לוח משרות דרושים חשמל ואלקטרוניקה

At Lumissil, we are driving innovation in automotive technology, developing solutions that power the next generation of vehicles. We are looking for a Junior Engineer who is eager to learn, grow, and make an impact in a dynamic and innovative environment. This is a unique opportunity to work alongside experienced professionals, gain hands-on experience, and contribute to projects at the forefront of automotive electronics. If you are passionate about technology, curious to explore new challenges, and excited to make a real difference, Lumissil is the place to develop your skills, innovate, and grow your career. Why join us?
* Work on cutting-edge automotive projects
* Learn from a talented and supportive team
* Gain exposure to real-world automotive challenges
* Grow your career in a collaborative and inspiring environment If you’re ready to take the next step in your career and be part of something meaningful, we’d love to meet you! About The Position: As a Junior ASIC Design Engineer at Lumissil, you will take part in the full lifecycle of advanced chips that power the next generation of vehicles. This is a hands-on, growth-oriented role where you’ll work closely with experienced ASIC engineers, gain exposure to real silicon, and build a strong foundation in chip design and verification. In this role, you will:
* Be part of a professional ASIC team working on cutting-edge automotive solutions
* Support and learn from real emulation platforms used in production-grade designs
* Contribute to RTL implementation and gain practical experience in design flows
* Assist with verification and backend (BE) activities, learning industry best practices
* Participate in silicon bring-up, seeing your work come to life on real hardware This position is ideal for curious engineers who want to learn fast, take ownership, and grow into a key contributor in the world of automotive semiconductor design.

we're seeking a visionary ASIC Design Student to help build our local engineering powerhouse from the ground up. This is a unique opportunity to take on meaningful product ownership in a new site, designing complex solutions that sit at the heart of our most ambitious connectivity projects.

As an ASIC Design Student, you won't just build chips-you will be part of a team defining the next generation of AI infrastructure main components. The complex digital blocks under your micro-architecture and implementation responsibilities will power the world's largest AI clusters. You will own the journey from high-level definition through RTL implementation and backend support, transforming complex logic challenges into elegant, high-performance hardware. If you thrive on solving unnamed challenges in deep-submicron processes and want to shape the digital design foundation for AI infrastructure connectivity, this is your opportunity.



Key Responsibilities

Assist in the development of micro-architecture, RTL coding, and debugging for complex digital blocks
Utilize industry-leading EDA tools (Lint, CDC, Synthesis) to ensure designs are robust and power-efficient
Work closely with the verification team to run simulations, analyze results, and ensure design quality
Interact with Architecture and Backend teams to understand the full chip development lifecycle
Help leverage AI-based automation tools to optimize engineering workflows

we're seeking a visionary Design Verification Student to help build our local engineering powerhouse from the ground up. This is a unique opportunity to take on meaningful product ownership in a new site, designing complex solutions that sit at the heart of our most ambitious connectivity projects.

As a Design Verification Student, you will be at the forefront of quality, learning how to ensure that the chips powering the world's largest AI clusters are bug-free and robust.
This isn't just about running tests - its an opportunity to learn advanced verification methodologies (UVM/SystemVerilog) alongside world-class engineers. You will support the development of sophisticated testbenches and help verify high-performance digital blocks that sit at the heart of AI infrastructure.



Key Responsibilities


Assist in building and maintaining System Verilog/UVM-based testbenches, including monitors, checkers, and functional coverage models
Run simulations, analyze failures, and work with the design team to debug and resolve RTL issues
Help define and implement functional coverage and assertions to ensure all "corner cases" of the design are tested
Utilize and improve scripting (Python/Tcl) to streamline verification flows and result reporting
Partner with Design Engineers to understand block specifications and ensure the verification plan matches the design intent

we're seeking a visionary Expert IC Package Design Lead to help build our local engineering powerhouse from the ground up. This is a unique opportunity to take on meaningful product ownership in a new site, leading the physical implementation strategy for chips that power the world's largest AI clusters.

As an Expert IC Package Design Lead, you will be a core technical contributor in the development of advanced IC packaging solutions for high-performance connectivity silicon.
You will own package flow, architecture, design, and qualification from concept through production, working closely with silicon, signal integrity, power integrity, mechanical, manufacturing, and external OSAT partners.You will be responsible for defining package technologies that meet aggressive electrical, thermal, mechanical, and cost targets, enabling products to operate reliably in the worlds most demanding AI and cloud environments.

