דרושים » חשמל ואלקטרוניקה » Senior Quality and Reliability Engineer

Required Senior Silicon DFT Lead
About the job
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
As the Design for Test (DFT) Engineer Lead, you will play a crucial role in DFT Architecture and DFT design, and support devices to production. You will be responsible for providing technical leadership in DFT, developing flows, automation, and methodology, planning DFT activities, tracking the DFT quality throughout the project life-cycle, and providing sign-off DFT to tapeout.
The AI and Infrastructure team is redefining whats possible. We empower customers with breakthrough capabilities and insights by delivering AI and Infrastructure at unparalleled scale, efficiency, reliability and velocity.
We're the driving force behind our groundbreaking innovations, empowering the development of our cutting-edge AI models, delivering unparalleled computing power to global services, and providing the essential platforms that enable developers to build the future. From software to hardware our teams are shaping the future of world-leading hyperscale computing, with key teams working on the development of our TPUs, Vertex AI for Cloud, Global Networking, Data Center operations, systems research, and much more.
Responsibilities
Lead and execute DFT activities in the design, implementation, and verification solutions for Application-Specific Integrated Circuits (ASIC).
Develop DFT strategy and architecture, including hierarchical DFT, Memory Built-In Self Test (MBIST), and Automatic Test Pattern Generation (ATPG).
Work with other Engineering teams (e.g., Design, Verification, Physical Design) to ensure that DFT requirements are met and mutual dependencies are managed.
Manage a DFT team planning, deliverables, and provide technical mentoring and guidance.
Lead DFT execution of a silicon project, planning, execution, tracking, quality, and signoff.

We are seeking a Package Layout Design Engineer to join our hardware team and contribute to the physical design of advanced IC packages for next-generation machine learning and data center ASICs.
In this role, you will execute package layout tasks from floor planning through tape out and manufacturing release, working closely with senior engineers, SI/PI, thermal, and manufacturing teams to deliver production-ready designs that meet performance, density, and reliability targets.

Key job responsibilities
- Execute package layout tasks across the design cycle: die floor planning, bump/pad assignment, RDL routing, substrate design, verification, and tape out release.
- Implement physical designs for advanced packaging architectures including 2.5D interposer, 3D-IC, fan-out wafer-level packaging, and silicon bridge technologies (e.g., CoWoS, EMIB, or similar).
- Support package floorplan development considering die placement, bump maps, power/ground distribution, signal escape routing, and decoupling capacitor placement.
- Perform RDL and substrate routing for high-density interconnects including microbumps, C4 bumps, TSVs, microvias, and PTH vias across multi-layer organic substrates or silicon interposers.
- Support die-level RDL routing and bump planning in coordination with ASIC physical design teams to help co-optimize the die-package interface.
- Contribute to cross-level layout co-optimization across die RDL, interposer/substrate, and PCB levels under guidance from senior engineers.
- Assist in maintaining package stack-up definitions in collaboration with SI/PI and materials engineering teams.
- Run physical verification checks (DRC, connectivity, shorts/opens) and support design closure.
- Follow and help refine package design rules and guidelines, working with OSAT partners and foundries to ensure DFM compliance.
- Collaborate with SI/PI engineers to incorporate electrical constraints into the physical layout - impedance-controlled routing, power plane optimization, and critical net shielding.

As we expand our presence in Israel, we're seeking a visionary Expert IC Package Design Lead to help build our local engineering powerhouse from the ground up. This is a unique opportunity to take on meaningful product ownership in a new site, leading the physical implementation strategy for chips that power the world's largest AI clusters.

As an Expert IC Package Design Lead, you will be a core technical contributor in the development of advanced IC packaging solutions for high-performance connectivity silicon.
You will own package flow, architecture, design, and qualification from concept through production, working closely with silicon, signal integrity, power integrity, mechanical, manufacturing, and external OSAT partners. You will be responsible for defining package technologies that meet aggressive electrical, thermal, mechanical, and cost targets, enabling our products to operate reliably in the worlds most demanding AI and cloud environments.

Key Responsibilities
Own end-to-end IC package design, from early architecture and feasibility through detailed design, qualification, and high-volume manufacturing.
Define package architecture and technology selection (organic substrates, advanced laminate, interposers, multi-die/chiplet packaging, CoWoS - 2.5D/3D integration).
Lead signal integrity (SI), power integrity (PI), and thermal considerations at the package level for high-speed, high-power devices.
Drive package layout, substrate routing, bump/ball maps, stack-ups, materials selection, and mechanical constraints.
Collaborate closely with silicon design, SerDes, system, SI/PI, and reliability teams to optimize overall product performance.
Interface with OSATs, substrate vendors, and manufacturing partners to ensure design-for-manufacturability (DFM), yield, and cost targets.
Lead package-related risk assessment, failure analysis, and corrective actions during bring-up and production ramp.
Support NPI, qualification, and product sustainment activities, including vendor audits and technical reviews.

