guidance to an algorithmics team
Work in the fields of tracking and inertial navigation while integrating innovative approaches
Collaborate with multidisciplinary interfaces within the division and beyond
Requirements:
M.Sc. in Physics, Mathematics, Aeronautics, Electrical Engineering or a related field
At least 5 years of experience in navigation algorithm development
Strong knowledge of Matlab and/or Python, C ++ - advantage
Experience leading an algorithmics team - significant advantage
Leadership, initiative, system -level perspective and excellent interpersonal skills

*Only relevant applications will be answered
This position is open to all candidates.
 
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הגשת מועמדות
עדכון קורות החיים לפני שליחה
8635520
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27/04/2026
חברה חסויה
Job Type: Full Time
Help shape how AI data centers are powered. we're a global leader in smart energy technology, with over 3,000 employees, offices in more than 20 countries, and millions of installations worldwide. we are expanding its innovation into the fast-growing world of AI data -center power infrastructure. Building on our leadership in solar, Storage, and power electronics, we are creating a next-generation Power Ecosystem - integrating Solid-State Transformers (SST), Battery Energy Storage Systems (BESS as UPS), and advanced power-conversion platforms designed for the AI era. As a Mechanical Engineer, you will be responsible for the design, development, and validation of mechanical components and systems for our diverse product line, focusing on innovation and manufacturability. This role offers the opportunity to contribute directly to the advancement of sustainable energy solutions. Responsibilities:
* Design and develop robust and reliable mechanical solutions for electronic packaging, particularly for high-power outdoor products, considering thermal management, environmental protection, and manufacturability.
*  Design components optimized for various manufacturing processes, including plastic injection molding, die casting, extrusion, and sheet metal fabrication.
*  Collaborate with electrical engineers on the mechanical integration of printed circuit boards (PCBs) within product enclosures.
* Create and maintain detailed production documentation, including mechanical drawings, assembly instructions, and PCB layouts, ensuring accuracy and completeness.
* Review First Article Inspection (FAI) reports, analyse results, and approve parts for mass production, ensuring adherence to quality standards.
* Perform engineering calculations (e.g., stress analysis, heat transfer analysis, magnetic simulations, dynamic analysis) to validate designs and ensure performance requirements are met.
* Participate in design reviews, contribute to problem-solving, and drive continuous improvement in design processes.
* Collaborate with cross-functional teams, including product management, manufacturing, and testing, to ensure successful product development and launch.
* Contribute to the validation, testing, and troubleshooting of mechanical components and systems throughout the product development lifecycle.
Country:
Israel
City:
Modiin
Requirements:
* B.Sc. or M.Sc. degree in Mechanical Engineering, Plastics Engineering, Aeronautical Engineering, or a related field from a recognized university.
* Minimum of 3 years of proven experience in mechanical design and development.
*  Demonstrated experience in designing for manufacturability (DFM) with a strong understanding of mass production processes.
* Preferred: Experience in designing components for plastic injection molding, die casting, extrusion, and metal forming.
*  Preferred: Experience in the mechanical integration of PCBs within electronic enclosures.
* Strong analytical and problem-solving skills, with the ability to perform engineering calculations and simulations.
*  Proficiency in CAD software (specify preferred software, e.g., SolidWorks, Creo, etc.).
*  Excellent communication and collaboration skills, with the ability to work effectively in a team environment.
* A passion for renewable energy and a commitment to sustainability
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
עדכון קורות החיים לפני שליחה
עדכון קורות החיים לפני שליחה
8577491
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27/04/2026
Location: Haifa
Job Type: Full Time
We are looking for a Senior Thermal Design & Equipment Engineer to join a team focused on advancing next-generation testing capabilities. In this role, you will contribute to thermal and mechanical design, simulation, and validation efforts - working with a high degree of independence across vendors and internal teams to ensure hardware performs reliably in production environments.

Key job responsibilities
- Own the thermal and mechanical design of test equipment from concept through production, including heat sink and cold plate design, thermal interface material selection, fan selection, and airflow/liquid-flow architecture.
- Perform thermal simulations using CFD tools and validate simulation accuracy against real-world test data.
- Develop and execute thermal validation test plans; debug and resolve thermal failures identified during bring-up and qualification.
- Collaborate with ODMs, OSATs, and internal cross-functional teams (Product Engineering, NPI, Operations) to drive hardware from prototype to mass production.
- Mentor and develop junior engineers; lead process improvement initiatives and contribute to team capability building in thermal and mechanical simulation.
- Author clear technical documentation to communicate design decisions, trade-off analyses, and validation results to stakeholders.
Requirements:
Basic Qualifications
- Bachelor's degree in Mechanical Engineering.
- 5+ years of experience in thermal and mechanical design.
- 5+ years of experience with thermal simulation (CFD tools such as Flotherm, ANSYS Icepak, or equivalent).

