דרושים » הנדסה » Photonics Engineer

We are seeking a highly skilled Algorithm Engineer with a strong focus on deep learning and problem-solving. The ideal candidate will have proven experience in end-to-end development - from research and prototyping to production deployment - and a passion for applying advanced algorithms to transform the field of medical robotics.

Responsibilities:

Design, develop, and deploy cutting-edge algorithms to enhance the accuracy, robustness, and efficiency of robotic surgical systems.
Apply deep learning, computer vision, and advanced data analysis techniques to solve challenging perception and decision-making problems.
Lead end-to-end development cycles: problem definition, algorithm design, implementation, optimization, and integration into real-time systems.
Collaborate with multidisciplinary teams, including software, hardware, and clinical experts, to ensure algorithms meet system and clinical requirements.
Validate and refine algorithms through simulation, lab testing, and clinical feedback.

As we expand our presence in Israel, we're seeking a visionary Expert IC Package Design Lead to help build our local engineering powerhouse from the ground up. This is a unique opportunity to take on meaningful product ownership in a new site, leading the physical implementation strategy for chips that power the world's largest AI clusters.

As an Expert IC Package Design Lead, you will be a core technical contributor in the development of advanced IC packaging solutions for high-performance connectivity silicon.
You will own package flow, architecture, design, and qualification from concept through production, working closely with silicon, signal integrity, power integrity, mechanical, manufacturing, and external OSAT partners. You will be responsible for defining package technologies that meet aggressive electrical, thermal, mechanical, and cost targets, enabling our products to operate reliably in the worlds most demanding AI and cloud environments.

Key Responsibilities
Own end-to-end IC package design, from early architecture and feasibility through detailed design, qualification, and high-volume manufacturing.
Define package architecture and technology selection (organic substrates, advanced laminate, interposers, multi-die/chiplet packaging, CoWoS - 2.5D/3D integration).
Lead signal integrity (SI), power integrity (PI), and thermal considerations at the package level for high-speed, high-power devices.
Drive package layout, substrate routing, bump/ball maps, stack-ups, materials selection, and mechanical constraints.
Collaborate closely with silicon design, SerDes, system, SI/PI, and reliability teams to optimize overall product performance.
Interface with OSATs, substrate vendors, and manufacturing partners to ensure design-for-manufacturability (DFM), yield, and cost targets.
Lead package-related risk assessment, failure analysis, and corrective actions during bring-up and production ramp.
Support NPI, qualification, and product sustainment activities, including vendor audits and technical reviews.

We are seeking a high-driven, results-oriented multidisciplinary orchestrator to act as the primary catalyst for our development infrastructure. In this role, you will operate at the critical intersection of product strategy, hardware engineering, and lab operations, serving as the connective tissue that aligns disparate teams under a unified goal. You will be responsible for driving cross-functional alignment across the organization, effectively managing stakeholders with differing ownership to ensure infrastructure roadmaps scale alongside product milestones. This position requires a self-starter comfortable pushing for success in ambiguous environments, where you will translate high-level strategy into the tactical execution of the physical and virtual ecosystems that power our development lifecycle.

Your Impact

You will own the end-to-end lifecycle of infrastructure projects, ensuring that our Sanity Test Beds and development environments are optimized to meet aggressive product launch timelines. By bridging the gap between engineering roadmaps and infrastructure requirements, you will serve as the engine that ensures our teams have the right resources at the right time, regardless of technical or organizational complexity.