As an Ethernet Validation Engineer, you'll own the validation strategy for high-speed Ethernet (400G/800G+) on our next-generation ASICs, ensuring they perform flawlessly before reaching millions of customers.

In this role you will set the validation strategy for HS-Ethernet, ensure the design worked well, and drive complex system debugs involving HW, FW and SW components. You will provide leadership, by driving the teams around you to raise the bar and deliver higher quality products on behalf of Amazon customers. You will set high standards for yourself and everyone you work with, and will be constantly looking for ways to improve the performance, quality, cost and reliability of AWS products and services. We are transforming an industry, and we are looking for individuals who are ready for this challenge and want to reach beyond what is possible today.

Key job responsibilities
- Own new products validation strategies for high-speed Ethernet interfaces and leading their execution.
- Support ongoing validation and integration of new products.
- Provide Annapurna Labs ASIC design, SW development, QA and architecture teams information and requirements from validation perspectives.

As we expand our presence in Israel, we're seeking a visionary Physical Design Engineer to help build our local engineering powerhouse from the ground up. This is a unique opportunity to take on meaningful product ownership in a new site, defining the backend execution and methodologies for chips that power the world's largest AI clusters.

As a Physical Design Engineer, you will be a key architect of our silicon's physical reality. You won't just execute a flow-you will help establish our local execution culture and technical standards, owning the transformation of complex logic into high-performance silicon. You will drive the physical implementation journey from synthesis through signoff, ensuring our connectivity solutions meet the extreme performance, power, and area targets required for next-generation AI infrastructure. If you thrive on solving complex challenges in deep-submicron processes and want to shape the backend methodology for AI infrastructure connectivity, this is your opportunity.

Key Responsibilities

Physical Implementation & Execution
Be part of the founding Backend team in Israel, playing a critical role in establishing local execution culture and technical standards
Take full responsibility for physical implementation journey including Synthesis, Floorplanning, Place & Route, and Clock-Tree Synthesis (CTS)
Own macro-level implementation with deep hands-on experience in floorplanning and complex routing

Signoff & Design Integrity
Drive final stages of design integrity, owning Timing signoff (STA), Physical Verification (DRC/LVS), and Reliability analysis (EMIR)
Ensure first-pass silicon success through rigorous signoff flows and analysis
Apply Logic Equivalence Checking (LEC) and other verification techniques to guarantee design correctness

Methodology Development & Cross-Functional Collaboration
Participate in defining and refining Backend methodologies with autonomy to improve workflows and tool automation
Work closely with Architecture, Design, and DFT teams to navigate challenges of advanced process nodes and high-speed connectivity
Leverage scripting and automation to make engineering environment faster and more robust

We are looking for a Nitro System Manufacturing Integration Lead Engineer to be part of defining, shaping, and implementing manufacturing flows, test definitions, and card-to-server integration processes for Nitro-based platforms. This includes to be part of the manufacturing flow architecture, production test strategy, process stabilization, and yield optimization bridging system design intent with high-volume manufacturing execution.

Key job responsibilities
As a System Manufacturing Integration Lead Engineer, in the Nitro team, you will own the end-to-end manufacturing flows for accelerator card-to-server integration across manufacturing partner facilities driving the process from initial definition through stabilization into a scalable, high-yield mass production operation.

Key responsibilities include:
- Architect manufacturing flows - be part of the complete card-to-server integration sequence, including every process step, quality gate, and decision point from sub-assembly through system integration and tests.
- Define test strategy - be part of determining what to test, when, and at which station, covering card-level functional tests, post-integration validation, firmware provisioning, and first power-up diagnostics.
- Establish classification criteria - be part of determining pass/fail thresholds and test exit gates to maximize yield and minimize material waste.
- Drive process stabilization - work directly and on-site with manufacturing partners to implement, debug, and iterate on manufacturing flows from early builds through a locked, repeatable production process.
- Design alternative flows - develop parallel manufacturing paths to address real-world constraints such as component availability gaps, deferred card integration, and hub-based assembly models.
- Own process documentation & KPIs - maintain manufacturing flow baselines, drive process change control, and track yield, first-pass rate, cycle time, and defect Pareto.
- Lead cross-functional coordination - serve as the single point of ownership across hardware engineering, firmware, test/vetting, thermal, mechanical, and operations teams for Nitro-based accelerator servers built at scale.

