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Location: Tel Aviv-Yafo
Job Type: Full Time
We are looking for an experienced System Engineer to lead the definition and integration of our next-generation wireless IoT systems. You will possess a unique "end-to-end" perspective: understanding the physics of the RF/Analog silicon, the intricacies of the BLE protocol, and the full integration between devices to network connectivity. You will work closely with Silicon, FW, and Cloud teams to ensure robust connectivity and optimized power consumption.

Responsibilities:
System Architecture: Define system-level requirements for Wireless IoT products, focusing on RF performance, power budgets, and data throughput. Faimilairy with in-door wireless including antenna design consideration is an advantage.
Silicon & RF Interface: Work with Silicon development teams to define RFIC specs and resolve integration challenges (Analog/RF mixed-signal flows).
Connectivity Pipeline: Define the HW to Firmware to Ethernet or wireless pipeline.
Integration & Debug: Hands-on bring-up of new silicon/hardware in the lab, debugging complex issues spanning from RF interference to network protocol failures.
Requirements:
Education: B.Sc. in Electrical Engineering (M.Sc. is an advantage).
Experience: 5+ years in System Engineering, with a focus on Wireless/IoT products.
RF/HW/Silicon Expertise: Experience working with Silicon development teams; solid understanding of RF chains, Analog constraints, and Board design.
Analytical Skills: Proficiency with modeling tools (Matlab/Python) and lab equipment (Spectrum Analyzers, Sniffers).
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
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Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our company's direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
Our portfolio spans CPU, TPU, Networking and other key data center technologies, which power our company's most demanding Compute and AI/ML applications.
In this role, youll work to shape the future of strategic Data Center silicon. Youll be an early and key contributor in a nascent high-growth team that pushes boundaries, developing advanced custom IP and solutions. You will need expertise in one or more of the following areas: wireline communications, analog circuit design, Digital Signal Processor (DSP) design and algorithms, signal integrity, transmission line theory, advanced analog and mixed-signal modeling, high-speed clocking, Clock and Data Recovery (CDR), equalization, high-speed input/output (IO) industry standards. Your role has a significant component of cross-collaboration with a broad set of cross-functional organizations. You'll bring out the best in the team to deliver designs that serve many of our companys advanced data center products.
The ML, Systems, & Cloud AI (MSCA) organization at our company designs, implements, and manages the hardware, software, machine learning, and systems infrastructure for all our company services (Search, YouTube, etc.) and our company Cloud. Our end users, Cloud customers and the billions of people who use our company services around the world.
We prioritize security, efficiency, and reliability across everything we do - from developing our latest TPUs to running a global network, while driving towards shaping the future of hyperscale computing. Our global impact spans software and hardware, including our company Clouds Vertex AI, the leading AI platform for bringing Gemini models to enterprise customers.
Responsibilities
Architect and design high-speed analog/digital circuits (ADC, DAC, PLL, CDR, DSP), including optimizing for Power, Performance, and Area (PPA).
Model and simulate channel behavior (S-parameters), signal integrity, and jitter using tools like MATLAB.
Bring up new silicon, characterize performance, and test for electrical compliance in lab environments.
Work with packaging, board design, and firmware teams to ensure seamless integration into System-on-Chips (SoCs).
Adhere to standards like IEEE or OIF for high-speed protocols and optimize power consumption.
Requirements:
Minimum qualifications:
Bachelor's degree in Electrical Engineering, Computer Engineering, Computer Science, or a related field, or equivalent practical experience.
15 years of experience in analog mixed signal or high-speed IO development.
Experience defining and taking to High Volume Manufacturing (HVM) leading edge mixed-signal or high-speed IO designs.