Key Responsibilities

Strategic Orchestration & Alignment

Unified Roadmap Integration: Translate complex product development roadmaps into long-term infrastructure requirements, driving cross-functional alignment between silicon milestones and lab availability.
Stakeholder Management: Act as the primary liaison between hardware engineering, software development, procurement, and lab operations; navigate competing priorities among stakeholders with differing ownership to keep teams synchronized.
Ambiguity Management: Proactively identify project roadblocks and navigate ambiguous environments to push critical-path dependencies to resolution.
Operational Velocity: Drive continuous improvement in infrastructure processes, identifying and removing friction to increase overall engineering velocity.
Operational Oversight & Execution

Strategic Capacity Planning: Lead high-stakes capacity management efforts, forecasting needs for power, rack space, and compute resources to proactively eliminate infrastructure bottlenecks.
Lifecycle Ownership: Oversee the full lifecycle of infrastructure projects-from initial procurement and technical specification through deployment, validation, and transition to operational readiness.
Visibility & Reporting: Drive the development of dashboards and reporting mechanisms to provide real-time visibility into infrastructure health, ensuring data-driven decision-making across the organization.
Vendor & Asset Optimization: Partner with cross-functional leadership to manage technical specifications, equipment lead times, and hardware lifecycles, ensuring a high-performance, cost-effective infrastructure footprint.

abra professional services is seeking a talented Aeromechanical Engineer If you are looking for a meaningful technological journey filled with multidisciplinary challenges, come and be a part of our story. As an Aeromechanical Engineer, you will join our Aeromechanics Team within the Platform Development Division at the company’s Modi'in site. Key Responsibilities:
* Participate in the mechanical design of airborne structures, mechanisms, and aircraft systems.
* Drive end-to-end development and validation, from initial conceptual design through to mass production.
* Improve, optimize, and upgrade existing operational products.
* Oversee production accompaniment, environmental/flight testing, and the preparation of detailed engineering drawings.
* Author technical requirements, design specifications, and engineering reports.

In this role, you will contribute to the development of complex ASIC package designs from early planning and exploration through implementation and tapeout. You will collaborate across package design, layout, SI/PI, and silicon teams to help deliver high‑speed, robust, and manufacturable package solutions.

You will participate in package architecture activities, design tradeoff discussions, and technical problem solving while growing your expertise in advanced packaging technologies and system-level integration. This role provides an opportunity to work on some of the most advanced networking silicon products in the industry within a highly collaborative engineering environment.

Responsibilities:
As a member of the Package Design team, you will:

Lead the package design activities including planning, floorplanning, pinout optimization, stack‑up definition, and high‑speed routing support.

Collaborate with SI/PI, silicon floorplanning, layout, and manufacturing teams to ensure high‑quality package solutions.

Support package implementation activities and work closely with layout designers to ensure alignment between design intent and physical implementation.

Participate in technical investigations, design reviews, and tradeoff discussions involving performance, manufacturability, and schedule considerations.

Assist in developing and improving package design methodologies, flows, and best practices.

Contribute to debugging, issue resolution, and package bring‑up activities as needed.

Spearhead innovative silicon architecture for AI infrastructure, guiding board design from concept through to mass production.

Act as the technical decision-maker for the project and collaborate with cross-functional teams in mechanics, thermal, PCB layout, and software/RTL.

Define product specifications, develop electrical schematics, and guide component selection.

Conduct hands-on testing in a lab environment and drive the PCB bring-up, characterization, and debugging stages.

As SIPI engineer youll be required to design and analyze high speed analog/digital signals for networking products, with emphasis on high speed signal and power analysis of ASIC, Package and PCB. Model/simulate/characterize high speed systems, including high speed I/Os, chip packages, printed circuit boards, and system interconnects. Overcome the challenges of ultra-high data rate and cutting-edge technology. We use the latest silicon technologies and processes to build largest scale and most complex devices at the edge of feasibility.

In this role, you will be leading all aspects of verification and will have a critical impact on the company's R&D path.



Responsibilities:

Define and implement robust SV/UVM verification solutions, including test benches and methodologies, to drive efficient verification closure across block-level and full-chip designs, integrating Mix-signals SoC simulation environment using Verilog, MATLAB, HW/SW Co-simulation and lab integration.
Work closely with Digital Design, Analog Design, Software, Back-end, SW and System teams to understand the functional, power and performance goals of the product and ensure its quality.