דרושים » הנדסה » Aeromechanical Engineer

we are an agile defense-tech startup tackling the most complex challenges in counter-drone and uncrewed defense. With hundreds of combat-proven systems deployed by the IDF and global partners, we are now engineering the next generation of C-UxS (Counter-Uncrewed Systems). We leverage advanced electronic warfare and kinetic measures to detect and neutralize hostile threats. If you want to push technological boundaries while safeguarding Israel and our allies, join us at this pivotal stage of our growth.
This is a unique opportunity to join a company at a pivotal growth stage and help shape its products, culture, and future.
We are looking for a Mechanical Design Team Leader to lead the mechanical engineering activities within our kinetic interception team, where we use racer drones for C-UAS interception. This is a hands-on leadership role at the heart of the practical R&D of our drones and their supporting platforms. The Team Leader will combine direct engineering contribution with technical mentoring, work planning, and responsibility for the quality and timely delivery of the team's mechanical designs.
Key Responsibilities
Lead, mentor, and develop the mechanical team (recruiting, onboarding, feedback), while planning work and allocating resources to match program milestones and priorities.
Drive the mechanical architecture and technical direction of autonomous racer drones, launchers, and platforms, remaining hands-on in design, prototyping, integration, and testing.
Lead design reviews (meeting performance, reliability, safety, cost) and establish strict engineering practices including CAD standards, GD&T, BOMs, ECOs, and PLM workflows.
Oversee the mechanical integration of electronics, harnesses, and electromechanical components; coordinate structural analysis, design validation, prototype builds, and translate test results into improvements.
Identify and mitigate technical/schedule risks, and collaborate closely with systems, software, manufacturing, suppliers, operations, and leadership.

We are looking for a highly skilled Senior Thermal-Mechanical Engineer to join our mechanical engineering team as a key player in the development of next-generation high-performance compute platforms for autonomous driving systems.
This key position includes leading the thermal-mechanical design and cooling architecture of advanced electronic systems throughout all lifecycle stages-from concept to mass production-while working closely with hardware, PCB layout, mechanical, validation, manufacturing, suppliers, and customers.
What will your job look like?
Lead the thermal-mechanical design process from concept through validation, NPI, and production.
Define cooling architectures and optimize air- and liquid-cooling solutions for high-power electronic systems.
Perform thermal simulations and analyses using tools such as Icepak, FloTHERM, Fluent, or equivalent.
Perform mechanical simulations and analyses using tools such as ANSYS Mechanical, Abaqus, Nastran, or equivalent.
Correlate simulation results with lab measurements and drive solutions that meet system requirements.
Lead thermal validation, prototyping, environmental testing, and reliability activities.
Collaborate closely with cross-functional teams, suppliers, subcontractors, and customers.
Support mechanical design and serve as a technical focal point for complex thermal-mechanical challenges.

As an R&D Mechanical Engineer at Augury, you will own the design of new parts and assemblies, design parts for machining and injection molding, perform analytical calculations and V&V tests.

Youll work closely with mechanical, hardware, V&V, sustain, manufacturing, and external sub contractors, to deliver innovative, reliable, and scalable IoT devices.

A Day In Your Life
Design mechanical parts and mechanisms, for highly challenging environments, from initial concepts, through all design phases, until transfer to production.
Master 3D CAD models and drawings for mechanical components, assemblies, jigs, and fixtures (including release management and GD&T).
Design for plastics: mostly parts for injection molding, compression and other classical manufacturing methods.
Run prototype validation: mechanical inspection, stress testing, sealing, field testing and support high level system validation procedures.
Cooperate with multidisciplinary teams (HW, V&V, FW, Algo), utilizing analytical thinking and strong theoretical background.
Transfer parts for production, in collaboration with the engineering team, and following product lifecycle methodologies.
Work with subcontractors and vendors in Israel and internationally.