Preferred qualifications:
Master's degree or PhD in Electrical Engineering, Computer Engineering or Computer Science, with an emphasis on wireline silicon architecture and design.
Experience with technical innovation in mixed-signal and high-speed IO solutions.
Experience working on high-performance, data-center class IP, from concept through high-volume deployment.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
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מודים לך שלקחת חלק בשיפור התוכן שלנו :)
Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our company's direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
Our portfolio spans CPU, TPU, Networking and other key data center technologies, which power our company's most demanding Compute and AI/ML applications.
In this role, youll work to shape the future of strategic Data Center silicon. Youll be an early and key contributor in a nascent high-growth team that pushes boundaries, developing advanced custom IP and solutions. You will require expertise in one or more of the following areas: wireline communications, analog circuit design, Digital Signal Processor (DSP) design and algorithms, signal integrity, transmission line theory, advanced analog and mixed-signal modeling, high-speed clocking, Clock and Data Recovery (CDR), equalization, high-speed input/output (IO) industry standards. Your role has a significant component of cross-collaboration with a broad set of cross-functional organizations. You'll bring out the best in the team to deliver designs that serve many of our companys advanced data center products.
The ML, Systems, & Cloud AI (MSCA) organization at our company designs, implements, and manages the hardware, software, machine learning, and systems infrastructure for all our company services (Search, YouTube, etc.) and our company Cloud. Our end users, Cloud customers and the billions of people who use our company services around the world.
We prioritize security, efficiency, and reliability across everything we do - from developing our latest TPUs to running a global network, while driving towards shaping the future of hyperscale computing. Our global impact spans software and hardware, including our company Clouds Vertex AI, the leading AI platform for bringing Gemini models to enterprise customers.
Responsibilities
Architect and design high-speed analog/digital circuits (ADC, DAC, PLL, CDR, DSP), including optimizing for Power, Performance, and Area (PPA).
Model and simulate channel behavior (S-parameters), signal integrity, and jitter using tools like MATLAB.
Bring up new silicon, characterize performance, and test for electrical compliance in lab environments.
Work with packaging, board design, and firmware teams to ensure seamless integration into System-on-Chips (SoCs).
Adhere to standards like IEEE or OIF for high-speed protocols and optimize power consumption.
Requirements:
Minimum qualifications:
Bachelor's degree in Electrical Engineering, Computer Engineering, Computer Science, or a related field, or equivalent practical experience.
8 years of experience in analog mixed signal or high-speed IO development.
Experience defining and taking to High Volume Manufacturing (HVM) leading edge mixed-signal or high-speed IO designs.
Preferred qualifications:
Master's degree or PhD in Electrical Engineering, Computer Engineering or Computer Science, with an emphasis on wireline silicon architecture and design.
Experience with technical innovation in mixed-signal and high-speed IO solutions.
Experience working on high-performance, data center class IP, from concept through high-volume deployment.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
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מודים לך שלקחת חלק בשיפור התוכן שלנו :)
08/02/2026
חברה חסויה
Location: Tel Aviv-Yafo
Job Type: Full Time
We are looking for an excellent Firmware Design Engineer for our FW PHY Group. The person will closely work with our FW development, architecture, chip design teams and gain deep understanding of our Networking products and technologies. We have some of the most forward-thinking and hardworking people in the world working for us. Are you a creative and autonomous engineer who loves a challenge? Are you ready to become the engineer you always wanted to be? Come and be part of the best chip design team in the industry!

What youll be doing:

Work on the next development Fusion GPU project.

Design and develop PHY-layer firmware for cutting-edge networking devices.

Enabling new SerDes and physical linkup flows

Work closely with the architecture, HW, and SW design teams

Define implement and maintain FW algorithm to control the Silicon

Develop and test FW on emulation & simulation environments during the Pre-silicon phase

Debug and screen HW/FW/SW issues

Take an active part in silicon bring-up and SW development phases

Lead data-driven discussions about the product functionality and areas for improvement
Requirements:
What we need to see:

B.Sc. or M.Sc. in Electrical or Computer Engineering.

3+ years of relevant experience.

Proficient programming in C.

Debugging experience and ability to investigate and triage difficult problems in embedded FW.

Good communication skills and the ability to work with people across several countries.

Ability to work with interrupts and dynamic environment with good spirit.

Excellent English verbal and written communication skills.

Ways to stand out from the crowd:

Proficient in Python and MatLab.