Preferred Qualifications
- Masters degree in mechanical engineering or equivalent.
- 7+ years of experience in thermal and mechanical design of actively controlled thermal solutions.
- Experience with design of optical testing solutions for semiconductors.
- Experience working with interdisciplinary teams to execute product design from concept to production.
- Experience developing and mentoring engineers; track record of leading process improvement initiatives.
- Strong written communication skills with experience conveying technical design decisions to cross-functional stakeholders.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
עדכון קורות החיים לפני שליחה
עדכון קורות החיים לפני שליחה
8626354
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Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
Required Power and Signal Integrity Engineer
About the job
As a Power and Signal Integrity Engineer, you will be responsible for the design and characterization of signal and power integrity of our IC designs. You will design the external electrical interfaces of the device, from their Signal/Power-integrity and electrical usage perspectives.
You'll set up methodologies, perform simulations, silicon characterization and correlations to ensure our IC designs meet systems design budgets and achieve the highest performance. You will work with systems architects, ASIC design, systems engineers, and partner cross-functionally with teams and external vendors/partners.
Responsibilities
Design and optimize power distribution networks (PDN) across chip, package, and board levels. This includes managing power/ground planes, decoupling capacitors, and power gating strategies.
Conduct both pre-layout and post-layout power integrity simulations to analyze power and ground noise (SSN/SSO), voltage drops (IR drop), and electromagnetic interference (EMI).
Implement and verify low-power design methodologies, such as multi-voltage designs and clock gating, using power intent formats like UPF/CPF.
Generate precise electrical models (e.g., S-parameters, SPICE models) for components such as packages, PCBs, and connectors for use in simulations.
Execute lab measurements utilizing test equipment like oscilloscopes, Vector Network Analyzers (VNA), Time Domain Reflectometers (TDR), Spectrum analyzers to validate simulation outcomes and debug signal and power-related issues on silicon prototypes and boards.
Requirements:
Minimum qualifications:
Bachelor's degree in Mechanical, Electrical Engineering, Material Science, or equivalent practical experience.
5 years of experience in signal or power integrity or hardware design.
Preferred qualifications:
Experience with industry-standard Electronic Design Automation (EDA) tools for simulation and layout (e.g., Cadence Sigrity/Allegro, Ansys HFSS/PowerDC/Q3D, Keysight ADS, Synopsys HSPICE).
Proficiency in scripting languages such as Python, Perl, or Tcl for flow automation and data analysis.
Familiarity with high-speed testing equipment like VNAs, TDRs, and oscilloscopes for measurement and validation.
Knowledge of circuit analysis, electromagnetics, and trans
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
עדכון קורות החיים לפני שליחה
עדכון קורות החיים לפני שליחה
8642035
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חברה חסויה
Location: Haifa
Job Type: Full Time
Required Advanced Manufacturing Engineer
Job Description
Role Summary
The Advanced Manufacturing Engineer (AME) is responsible for industrializing and sustaining complex PET and SPECT imaging products at a high‑complexity electromechanical manufacturing site. The AME ensures robust manufacturability of high‑level mechanical assemblies, electronics integration, wiring, detector modules, motion systems, and system‑level testing. The role drives process development, tooling, validation, DFM/DFA, quality improvement, and readiness for production and NPIs.
NPI Leadership for PET & SPECT Imaging Systems
Lead manufacturing readiness for new PET/SPECT products, including process layout, tooling development, and new equipment introduction.
Participate in design reviews and influence DFM/DFA/DFT across mechanical assemblies, detector modules, power systems, wiring harnesses, and electromechanical subsystems.
Translate design intent into controlled, stable manufacturing processes.
Coordinate ECO implementation and ensure smooth manufacturing release.
Assembly Process Development & Optimization
Develop robust assembly processes for mechanical and electronic integration, alignment, torque control, and detector installation.
Define and design manufacturing jigs, tools, fixtures, and lifting/handling solutions required for large subsystems.
Lead design/manufacture of equipment, tooling, and jigs internally or via suppliers to eliminate defects.
Drive LEAN manufacturing implementation and support continuous improvement.
Conduct PFMEA for existing and new processes.
Quality & Problem Solving
Drive product quality improvements by identifying manufacturing issues and implementing cost‑effective solutions.
Work with Production Associates to resolve manufacturing and quality problems.
Oversee corrective action implementation in production or suppliers.
Support RCA through structured failure analysis.
System Integration & Testing Support
Support integration/testing of assembled PET/SPECT systems including calibration, alignment, motion validation, detector gain calibration, and safety checks.
Work with System Engineering to define test protocols and acceptance criteria.
Troubleshoot system issues related to electromechanical assemblies.
Validation & Regulatory Compliance
Own IQ/OQ/PQ for equipment, tools, and manufacturing processes.
Ensure compliance with ISO 13485, ISO 14971, 21 CFR 820, IEC 60601, and internal QMS requirements.
Maintain strong documentation practices including control plans, validation protocols, and DHR/DMR accuracy.
Ensure traceability for critical parameters, torques, and calibration data.
Supplier & Cross‑Functional CollaborationCollaborate with suppliers of mechanical assemblies, detector modules, wiring harnesses, and PCBs.
Lead technical discussions with suppliers for tooling, process capability, and quality issues.
Train and qualify production and supplier teams on processes and inspection/assembly methods.
EHS & Plant Compliance
Lead and support Environment, Health & Safety efforts aligned with site goals.
Ensure safe handling of large assemblies, HV systems, and radiation‑related components.
דרישות:
Drive product quality improvements through systematic problem solving.
Lead design requirements for manufacturing processes, tools, and fixtures.
Design and manufacture jigs, fixtures, and tooling (internal or supplier‑managed).
Strong experience with LEAN manufacturing and PFMEA execution.
Ability to resolve complex manufacturing and quality issues.
Leadership of NPI activities including tool development and equipment introduction.
ECO coordination and controlled release management.
Strong understanding of compliance, EHS, and regulated manufacturing.
Ability to train and qualify production and supplier teams.
Mechanical/electromechanical assembly expertise.
Experience with HV/LV wiring, detector systems, and motion integration.
Strong המשרה מיועדת לנשים ולגברים כאחד.
 