As we expand our presence in Israel, we're seeking a visionary Expert IC Package Design Lead to help build our local engineering powerhouse from the ground up. This is a unique opportunity to take on meaningful product ownership in a new site, leading the physical implementation strategy for chips that power the world's largest AI clusters.

As an Expert IC Package Design Lead, you will be a core technical contributor in the development of advanced IC packaging solutions for high-performance connectivity silicon.
You will own package flow, architecture, design, and qualification from concept through production, working closely with silicon, signal integrity, power integrity, mechanical, manufacturing, and external OSAT partners. You will be responsible for defining package technologies that meet aggressive electrical, thermal, mechanical, and cost targets, enabling our products to operate reliably in the worlds most demanding AI and cloud environments.

Key Responsibilities
Own end-to-end IC package design, from early architecture and feasibility through detailed design, qualification, and high-volume manufacturing.
Define package architecture and technology selection (organic substrates, advanced laminate, interposers, multi-die/chiplet packaging, CoWoS - 2.5D/3D integration).
Lead signal integrity (SI), power integrity (PI), and thermal considerations at the package level for high-speed, high-power devices.
Drive package layout, substrate routing, bump/ball maps, stack-ups, materials selection, and mechanical constraints.
Collaborate closely with silicon design, SerDes, system, SI/PI, and reliability teams to optimize overall product performance.
Interface with OSATs, substrate vendors, and manufacturing partners to ensure design-for-manufacturability (DFM), yield, and cost targets.
Lead package-related risk assessment, failure analysis, and corrective actions during bring-up and production ramp.
Support NPI, qualification, and product sustainment activities, including vendor audits and technical reviews.

We are looking for a highly experienced Senior Thermal Engineer to join our Architecture engineering team and take a key role in the development of next-generation SoCs, ECUs, and high-performance compute platforms for autonomous driving systems.
The position combines SoC/package thermal development, ECU cooling architecture, thermal simulation, characterization, validation, and vehicle-level thermal integration, working across multiple next-generation programs from early concept through qualification and production.
Please note: This position is also relevant for our other sites in Haifa, Petah Tikva, and Jerusalem.
What will your job look like?
Work on thermal development of next-generation SoCs and air/liquid-cooled ECU platforms, covering product requirements, thermal architecture, design, simulation, characterization, testing and qualification.
Perform detailed thermal performance assessment and CFD analysis of next-generation SoC/package designs, including die/package temperature distribution, heat spreading, thermal interfaces, material and stack-up optimization, and thermal resistance evaluation
Develop and evaluate advanced cooling solutions, including air cooling, liquid cooling, heat pipes, and advanced heat-spreading technologies.
Support vehicle-level cooling architecture and ECU integration for next-generation autonomous driving and Robotaxi platforms.
Define cooling requirements including coolant temperature, flow rate, pressure drop, thermal interfaces, and system thermal margins.
Correlate simulation results with laboratory and product measurements, drive thermal optimization and troubleshooting throughout development and qualification.
Work closely with silicon Arch, package, HW, mechanical, electrical, validation, suppliers, Tier-1s and OEM customers.

