דרושים » חשמל ואלקטרוניקה » Expert IC Package Design Lead

we are establishing a strategic R&D center in Israel to drive the development of complex semiconductor chips that solve the critical 'data bottlenecks' enabling the future of AI at scale. As we expand our presence in Israel, we're seeking a visionary Package Design Engineer to help build our local engineering powerhouse from the ground up. This is a unique opportunity to take on meaningful product ownership in a new site, Driving the physical implementation strategy for chips that power the world's largest AI clusters.
As a Package Design Engineer, you will be a core technical contributor in the development of advanced IC packaging solutions for high-performance connectivity silicon. You will execute the package flow, design, and qualification from concept through production, working closely with silicon, signal integrity, power integrity, mechanical, manufacturing, and external OSAT partners. You will be responsible for implementing package technologies that meet aggressive electrical, thermal, mechanical, and cost targets, enabling our companys products to operate reliably in the worlds most demanding AI and cloud environments.
Key Responsibilities
Execute end-to-end IC package design, from early feasibility and detailed design through to qualification and high-volume manufacturing
Implement package architecture and utilize advanced technologies (organic substrates, advanced laminate, interposers, multi-die/chiplet packaging, CoWoS - 2.5D/3D integration)
Drive signal integrity (SI), power integrity (PI), and thermal considerations at the package level for high-speed, high-power devices
Perform package layout, substrate routing, bump/ball maps, stack-ups, materials selection, and apply mechanical constraints
Collaborate closely with silicon design, SerDes, system, SI/PI, and reliability teams to optimize overall product performance
Interface directly with OSATs, substrate vendors, and manufacturing partners to ensure design-for-manufacturability (DFM), yield, and cost targets are met
Conduct package-related risk assessments, failure analysis, and corrective actions during bring-up and production ramp
Support NPI, qualification, and product sustainment activities, including vendor technical reviews.

we are establishing a strategic R&D center in Israel to drive the development of complex semiconductor chips that solve the critical 'data bottlenecks' enabling the future of AI at scale. As we expand our presence in Israel, we're seeking a highly skilled Physical Design Engineer specializing in SoC EMIR to join our local engineering powerhouse from the ground up.
This is a unique opportunity to take on meaningful technical ownership in a new site, executing the backend power methodologies for chips that power the world's largest AI clusters. As an EMIR Engineer, you will be a core technical contributor ensuring the power robustness and long-term reliability of our high-performance connectivity silicon.
You will be responsible for SoC EMIR Analysis to ensure our products meet aggressive voltage drop and reliability targets in advanced FinFET process nodes, directly impacting the performance and yield of chips operating in the worlds most demanding AI and cloud environments.
Key Responsibilities
Take responsibility on IR drop analysis and signal/power electromigration (EM) of very complex chip
Collaborate closely with Physical Design team to insure a full power integrity
Partner with Package Design engineers to perform Chip-Package co-analysis (CPM)
Understand root-cause analysis for voltage drop violations and EM risks.

we are establishing a strategic R&D center in Israel to drive the development of complex semiconductor chips that solve the critical 'data bottlenecks' enabling the future of AI at scale. As we expand our presence in Israel, we're seeking a highly skilled Physical Design Engineer specializing in SoC EMIR to join our local engineering powerhouse from the ground up.
This is a unique opportunity to take on meaningful technical ownership in a new site, executing the backend power methodologies for chips that power the world's largest AI clusters. As an EMIR Engineer, you will be a core technical contributor ensuring the power robustness and long-term reliability of our high-performance connectivity silicon.
You will be responsible for SoC EMIR Analysis to ensure our products meet aggressive voltage drop and reliability targets in advanced FinFET process nodes, directly impacting the performance and yield of chips operating in the worlds most demanding AI and cloud environments.
Key Responsibilities
Take responsibility on IR drop analysis and signal/power electromigration (EM) of very complex chip
Collaborate closely with Physical Design team to insure a full power integrity
Be responsible on IR architecture for timing convergence
Partner with Package Design engineers to perform Chip-Package co-analysis (CPM)
Understand root-cause analysis for voltage drop violations and EM risks
Be responsible and go-to person for any IR related issues.

