our company has been transforming computer graphics, PC gaming, and accelerated computing for more than 25 years. Its a unique legacy of innovation thats fueled by great technologyand amazing people. Today, were tapping into the unlimited potential of AI to define the next era of computing. An era in which our GPU acts as the brains of computers, robots, and self-driving cars that can understand the world. Doing whats never been done before takes vision, innovation, and the worlds best talent. As a worker, youll be immersed in a diverse, supportive environment where everyone is inspired to do their best work. Come join the team and see how you can make a lasting impact on the world.
Are you ready to take your engineering career to the next level? our company, a world-class technology company, is seeking a passionate Package Engineer to join our team in Israel. In this role, you will have the opportunity to collaborate with several design and program teams in the development of sophisticated IC substrates for our groundbreaking products. At our company, we are committed to delivering exceptional solutions in a wide range of sectors, and we are looking for engineers who share our passion and dedication to making a difference in the world through their inventions. As a Package Engineer, you will work closely with SI, layout, and ASIC design teams to develop complex, top-of-the-line ASIC packages. You will be responsible for planning schedules, resolving costs, packaging, manufacturing, and electrical design issues.
What you will be doing:
Leading development of cutting-edge microelectronics packaging of our company Networking Business Units future products, evaluating our company products for reliability and performance.
Review manufacturability readiness at each milestone.
Work with world leading vendors to develop highly challenging packaging solutions.
Leading the development of groundbreaking microelectronics packaging for our company Networking Business Unit's future products
Collaborating with world-leading vendors to develop highly ambitious packaging solutions
Thriving in a dynamic and challenging environment
Join and lead task forces to investigate and support production excursions, failure analysis and reliability issues and establish quality standards.
Monitor substrate and assembly production KPIs and collaborate with cross functional teams to define and monitor Yield Improvement Plans for continuous improvement and establish quality standards.
Lead process changes reviews, prepare and present data in Change Control Board meetings, lead technical reviews of product changes throughout the supply chain.
Requirements: BSc or equivalent Mechanical/Material Engineering degree, or any related equivalent experience.
3+ years of relevant work experience in the semiconductor packaging or equivalent experience, development and manufacturing.
Basic design skills, such as using 2D ArtiosCAD, and 3D NX/SolidWorks/Creo applications.
Experience in DFM, understand tooling design, manufacturing processes, material properties and metrology tools.
High awareness for quality, robustness, and manufacturability.
High self-learning and self-motivation skills, fostering a culture of continuous learning, ongoing process improvement and proactive approach.
Leadership skills, capability to lead cross company projects that involve cross functional teams in different locations.
Curious and creative problem solver, well organized and multi-tasker.
Ways to stand out of the crowd:
Hands-on FEA mechanical simulation experience - Advantage
Team / Group / Project management - Advantage
Experience with manufacturing environment and manufacturing statistics tools
Background in engineering semiconductor manufacturing processes.
This position is open to all candidates.