we are an agile defense-tech startup tackling the most complex challenges in counter-drone and uncrewed defense. With hundreds of combat-proven systems deployed by the IDF and global partners, we are now engineering the next generation of C-UxS (Counter-Uncrewed Systems). We leverage advanced electronic warfare and kinetic measures to detect and neutralize hostile threats. If you want to push technological boundaries while safeguarding Israel and our allies, join us at this pivotal stage of our growth.
This is a unique opportunity to join a company at a pivotal growth stage and help shape its products, culture, and future.
DART is an autonomous counter-drone system: a standalone system and a radar-cued ground station launch small interceptor drones that acquire an airborne target with a thermal seeker and defeat it by direct impact. The interceptor is built on a COTS high-agility racer platform, with Betaflight closing the inner rate loop and a mission computer running perception and outer-loop guidance.
You will own the two disciplines that determine whether the interceptor actually hits: guidance and control law design, and the simulation environment used to develop, validate, and regression-test those laws before anything flies. This is a hands-on leadership role - you are expected to write and tune code, sit in front of flight logs, and stand in the field on test days, while also setting technical direction for a small team.
Key Responsibilities
Own outer-loop guidance (image-based thermal aim, pursuit/proportional-navigation, latency-compensated LOS, and throttle management) and manage end-to-end latency and stability budgets.
Implement and tune controllers (from PID/PI to adaptive/MPC), define flight controller interfaces (MSP/CRSF/SBUS injection), and govern the flight-mode state machine, failsafes, and safety envelope.
Deliver the 6-DOF simulation product (interceptor/target dynamics, thermal seeker), maintain SIL/HIL rigs for unmodified production code, validate models against flight data, and run automated regression suites and KPIs.
Lead and mentor the control and simulation team, set test-progression gates (sim to full-envelope flight), collaborate closely with Vision and Systems Engineering, and produce all required technical artifacts.

We are looking for a highly experienced Senior Thermal Engineer to join our Architecture engineering team and take a key role in the development of next-generation SoCs, ECUs, and high-performance compute platforms for autonomous driving systems.
The position combines SoC/package thermal development, ECU cooling architecture, thermal simulation, characterization, validation, and vehicle-level thermal integration, working across multiple next-generation programs from early concept through qualification and production.
Please note: This position is also relevant for our other sites in Haifa, Petah Tikva, and Jerusalem.
What will your job look like?
Work on thermal development of next-generation SoCs and air/liquid-cooled ECU platforms, covering product requirements, thermal architecture, design, simulation, characterization, testing and qualification.
Perform detailed thermal performance assessment and CFD analysis of next-generation SoC/package designs, including die/package temperature distribution, heat spreading, thermal interfaces, material and stack-up optimization, and thermal resistance evaluation
Develop and evaluate advanced cooling solutions, including air cooling, liquid cooling, heat pipes, and advanced heat-spreading technologies.
Support vehicle-level cooling architecture and ECU integration for next-generation autonomous driving and Robotaxi platforms.
Define cooling requirements including coolant temperature, flow rate, pressure drop, thermal interfaces, and system thermal margins.
Correlate simulation results with laboratory and product measurements, drive thermal optimization and troubleshooting throughout development and qualification.
Work closely with silicon Arch, package, HW, mechanical, electrical, validation, suppliers, Tier-1s and OEM customers.

We are looking for a highly experienced Senior Thermal Engineer to join our Architecture engineering team and take a key role in the development of next-generation SoCs, ECUs, and high-performance compute platforms for autonomous driving systems.
The position combines SoC/package thermal development, ECU cooling architecture, thermal simulation, characterization, validation, and vehicle-level thermal integration, working across multiple next-generation programs from early concept through qualification and production.
Please note: This position is also relevant for our other sites in Haifa, Petah Tikva, and Jerusalem.
What will your job look like?
Work on thermal development of next-generation SoCs and air/liquid-cooled ECU platforms, covering product requirements, thermal architecture, design, simulation, characterization, testing and qualification.
Perform detailed thermal performance assessment and CFD analysis of next-generation SoC/package designs, including die/package temperature distribution, heat spreading, thermal interfaces, material and stack-up optimization, and thermal resistance evaluation
Develop and evaluate advanced cooling solutions, including air cooling, liquid cooling, heat pipes, and advanced heat-spreading technologies.
Support vehicle-level cooling architecture and ECU integration for next-generation autonomous driving and Robotaxi platforms.
Define cooling requirements including coolant temperature, flow rate, pressure drop, thermal interfaces, and system thermal margins.
Correlate simulation results with laboratory and product measurements, drive thermal optimization and troubleshooting throughout development and qualification.
Work closely with silicon Arch, package, HW, mechanical, electrical, validation, suppliers, Tier-1s and OEM customers.