we are establishing a strategic R&D center in Israel to drive the development of complex semiconductor chips that solve the critical 'data bottlenecks' enabling the future of AI at scale. As we expand our presence in Israel, we're seeking a highly skilled Physical Design Engineer specializing in EMIR CAD to join our local engineering powerhouse from the ground up.
This is a unique opportunity to take on meaningful technical ownership in a new site, executing the backend power methodologies for chips that power the world's largest AI clusters. As a Physical Design Engineer, you will be a core technical contributor ensuring the power robustness and long-term reliability of our high-performance connectivity silicon.
You will continuously develop the Electro-Migration and IR Drop (EMIR) flow, working closely at the intersection of Physical Design, Analog/Mixed-Signal design, and Package Engineering.
Key Responsibilities
Take responsibility on IR drop analysis and signal/power electromigration (EM) flow
Implement and maintain robust EMIR flows and methodologies using industry-standard tools (Ansys RedHawk-SC, Cadence Voltus, or equivalent)
Collaborate closely with Analog/SerDes designers to integrate current profiles and ensure robust power delivery to sensitive high-speed IP blocks
Partner with Package Design engineers to perform Chip-Package-System (CPS) co-analysis flow
Understand root-cause analysis for voltage drop violations and EM risks
Support silicon bring-up by correlating simulation results with actual silicon measurements and yield data.

we are establishing a strategic R&D center in Israel to drive the development of complex semiconductor chips that solve the critical 'data bottlenecks' enabling the future of AI at scale. As we expand our presence in Israel, we're seeking a highly skilled Chip Top Physical Design Engineer focusing on implementation to join our local engineering powerhouse from the ground up.
If you thrive on solving complex, unnamed challenges in deep-submicron processes, your place is with us.
As a Physical Design Engineer, you will be a key hands-on member of our PD Team in the Israel R&D center. You will execute the physical design of the SoC Top level for chips that drive the worlds largest AI clusters. You will be deeply involved in all PD disciplines of the chip, driving the tape-out (T.O.) GDS to meet strict signoff criteria (Timing, LVS, EMIR, DRC, PV, etc.), ensuring our silicon meets the extreme performance, power, and area (PPA) targets required for AI scale.
Key Responsibilities
Execute SoC Top-level physical design and actively drive full-chip convergence
Perform Top-Level physical implementation, including floor-planning, Place & Route (P&R), Clock Tree Synthesis (CTS), Power/Clock distribution, Power Integrity, and Timing/Physical signoff
Work closely with the Architecture, Design, DFT, and Product teams to achieve optimal Power, Performance, and Area (PPA). This involves participating in feasibility studies for new architectures and optimizing runs to ensure the best Quality of Results (QoR)
Resolve complex signal integrity, thermal, and power challenges inherent in high-speed connectivity silicon
Collaborate closely with the Package team on Bump-map-to-Ballout design, taking all signal integrity aspects into consideration

