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You'll be joining our Physical Design team within Cisco Silicon One, which is responsible for the entire backend methodology and flow development from RTL to GDS. This is a critical part of the group leading the development of high-quality VLSI designs.

Our Backend Engineers handle all aspects of chip design, including Definition, Physical Synthesis, Place and Route, Optimization, Timing Closure, Design Floor Planning.

You will be leveraging your backend and physical design experience to drive the development, optimization, and innovation of CAD methodologies and tools, ensuring the highest quality and efficiency in our chip design flows from RTL to GDS.

The Design for Test (DFT) team is part of the design group, which focuses on logic design, RTL development, and running verification tests.

Their main role is to design test structures embedded within the chip to ensure proper functionality after manufacturing.

The goal is to detect potential manufacturing defects with maximum efficiency and filter out faulty units before they reach the market.



What You'll Do

Insert DFT logic, perform synthesis, and run Automatic Test Pattern Generation (ATPG) to ensure hardware testability.

Execute Gate Level Simulations, timing checks, and DRC checks to maintain rigorous design integrity and performance standards.

Run regressions and perform deep-dive debugging on simulation failures as part of the core verification process.

Work in a small, agile team with an intimate atmosphere that offers direct mentoring and broad professional growth.

we are seeking a Physical Design Technical Leader.

Write and review micro-architecture specifications
Implement RTL (Verilog/SystemVerilog) to meet timing, performance, and power requirements
Contribute to full chip integration, timing methodology, and analysis
Collaborate with verification engineers to resolve bugs and achieve coverage closure
Work with the physical design team to close timing and PnR issues
Support design methodology evolution and best practices
Perform debug, root-cause analysis, and post-silicon validation in the lab

As a Project Manager, you will support multiple ASIC development programs by coordinating execution, tracking deliverables, and enabling collaboration across engineering teams. You will strengthen operational excellence through AI-based automation and tracking solutions. Your work will help teams identify risks and dependencies early, maintain alignment, and deliver programs successfully.

Support Program Managers throughout each phase of ASIC program execution.
Track milestones, action items, dependencies, risks, deliverables, status reports, dashboards, and execution metrics across multiple projects.
Coordinate activities among ASIC, Software, and Business Operations teams, including global stakeholders.
Drive follow-up and accountability to ensure project actions are completed on time.
Develop AI-powered tracking tools and automation solutions that improve project visibility, streamline processes, and strengthen program management methodologies.
Collaborate with engineering and operations teams to maintain alignment and support successful program delivery.

In this role, you will contribute to the development of complex ASIC package designs from early planning and exploration through implementation and tapeout. You will collaborate across package design, layout, SI/PI, and silicon teams to help deliver high‑speed, robust, and manufacturable package solutions.

You will participate in package architecture activities, design tradeoff discussions, and technical problem solving while growing your expertise in advanced packaging technologies and system-level integration. This role provides an opportunity to work on some of the most advanced networking silicon products in the industry within a highly collaborative engineering environment.

Responsibilities:
As a member of the Package Design team, you will:

Lead the package design activities including planning, floorplanning, pinout optimization, stack‑up definition, and high‑speed routing support.

Collaborate with SI/PI, silicon floorplanning, layout, and manufacturing teams to ensure high‑quality package solutions.

Support package implementation activities and work closely with layout designers to ensure alignment between design intent and physical implementation.

Participate in technical investigations, design reviews, and tradeoff discussions involving performance, manufacturability, and schedule considerations.

Assist in developing and improving package design methodologies, flows, and best practices.

Contribute to debugging, issue resolution, and package bring‑up activities as needed.

Write and review micro-architecture specifications
Implement RTL (Verilog/SystemVerilog) to meet timing, performance, and power requirements
Contribute to full chip integration, timing methodology, and analysis
Collaborate with verification engineers to resolve bugs and achieve coverage closure
Work with the physical design team to close timing and PnR issues
Support design methodology evolution and best practices
Perform debug, root-cause analysis, and post-silicon validation in the lab

Write and review micro-architecture specifications

Implement RTL (Verilog/SystemVerilog) to meet timing, performance, and power requirements

Contribute to full chip integration, timing methodology, and analysis

Collaborate with verification engineers to resolve bugs and achieve coverage closure

Work with the physical design team to close timing and PnR issues

Support design methodology evolution and best practices

Perform debug, root-cause analysis, and post-silicon validation in the lab

As SIPI engineer youll be required to design and analyze high speed analog/digital signals for networking products, with emphasis on high speed signal and power analysis of ASIC, Package and PCB. Model/simulate/characterize high speed systems, including high speed I/Os, chip packages, printed circuit boards, and system interconnects. Overcome the challenges of ultra-high data rate and cutting-edge technology. We use the latest silicon technologies and processes to build largest scale and most complex devices at the edge of feasibility.

