דרושים » אבטחת איכות QA » Senior IC Test Engineer

As a Senior DFT Engineer at Astera Labs, you will be at the intersection of architecture, design, and production. You won't just run tools-you will be a foundational member of the team responsible for the entire lifecycle of our silicon's reliability. From defining initial DFT architecture to supporting post-silicon bring-up, your work ensures that the backbone of AI infrastructure connectivity is flawless and scalable. If you thrive on solving complex challenges in deep-submicron processes and want to establish world-class DFT methodologies, this is your opportunity.

Key Responsibilities

DFT Architecture & Strategy

Own the DFT journey from high-level architecture definition and RTL design to backend implementation and post-production support
Develop comprehensive Design-for-Testability (DFT) strategies for next-generation connectivity platforms, ensuring chips meet the highest quality standards
Define DFT architectures including JTAG/iJTAG, MBIST, Scan, and ATPG methodologies
Test Pattern Development & Optimization

Generate and optimize high-quality test and debug patterns for production
Perform Static Timing Analysis (STA) for DFT modes and conduct gate-level simulations to ensure robust performance
Drive test coverage and quality metrics to meet stringent manufacturing requirements
Cross-Functional Collaboration & Methodology Innovation

Act as a multidisciplinary bridge, collaborating closely with Architecture, Verification, and Backend teams to ensure seamless integration and optimal QoR
Participate in developing and maintaining cutting-edge DFT implementation flows
Automate and improve methodologies using advanced scripting and tools

As a member of the UC organization, youll support the development and management of Compute, Database, Storage, Internet of Things (IoT), Platform, and Productivity Apps services in our company, including support for customers who require specialized security solutions for their cloud services.

Take part in the development of cutting-edge products within a disruptive system architecture. You will have the opportunity to work on the technologies that power the worlds largest cloud provider, in a dynamic, open, and fast-paced environment. We provide a highly reliable, scalable, low-cost infrastructure platform in the cloud, which powers hundreds of thousands of businesses in 190 countries around the world. Annapurna Labs, as part of us, is looking for talented engineers to help us develop a semiconductor platform based on a revolutionary architecture.

Looking for exceptional senior engineers to join the top-tier team that is developing the next generation semiconductor platform, based on a revolutionary architecture. Engineers will participate in design activities, working on the next generation of our products.

You are invited to take part in developing, integrating and deploying cutting-edge technologies, starting with identification and definition of project requirements, architecture, feature development, and collaboration with the different groups.
Your design will be integrated into the nitro SoC, on millions of servers worldwide. This is an opportunity to have a large-scale impact.
As a VLSI engineer and a member of the Nitro project, you will have an impact over the device through its entire lifecycle, from the product definition stage to mass production. You will work in close collaboration with multiple groups, including Architecture, Software, Verification, Backend, and DFT.

Key job responsibilities
*Full ownership of one or more IPs within the product:
-Micro-architecture.
-RTL coding and debug.
-Synthesis and timing closure.
-Sign-off.
* Supporting the Verification and Emulation teams: Test plan, Coverage review.
* Ensuring that the chip meets quality and reliability standards.
* Collaborating with cross-functional teams, including Product Definition, Verification, Software, and Physical design.

Required Senior SOC DFT Engineer, Cloud
About the job
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
In this role, you will play a crucial role in Design for Testing (DFT) Architecture and DFT design, and support devices of extreme complexity to production. You will be responsible for providing technical leadership in DFT, developing flows, automation, and methodology, planning DFT activities, tracking the DFT quality matrix throughout the project life-cycle, and providing sign-off DFT to tapeout.
Responsibilities
Lead and execute activities in the design, implementation, and verification of DFT solutions for large-scale ASICs.
Develop DFT strategy and architecture, including hierarchical DFT, Memory Built-In Self Test (MBIST), and Automatic Test Pattern Generation (ATPG).
Work with other Engineering teams (e.g., Design, Verification, Physical Design) to ensure that DFT requirements are met and mutual dependencies are managed.
Manage the DFT team's workload and deliverables, provide technical leadership and guidance to the team.
Lead DFT execution of a silicon project (e.g., planning, execution, tracking, quality, and signoff).