we are establishing a strategic R&D center in Israel to drive the development of complex semiconductor chips that solve the critical 'data bottlenecks' enabling the future of AI at scale. As we expand our presence in Israel, we're seeking a visionary Physical Design Engineer to help build our local engineering powerhouse from the ground up. This is a unique opportunity to take on meaningful product ownership in a new site, defining the backend execution and methodologies for chips that power the world's largest AI clusters.
As a Physical Design Engineer, you will be a key architect of our silicon's physical reality. You won't just execute a flow-you will help establish our local execution culture and technical standards, owning the transformation of complex logic into high-performance silicon. You will drive the physical implementation journey from synthesis through signoff, ensuring our connectivity solutions meet the extreme performance, power, and area targets required for next-generation AI infrastructure. If you thrive on solving complex challenges in deep-submicron processes and want to shape the backend methodology for AI infrastructure connectivity, this is your opportunity.
Key Responsibilities
Physical Implementation & Execution
Be part of the founding Backend team in Israel, playing a critical role in establishing local execution culture and technical standards
Take full responsibility for physical implementation journey including Synthesis, Floorplanning, Place & Route, and Clock-Tree Synthesis (CTS)
Own macro-level implementation with deep hands-on experience in floorplanning and complex routing
Signoff & Design Integrity
Drive final stages of design integrity, owning Timing signoff (STA), Physical Verification (DRC/LVS), and Reliability analysis (EMIR)
Ensure first-pass silicon success through rigorous signoff flows and analysis
Apply Logic Equivalence Checking (LEC) and other verification techniques to guarantee design correctness
Methodology Development & Cross-Functional Collaboration
Participate in defining and refining Backend methodologies with autonomy to improve workflows and tool automation
Work closely with Architecture, Design, and DFT teams to navigate challenges of advanced process nodes and high-speed connectivity
Leverage scripting and automation to make engineering environment faster and more robust.

we are establishing a strategic R&D center in Israel to drive the development of complex semiconductor chips that solve the critical 'data bottlenecks' enabling the future of AI at scale. As we expand our presence in Israel, we're seeking a visionary Principal DFT Engineer to help build our local engineering powerhouse from the ground up. This is a unique opportunity to take on meaningful product ownership in a new site, ensuring the reliability and testability of chips that power the world's largest AI clusters.
As a Principal DFT Engineer, you will provide technical leadership across the full DFT lifecycle-from architecture and specification through implementation, verification, and silicon bring-up. You will define and drive DFT strategy, establish robust methodologies, and lead execution to ensure high test quality and manufacturability. This role requires deep expertise, cross-functional influence, and the ability to drive DFT excellence across projects and teams.
This is a critical leadership position with high impact on first-pass silicon success and production quality for next-generation AI connectivity solutions.
Key Responsibilities
DFT Architecture & Technical Leadership
Define and own DFT architecture for complex SoCs, including Scan, MBIST, LBIST, JTAG/iJTAG, and ATPG strategies
Lead DFT planning, specification, and quality tracking across the project lifecycle
Provide technical leadership and drive DFT sign-off readiness to ensure successful tapeout
Execution Across the Full Lifecycle
Lead DFT implementation, integration, and verification at block, full-chip and chiplet levels
Own end-to-end DFT activities from specification through silicon bring-up and production support
Ensure high test coverage, robust pattern generation, and alignment with manufacturing requirements
Methodology & Cross-Functional Impact
Develop and drive scalable DFT methodologies, flows, and automation frameworks
Collaborate closely with RTL, Physical Design, STA, and Test Engineering teams to ensure design-for-test readiness
Optimize DFT integration across front-end and backend flows to improve quality, PPA, and turnaround time.

we are establishing a strategic R&D center in Israel to drive the development of complex semiconductor chips that solve the critical 'data bottlenecks' enabling the future of AI at scale. As we expand our presence in Israel, we're seeking a visionary Junior Physical Design Engineer to help build our local engineering powerhouse from the ground up. This is a unique opportunity to take on meaningful product ownership in a new site, defining the backend execution and methodologies for chips that power the world's largest AI clusters.
As a Junior Physical Design Engineer, you will be a key architect of our silicon's physical reality. You won't just execute a flow-you will help establish our local execution culture and technical standards, owning the transformation of complex logic into high-performance silicon. You will drive the physical implementation journey from synthesis through signoff, ensuring our connectivity solutions meet the extreme performance, power, and area targets required for next-generation AI infrastructure. If you thrive on solving complex challenges in deep-submicron processes and want to shape the backend methodology for AI infrastructure connectivity, this is your opportunity.
Key Responsibilities
Physical Implementation & Execution
Be part of the founding Backend team in Israel, playing a critical role in establishing local execution culture and technical standards
Take full responsibility for physical implementation journey including Synthesis, Floorplanning, Place & Route, and Clock-Tree Synthesis (CTS)
Own macro-level implementation with deep hands-on experience in floorplanning and complex routing
Signoff & Design Integrity
Drive final stages of design integrity, owning Timing signoff (STA), Physical Verification (DRC/LVS), and Reliability analysis (EMIR)
Ensure first-pass silicon success through rigorous signoff flows and analysis
Apply Logic Equivalence Checking (LEC) and other verification techniques to guarantee design correctness
Methodology Development & Cross-Functional Collaboration
Participate in defining and refining Backend methodologies with autonomy to improve workflows and tool automation
Work closely with Architecture, Design, and DFT teams to navigate challenges of advanced process nodes and high-speed connectivity
Leverage scripting and automation to make engineering environment faster and more robust.