Good understanding of SerDes operation.

Experience with developing the physical layer of communication protocols.

Knowledgeable of Hardware/Software Development Process.

Strong collaborative and interpersonal skills, with an ability to successfully guide and influence.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
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תודה על שיתוף הפעולה
מודים לך שלקחת חלק בשיפור התוכן שלנו :)
חברה חסויה
Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our company's direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
In this role, you will work to shape the future of the Data Center silicon. Our portfolio spans CPU, TPU, Networking and other key data center technologies, which power our company's most demanding Compute and AI/ML applications. You will be a key contributor in the growth team, developing advanced custom IP and solutions. We seek experienced applicants with expertise in one or more of the following areas: wireline communications, analog circuit design, DSP design and algorithms, signal integrity, transmission line theory, advanced analog and mixed-signal modeling, high-speed clocking, Clock and Data Recovery (CDR), equalization, high-speed IO industry standards. You will collaborate with a set of cross-functional organizations. You will serve many of our companys advanced data center products.The ML, Systems, & Cloud AI (MSCA) organization at our company designs, implements, and manages the hardware, software, machine learning, and systems infrastructure for all our company services (Search, YouTube, etc.) and our company Cloud. Our end users, Cloud customers and the billions of people who use our companyservices around the world.
We prioritize security, efficiency, and reliability across everything we do - from developing our latest TPUs to running a global network, while driving towards shaping the future of hyperscale computing. Our global impact spans software and hardware, including our company Clouds Vertex AI, the leading AI platform for bringing Gemini models to enterprise customers.
Responsibilities
Architecture and design of high-speed analog/digital circuits (ADC, DAC, PLL, CDR, DSP), including optimizing for Power, Performance, and Area (PPA).
Model and simulate channel behavior (S-parameters), signal integrity, and jitter using tools like MATLAB.
Bring up new silicon, characterizing performance, and testing for electrical compliance in lab environments.
Work with packaging, board design, and firmware teams to ensure integration into System-on-Chips (SoCs).
Adhere to standards like Institute of Electrical and Electronics Engineers(IEEE) or Optical Internetworking Forum (OIF) for protocols and optimizing power consumption.
Requirements:
Minimum qualifications:
Bachelor's degree in Electrical Engineering, Computer Engineering, Computer Science, or a related field, or equivalent practical experience.
10 years of experience in analog mixed signal and high-speed Input/Output development.
Experience defining and taking to High Volume Manufacturing(HVM) leading edge mixed-signal or high-speed IO designs.
Preferred qualifications:
Master's degree or PhD in Electrical Engineering, Computer Engineering or Computer Science.
Experience in mixed-signal and high-speed Input/Output (IO) solutions.
Experience working on high-performance, data-center class IP, from concept through high-volume deployment.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
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שליחה
סגור
v נשלח
תודה על שיתוף הפעולה
מודים לך שלקחת חלק בשיפור התוכן שלנו :)
Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our company's direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
As a Foundry, IP and Package Technologist, you will directly collaborate with architecture teams, external manufacturing partners (foundries and packaging vendors) to coordinate the technical stabilization and yield ramp of our custom silicon. You will be responsible for in-depth yield analysis, debugging process-design interactions, and driving corrective actions to resolve manufacturing defects. Your expertise in root-cause analysis and process optimization will ensures that our groundbreaking chips ramp up seamlessly from initial silicon arrival to high-volume production, directly enabling the future of our computing capacity.
The AI and Infrastructure team is redefining whats possible. We empower our company customers with breakthrough capabilities and insights by delivering AI and Infrastructure at unparalleled scale, efficiency, reliability and velocity. Our customers, our company Cloud customers, and billions of our company users worldwide.
We're the driving force behind our company's groundbreaking innovations, empowering the development of our cutting-edge AI models, delivering unparalleled computing power to global services, and providing the essential platforms that enable developers to build the future. From software to hardware our teams are shaping the future of world-leading hyperscale computing, with key teams working on the development of our TPUs, Vertex AI for our company Cloud, our company Global Networking, Data Center operations, systems research, and much more.
Responsibilities