The V&V Lead will also support product development activities as a Test Engineer by designing and implementing detailed, comprehensive, well-structured test plans and test procedures.
The V&V Lead will need to have people management experience, as well as technical experience, including instrumentation, medical device V&V, and test method validation.
The V&V Lead should be creative and proactive to work successfully in a fast-paced environment, contributing to early prototype evaluations, test method development, design feedback to engineering teams, defect identification, and troubleshooting.



This is a full-time, exempt position located in our Haifa, Israel office and reports to the Verification and Validation Manager.



ESSENTIAL DUTIES AND RESPONSIBILITIES:

Line manager to Israel-based V&V Test Engineers and V&V Test Technicians for design verification activities.
Contribute to continuous improvements of the quality system and V&V process as part of the integrated V&V team across multiple locations.
Lead a team of different role types and varying levels of experience to perform the design V&V activities in support of product development activities.
Engage with leadership and cross-functional peers to ensure the design V&V team is integrated into the product development process, meeting both product quality and milestones on time.
Coordinate V&V activities of product development and sustaining projects.
Serve as signature alternate for V&V Manager on project-level documents, when appointed.
Execute V&V engineering work as an individual contributor when needed:
Plan test strategy and establish clear traceability between requirements and test procedures.
Analyze requirements and write test procedures with robust coverage of requirements using different test scenarios.
Write instruction-based test procedures and design test fixtures and/or SW tools as needed.
Guide and participate in the review of team members work output (above bullets) as needed to ensure a consistent quality level.
Train V&V team members on the quality system and V&V process.

Required Experienced SoC Verification Engineer
Haifa
Full time
Our SOC verification group owns the important and challenging job of verifying our chip. It is involved from product specification to final SOC delivery, and involves all the system components. The group is made up of few of the best verification engineers, so besides contributing to making our roads safer, youll get the chance to work at one of the most professional verification teams.
What will your job look like:
You'll be responsible for Pre-Silicon system-level verification of the most cutting-edge AI accelerators and technologies in the automotive field.
Define the TestPlan, develop and run tests on simulation/emulation environments, develop test environment and verification collaterals.
You'll have a broad effect on our unique product from the very beginning of the process.

As a Package Design Engineer, you will be a core technical contributor in the development of advanced IC packaging solutions for high-performance connectivity silicon. You will execute the package flow, design, and qualification from concept through production, working closely with silicon, signal integrity, power integrity, mechanical, manufacturing, and external OSAT partners. You will be responsible for implementing package technologies that meet aggressive electrical, thermal, mechanical, and cost targets, enabling products to operate reliably in the worlds most demanding AI and cloud environments.

Key Responsibilities


Execute end-to-end IC package design, from early feasibility and detailed design through to qualification and high-volume manufacturing
Implement package architecture and utilize advanced technologies (organic substrates, advanced laminate, interposers, multi-die/chiplet packaging, CoWoS - 2.5D/3D integration)
Drive signal integrity (SI), power integrity (PI), and thermal considerations at the package level for high-speed, high-power devices
Perform package layout, substrate routing, bump/ball maps, stack-ups, materials selection, and apply mechanical constraints
Collaborate closely with silicon design, SerDes, system, SI/PI, and reliability teams to optimize overall product performance
Interface directly with OSATs, substrate vendors, and manufacturing partners to ensure design-for-manufacturability (DFM), yield, and cost targets are met
Conduct package-related risk assessments, failure analysis, and corrective actions during bring-up and production ramp
Support NPI, qualification, and product sustainment activities, including vendor technical reviews

As a Design Verification Engineer, you will be responsible for ensuring "bug-free first silicon" for complex IP and SoC designs. You will drive all phases of pre-silicon verification, from defining methodologies and test plans to RTL freeze and tape-out sign-off. These roles are highly collaborative, requiring close interaction with architecture, design, and software teams across global sites.
Responsibilities
Architect and develop scalable, portable verification environments, including UVM-based testbenches, protocol monitors, agents, and checkers.
Define detailed test and coverage plans based on micro-architecture specifications and extract features for DV attributes.
Create and simulate test scenarios, perform advanced debugging, and conduct end-to-end simulations of data/control paths.
Drive regression and coverage analysis (metric-driven verification) to ensure the highest quality, productivity, and time-to-market.
Partner with architects and designers from the early stages of feature definition to influence IP/SoC specifications.
Apply formal verification, hardware acceleration, and power/performance (NLP) analysis where applicable.