we are establishing a strategic R&D center in Israel to drive the development of complex semiconductor chips that solve the critical 'data bottlenecks' enabling the future of AI at scale. As we expand our presence in Israel, we're seeking a visionary Silicon Technical Program Manager to help build our local engineering powerhouse from the ground up. This is a unique opportunity to take on meaningful product ownership in a new site, leading the physical implementation strategy for chips that power the world's largest AI clusters.
As an Technical Program Manager, you will be the key architect of our silicons operational reality. You wont just track timelines - you will help establish our local execution culture and technical standards, owning the cross-functional journey of transforming complex logic into high-performance silicon.
Key Responsibilities
Drive and manage ASIC development and subsystems from concept through to production in collaboration with internal teams and external vendors.
Provide hands-on program management throughout the full development cycle of silicon and firmware, including concept, design, development, fabrication, validation, and production release.
Work closely with the software, hardware, and architecture teams to align with product requirements and ensure all constraints are met.
Lead process improvements across multiple teams and functions to drive better collaboration and efficiency.
Independently manage complex projects with minimal supervision, ensuring timelines and milestones are met.
Deliver high-quality ASIC solutions products while collaborating with product management and architecture teams.

we are establishing a strategic R&D center in Israel to drive the development of complex semiconductor chips that solve the critical 'data bottlenecks' enabling the future of AI at scale. As we expand our presence in Israel, we're seeking a visionary DFT Engineer to help build our local engineering powerhouse from the ground up. This is a unique opportunity to take on meaningful product ownership in a new site, ensuring the reliability and testability of chips that power the world's largest AI clusters.
As a DFT Engineer at our company, you will be at the intersection of architecture, design, and production. You won't just run tools-you will be a foundational member of the team responsible for the entire lifecycle of our silicon's reliability. From defining initial DFT architecture to supporting post-silicon bring-up, your work ensures that the backbone of AI infrastructure connectivity is flawless and scalable. If you thrive on solving complex challenges in deep-submicron processes and want to establish world-class DFT methodologies, this is your opportunity.
Key Responsibilities
DFT Architecture & Strategy
Be part of the DFT journey from high-level architecture definition and RTL design to backend implementation and post-production support
Develop comprehensive Design-for-Testability (DFT) strategies for next-generation connectivity platforms, ensuring chips meet the highest quality standards
Design and implement DFT architectures including JTAG/iJTAG, MBIST, Scan, and ATPG for high-end devices
Test Pattern Development & Optimization
Generate and optimize high-quality test and debug patterns for production
Perform Static Timing Analysis (STA) for DFT modes and conduct gate-level simulations to ensure robust performance
Drive test coverage and quality metrics to meet stringent manufacturing requirements
Cross-Functional Collaboration & Methodology Innovation
Act as a multidisciplinary bridge, collaborating closely with Architecture, Verification, and Backend teams to ensure seamless integration and optimal QoR
Participate in developing and maintaining cutting-edge DFT implementation flows
Automate and improve methodologies using advanced scripting and tools.