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Requirements:
* Bachelor's degree in Materials Engineering Electrical Engineering, Electronics Engineering
* Up to two years of experience in a manufacturing environment. Recent graduates with relevant academic projects or internships are encouraged to apply.
* Basic knowledge of SMT manufacturing processes is an advantage.
* Familiarity with PCB assembly processes is preferred.
* Strong analytical, troubleshooting, and problem-solving skills.
* Proficiency in Microsoft Office, especially Excel.
* Good written and verbal communication skills in English.
* Ability to work independently and as part of a multidisciplinary team.
Preferred Qualifications:
* Knowledge of IPC-A-610 and J-STD-001 standards.
* Familiarity with AOI, SPI, X-Ray inspection systems, and reflow profiling.
* Understanding of Lean Manufacturing, SPC, FMEA, DOE, 8D, and Root Cause Analysis methodologies.
* Experience with MES and ERP systems is an advantage.
* Experience in a high-mix, low-volume manufacturing environment is an advantage.

Requirements:
Experience:
Global cash flow & liquidity management (cash forecasting) at least 3 years - (Must-have experience)
Debt management (loans, covenants, banks, refinancing) - (Must-have experience)
Strong collections and disbursements analysis (DSO, DIO, DPO, and working capital analysis)
Experience in global/multi-currency corporate environments
Experience working with cross-functional and international teams
Requirements:
BA in Finance / Economics / Accounting (Must-have)
MBA in Finance / Economics / Accounting
5+ years of treasury experience in global, multi-currency companies - (Must-have)
Proven experience in cash flow and debt management - (Must-have)
Experience with SAP / ERP and treasury systems (e.g., JDOX) - (Must-have)
Advanced Excel (pivot tables, complex formulas, modeling) and Power Point
Fluency in English.

Requirements:
Minimum Qualifications
BS degree in technical discipline with minimum 10 years of relevant experience.

Preferred Qualifications
Experience designing analog and mixed-signal layouts in deep-submicron CMOS and FinFET technologies.
Strong programming/scripting skills in SKILL, Perl, TCL, Shell, and/or Python, with emphasis on layout automation, productivity tooling, and data analysis.
Solid understanding of supervised and self-supervised learning, convolutional neural networks (CNNs), and core training concepts such as loss functions, backpropagation, and optimization.
Hands-on experience with PyTorch for model development and experimentation.
Demonstrated ability to automate layout tasks, flows, and quality checks using scripting and CAD tools.
Proven record in implementing high-quality analog layouts with tight device matching, low noise, and low power consumption.
Familiarity with failure-prone circuit/layout structures, analog and DFM best practices, and the ability to diagnose and resolve layout-related issues.
Strong proficiency in custom and standard-cell floor planning, hierarchical layout assembly, and physical integration.
Understanding of image processing fundamentals, spatial representations, multi-channel image handling, segmentation, and object detection concepts.
Technical understanding of IR drop, RC delay, electromigration, self-heating, coupling capacitance, and related reliability concerns.
High proficiency in interpreting physical verification reports, including DRC, ERC, and LVS.
Experience using advanced Cadence Virtuoso features (XL, EAD, APR, Constraint Manager), and familiarity with Cadence Innovus.
Experience with CAD automation workflows and PCell creation.
Excellent communication skills and the ability to work effectively with cross-functional teams.

Requirements:
Minimum Qualifications
Pursuing a B.Sc.\M.Sc. in Electrical Engineering, Computer Engineering.
Students who have completed at least 3 semesters.
** Must add grade sheet **

Preferred Qualifications
Experience with Python/ C/C++ or other scripting languages is an advantage.

Requirements:
Minimum Qualifications
Experience with programming (C++/C) and scripting skills (Python). (MSc graduates may be considered without prior industry experience)
Background in low-level software, operating systems, or compilers.
Experience developing and debugging large, complex system software.
Experience with concurrent and parallel programming.
Knowledge of ARM and/or X86 architecture.

Preferred Qualifications
Degree in Computer Science or Computer Engineering.
Experience with kernel, driver and firmware development.
Experience with modeling and simulation.
Assembly experience.
Knowledge of modern SoC architectures.
Experience collaborating with cross-functional teams to achieve scheduled milestones.

Requirements:
Minimum Qualifications
3+ years of experience in embedded firmware development within Real-Time (RT) or Embedded environments.
Strong proficiency in C, with a deep understanding of hardware-software interaction.
Hands-on expertise with Hardware-Software integrations, particularly for silicon validation and bring-up.
Exceptional debugging skills at the firmware and hardware level.
Bachelor's or Master's degree in Electrical Engineering, Computer Engineering, or equivalent practical experience.

Preferred Qualifications
Experience with pre-silicon and post-silicon validation methodologies.
Familiarity with CPU architectures (e.g., ARM) and low-level system programming.
Direct experience with System-on-Chip (SoC) development or validation.

Requirements:
Minimum Qualifications
10+ years of experience in embedded firmware development within Real-Time (RT) or Embedded environments.
Strong proficiency in C, with a deep understanding of hardware-software interaction.
Hands-on expertise with Hardware-Software integrations, particularly for silicon validation and bring-up.
Exceptional debugging skills at the firmware and hardware level.
Bachelor's or Master's degree in Electrical Engineering, Computer Engineering, or equivalent practical experience.

Preferred Qualifications
Experience with pre-silicon and post-silicon validation methodologies.
Familiarity with CPU architectures (e.g., ARM) and low-level system programming.
Direct experience with System-on-Chip (SoC) development or validation.

Requirements:
Minimum Qualifications
BS.c/MS.c in Electrical Engineering, Computer Engineering, or Computer Science.
Constantly striving for improvement.
Proven experience with Design Verification - multiple years working in DV or DV CAD space.
Strong software foundation, good understanding of SW basics, including data structures, algorithms.
Proven track record of automating tasks and improving existing workflows and processes.
Good communication skills.
General understanding of the chip design process, what are: hardware description languages, FE, design simulation, synthesis, PD, etc.

Preferred Qualifications
Cloud-native development: experience with docker, k8s, writing HTTP servers, authentication and authorization.
Familiarity with LLM harnesses and LLM frameworks.
Good Python skills, including: familiarity with async programming, Pydantic, SQLAlchemy, FastAPI.
Familiarity with SQL and experience working with databases such as MySQL.