Required Design and Power Methodology Manager, Servers, Cloud
About the job
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
As part of our Server Chip Design team, you will use your ASIC design experience to be part of a team that creates the SoC VLSI design cycle from start to finish. You will collaborate closely with design and verification engineers in active projects, creating architecture definitions with RTL coding, and running block level simulations.
As a Design and Power Methodology Team Manager within the Server Chip Design team, you will be responsible for managing and leading design and power methodologies from IP to SoC, pre and post silicon. You will be responsible for mentoring and developing team members and tech leads while driving improvements in leadership, technical execution, and design flows.
You will work closely with CAD vendors and internal teams to develop lead design and power methodology and execution.
Responsibilities
Manage a team of tech leads and designers. Develop and mentor team members, and communicate and co-work with multi-disciplined and multi-site teams.
Lead flow and methodology development and assimilation across multiple groups. Work closely with CAD tool providers as well as internal CAD teams.
Plan, execute, track progress, assure quality, and report status.
Work closely with internal customers and support multiple activities and deliverables.
Drive design methodologies such as design construction, CDC, RDC, SDC. Drive power at: IP and SoC RTL/Gate Level Optimization, estimation, correlation.

we're seeking a visionary Expert IC Package Design Lead to help build our local engineering powerhouse from the ground up. This is a unique opportunity to take on meaningful product ownership in a new site, leading the physical implementation strategy for chips that power the world's largest AI clusters.

As an Expert IC Package Design Lead, you will be a core technical contributor in the development of advanced IC packaging solutions for high-performance connectivity silicon.
You will own package flow, architecture, design, and qualification from concept through production, working closely with silicon, signal integrity, power integrity, mechanical, manufacturing, and external OSAT partners.You will be responsible for defining package technologies that meet aggressive electrical, thermal, mechanical, and cost targets, enabling products to operate reliably in the worlds most demanding AI and cloud environments.

Key Responsibilities

Own end-to-end IC package design, from early architecture and feasibility through detailed design, qualification, and high-volume manufacturing
Define package architecture and technology selection (organic substrates, advanced laminate, interposers, multi-die/chiplet packaging, CoWoS - 2.5D/3D integration)
Lead signal integrity (SI), power integrity (PI), and thermal considerations at the package level for high-speed, high-power devices
Drive package layout, substrate routing, bump/ball maps, stack-ups, materials selection, and mechanical constraints
Collaborate closely with silicon design, SerDes, system, SI/PI, and reliability teams to optimize overall product performance
Interface with OSATs, substrate vendors, and manufacturing partners to ensure design-for-manufacturability (DFM), yield, and cost targets
Lead package-related risk assessment, failure analysis, and corrective actions during bring-up and production ramp
Support NPI, qualification, and product sustainment activities, including vendor audits and technical reviews

Required RTL Design Technical Lead, Servers, Cloud
About the job
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
As part of our Server Chip Design team, you will use the ASIC design experience to be part of a team that creates the SoC VLSI design cycle from start to finish. You will collaborate with design and verification engineers in active projects, creating architecture definitions with RTL coding, and running block level simulations.
The ML, Systems, & Cloud AI (MSCA) organization designs, implements, and manages the hardware, software, machine learning, and systems infrastructure for all our services (Search, YouTube, etc.) and Cloud. Our end users are Googlers, Cloud customers and the billions of people who use our services around the world.
We prioritize security, efficiency, and reliability across everything we do - from developing our latest TPUs to running a global network, while driving towards shaping the future of hyperscale computing. Our global impact spans software and hardware, including Clouds Vertex AI, the leading AI platform for bringing Gemini models to enterprise customers.
Responsibilities
Lead the Design Activities at IPs, SubSystems(S.S) and SoC.
Plan, execute, track progress, assure quality, report status of the assigned activity.
Lead a team of designers both directly and in teams.
Define the Block/SoC level design documents such as Micro Architectural Specifications.
Own IP, S, SoC strategies for clocks, resets, and debugs. Enforce global methodologies and drive enhancements.