Drive yield modeling for NPIs, support pre silicon activities in Foundry aspects of new devices.
Lead process debug investigations, utilizing inline data to isolate the root cause of yield limiters, distinguishing between random defects and systematic marginalities.
Drive yield improvements by executing advanced statistical analysis on high-volume manufacturing data, identifying subtle process-design interactions that impact performance, and defining the necessary corrective actions.
Collaborate with cross-functional design, product, and test teams to triage silicon failures, distinguishing between design bugs, foundry process marginalities, and packaging interaction issues to support New Product Introduction (NPI).
Partner with architecture and design teams to feed back critical manufacturing constraints into future product definitions, ensuring that next-generation chiplets are architected to be resilient to known process variances.
Requirements:
Minimum qualifications:
Bachelors degree in Electrical Engineering, Material Science, Physics, Microelectronics, a related technical field, or equivalent practical experience.
8 years of experience in semiconductor foundry technologies, advanced process nodes and product engineering or yield analysis.
Experience in leading post-silicon yield improvement, including root cause analysis, defect correlation, and process debugging.
Experience with characterization of silicon interaction with package thermal and mechanical stress.
Preferred qualifications:
15 years of experience in test engineering, product engineering, foundry technology, advanced packaging development, or product yield engineering.
Experience in debugging IP integration issues (e.g., HBM, SerDes, PCIe) and advanced packaging failures (2.5D/3D, flip-chip).
Ability to drive technical feedback loops between foundry partners, internal architecture and design teams, and Post-Silicon (Post-Si) teams to resolve manufacturing limiters.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
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מודים לך שלקחת חלק בשיפור התוכן שלנו :)
Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
our company's custom-designed machines make up one of the largest and most powerful computing infrastructures in the world. The Hardware Testing Engineering team ensures that this cutting-edge equipment is reliable. In the R&D lab, you design test equipment for prototypes of our machinery and develop the protocols used to scale these tests for the entire global team. Working closely with design engineers, you give input on designs to improve our hardware until you're sure it meets our company's standards of quality and reliability.
As a Senior SoC System Test Engineer, you will help to integrate SoC technologies into devices and drive manufacturing test flows to assure performance and screen devices. You will drive yield improvement, cost optimization, and work closely with cross-functional teams to ensure the optimal test coverage in production to ensure high quality SoCs. You will work with various groups to deploy screening methodologies and flows for data processing, analytics, and diagnostics. You will drive the release of cost effective production test solutions into mass production to hit yield and quality goals.
The AI and Infrastructure team is redefining whats possible. We empower our company customers with breakthrough capabilities and insights by delivering AI and Infrastructure at unparalleled scale, efficiency, reliability and velocity. Our customers, our company Cloud customers, and billions of our company users worldwide.
We're the driving force behind our company's groundbreaking innovations, empowering the development of our cutting-edge AI models, delivering unparalleled computing power to global services, and providing the essential platforms that enable developers to build the future. From software to hardware our teams are shaping the future of world-leading hyperscale computing, with key teams working on the development of our TPUs, Vertex AI for our company Cloud, our company Global Networking, Data Center operations, systems research, and much more.
Responsibilities
Collaborate with Architecture, Design and Verification teams to develop new product bring-up, validation, characterization, qualification strategies, and manufacturing test solutions for new High Performance Computing (HPC) products in advanced process technologies.
Validate test solutions on system-level platforms and prepare for mass production.
Work with hardware and software teams to evaluate functional device yield and performance across various operating conditions.
Develop effective production screens to reduce Defective Parts per Million (DPPM).
Assess test escapees and localize failures, implement containment measures in the manufacturing test flow, and partner with manufacturing, test, quality and reliability teams to identify root cause and implement corrective actions.
Requirements:
Minimum qualifications:
Bachelors degree in Electrical Engineering, Computer Engineering, Computer Science, a related field, or equivalent practical experience.
5 years of experience in system level test engineering.
Experience with Python or C/C++.
Experience in silicon System level components/LinuxOS.

