לוח משרות דרושים Board Design, לחיפוש זה נמצאו 41 משרות

Join our Communication Systems as a Hardware Board Design Engineer, where you will contribute to complex design projects and the development of cutting-edge communication systems. In this role, you will design high-performance boards for advanced avionics systems, working as part of a professional hardware design team. Your expertise will drive innovation and ensure the highest standards of quality in our products.

Responsibilities:
End to end boards design.
Starting from the component's selection and evaluation, schematic design, thermal considerations, mechanical constraints.
Layout design, production supervision, bring-up on lab.
Including all the relevant document writing and conducting the design reviews needed until the product is finished.
Leading products from the definition until their release.
Supporting production when needed.

DRS RADA Technologies , a leading defense company developing and manufacturing life-saving radar systems, is looking for an MRO Operator to join our site in Beit She’an. Job Description:
* Perform functional testing of electronic boards using both manual and automated testing methods, utilizing advanced test equipment such as a multimeter, spectrum analyzer, and signal generator.
* Work with computerized systems to analyze test results, troubleshoot failures, and identify faults in accordance with strict procedures and quality standards.
* Analyze and repair electronic boards with complex failures.
* Identify faults and work with electronic schematics and circuits down to the component level.
* Full-time position: Sunday–Thursday, 08:00–17:00, with overtime and Friday work as required.

We are looking for Senior Hardware Engineer who can be part of the System& Platform R&D group, who is ready to take on technical leadership and help drive the development of complex, high‑performance hardware for communication and networking systems.
If youre passionate about high‑speed digital design, enjoy mentoring engineers, and thrive in a hands‑on technical environment.
What Youll Do?
Hardware Design & Ownership
Design high-speed digital boards (SerDes, DDR, Ethernet).
Own schematic development and closely oversee PCB layout.
Ensure robust SI/PI performance through analysis and review.
Lead board bring‑up, validation, troubleshooting, and optimization in the lab.
Cross‑Functional Collaboration
Work closely with SW, FPGA, mechanical, and RF teams for system integration.
Present technical insights, design updates, and project risks to management.

We are looking for a talented Hardware Board Designer to join our multidisciplinary R&D team. This is an exciting opportunity to take part in the design and development of advanced electronic systems, working alongside hardware, firmware, software, and system engineers from concept through integration.
We are looking for a creative, hands-on engineer with a passion for hardware design and a desire to work on cutting-edge technologies.
Responsibilities:
Design and develop complex electronic boards from concept to production.
Perform hands-on schematic design and component selection.
Support and guide PCB layout activities.
Prepare and present design reviews.
Collaborate closely with firmware, software, RF, and system engineering teams to ensure successful system integration.
Develop advanced multidisciplinary systems incorporating:
CPUs / SoCs
FPGA-based designs
Analog and mixed-signal circuits
High-speed interfaces (DDR, PCIe, Ethernet, LVDS, etc.)
RF transmit and receive chains
Filters and amplifier circuits
Power supply and power management circuits
Support board bring-up, debugging, validation, and troubleshooting.

We are looking for an experienced Board Design Engineer to support the design and development of complex mixed-signal and high-speed digital boards for advanced medical systems. You will join our multidisciplinary team in CT organization.


Your role :
Design and develop multi-layer high-speed PCBs and define layout constraints.
Perform component selection and schematic design.
Design power management circuits (including DC-DC converters and power distribution).
Design and support analog circuits and boards.
Support EMC/EMI tests.
Lead board bring-up, validation, and lab debugging. Troubleshoot system-level HW/FW issues.
Support high-speed interfaces such as DDR4/DDR5, PCIe, and Ethernet.
Support Install Base (IB) activities , field investigations, and NPI activities.
Support Lifecycle Management (LCM) tasks, including EOL handling.
Work with PCBA vendors on production, manufacturing issues, and yield improvements.
Search for component alternatives, test and approve replacements.
Work with PLM (Product lifecycle Management) system and support ECO creation and release.

