דרושים » חשמל ואלקטרוניקה » Senior IC Package mechanical and thermal design engineer

As we expand our presence in Israel, we're seeking a visionary Expert IC Package Design Lead to help build our local engineering powerhouse from the ground up. This is a unique opportunity to take on meaningful product ownership in a new site, leading the physical implementation strategy for chips that power the world's largest AI clusters.

As an Expert IC Package Design Lead, you will be a core technical contributor in the development of advanced IC packaging solutions for high-performance connectivity silicon.
You will own package flow, architecture, design, and qualification from concept through production, working closely with silicon, signal integrity, power integrity, mechanical, manufacturing, and external OSAT partners. You will be responsible for defining package technologies that meet aggressive electrical, thermal, mechanical, and cost targets, enabling our products to operate reliably in the worlds most demanding AI and cloud environments.

Key Responsibilities
Own end-to-end IC package design, from early architecture and feasibility through detailed design, qualification, and high-volume manufacturing.
Define package architecture and technology selection (organic substrates, advanced laminate, interposers, multi-die/chiplet packaging, CoWoS - 2.5D/3D integration).
Lead signal integrity (SI), power integrity (PI), and thermal considerations at the package level for high-speed, high-power devices.
Drive package layout, substrate routing, bump/ball maps, stack-ups, materials selection, and mechanical constraints.
Collaborate closely with silicon design, SerDes, system, SI/PI, and reliability teams to optimize overall product performance.
Interface with OSATs, substrate vendors, and manufacturing partners to ensure design-for-manufacturability (DFM), yield, and cost targets.
Lead package-related risk assessment, failure analysis, and corrective actions during bring-up and production ramp.
Support NPI, qualification, and product sustainment activities, including vendor audits and technical reviews.

We are looking for a highly experienced Senior Thermal Engineer to join our Architecture engineering team and take a key role in the development of next-generation SoCs, ECUs, and high-performance compute platforms for autonomous driving systems.
The position combines SoC/package thermal development, ECU cooling architecture, thermal simulation, characterization, validation, and vehicle-level thermal integration, working across multiple next-generation programs from early concept through qualification and production.
Please note: This position is also relevant for our other sites in Haifa, Petah Tikva, and Jerusalem.
What will your job look like?
Work on thermal development of next-generation SoCs and air/liquid-cooled ECU platforms, covering product requirements, thermal architecture, design, simulation, characterization, testing and qualification.
Perform detailed thermal performance assessment and CFD analysis of next-generation SoC/package designs, including die/package temperature distribution, heat spreading, thermal interfaces, material and stack-up optimization, and thermal resistance evaluation
Develop and evaluate advanced cooling solutions, including air cooling, liquid cooling, heat pipes, and advanced heat-spreading technologies.
Support vehicle-level cooling architecture and ECU integration for next-generation autonomous driving and Robotaxi platforms.
Define cooling requirements including coolant temperature, flow rate, pressure drop, thermal interfaces, and system thermal margins.
Correlate simulation results with laboratory and product measurements, drive thermal optimization and troubleshooting throughout development and qualification.
Work closely with silicon Arch, package, HW, mechanical, electrical, validation, suppliers, Tier-1s and OEM customers.

We are looking for a highly skilled Senior Thermal-Mechanical Engineer to join our mechanical engineering team as a key player in the development of next-generation high-performance compute platforms for autonomous driving systems.
This key position includes leading the thermal-mechanical design and cooling architecture of advanced electronic systems throughout all lifecycle stages-from concept to mass production-while working closely with hardware, PCB layout, mechanical, validation, manufacturing, suppliers, and customers.
What will your job look like?
Lead the thermal-mechanical design process from concept through validation, NPI, and production.
Define cooling architectures and optimize air- and liquid-cooling solutions for high-power electronic systems.
Perform thermal simulations and analyses using tools such as Icepak, FloTHERM, Fluent, or equivalent.
Perform mechanical simulations and analyses using tools such as ANSYS Mechanical, Abaqus, Nastran, or equivalent.
Correlate simulation results with lab measurements and drive solutions that meet system requirements.
Lead thermal validation, prototyping, environmental testing, and reliability activities.
Collaborate closely with cross-functional teams, suppliers, subcontractors, and customers.
Support mechanical design and serve as a technical focal point for complex thermal-mechanical challenges.