Key Responsibilities

Own end-to-end IC package design, from early architecture and feasibility through detailed design, qualification, and high-volume manufacturing
Define package architecture and technology selection (organic substrates, advanced laminate, interposers, multi-die/chiplet packaging, CoWoS - 2.5D/3D integration)
Lead signal integrity (SI), power integrity (PI), and thermal considerations at the package level for high-speed, high-power devices
Drive package layout, substrate routing, bump/ball maps, stack-ups, materials selection, and mechanical constraints
Collaborate closely with silicon design, SerDes, system, SI/PI, and reliability teams to optimize overall product performance
Interface with OSATs, substrate vendors, and manufacturing partners to ensure design-for-manufacturability (DFM), yield, and cost targets
Lead package-related risk assessment, failure analysis, and corrective actions during bring-up and production ramp
Support NPI, qualification, and product sustainment activities, including vendor audits and technical reviews

we're seeking a visionary Physical Design Engineer to help build our local engineering powerhouse from the ground up. This is a unique opportunity to take on meaningful product ownership in a new site, defining the backend execution and methodologies for chips that power the world's largest AI clusters.

As a Physical Design Engineer, you will be a key architect of our silicon's physical reality. You won't just execute a flow-you will help establish our local execution culture and technical standards, owning the transformation of complex logic into high-performance silicon. You will drive the physical implementation journey from synthesis through signoff, ensuring our connectivity solutions meet the extreme performance, power, and area targets required for next-generation AI infrastructure. If you thrive on solving complex challenges in deep-submicron processes and want to shape the backend methodology for AI infrastructure connectivity, this is your opportunity.

Key Responsibilities

Physical Implementation & Execution

Be part of the founding Backend team in Israel, playing a critical role in establishing local execution culture and technical standards
Take full responsibility for physical implementation journey including Synthesis, Floorplanning, Place & Route, and Clock-Tree Synthesis (CTS)
Own macro-level implementation with deep hands-on experience in floorplanning and complex routing
Signoff & Design Integrity

Drive final stages of design integrity, owning Timing signoff (STA), Physical Verification (DRC/LVS), and Reliability analysis (EMIR)
Ensure first-pass silicon success through rigorous signoff flows and analysis
Apply Logic Equivalence Checking (LEC) and other verification techniques to guarantee design correctness
Methodology Development & Cross-Functional Collaboration

Participate in defining and refining Backend methodologies with autonomy to improve workflows and tool automation
Work closely with Architecture, Design, and DFT teams to navigate challenges of advanced process nodes and high-speed connectivity
Leverage scripting and automation to make engineering environment faster and more robust

we're seeking a visionary Physical Design Engineer to help build our local engineering powerhouse from the ground up. This is a unique opportunity to take on meaningful product ownership in a new site, defining the backend execution and methodologies for chips that power the world's largest AI clusters.

As a Physical Design Engineer, you will be a key architect of our silicon's physical reality. You won't just execute a flow-you will help establish our local execution culture and technical standards, owning the transformation of complex logic into high-performance silicon. You will drive the physical implementation journey from synthesis through signoff, ensuring our connectivity solutions meet the extreme performance, power, and area targets required for next-generation AI infrastructure. If you thrive on solving complex challenges in deep-submicron processes and want to shape the backend methodology for AI infrastructure connectivity, this is your opportunity.

Key Responsibilities

Physical Implementation & Execution

Be part of the founding Backend team in Israel, playing a critical role in establishing local execution culture and technical standards
Take full responsibility for physical implementation journey including Synthesis, Floorplanning, Place & Route, and Clock-Tree Synthesis (CTS)
Own macro-level implementation with deep hands-on experience in floorplanning and complex routing
Signoff & Design Integrity

Drive final stages of design integrity, owning Timing signoff (STA), Physical Verification (DRC/LVS), and Reliability analysis (EMIR)
Ensure first-pass silicon success through rigorous signoff flows and analysis
Apply Logic Equivalence Checking (LEC) and other verification techniques to guarantee design correctness
Methodology Development & Cross-Functional Collaboration

Participate in defining and refining Backend methodologies with autonomy to improve workflows and tool automation
Work closely with Architecture, Design, and DFT teams to navigate challenges of advanced process nodes and high-speed connectivity
Leverage scripting and automation to make engineering environment faster and more robust

we're seeking a talented Senior ASIC Design Engineer to help build our local engineering powerhouse from the ground up. This is an exciting opportunity to take on meaningful product ownership in a new site, designing the digital blocks that sit at the heart of our most ambitious connectivity projects.

As a Senior ASIC Design Engineer, you won't just build chips-you will be part of a team defining the next generation of AI infrastructure main components. The complex digital blocks under your micro-architecture and implementation responsibilities will power the world's largest AI clusters. You will own the journey from high-level definition through RTL implementation and backend support, transforming complex logic challenges into elegant, high-performance hardware. If you thrive on solving challenging problems in deep-submicron processes and want to contribute to the digital design foundation for AI infrastructure connectivity, this is your opportunity.