We are looking for a Board Design Engineer to join our team. In this role, you will be responsible for the end-to-end development of hardware boards, including schematic
design, component selection, PCB layout guidance, board bring-up, debugging, validation, and release to production.
Responsibilities:
Design and develop hardware boards for our products.
Create schematics and select components according to system requirements.
Guide PCB layout activities.
Perform board bring-up, debugging, testing, and validation.
Support product release to production.
Work closely with relevant teams throughout the development process.

We are looking for
we are looking for a Board Design Engineer for our Haifa site within the Aerospace Division. Join a leading global technology company developing advanced mission-critical systems and cutting-edge solutions across a wide range of defense applications. As part of our multidisciplinary engineering teams, you will take part in the development of advanced hardware platforms while working with cutting-edge technologies and complex engineering challenges
In this role you will
Support the development lifecycle of printed circuit boards (PCBs), from requirements capture and board-level architecture definition through design, integration, and testing of advanced digital hardware systems
Work closely with Software, FPGA, Mechanical, and Environmental Engineering teams throughout the development process
Lead PCB layout reviews, high-speed design activities, and signal integrity considerations
Perform debugging, validation, and engineering problem-solving activities during development and integration phases
Collaborate across teams and contribute to technical discussions and engineering solutions.

we are seeking a Physical Design Engineer.
Meet the Team:
The Physical Design team owns backend methodology and flow development from RTL to GDS. The team plays a critical role in developing high-quality VLSI designs for some of most advanced silicon products.
We work with the latest silicon technologies and processes to build large-scale, complex devices that push the boundaries of feasibility. You will collaborate with experienced engineers across architecture, design, verification, and implementation to deliver high-performance silicon.
Your Impact:
You will be part of the team, which is at the heart of software and ASIC design efforts. As a Physical Design Engineer, you will contribute to backend implementation work across key stages of chip design, helping move complex designs from RTL toward GDS.
You will work on physical synthesis, place and route, optimization, timing closure, and floor planning activities. Success in this role means delivering high-quality implementation results, learning quickly from senior engineers, and helping improve the flow and methodology used by the team.

Our Board Design Team is growing! Youll collaborate with top industry engineers within the fast-growing Cisco Silicon One group worldwide.
You will be part of a team driving our groundbreaking next-generation network devices-Cisco Silicon One. Our team operates in a startup-like atmosphere within a global, leading corporation.
Our design center is unique, hosting all silicon hardware and software development fields under one roof. Our Networking Chips deliver high speed without compromising programmability, buffering, power efficiency, scale, or feature flexibility. They are strategically placed in critical AI infrastructure, powering next-generation network devices and supporting advanced AI workloads. They deliver high speed without compromising programmability, buffering, power efficiency, scale, or feature flexibility.
Your Impact:
Spearhead innovative silicon architecture for AI infrastructure, guiding board design from concept through to mass production.
Act as the technical decision-maker for the project and collaborate with cross-functional teams in mechanics, thermal, PCB layout, and software/RTL.
Define product specifications, develop electrical schematics, and guide component selection.
Conduct hands-on testing in a lab environment and drive the PCB bring-up, characterization, and debugging stages.

Come join us and help shape groundbreaking solutions by designing, developing, and testing some of the most complex ASICs in the industry.
In this role, you will be part of the Switch ASIC Post-Silicon Electrical Validation (EPSV) team.
Ensure the ASIC operates according to specifications and reliably over time by performing extensive, high-precision measurements using advanced test equipment and procedures.
Conduct deep-dive investigations, integrating knowledge across hardware, software, and system domains to identify root causes of observed device behavior.
Handle all chip validation aspects, including:
Building validation plans.
Performing EPSV using advanced test and measurement equipment.
Writing tests in Python over device SDK.
Executing tests and analyzing results.
You will gain in-depth knowledge of chip architecture, functionality, and operating modes, enabling you to debug and resolve electrical chip-related issues.

