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Do you love taking on big challenges that require exceptionally creative solutions? Do you deeply understand how an incredible camera experience should work? As part of our Camera Technologies group, youll help design the innovative technology that allows each generation of our products to produce photos even more incredible than the last. Youll design and develop groundbreaking ideas for everything involved in our camera systems, from sensor to lens. Youll collaborate with teams across us to research, design, develop, test, and qualify camera hardware for our products.

The Camera Hardware Engineering group is responsible for all research, design, development, testing, and qualification of camera hardware for our products. We are searching for extraordinary Hardware Engineers to take ownership in the development and system integration of very high-performance, compact camera modules and depth-sensing hardware such as user facing cameras, through machine vision cameras and the revolutionary True Depth and LiDAR.

The primary responsibility for this role is design and delivery of cutting edge camera and depth sensing modules, from concept through production ramp. Heavy interaction with multidisciplinary design teams (electrical, mechanical, process, test, firmware, software and operations) requires the ability to understand a wide breadth of engineering and technical principles.

Responsibilities include:
Multi-functional leadership of optical, electrical and mechanical design teams to develop and integrate depth/camera hardware into products
Concept definition, design, and detailed trade studies for laser projectors, camera optics, sensors, and module packaging
Documentation of module-specific design, test, and manufacturing requirements
Leadership of international manufacturing partners for module design evaluation, prototype builds, and qualification
Leadership of failure analysis and corrective action implementation at manufacturing sites as well as remotely, including assembly processes, testing, and calibration; parametric-data analysis of end-of-line yield and post-reliability failures.
Frequent reporting to executive and multi-functional teams on the development status of module development
- International travel may be required to supplier facilities for product development and production bring-up.

We are looking for an HW electrical engineer to join our Failure Analysis engineering team under the System Product Engineering group in the company. You will work in a multidisciplinary environment with customers, contract manufacturers, and vendors. This job allows you to work in sophisticated, high-end technology with state of the art products, exciting engineering environment and having a great impact on top technology products, mass production processes, quality and reliability of the company networking products.
What you'll be doing:
Root Cause Analysis and Test Planning: You will perform in-depth root cause analysis by meticulously analyzing failure modes and devising comprehensive test plans. Your expertise in planning and executing tests will be instrumental in pinpointing the underlying causes of failures.
Big-Data-Driven Analysis: Utilizing cutting-edge big-data tools, you will correlate customer-reported failures with production data and RMA history. This data-driven approach will enable you to gain valuable insights into root causes, identify potential risks, and assess the overall exposure of quality issues.
Leading Cross-Organizational Task Forces: You will be responsible for managing and leading cross-functional teams to address quality events and failure modes in our company's networking products. This involves coordinating efforts from various departments, such as hardware, software, and manufacturing, to collectively work towards identifying and resolving issues.
Customer Communication: As a pivotal point of contact, you will proactively communicate with our company's customers to relay RMA root cause findings. Your effective communication skills will help build strong customer relationships and instill confidence in our company's commitment to product quality.
Product Improvement Initiatives: You will play a critical role in enhancing the design, manufacturing process, and testing flow of our networking products. Through analysis processes, you will identify areas for improvement and recommend corrective and preventive actions to address quality complaints.
Hands-on Lab Work: Your expertise will extend to conducting extensive lab work, encompassing hardware, firmware, and software components. This will involve debugging and characterizing system-level, board-level, and chip-level issues, ensuring a robust understanding of product performance.
Continuous Learning and Innovation: Staying updated on the latest industry trends and technological advancements will be essential in fostering innovation and driving continuous improvement within our company's failure analysis processes.

