דרושים » הנדסה » FPGA Engineer (6294)

Mechatronics & Components Engineer We are seeking a Mechatronics & Components Engineer to support the development of advanced products through selection, evaluation, and integration of mechanical and electromechanical components.

we are looking for a Hardware Lead Engineer.
As HW Lead Engineer, in the Nitro team, you will be responsible for defining Annapurna Labs Smart Network Interface Card (NIC) design, leading development and validation cycles, and bringing the product to healthy mass production.
Youll provide leadership in new technologies, bringing them to large-scale deployment, in a continuous effort to deliver a world-class customer experience. We offer a fast-paced, intellectually challenging position, where youll work with technical experts, senior leaders, covering multiple technologies. We are changing the industry, and looking for individuals who are ready for this challenge and want to reach beyond what is possible today.
Key job responsibilities:
- Define the architecture and design specifications of next generation K2 Nitro Cards.
- Own full product life cycle, engage with design partners and manufacturing sites to enable high-yield mass production.
- Lead the analysis and debugging of complex design, manufacturing, and integration challenges.
- Continuously design for process optimization to improve product quality, simplify workflows, and accelerate the Nitro card development lifecycle.

We are redefining urban mobility by proving that autonomous vehicles can navigate complex environments using vision-only technology.
As our Hardware Systems Integration Engineer, you will be the lead architect responsible for the "nervous system " of our vehicles. You won't just be selecting components; you will be evaluating infrastructure that enables our AI software to see, process, and React to the world in Real-Time.
Responsibilities:
* Vision-Centric Architecture: Lead the selection and integration of high-dynamic-range (HDR) automotive-grade cameras.
* Compute Platform Selection - Evaluate and benchmark high-performance edge platforms (e.g., NVIDIA Orin, Qualcomm Snapdragon, Ambarella, or custom SOC solutions) capable of handling massive parallel video streams with minimal latency.
* Thermal & Power Integrity: Design integration of computing HW into automotive grade environment. This work can be done with external suppliers.
*  system Synchronization: design and ensure sensor synchronization.
* Redundancy Planning: architect fail-operational hardware systems to ensure the vehicle remains safe even if a specific component or communication bus fails.
* Present to and consult with the group leaders as to hardware design trade-offs

about the job
be part of a team that pushes boundaries, developing custom silicon solutions that power the future of direct-to-consumer products. you'll contribute to the innovation behind products loved by millions worldwide. your expertise will shape the next-generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.the ml, systems, & cloud ai (msca) organization at google designs, implements, and manages the hardware, software, Machine Learning, and systems infrastructure for all google services (search, youtube, etc.) and google cloud. our end users are googlers, cloud customers and the billions of people who use google services around the world. we prioritize security, efficiency, and reliability across everything we do - from developing our latest tpus to running a global network, while driving towards shaping the future of hyperscale computing. our global impact spans software and hardware, including google clouds vertex ai, the leading ai platform for bringing gemini models to enterprise customers.
responsibilities
lead the schematic capture and component selection for high-density, multi-layer pcbs (20+ layers) incorporating high-power asics (tpus/cpus), fpgas, and high-speed memory (hbm/ddr5).
design and validate high-speed interfaces including pcie gen 6.0/7.0, 400g/800g/1.6t ethernet (pam4). collaborate with signal integrity (si) engineers to define routing constraints and stack-up.
design multi-phase power regulators (vrms) capable of delivering >1000a currents with fast transient response for ai processors.
work with pcb layout designers to guide placement and routing of critical signals and power planes.
lead the lab bring-up of first-silicon/first-board by debugging hardware issues using oscilloscopes, tdrs, and logic analyzers to root-cause failures to component, assembly, or design issues.

Define the AI core architecture that will shape the next generation of AI chips, leading the global competition in AI computing power. As a key contributor to the competitiveness of AI core architecture, we drive chip architecture innovation starting from algorithm evolution, building a full-stack closed-loop capability of "algorithm-architecture-circuit-system," and creating a globally leading, independently controllable AI accelerator core to support the Ascend AI ecosystem and the implementation of large model strategies.
Responsibilities:
Modeling of HW specification of new architecture and microarchitecture. Working closely with architect and microarchitecture on modeling the specification.