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הגשת מועמדותהגש מועמדות
עדכון קורות החיים לפני שליחה
עדכון קורות החיים לפני שליחה
8629912
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01/04/2026
חברה חסויה
Location: Haifa
Job Type: Full Time
we're seeking a visionary Expert IC Package Design Lead to help build our local engineering powerhouse from the ground up. This is a unique opportunity to take on meaningful product ownership in a new site, leading the physical implementation strategy for chips that power the world's largest AI clusters.

As an Expert IC Package Design Lead, you will be a core technical contributor in the development of advanced IC packaging solutions for high-performance connectivity silicon.
You will own package flow, architecture, design, and qualification from concept through production, working closely with silicon, signal integrity, power integrity, mechanical, manufacturing, and external OSAT partners.You will be responsible for defining package technologies that meet aggressive electrical, thermal, mechanical, and cost targets, enabling products to operate reliably in the worlds most demanding AI and cloud environments.

Key Responsibilities

Own end-to-end IC package design, from early architecture and feasibility through detailed design, qualification, and high-volume manufacturing
Define package architecture and technology selection (organic substrates, advanced laminate, interposers, multi-die/chiplet packaging, CoWoS - 2.5D/3D integration)
Lead signal integrity (SI), power integrity (PI), and thermal considerations at the package level for high-speed, high-power devices
Drive package layout, substrate routing, bump/ball maps, stack-ups, materials selection, and mechanical constraints
Collaborate closely with silicon design, SerDes, system, SI/PI, and reliability teams to optimize overall product performance
Interface with OSATs, substrate vendors, and manufacturing partners to ensure design-for-manufacturability (DFM), yield, and cost targets
Lead package-related risk assessment, failure analysis, and corrective actions during bring-up and production ramp
Support NPI, qualification, and product sustainment activities, including vendor audits and technical reviews
Requirements:
10+ years of hands-on IC BIG package design experience for high-performance semiconductor products, with full ownership from concept through tape-out
Expert proficiency in IC package design tools (Cadence APD / SiP or equivalent) and experience designing complex packages (BGA, FCBGA, FCCSP)
Strong package architecture & integration expertise, including stack-ups, ball/bump maps, constraints, SMT integration, and package BOM ownership
Deep understanding of signal, power, and thermal integrity at the package level, with ability to drive design tradeoffs based on analysis
Proven manufacturing and release experience, including DRC/LVS/DFM, OSAT engagement, and delivering production-ready package designs
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
עדכון קורות החיים לפני שליחה
עדכון קורות החיים לפני שליחה
8599399
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תודה על שיתוף הפעולה
מודים לך שלקחת חלק בשיפור התוכן שלנו :)
01/04/2026
Location: Haifa
Job Type: Full Time
As a Package Design Engineer, you will be a core technical contributor in the development of advanced IC packaging solutions for high-performance connectivity silicon. You will execute the package flow, design, and qualification from concept through production, working closely with silicon, signal integrity, power integrity, mechanical, manufacturing, and external OSAT partners. You will be responsible for implementing package technologies that meet aggressive electrical, thermal, mechanical, and cost targets, enabling products to operate reliably in the worlds most demanding AI and cloud environments.

Key Responsibilities


Execute end-to-end IC package design, from early feasibility and detailed design through to qualification and high-volume manufacturing