Spearhead innovative silicon architecture for AI infrastructure, guiding board design from concept through to mass production.

Act as the technical decision-maker for the project and collaborate with cross-functional teams in mechanics, thermal, PCB layout, and software/RTL.

Define product specifications, develop electrical schematics, and guide component selection.

Conduct hands-on testing in a lab environment and drive the PCB bring-up, characterization, and debugging stages.

We are seeking a high-driven, results-oriented multidisciplinary orchestrator to act as the primary catalyst for our development infrastructure. In this role, you will operate at the critical intersection of product strategy, hardware engineering, and lab operations, serving as the connective tissue that aligns disparate teams under a unified goal. You will be responsible for driving cross-functional alignment across the organization, effectively managing stakeholders with differing ownership to ensure infrastructure roadmaps scale alongside product milestones. This position requires a self-starter comfortable pushing for success in ambiguous environments, where you will translate high-level strategy into the tactical execution of the physical and virtual ecosystems that power our development lifecycle.

Your Impact

You will own the end-to-end lifecycle of infrastructure projects, ensuring that our Sanity Test Beds and development environments are optimized to meet aggressive product launch timelines. By bridging the gap between engineering roadmaps and infrastructure requirements, you will serve as the engine that ensures our teams have the right resources at the right time, regardless of technical or organizational complexity.

Key Responsibilities

Strategic Orchestration & Alignment

Unified Roadmap Integration: Translate complex product development roadmaps into long-term infrastructure requirements, driving cross-functional alignment between silicon milestones and lab availability.
Stakeholder Management: Act as the primary liaison between hardware engineering, software development, procurement, and lab operations; navigate competing priorities among stakeholders with differing ownership to keep teams synchronized.
Ambiguity Management: Proactively identify project roadblocks and navigate ambiguous environments to push critical-path dependencies to resolution.
Operational Velocity: Drive continuous improvement in infrastructure processes, identifying and removing friction to increase overall engineering velocity.
Operational Oversight & Execution

Strategic Capacity Planning: Lead high-stakes capacity management efforts, forecasting needs for power, rack space, and compute resources to proactively eliminate infrastructure bottlenecks.
Lifecycle Ownership: Oversee the full lifecycle of infrastructure projects-from initial procurement and technical specification through deployment, validation, and transition to operational readiness.
Visibility & Reporting: Drive the development of dashboards and reporting mechanisms to provide real-time visibility into infrastructure health, ensuring data-driven decision-making across the organization.
Vendor & Asset Optimization: Partner with cross-functional leadership to manage technical specifications, equipment lead times, and hardware lifecycles, ensuring a high-performance, cost-effective infrastructure footprint.

We are looking for best-in-class Physical Design Engineers to join our outstanding Networking Silicon engineering team, developing the industry's best high-speed communication devices, delivering the highest throughput and lowest latency! Come and take a part in designing our groundbreaking and innovating chips, enjoy working in a meaningful, growing and highly professional environment where you make a significant impact in a technology-focused company.

What you'll be doing:

Perform physical layout for full-chip level, integration, pinning and bump route.

Work with block owners and project managers to assure high quality convergence in all layout aspects.

You will be responsible for chip layout from the floorplanning stage through tape-out.

We have continuously reinvented itself over two decades. Our invention of the GPU in 1999 sparked the growth of the PC gaming market, redefined modern computer graphics, and revolutionized parallel computing. More recently, GPU deep learning ignited modern AI - the next era of computing. we are a learning machine that constantly evolves by adapting to new opportunities that are hard to seek, that only we can pursue, and that matter to the world. This is our lifes work, to amplify human creativity and intelligence. Make the choice to join us today.

What youll be doing:

Working closely with product design engineers, you'll perform PCB layout of high speed/high-density value-conscious PCBs for all business units in our company (GPU Desktop, Notebook, Automotive, Professional, Data Center, Deep Learning, and AI), all using Cadence PCB design tools.

Focus will be on the complete development of CAD layout from symbol creation, floor planning, and detailed component placement, constraints management, with a concept of topology and signal/trace integrity.

You will be responsible for the design releases required generation of artwork files, ODB++, and electronic PCB documentation.

Your designs will need to follow SI constraints, EMI/RFI control and FCC, UL and European regulations, IPC specifications and NRC regulations.