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Our New Product Introduction (NPI) team is growing, and We are now looking for a Chip Engineering Operations Program Manager.! The Engineering Operations group has an immediate opening for a top Program Manager. This group is responsible for the silicon schedule from bring-up to production release. We are looking for individuals who thrive in a dynamic environment, and are not afraid to roll-up his their sleeves and get their hands dirty. We desire a self-starter, with great communication skills; as well as a leader, with a deep sense of commitment. You will be responsible for developing wafer forecasts, schedule generation and management, supporting cross-functional teams, and mitigating any programmatic risks. You will also review and improve processes, and handle prototype demand.

Our Networking division is a leading supplier of innovative end-to-end NVLINK, InfiniBand and Ethernet connectivity solutions and services for servers and storage. We offer market-leading solutions that include adapter cards, switches, cables, and software to support networking technologies. Our products optimize data center performance, using our AI solution and deliver industry-leading bandwidth and scalability. In addition, we serve a wide range of sectors, including high-performance computing, enterprise, data centers, cloud computing, big data, and Web 2.0.

What you'll be doing:

You own silicon bring-up schedule from power on to production release.

Negotiate silicon and board demand with teams and drive a bottom-up forecast.

Oversee and manage chip and board allocations across the company.

Lead prototype chip delivery to internal customers.

Track and coordinate engineering deliverables, key milestones and qualification/validation tasks in the new product introduction phase.

Identify and mitigate risks to schedules and programs.

Communicate status to cross-functional teams as well as upper management.

Continuously evaluate internal tools and processes and drive fixes to improve productivity.

Create new and fix existing processes between different teams.

Drive implementation of SW tools for data analytics and process evaluation.

Our Networking Business Unit is seeking a highly motivated and experienced Packaging Engineer to join our team. In this critical role, you will be responsible for developing, managing, and implementing product packaging solutions, focusing specifically on our network products. The role involves analyzing packaging requirements and developing innovative approaches to packaging design and production, ensuring that the product fits the companys business objectives and satisfies customer requirements. You will work closely with cross-functional teams to determine the packaging costs, implement sustainable packaging solutions, and find ways to improve quality, profitability, and product delivery.

What you will be doing:

Create packaging specifications and testing protocols.

Collaborate with cross-functional teams to ensure packaging meets product and shipping requirements.

Evaluate packaging materials and suppliers.

Ensure packaging compliance with industry regulations.

Work on reducing packaging-related costs and improving the efficiency of the product packaging process.

Maintain packaging-related documentation and records.

Manage packaging projects and timelines.

Lead regular working sessions and status meetings to track timeline, deliverables, materials, orders, test status,and blockers. Ensure alignment across functions and escalating issues as needed.

Proactively identify risks and issues that could impact project delivery, and work with collaborators to develop mitigation plans.

Ensure all relevant project documentation - including requirements, decisions, timelines, project progress, risks, and important decisions/action items.

Our Networking IC Product Engineering team is looking for a Post Si Characterization and Validation engineer, to take part of Network ASIC, SOC and SiPh ICs characterization efforts of speed, logic, memory, power and analog circuits both using ATE and system level testing. We are in need of hardworking and motivated engineers. Do you have passion for data analysis, post-Si hand on work and problem solving? We will be happy to have you on our team!

What you'll be doing:

The position includes taking ownership of characterization of IC performance and power parameters, developing new characterization and analysis capabilities, enabling the qualification of new and improvement of future products. You will define and build the required tests, perform the analysis and present the results and conclusions to a wide forum including leading designers and high level executives.

Take important part in definition of requirements for post-SI validation, as well as IC power and performance characterization.

We offer an exciting work environment, with many new learning experiences and interactions with people from different aspects of the company. Our company employs some of the best engineers in the communication field from all across the world, working on innovative technology and developing new and daring projects.

We are searching for hardworking engineers, that will lead new projects starting from the product definition phase, until the mass-production phase, working closely with several other teams, including chip design, power architecture, and BE.

We are searching for an MSc Graduate continuing to a Ph.D studies to join combined work efforts at the advanced research group, at both Bar Ilan university lab and in Yokneam site. This role offers an opportunity to be immersed in an environment focused on groundbreaking research and development in advanced materials and device simulations.

What you'll be doing:

Synthesis and fabrication of advanced materials, including characterization using techniques such as SEM, TEM, and Raman spectroscopy.

Performing device simulations and electrical measurements (DC and RF).