Implement package architecture and utilize advanced technologies (organic substrates, advanced laminate, interposers, multi-die/chiplet packaging, CoWoS - 2.5D/3D integration)
Drive signal integrity (SI), power integrity (PI), and thermal considerations at the package level for high-speed, high-power devices
Perform package layout, substrate routing, bump/ball maps, stack-ups, materials selection, and apply mechanical constraints
Collaborate closely with silicon design, SerDes, system, SI/PI, and reliability teams to optimize overall product performance
Interface directly with OSATs, substrate vendors, and manufacturing partners to ensure design-for-manufacturability (DFM), yield, and cost targets are met
Conduct package-related risk assessments, failure analysis, and corrective actions during bring-up and production ramp
Support NPI, qualification, and product sustainment activities, including vendor technical reviews
Requirements:
5+ years of hands-on IC package design experience for high-performance semiconductor products, with full technical ownership from concept through tape-out
Expert proficiency in IC package design tools (Cadence APD / SiP or equivalent) and hands-on experience designing complex packages (BGA, FCBGA, FCCSP)
Strong package integration expertise, including stack-ups, ball/bump maps, constraints, SMT integration, and package BOM ownership
Deep understanding of signal, power, and thermal integrity at the package level, with the ability to execute design tradeoffs based on analysis
Proven manufacturing and release experience, including running DRC/LVS/DFM, OSAT engagement, and delivering production-ready package designs
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
עדכון קורות החיים לפני שליחה
עדכון קורות החיים לפני שליחה
8599381
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חברה חסויה
Location: Haifa
Job Type: More than one
Required V&V Intern
Job Description Summary
Responsible for running various verification activities on PET medical products that covers multi-disciplinary aspects from SW/HW, electronics, mechanics, physics, image quality and radiation - which is safety for users and monitored by a tag all the time.
Job Description
Responsible for planning and implementing verification methodologies and ensuring proper fulfillment of system and sub-system requirements.
Responsible for reviewing various product designs, verifying its functionality in agile testing methods.
Responsible to determine the testing environments and tools.
Analyze and debug system failures and issue found during testing, while delivering detailed reports identifying these issues for further investigation.
Work closely with development teams
Non-hybrid, full-time position on site
Flexible on working hour, including 2-3 evening shifts (14:00-23:00) per week as needed
Working on global programs that required tight collaboration with global and Israel teams.
Requirements:
B.Sc. in Mechanical / Bio-Medical / Electronic Engineering
+3 years of experience in multi-disciplinary medical products manual/automation testing, with strong knowledge of software QA processes
Good documentation skills of test design and scripts for complete coverage of detailed system requirements
Quality focus, willingness to learn, versatility and adaptability.
Good organizational skills and strong written and verbal communication.
Excellent English skills (read and write).
Advantages:
Experience >5 years as verification engineer in medical device (PET/SPECT) companies
Experience with Agile methodology
Experience with Linux and MATLAB
Experience with Python & automation development
Experience with test tools and frameworks (such as: ALM, Rally, Doors & Compass).
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
עדכון קורות החיים לפני שליחה
עדכון קורות החיים לפני שליחה
8629878
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