You'll be joining our Physical Design team within Cisco Silicon One, which is responsible for the entire backend methodology and flow development from RTL to GDS. This is a critical part of the group leading the development of high-quality VLSI designs.
Our Backend Engineers handle all aspects of chip design, including Definition, Physical Synthesis, Place and Route, Optimization, Timing Closure, Design Floor Planning.
You will be leveraging your backend and physical design experience to drive the development, optimization, and innovation of CAD methodologies and tools, ensuring the highest quality and efficiency in our chip design flows from RTL to GDS.

we are looking for a Logic Design Engineer.
Your Impact:
Write and review micro-architecture specifications
Implement RTL (Verilog/SystemVerilog) to meet timing, performance, and power requirements
Contribute to full chip integration, timing methodology, and analysis
Collaborate with verification engineers to resolve bugs and achieve coverage closure
Work with the physical design team to close timing and PnR issues
Support design methodology evolution and best practices
Perform debug, root-cause analysis, and post-silicon validation in the lab

we are looking for a IC Package Design Engineer.
In this role, you will contribute to the development of complex ASIC package designs from early planning and exploration through implementation and tapeout. You will collaborate across package design, layout, SI/PI, and silicon teams to help deliver high‑speed, robust, and manufacturable package solutions.
You will participate in package architecture activities, design tradeoff discussions, and technical problem solving while growing your expertise in advanced packaging technologies and system-level integration. This role provides an opportunity to work on some of the most advanced networking silicon products in the industry within a highly collaborative engineering environment.
Responsibilities:
As a member of the Package Design team, you will:
Lead the package design activities including planning, floorplanning, pinout optimization, stack‑up definition, and high‑speed routing suport.
Collaborate with SI/PI, silicon floorplanning, layout, and manufacturing teams to ensure high‑quality package solutions.
Support package implementation activities and work closely with layout designers to ensure alignment between design intent and physical implementation.
Participate in technical investigations, design reviews, and tradeoff discussions involving performance, manufacturability, and schedule considerations.
Assist in developing and improving package design methodologies, flows, and best practices.
Contribute to debugging, issue resolution, and package bring‑up activities as needed.

we are establishing a strategic R&D center in Israel to drive the development of complex semiconductor chips that solve the critical 'data bottlenecks' enabling the future of AI at scale. As we expand our presence in Israel, we're seeking a visionary Expert IC Package Design Lead to help build our local engineering powerhouse from the ground up. This is a unique opportunity to take on meaningful product ownership in a new site, leading the physical implementation strategy for chips that power the world's largest AI clusters.
As an Expert IC Package Design Lead, you will be a core technical contributor in the development of advanced IC packaging solutions for high-performance connectivity silicon.
You will own package flow, architecture, design, and qualification from concept through production, working closely with silicon, signal integrity, power integrity, mechanical, manufacturing, and external OSAT partners.You will be responsible for defining package technologies that meet aggressive electrical, thermal, mechanical, and cost targets, enabling our companys products to operate reliably in the worlds most demanding AI and cloud environments.
Key Responsibilities
Own end-to-end IC package design, from early architecture and feasibility through detailed design, qualification, and high-volume manufacturing
Define package architecture and technology selection (organic substrates, advanced laminate, interposers, multi-die/chiplet packaging, CoWoS - 2.5D/3D integration)
Lead signal integrity (SI), power integrity (PI), and thermal considerations at the package level for high-speed, high-power devices
Drive package layout, substrate routing, bump/ball maps, stack-ups, materials selection, and mechanical constraints
Collaborate closely with silicon design, SerDes, system, SI/PI, and reliability teams to optimize overall product performance
Interface with OSATs, substrate vendors, and manufacturing partners to ensure design-for-manufacturability (DFM), yield, and cost targets
Lead package-related risk assessment, failure analysis, and corrective actions during bring-up and production ramp
Support NPI, qualification, and product sustainment activities, including vendor audits and technical reviews.