Required Senior SoC Product Engineer, Cloud
About the job
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
Responsibilities
Develop and implement strategies for high volume manufacturing of SoC products, including troubleshooting, ATE test coverage optimization, DPPM reduction, test cost reduction, power and performance assurance, and product data integration and correlation between system, ATE, and SLT.
Drive interactions with wafer fab and OSATs, own and drive checkpoints for key quality metrics.
Drive volume ramp and mass production through test program releases, volume data analytics, lot disposition, extended test time reduction, yield improvement, and RMA handling.
Support setup and maintenance of test, diagnosis, and yield analysis infrastructure, including Return Merchandise Authorization (RMA) support.
Collaborate with cross functional teams across the globe including ATE and SLT Test Engineering, Quality and Reliability (Q&R), Packaging, Supplier Management and Operations to build, deploy, and maintain a high volume manufacturing screening solution.

As we expand our presence in Israel, we're seeking a talented Senior Emulation Engineer to help build our local engineering powerhouse from the ground up. This is an exciting opportunity to take on meaningful ownership in a new site, implementing the emulation strategy for chips that power the world's largest AI clusters.

As an Senior Emulation Engineer, you will be a core technical driver of our Israel R&D center, working at the intersection of hardware and software to ensure our silicon meets extreme quality and performance targets. You will execute end-to-end emulation flows, bridge the gap between RTL and functional validation, and partner with cross-functional teams to enable seamless hardware-software integration. If you thrive on solving complex technical challenges and want to play a key role in validating cutting-edge AI infrastructure connectivity solutions, this is your opportunity.

Key Responsibilities

Emulation Flow Execution & Implementation
Execute end-to-end emulation flow from high-level model generation and RTL synthesis to complex system-level testing and silicon-accurate debugging.
Work directly with next-generation emulation platforms (Zebu, Palladium, or Veloce) to implement cutting-edge methodologies.
Maintain and evolve emulation flows to reduce compile times and increase execution speed, directly impacting time-to-market.

System-Level Debug & Validation
Drive initial model bring-up process in high-stakes environment, identifying and resolving complex bugs.
Ensure rapid cycles from RTL to functional stability through systematic debug approaches.
Own technical blocks and drive them to completion independently.

Cross-Functional Collaboration
Partner with Firmware, Software, and Validation teams to debug complex system-level scenarios.
Ensure seamless hardware-software integration for AI infrastructure connectivity.
Collaborate with Design and Verification teams to optimize emulation strategies.

As we expand our presence in Israel, we're seeking a talented Senior ASIC Design Engineer to help build our local engineering powerhouse from the ground up. This is an exciting opportunity to take on meaningful product ownership in a new site, designing the digital blocks that sit at the heart of our most ambitious connectivity projects.

As a Senior ASIC Design Engineer, you won't just build chips-you will be part of a team defining the next generation of AI infrastructure main components. The complex digital blocks under your micro-architecture and implementation responsibilities will power the world's largest AI clusters. You will own the journey from high-level definition through RTL implementation and backend support, transforming complex logic challenges into elegant, high-performance hardware. If you thrive on solving challenging problems in deep-submicron processes and want to contribute to the digital design foundation for AI infrastructure connectivity, this is your opportunity.

Key Responsibilities

Design Ownership & Implementation
Own the journey from high-level definition through micro-architecture, coding, and debug to backend implementation support
Tackle complex logic challenges and transform them into elegant, high-performance hardware solutions
Serve as the point of contact for your logic blocks, interacting with Architecture, Verification, and Backend teams

Quality Assurance & Design Optimization
Utilize industry-leading EDA tools (Lint, CDC, Synthesis, Timing, Power) and in-house quality assurance tools to ensure designs are robust, scalable, and power-efficient
Apply design techniques to meet PPA (Power, Performance, Area) targets
Contribute to design quality through verification and validation activities

Methodology Innovation & Collaboration
Participate in design methodology improvements and tool automation initiatives
Leverage AI assistance tools and contribute to in-house automation development to make engineering workflows faster and smarter
Collaborate effectively across teams to ensure seamless integration

As a Q&R Lab Engineer you will help to manage the qualification and testing of some of the most advanced ICs in the world, support the maintenance of the Lab equipment and help the Q&R Engineers ensure that the AWS cloud remain the most reliable cloud in the world.


Key job responsibilities
In this role you will have end-to-end responsibility for the Q&R labs, support Annapurna's Q&R Engineers to setup and conduct reliability tests, preform tests on leading world-class ICs using high-end equipment and support the operation and maintenance of the Q&R lab.