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Join our advanced packaging team to define and develop cutting-edge semiconductor package solutions for automotive-grade digital and RF System-on-Chip (SoC) products. Youll collaborate with internal teams and external OSATs to deliver high-performance, manufacturable, and reliable packages that meet stringent automotive standards.
What will your job look like:
Define and specify advanced package architectures for digital SoCs and RF ICs in automotive applications.
Perform substrate design for flip-chip BGA (FC-BGA) packages, including stack-up, routing, and ball-out optimizations.
Evaluate and select substrate technologies, materials, and package solutions based on performance, cost, and reliability.
Collaborate with OSATs to define and validate assembly materials and process flows.
Work closely with internal teams such as Backend, SIPI, Product Engineering, and Quality & Reliability to ensure seamless integration.
Monitor yield, quality, and manufacturability across package development and production stages.
Support DFM reviews and ensure compliance with automotive standards and customer requirements.

Join our advanced packaging team to define and develop cutting-edge semiconductor package solutions for automotive-grade digital and RF System-on-Chip (SoC) products. Youll collaborate with internal teams and external OSATs to deliver high-performance, manufacturable, and reliable packages that meet stringent automotive standards.
What will your job look like:
Define and specify advanced package architectures for digital SoCs and RF ICs in automotive applications.
Perform substrate design for flip-chip BGA (FC-BGA) packages, including stack-up, routing, and ball-out optimizations.
Evaluate and select substrate technologies, materials, and package solutions based on performance, cost, and reliability.
Collaborate with OSATs to define and validate assembly materials and process flows.
Work closely with internal teams such as Backend, SIPI, Product Engineering, and Quality & Reliability to ensure seamless integration.
Monitor yield, quality, and manufacturability across package development and production stages.
Support DFM reviews and ensure compliance with automotive standards and customer requirements.

As the Silicon Engineering Manager you will be responsible for improving silicon-photonics yield and performance through data-driven analysis, cross-functional collaboration and proactive issue resolution.

You will serve as the key interface between R&D, Process and Production teams, ensuring efficient data flow, rapid issue identification and continuous process improvement across wafer fabrication, device testing, and packaging stages.

Responsibilities:
Perform silicon process and chip-level data analysis, establishing correlation between chip and wafer performance.
Lead process debug and yield loss analysis at chip/wafer level, driving root cause investigations and corrective actions.
Manage engineering approval forum to release production material.
Collaborate closely with vendors to implement new product tests and resolve technical/process issues.
Act as a key interface between design, testing, and production teams, ensuring alignment across the product lifecycle
Oversee and coordinate the transfer of data related to silicon design, testing, fabrication, and characterization between Production and R&D departments.
Develop and implement data management strategies to ensure data accuracy, security, and accessibility.
Maintain proper documentation of data transfer protocols, version control, and data integrity checks.
Support data analysis efforts to improve silicon performance, yield, and quality.
Ensure compliance with company policies and industry standards related to data security and confidentiality.

We are looking for a Manufacturing Technology Process Engineer someone who is excited to join a growing group of diverse individuals responsible for handling high-mixed manufacturing technologies challenges.

What youll be doing:

Work with SI, Thermal, Hardware engineering, IC development team to examine and understand road map requirements, understand the gaps. Collaborate with PCB, PCBA, materials vendors, R&D teams and management, drive capabilities to overlap with our NETWORKING needs.

DFX: Build and Sustain design guidelines for functionality, test ability, reliability, cost. Become an active member in industry Eng. forums, IPC, HDPUG, SMTA... Reflect our interest and affect Industry specs & agenda. Preform Industry Benchmarking.

Ongoing PCB/PCBA activities: New materials from Selection to Implementation. New manufacturing technologies study, proof of concepts and implementation on products. Provide ongoing technological and process improvements to meet quality, cost and production goals. Engage with production line work. Provide ongoing production support to ensure continuous production.

PCB, PCBA reliability modelling.

Drive CMs to excellence in aspects of manufacturing process, quality management and HVM mindset.