Our company has been transforming computer graphics, PC gaming, and accelerated computing for more than 25 years. Its a unique legacy of innovation thats fueled by great technologyand amazing people. Today, were tapping into the unlimited potential of AI to define the next era of computing. An era in which our GPU acts as the brains of computers, robots, and self-driving cars that can understand the world. Doing whats never been done before takes vision, innovation, and the worlds best talent. As a worker, youll be immersed in a diverse, supportive environment where everyone is inspired to do their best work. Come join the team and see how you can make a lasting impact on the world.
Are you ready to be part of a team that's at the forefront of technological innovation? our company has been revolutionizing computer graphics, PC gaming, and accelerated computing for over 25 years, and now we're leading the charge into the era of AI. Our Networking IC Product Engineering Department is seeking a dedicated Senior Silicon Photonics Characterization Engineer to join our dynamic silicon-photonics characterization and validation team. This is an outstanding chance to create a significant impact on the development of the next generation of networking chips in an inspiring, collaborative environment.
What you'll be doing:
Characterizing and assessing silicon photonics devices to ensure flawless performance, productization, and outstanding quality.
Collaborating with cross-functional teams, including R&D, verification teams, architects, FW developers, and board engineers, to determine and successfully implement world-class testing protocols and methodologies.
Analyzing complex data sets to provide actionable insights that drive product improvements and innovations.
Implementing automated testing systems to streamline processes and improve efficiency.
Mentoring junior engineers and encouraging an inclusive, collaborative environment that drives outstanding team performance.
Hands-on lab work using optical test equipment (OSA, power meters, VNAs, probe stations, automated fiber-alignment systems).

Join our advanced packaging team to define and develop cutting-edge semiconductor package solutions for automotive-grade digital and RF System-on-Chip (SoC) products. Youll collaborate with internal teams and external OSATs to deliver high-performance, manufacturable, and reliable packages that meet stringent automotive standards.
What will your job look like:
Define and specify advanced package architectures for digital SoCs and RF ICs in automotive applications.
Perform substrate design for flip-chip BGA (FC-BGA) packages, including stack-up, routing, and ball-out optimizations.
Evaluate and select substrate technologies, materials, and package solutions based on performance, cost, and reliability.
Collaborate with OSATs to define and validate assembly materials and process flows.
Work closely with internal teams such as Backend, SIPI, Product Engineering, and Quality & Reliability to ensure seamless integration.
Monitor yield, quality, and manufacturability across package development and production stages.
Support DFM reviews and ensure compliance with automotive standards and customer requirements.

Join our advanced packaging team to define and develop cutting-edge semiconductor package solutions for automotive-grade digital and RF System-on-Chip (SoC) products. Youll collaborate with internal teams and external OSATs to deliver high-performance, manufacturable, and reliable packages that meet stringent automotive standards.
What will your job look like:
Define and specify advanced package architectures for digital SoCs and RF ICs in automotive applications.
Perform substrate design for flip-chip BGA (FC-BGA) packages, including stack-up, routing, and ball-out optimizations.
Evaluate and select substrate technologies, materials, and package solutions based on performance, cost, and reliability.
Collaborate with OSATs to define and validate assembly materials and process flows.
Work closely with internal teams such as Backend, SIPI, Product Engineering, and Quality & Reliability to ensure seamless integration.
Monitor yield, quality, and manufacturability across package development and production stages.
Support DFM reviews and ensure compliance with automotive standards and customer requirements.

As the Silicon Engineering Manager you will be responsible for improving silicon-photonics yield and performance through data-driven analysis, cross-functional collaboration and proactive issue resolution.

You will serve as the key interface between R&D, Process and Production teams, ensuring efficient data flow, rapid issue identification and continuous process improvement across wafer fabrication, device testing, and packaging stages.

Responsibilities:
Perform silicon process and chip-level data analysis, establishing correlation between chip and wafer performance.
Lead process debug and yield loss analysis at chip/wafer level, driving root cause investigations and corrective actions.
Manage engineering approval forum to release production material.
Collaborate closely with vendors to implement new product tests and resolve technical/process issues.
Act as a key interface between design, testing, and production teams, ensuring alignment across the product lifecycle
Oversee and coordinate the transfer of data related to silicon design, testing, fabrication, and characterization between Production and R&D departments.
Develop and implement data management strategies to ensure data accuracy, security, and accessibility.
Maintain proper documentation of data transfer protocols, version control, and data integrity checks.
Support data analysis efforts to improve silicon performance, yield, and quality.
Ensure compliance with company policies and industry standards related to data security and confidentiality.