We are looking for a highly experienced Senior Thermal Engineer to join our Architecture engineering team and take a key role in the development of next-generation SoCs, ECUs, and high-performance compute platforms for autonomous driving systems.
The position combines SoC/package thermal development, ECU cooling architecture, thermal simulation, characterization, validation, and vehicle-level thermal integration, working across multiple next-generation programs from early concept through qualification and production.
Please note: This position is also relevant for our other sites in Haifa, Petah Tikva, and Jerusalem.
What will your job look like?
Work on thermal development of next-generation SoCs and air/liquid-cooled ECU platforms, covering product requirements, thermal architecture, design, simulation, characterization, testing and qualification.
Perform detailed thermal performance assessment and CFD analysis of next-generation SoC/package designs, including die/package temperature distribution, heat spreading, thermal interfaces, material and stack-up optimization, and thermal resistance evaluation
Develop and evaluate advanced cooling solutions, including air cooling, liquid cooling, heat pipes, and advanced heat-spreading technologies.
Support vehicle-level cooling architecture and ECU integration for next-generation autonomous driving and Robotaxi platforms.
Define cooling requirements including coolant temperature, flow rate, pressure drop, thermal interfaces, and system thermal margins.
Correlate simulation results with laboratory and product measurements, drive thermal optimization and troubleshooting throughout development and qualification.
Work closely with silicon Arch, package, HW, mechanical, electrical, validation, suppliers, Tier-1s and OEM customers.

We are looking for a highly experienced Senior Thermal Engineer to join our Architecture engineering team and take a key role in the development of next-generation SoCs, ECUs, and high-performance compute platforms for autonomous driving systems.
The position combines SoC/package thermal development, ECU cooling architecture, thermal simulation, characterization, validation, and vehicle-level thermal integration, working across multiple next-generation programs from early concept through qualification and production.
Please note: This position is also relevant for our other sites in Haifa, Petah Tikva, and Jerusalem.
What will your job look like?
Work on thermal development of next-generation SoCs and air/liquid-cooled ECU platforms, covering product requirements, thermal architecture, design, simulation, characterization, testing and qualification.
Perform detailed thermal performance assessment and CFD analysis of next-generation SoC/package designs, including die/package temperature distribution, heat spreading, thermal interfaces, material and stack-up optimization, and thermal resistance evaluation
Develop and evaluate advanced cooling solutions, including air cooling, liquid cooling, heat pipes, and advanced heat-spreading technologies.
Support vehicle-level cooling architecture and ECU integration for next-generation autonomous driving and Robotaxi platforms.
Define cooling requirements including coolant temperature, flow rate, pressure drop, thermal interfaces, and system thermal margins.
Correlate simulation results with laboratory and product measurements, drive thermal optimization and troubleshooting throughout development and qualification.
Work closely with silicon Arch, package, HW, mechanical, electrical, validation, suppliers, Tier-1s and OEM customers.

We are seeking a Package Layout Design Engineer to join our hardware team and contribute to the physical design of advanced IC packages for next-generation machine learning and data center ASICs.
In this role, you will execute package layout tasks from floor planning through tape out and manufacturing release, working closely with senior engineers, SI/PI, thermal, and manufacturing teams to deliver production-ready designs that meet performance, density, and reliability targets.

Key job responsibilities
- Execute package layout tasks across the design cycle: die floor planning, bump/pad assignment, RDL routing, substrate design, verification, and tape out release.
- Implement physical designs for advanced packaging architectures including 2.5D interposer, 3D-IC, fan-out wafer-level packaging, and silicon bridge technologies (e.g., CoWoS, EMIB, or similar).
- Support package floorplan development considering die placement, bump maps, power/ground distribution, signal escape routing, and decoupling capacitor placement.
- Perform RDL and substrate routing for high-density interconnects including microbumps, C4 bumps, TSVs, microvias, and PTH vias across multi-layer organic substrates or silicon interposers.
- Support die-level RDL routing and bump planning in coordination with ASIC physical design teams to help co-optimize the die-package interface.
- Contribute to cross-level layout co-optimization across die RDL, interposer/substrate, and PCB levels under guidance from senior engineers.
- Assist in maintaining package stack-up definitions in collaboration with SI/PI and materials engineering teams.
- Run physical verification checks (DRC, connectivity, shorts/opens) and support design closure.
- Follow and help refine package design rules and guidelines, working with OSAT partners and foundries to ensure DFM compliance.
- Collaborate with SI/PI engineers to incorporate electrical constraints into the physical layout - impedance-controlled routing, power plane optimization, and critical net shielding.

We are developing leading edge products, manufactured on leading edge technologies. We offer a dynamic, open, teamwork environment operating at high pace mode.

Key job responsibilities
Primary responsibilities:
- Development of DfX (DfM, DfT, DfQ&R, etc.) methodologies and BKMs (Best Known Methods).
- DfX activities during the product design stage.
- Product quality & reliability validation (QRV) and ongoing quality & reliability monitoring (OQRM).
- Q&R engineering of volume manufacturing: auditing, monitoring, risk assessment and disposition of non-conformance events/non-conforming material, defining and implementing corrective actions.
- RMAs: investigation, disposition, reporting and follow-up.

We are looking for a Nitro System Manufacturing Integration Lead Engineer to be part of defining, shaping, and implementing manufacturing flows, test definitions, and card-to-server integration processes for Nitro-based platforms. This includes to be part of the manufacturing flow architecture, production test strategy, process stabilization, and yield optimization bridging system design intent with high-volume manufacturing execution.