We are looking for NPI Engineer who will join the operation team and help us scale onwards!
The NPI product leader will be responsible for transitioning new products from early stage development to production level till field deployment processes. Work with cross functional teams ranging from HW designers, systems engineers, marketing and operations teams and participate in the complete product life cycle from development through build prototype until handing off the product to sustaining engineers.
The NPI product leader will manage all engineering related activities of QMs new products. The NPI PL will have a full responsibility on the overall operational activities to ensure qualified manufacturing readiness of new products.
Responsibilities:
Lead cross functional teams to execute the NPI process within the operations group.
Set an overall Operational NPI plan, Set Ops KPIs, Track and follow project progress, manage risk and report accordingly.
Define the NPI methodologies, interfaces, and process within the operation matrix to ensure smooth product introduction
Providing engineering leadership for the definition and scoping of NPI projects for all aspects of manufacturing and transitioning of projects to Manufacturing for project implementation and subsequent operation.
Ensure Design for Manufacturing guidelines are well implemented in the product design and validate implementation impact on product quality
Overall accountability of production data integrity including: BOM, production documentation, jigs and tools, product regulation.
Establishing and documenting process specifications that ensure manufacturing operations will meet product capability and quality expectations.
Analyze and recommend improvements to all production processes and methods to facilitate cost reduction and quality improvement through engineering change requests
Prepare plans for all NPI projects and coordinate with all stakeholders to ensure a good quality product represent the operations in the product life cycles gates
Serve as a technical mentor to contract manufacturing during NPI process

Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our company's direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
our company's mission is to organize the world's information and make it universally accessible and useful. Our team combines the best of our company AI, Software, and Hardware to create radically helpful experiences. We research, design, and develop new technologies and hardware to make computing faster, seamless, and more powerful. We aim to make people's lives better through technology.
As a Power and Signal Integrity Engineer, you will be responsible for the design and characterization of signal and power integrity of our IC designs. You will design the external electrical interfaces of the device, from their Signal/Power-integrity and electrical usage perspectives.
You'll set up methodologies, perform simulations, silicon characterization and correlations to ensure our IC designs meet systems design budgets and achieve the highest performance. You will work with systems architects, ASIC design, systems engineers, and partner cross-functionally with teams and external vendors/partners.
The ML, Systems, & Cloud AI (MSCA) organization at our company designs, implements, and manages the hardware, software, machine learning, and systems infrastructure for all our company services (Search, YouTube, etc.) and our company Cloud. Our end users , Cloud customers and the billions of people who use our company services around the world.
We prioritize security, efficiency, and reliability across everything we do - from developing our latest TPUs to running a global network, while driving towards shaping the future of hyperscale computing. Our global impact spans software and hardware, including our company Clouds Vertex AI, the leading AI platform for bringing Gemini models to enterprise customers.
Responsibilities
Design and optimize power distribution networks (PDN) across chip, package, and board levels. This includes managing power/ground planes, decoupling capacitors, and power gating strategies.
Conduct both pre-layout and post-layout power integrity simulations to analyze power and ground noise (SSN/SSO), voltage drops (IR drop), and electromagnetic interference (EMI).
Implement and verify low-power design methodologies, such as multi-voltage designs and clock gating, using power intent formats like UPF/CPF.
Generate precise electrical models (e.g., S-parameters, SPICE models) for components such as packages, PCBs, and connectors for use in simulations.
Execute lab measurements utilizing test equipment like oscilloscopes, Vector Network Analyzers (VNA), Time Domain Reflectometers (TDR), Spectrum analyzers to validate simulation outcomes and debug signal and power-related issues on silicon prototypes and boards.

Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our company's direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
As a NPI and Layout package Engineer on the packaging team, you will be working on fast-paced products for consumer devices. In this role, you will work with Hardware Designers and Mechanical Engineers throughout the full product development life-cycle, supporting package outline, component placement and routing, using advanced package technologies while analyzing package reliability and manufacturability aspects.The ML, Systems, & Cloud AI (MSCA) organization at our company designs, implements, and manages the hardware, software, machine learning, and systems infrastructure for all our company services (Search, YouTube, etc.) and our company Cloud. Our end users , Cloud customers and the billions of people who use our company services around the world.

We prioritize security, efficiency, and reliability across everything we do - from developing our latest TPUs to running a global network, while driving towards shaping the future of hyperscale computing. Our global impact spans software and hardware, including our company Clouds Vertex AI, the leading AI platform for bringing Gemini models to enterprise customers.
Responsibilities
Design the layout of package substrates using Cadence Allegro Package Designer.
Apply package substrate layout design rules from manufacturing point of view and electrical requirement considerations.
Generate high-quality design documents for substrate manufacturers and package assembly houses.
Enhance the package design work continuously by developing initiatives that drive efficiency and improve quality/cost/schedule of the package layout work.
Manage new ASIC packages during the NPI phase as the primary engineering owner, overseeing the product life-cycle from design lockdown to mass production release.