Preferred qualifications:
Masters degree in Electrical Engineering, Computer Engineering, Computer Science, or related fields.
10 years of experience in test engineering and product engineering.
Experience with CPU/GPU and SoC architecture, design, validation and debug.
Experience in SLT hardware design and proliferation (e.g., system boards, peripheral devices, sockets, handler kits, and thermal control solutions).
Ability to venture into, and improve, all aspects of post-silicon testing from definition to realization.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
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מודים לך שלקחת חלק בשיפור התוכן שלנו :)
Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our company's direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
As the Performance Modeling Manager, you will lead a team of high-performing engineers responsible for the software performance models that are used to guide the future of our companys custom silicon. You will bridge the gap between software architecture and hardware implementation, ensuring that our next-generation CPUs and NICs are optimized for our companys most critical workloads, such as Gemini, Search, and Cloud AI.
In this role, you will lead a team of high-performing engineers in the development of sophisticated performance models and oversee the conduct of deep-dive architectural analyses. By guiding the team to explore various architectural alternatives under different scenarios, you will ensure the identification of bottlenecks and provide data-driven guidance to architects on preferred hardware implementations. Your focus will be on leading the technical roadmap and career development while maintaining high-level architectural influence across both CPU and NIC modeling domains.
The AI and Infrastructure team is redefining whats possible. We empower our company customers with breakthrough capabilities and insights by delivering AI and Infrastructure at unparalleled scale, efficiency, reliability and velocity. Our customers, our company Cloud customers, and billions of our company users worldwide.
We're the driving channel behind our company's groundbreaking innovations, empowering the development of our cutting-edge AI models, delivering unparalleled computing power to global services, and providing the essential platforms that enable developers to build the future. From software to hardware our teams are shaping the future of world-leading hyperscale computing, with key teams working on the development of our TPUs, Vertex AI for our company Cloud, our company Global Networking, Data Center operations, systems research, and much more.
Responsibilities
Build, lead, and mentor a team of performance modeling engineers, fostering a culture of technical excellence and innovation in the Tel Aviv and Haifa silicon space.
Define the goal for performance modeling tools and methodologies, ensuring they provide highly accurate projections for future architectural pivots.
Partner with Hardware Architects, Silicon Designers, and Software Workload teams to influence SoC specifications based on data-driven modeling results.
Drive the development of advanced SystemC performance simulators and infrastructure, ensuring scalability and correlation with post-silicon performance.
Serve as a subject matter expert in CPU/NIC micro-architecture, guiding the team through complex trade-off analyses (power, area, performance).
Requirements:
Minimum qualifications:
Bachelors degree in Computer Science, Electrical Engineering, or a related technical field, or equivalent practical experience.
15 years of experience in people management, leading engineering teams in a hardware or system-software environment.
Experience in C++ performance modeling or micro-architectural simulator development.
Experience with Central Processing Unit (CPU) or Network Interface Card (NIC) accelerator architectures.
Preferred qualifications:
PhD in Electrical Engineering, Computer Engineering, or equivalent practical experience.
Experience delivering performance models for large-scale, high-performance silicon projects (from pre-silicon projection to post-silicon validation).
Ability to translate complex technical data into clear business recommendations for executive leadership.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
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מודים לך שלקחת חלק בשיפור התוכן שלנו :)
Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our company's direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
As a Power and Signal Integrity Engineer, you will be responsible for the design and characterization of signal and power integrity of our IC designs. You will design the external electrical interfaces of the device, from their Signal/Power-integrity and electrical usage perspectives and set up methodologies, perform simulations, silicon characterization and correlations to ensure our IC designs meet systems design budgets and achieve the highest performance. You will work with systems architects, ASIC design, systems engineers, and partner cross-functionally with teams and external vendors/partners.The ML, Systems, and Cloud AI (MSCA) organization at our company designs, implements, and manages the hardware, software, machine learning, and systems infrastructure for all our company services (Search, YouTube, etc.) and our company Cloud. Our end users, Cloud customers and the billions of people who use our company services around the world.
We prioritize security, efficiency, and reliability across everything we do - from developing our latest TPUs to running a global network, while driving towards shaping the future of hyperscale computing. Our global impact spans software and hardware, including our company Clouds Vertex AI, the leading AI platform for bringing Gemini models to enterprise customers.
Responsibilities
Generate precise electrical models (e.g., S-parameters, SPICE models) for components such as packages, PCBs, and connectors for use in simulations.
Simulate high speed interface electrical behavior using HSPICE or other circuit simulators.
Execute lab measurements utilizing test equipment like oscilloscopes, Vector Network Analyzers (VNA), Time Domain Reflectometers (TDR) , Spectrum analyzers to validate simulation outcomes and debug signal and power-related issues on silicon prototypes and boards.
Establish design rules and guidelines for optimal signal/power integrity during PCB and package layout, ensuring high production yield and reliability.
Document design specifications, analysis results, and validation reports to ensure compliance with standards and for future reference, while collaborating extensively with cross-functional teams, including ASIC architects, digital/analog designers, physical design/layout engineers, and system engineers.
Requirements:
Minimum qualifications:
Bachelor's degree in Mechanical, Electrical Engineering, Material Science, or equivalent practical experience.
2 years of experience in the signal and power integrity field.
Preferred qualifications:
5 years of experience with signal and power integrity modeling and simulation for high-speed interfaces (e.g., LPDDR, MIPI, UFS, PCIe, USB).
Experience with industry-standard Electronic Design Automation (EDA) tools for simulation and layout (e.g., Cadence Sigrity/Allegro, Ansys HFSS/PowerDC/Q3D, Keysight ADS, Synopsys HSPICE).
Experience in scripting languages such as Python, Perl, or Tcl for flow automation and data analysis.
Familiarity with high-speed testing equipment like VNAs, TDRs, and oscilloscopes for measurement and validation.
Knowledge of circuit analysis, electromagnetics, and transmission line theory.
This position is open to all candidates.
 
