לוח משרות דרושים, לחיפוש זה נמצאו 35,269 משרות

- Full technical ownership of assigned product lines across their lifecycle, serving as the senior engineering authority for sustaining activities.
- Lead mechanical design changes in multidisciplinary products to improve quality, reliability, manufacturability, serviceability, and customer experience.
- Drive cost-reduction initiatives (VAVE / Cost Down) through redesign of mechanical and electromechanical assemblies, materials, and manufacturing processes.
- Lead root cause analysis (RCA) and implement corrective and preventive actions (CAPA) for field failures and production issues.
- Provide ongoing engineering support to manufacturing and suppliers, including design optimization, tooling development, and first article inspections (FAI).

we are establishing a strategic R&D center in Israel to drive the development of complex semiconductor chips that solve the critical 'data bottlenecks' enabling the future of AI at scale. As we expand our presence in Israel, we're seeking a highly skilled Chip Top Physical Design Engineer focusing on implementation to join our local engineering powerhouse from the ground up.
If you thrive on solving complex, unnamed challenges in deep-submicron processes, your place is with us.
As a Physical Design Engineer, you will be a key hands-on member of our PD Team in the Israel R&D center. You will execute the physical design of the SoC Top level for chips that drive the worlds largest AI clusters. You will be deeply involved in all PD disciplines of the chip, driving the tape-out (T.O.) GDS to meet strict signoff criteria (Timing, LVS, EMIR, DRC, PV, etc.), ensuring our silicon meets the extreme performance, power, and area (PPA) targets required for AI scale.
Key Responsibilities
Execute SoC Top-level physical design and actively drive full-chip convergence
Perform Top-Level physical implementation, including floor-planning, Place & Route (P&R), Clock Tree Synthesis (CTS), Power/Clock distribution, Power Integrity, and Timing/Physical signoff
Work closely with the Architecture, Design, DFT, and Product teams to achieve optimal Power, Performance, and Area (PPA). This involves participating in feasibility studies for new architectures and optimizing runs to ensure the best Quality of Results (QoR)
Resolve complex signal integrity, thermal, and power challenges inherent in high-speed connectivity silicon
Collaborate closely with the Package team on Bump-map-to-Ballout design, taking all signal integrity aspects into consideration

We are looking for an outstanding Research Team Lead with deep hands-on expertise in large-scale distributed systems, AI framework infrastructure, and performance optimization on custom accelerators. If you are a visionary technical leader, a skilled communicator, and a team builder who thrives at the frontier of systems and AI research - you're welcome on board.
What Will You Be Doing?
Lead and grow a world-class team of researchers and engineers working on distributed AI infrastructure and systems software
Architect and own the software infrastructure enabling distributed training and inference on Huawei's custom accelerator hardware (e.g., Ascend NPU)
Drive research and development on communication libraries, runtime systems, memory management, and graph execution & synchronization at scale
Optimize end-to-end performance across large-scale clusters, covering both scale-up (multi-device) and scale-out (multi-node) configurations
Design and implement high-performance communication backends and collective operations (AllReduce, AllGather, broadcast) for distributed training workloads
Collaborate cross-functionally with hardware architects, compiler teams, and framework engineers to co-design hardware-software solutions
Publish and present research findings at top international venues (NeurIPS, EuroSys, SC, MLSys, OSDI) and represent the team externally
Mentor engineers and researchers, conduct performance and growth reviews, and shape team culture and technical direction
Partner with top academic institutions and open-source communities to advance the state of the art in distributed AI systems

we are establishing a strategic R&D center in Israel to drive the development of complex semiconductor chips that solve the critical 'data bottlenecks' enabling the future of AI at scale. As we expand our presence in Israel, we're seeking a visionary Formal Verification Engineer to help build our local engineering powerhouse from the ground up. This is a unique opportunity to take on meaningful product ownership in a new site, defining the formal verification strategy for chips that power the world's largest AI clusters.
As the Formal Verification Engineer, you will be a foundational member of our Israel R&D center. You wont just execute tasks; you will define the Formal verification strategy for chips that drive the worlds largest AI clusters. You will dive deep into the technical details, proving the correctness of complex designs and ensuring they flawlessly meet specifications.
Key Responsibilities
Own and develop formal verification environments from scratch through to sign-off
Apply formal verification methodologies and strategies to prove the correctness of intricate designs
Work closely with the Architecture, Design, and DV teams to identify verification needs and pinpoint design requirements
Create robust formal environments, analyze complex RTL designs, and apply advanced formal techniques to find corner-case bugs
Analyze verification results, identify failures, and collaborate directly with designers to resolve issues efficiently
Architect and develop generic, common formal functions and properties to be reused across multiple projects.

we are establishing a strategic R&D center in Israel to drive the development of complex semiconductor chips that solve the critical 'data bottlenecks' enabling the future of AI at scale. As we expand our presence in Israel, we're seeking a highly skilled Front-End CAD Engineer to join our local engineering powerhouse from the ground up.
As a Front-End CAD Engineer, you will be the backbone of our chip design ecosystem. You wont just be using tools; youll be architecting the methodologies, automation scripts, and design flows that enable our hardware teams to push the limits of silicon performance. Your work directly impacts the productivity of the design team and the time-to-market for our next-generation processors.
Key Responsibilities
Develop, maintain, and optimize RTL generation tools, building automated IPs and SoC schemes
Create robust applications using Python and Tcl to automate models build, regression and analysis tools and other assisting tools for all disciplines in front-end flows
Evaluate and integrate Electronic Design Automation (EDA) tools from vendors like Cadence, Synopsys, and Mentor Graphics
Define the methodologies of usage and integrate AI tools in this fast-growing field impacting all VLSI development flows.

we are establishing a strategic R&D center in Israel to drive the development of complex semiconductor chips that solve the critical 'data bottlenecks' enabling the future of AI at scale. As we expand our presence in Israel, we're seeking a visionary Package Design Engineer to help build our local engineering powerhouse from the ground up. This is a unique opportunity to take on meaningful product ownership in a new site, Driving the physical implementation strategy for chips that power the world's largest AI clusters.
As a Package Design Engineer, you will be a core technical contributor in the development of advanced IC packaging solutions for high-performance connectivity silicon. You will execute the package flow, design, and qualification from concept through production, working closely with silicon, signal integrity, power integrity, mechanical, manufacturing, and external OSAT partners. You will be responsible for implementing package technologies that meet aggressive electrical, thermal, mechanical, and cost targets, enabling our companys products to operate reliably in the worlds most demanding AI and cloud environments.
Key Responsibilities
Execute end-to-end IC package design, from early feasibility and detailed design through to qualification and high-volume manufacturing
Implement package architecture and utilize advanced technologies (organic substrates, advanced laminate, interposers, multi-die/chiplet packaging, CoWoS - 2.5D/3D integration)
Drive signal integrity (SI), power integrity (PI), and thermal considerations at the package level for high-speed, high-power devices
Perform package layout, substrate routing, bump/ball maps, stack-ups, materials selection, and apply mechanical constraints
Collaborate closely with silicon design, SerDes, system, SI/PI, and reliability teams to optimize overall product performance
Interface directly with OSATs, substrate vendors, and manufacturing partners to ensure design-for-manufacturability (DFM), yield, and cost targets are met
Conduct package-related risk assessments, failure analysis, and corrective actions during bring-up and production ramp
Support NPI, qualification, and product sustainment activities, including vendor technical reviews.