Key job responsibilities
As a System Manufacturing Integration Lead Engineer, in the Nitro team, you will own the end-to-end manufacturing flows for accelerator card-to-server integration across manufacturing partner facilities driving the process from initial definition through stabilization into a scalable, high-yield mass production operation.

Key responsibilities include:
- Architect manufacturing flows - be part of the complete card-to-server integration sequence, including every process step, quality gate, and decision point from sub-assembly through system integration and tests.
- Define test strategy - be part of determining what to test, when, and at which station, covering card-level functional tests, post-integration validation, firmware provisioning, and first power-up diagnostics.
- Establish classification criteria - be part of determining pass/fail thresholds and test exit gates to maximize yield and minimize material waste.
- Drive process stabilization - work directly and on-site with manufacturing partners to implement, debug, and iterate on manufacturing flows from early builds through a locked, repeatable production process.
- Design alternative flows - develop parallel manufacturing paths to address real-world constraints such as component availability gaps, deferred card integration, and hub-based assembly models.
- Own process documentation & KPIs - maintain manufacturing flow baselines, drive process change control, and track yield, first-pass rate, cycle time, and defect Pareto.
- Lead cross-functional coordination - serve as the single point of ownership across hardware engineering, firmware, test/vetting, thermal, mechanical, and operations teams for Nitro-based accelerator servers built at scale.

we are an agile defense-tech startup tackling the most complex challenges in counter-drone and uncrewed defense. With hundreds of combat-proven systems deployed by the IDF and global partners, we are now engineering the next generation of C-UxS (Counter-Uncrewed Systems). We leverage advanced electronic warfare and kinetic measures to detect and neutralize hostile threats. If you want to push technological boundaries while safeguarding Israel and our allies, join us at this pivotal stage of our growth.
This is a unique opportunity to join a company at a pivotal growth stage and help shape its products, culture, and future.
DART is an autonomous counter-drone system: a standalone system and a radar-cued ground station launch small interceptor drones that acquire an airborne target with a thermal seeker and defeat it by direct impact. The interceptor is built on a COTS high-agility racer platform, with Betaflight closing the inner rate loop and a mission computer running perception and outer-loop guidance.
You will own the two disciplines that determine whether the interceptor actually hits: guidance and control law design, and the simulation environment used to develop, validate, and regression-test those laws before anything flies. This is a hands-on leadership role - you are expected to write and tune code, sit in front of flight logs, and stand in the field on test days, while also setting technical direction for a small team.
Key Responsibilities
Own outer-loop guidance (image-based thermal aim, pursuit/proportional-navigation, latency-compensated LOS, and throttle management) and manage end-to-end latency and stability budgets.
Implement and tune controllers (from PID/PI to adaptive/MPC), define flight controller interfaces (MSP/CRSF/SBUS injection), and govern the flight-mode state machine, failsafes, and safety envelope.
Deliver the 6-DOF simulation product (interceptor/target dynamics, thermal seeker), maintain SIL/HIL rigs for unmodified production code, validate models against flight data, and run automated regression suites and KPIs.
Lead and mentor the control and simulation team, set test-progression gates (sim to full-envelope flight), collaborate closely with Vision and Systems Engineering, and produce all required technical artifacts.

We're looking for exceptional engineers to join our Signal/Power-Integrity and Packaging team. A team that sits where the Silicon meets the Board, bridging the gap between what happens internally at the DIE and the overall system interconnect and the external memories and peer devices.
What sets us apart:
Small team, yet a one stop shop for IP electrical integration at the DIE level, Package design, SI/PI simulations, Layout, Board-design and advanced lab characterization.
Combining Signal-Integrity and Layout, to come up with optimized Package and PCB designs.
Holistic view of the entire interconnect, from the DIEs metals, through the Package, to the PCB traces, and all the way to the peer device.
In-depth post-silicon characterization, using advanced measurement techniques, far exceeding traditional compliance measurements.
Deep dive mentality, in both theory and the bolts and nuts that make the internal circuitry of the electrical interfaces.

The SIP (Signal-Integrity & Packaging) team is part of Annapurna-Labs Chip development team.
The team is dealing with the external electrical interfaces of the device, from their Signal/Power-integrity and electrical usage perspectives.
The teams work includes close work with the BackEnd team on integrating these interfaces to the Die, the package layout design of the BGAs substrate, Signal and power integrity simulations, and working with the system team to come up with optimal pin-out and optimal PCB breakout schemes.
We are looking for highly motivated Electrical Engineering graduates, or engineers with up to 3 years' experience in related fields, to join our growing team specializing in Signal Integrity and IC Package Design. The position offers a unique entry point into a diverse and multidisciplinary domain.

Key job responsibilities
Work on advanced high-speed interfaces such as PCIe, DDR and Ethernet.
End-to-end solution of high-speed interfaces; from floor-planning at the DIE level, through Package and PCB routing, addressing both robust SI/PI considerations as well as optimizing layout routing.
Signal and power integrity modeling and simulation of high-speed interconnects using advanced SI/PI simulation tools.