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Location: Tel Aviv-Yafo
Job Type: Full Time
At Lumissil, we are driving innovation in automotive technology, developing solutions that power the next generation of vehicles. We are looking for a Junior Engineer who is eager to learn, grow, and make an impact in a dynamic and innovative environment. This is a unique opportunity to work alongside experienced professionals, gain hands-on experience, and contribute to projects at the forefront of automotive electronics. If you are passionate about technology, curious to explore new challenges, and excited to make a real difference, Lumissil is the place to develop your skills, innovate, and grow your career. Why join us?
* Work on cutting-edge automotive projects
* Learn from a talented and supportive team
* Gain exposure to real-world automotive challenges
* Grow your career in a collaborative and inspiring environment If you’re ready to take the next step in your career and be part of something meaningful, we’d love to meet you! About The Position: As a Junior ASIC Design Engineer at Lumissil, you will take part in the full lifecycle of advanced chips that power the next generation of vehicles. This is a hands-on, growth-oriented role where you’ll work closely with experienced ASIC engineers, gain exposure to real silicon, and build a strong foundation in chip design and verification. In this role, you will:
* Be part of a professional ASIC team working on cutting-edge automotive solutions
* Support and learn from real emulation platforms used in production-grade designs
* Contribute to RTL implementation and gain practical experience in design flows
* Assist with verification and backend (BE) activities, learning industry best practices
* Participate in silicon bring-up, seeing your work come to life on real hardware This position is ideal for curious engineers who want to learn fast, take ownership, and grow into a key contributor in the world of automotive semiconductor design.
Requirements:
* B.Sc. in Electrical Engineering (graduate with excellence)
* Strong interest in ASIC / chip design and hardware development
* Basic understanding of RTL design concepts – an advantage
* Any exposure to programming or scripting (e.g., Python, TCL, Perl) – an advantage
* Previous academic or practical experience in relevant fields – an advantage
* Good English communication skills, both written and verbal
* Team player with a positive attitude, curiosity, and willingness to learn
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
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8476259
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