Key Responsibilities

Design Ownership & Implementation

Own the journey from high-level definition through micro-architecture, coding, and debug to backend implementation support
Tackle complex logic challenges and transform them into elegant, high-performance hardware solutions
Serve as the point of contact for your logic blocks, interacting with Architecture, Verification, and Backend teams
Quality Assurance & Design Optimization

Utilize industry-leading EDA tools (Lint, CDC, Synthesis, Timing, Power) and in-house quality assurance tools to ensure designs are robust, scalable, and power-efficient
Apply design techniques to meet PPA (Power, Performance, Area) targets
Contribute to design quality through verification and validation activities
Methodology Innovation & Collaboration

Participate in design methodology improvements and tool automation initiatives
Leverage AI assistance tools and contribute to in-house automation development to make engineering workflows faster and smarter
Collaborate effectively across teams to ensure seamless integration

we're seeking a visionary Senior DFT Engineer to help build our local engineering powerhouse from the ground up. This is a unique opportunity to take on meaningful product ownership in a new site, ensuring the reliability and testability of chips that power the world's largest AI clusters.

As a Senior DFT Engineer, you will be at the intersection of architecture, design, and production. You won't just run tools-you will be a foundational member of the team responsible for the entire lifecycle of our silicon's reliability. From defining initial DFT architecture to supporting post-silicon bring-up, your work ensures that the backbone of AI infrastructure connectivity is flawless and scalable. If you thrive on solving complex challenges in deep-submicron processes and want to establish world-class DFT methodologies, this is your opportunity.

Key Responsibilities

DFT Architecture & Strategy

Own the DFT journey from high-level architecture definition and RTL design to backend implementation and post-production support
Develop comprehensive Design-for-Testability (DFT) strategies for next-generation connectivity platforms, ensuring chips meet the highest quality standards
Define DFT architectures including JTAG/iJTAG, MBIST, Scan, and ATPG methodologies
Test Pattern Development & Optimization

Generate and optimize high-quality test and debug patterns for production
Perform Static Timing Analysis (STA) for DFT modes and conduct gate-level simulations to ensure robust performance
Drive test coverage and quality metrics to meet stringent manufacturing requirements
Cross-Functional Collaboration & Methodology Innovation

Act as a multidisciplinary bridge, collaborating closely with Architecture, Verification, and Backend teams to ensure seamless integration and optimal QoR
Participate in developing and maintaining cutting-edge DFT implementation flows
Automate and improve methodologies using advanced scripting and tools

we're seeking a talented Senior Emulation Engineer to help build our local engineering powerhouse from the ground up. This is an exciting opportunity to take on meaningful ownership in a new site, implementing the emulation strategy for chips that power the world's largest AI clusters.

As an Senior Emulation Engineer, you will be a core technical driver of our Israel R&D center, working at the intersection of hardware and software to ensure our silicon meets extreme quality and performance targets. You will execute end-to-end emulation flows, bridge the gap between RTL and functional validation, and partner with cross-functional teams to enable seamless hardware-software integration. If you thrive on solving complex technical challenges and want to play a key role in validating cutting-edge AI infrastructure connectivity solutions, this is your opportunity.

Key Responsibilities

Emulation Flow Execution & Implementation

Execute end-to-end emulation flow from high-level model generation and RTL synthesis to complex system-level testing and silicon-accurate debugging
Work directly with next-generation emulation platforms (Zebu, Palladium, or Veloce) to implement cutting-edge methodologies
Maintain and evolve emulation flows to reduce compile times and increase execution speed, directly impacting time-to-market
System-Level Debug & Validation

Drive initial model bring-up process in high-stakes environment, identifying and resolving complex bugs
Ensure rapid cycles from RTL to functional stability through systematic debug approaches
Own technical blocks and drive them to completion independently
Cross-Functional Collaboration

Partner with Firmware, Software, and Validation teams to debug complex system-level scenarios
Ensure seamless hardware-software integration for AI infrastructure connectivity
Collaborate with Design and Verification teams to optimize emulation strategies

we're seeking a highly skilled Chip Top Physical Design Engineer focusing on implementation to join our local engineering powerhouse from the ground up.
If you thrive on solving complex, unnamed challenges in deep-submicron processes, your place is with us.

As a Physical Design Engineer, you will be a key hands-on member of our PD Team in the Israel R&D center. You will execute the physical design of the SoC Top level for chips that drive the worlds largest AI clusters. You will be deeply involved in all PD disciplines of the chip, driving the tape-out (T.O.) GDS to meet strict signoff criteria (Timing, LVS, EMIR, DRC, PV, etc.), ensuring our silicon meets the extreme performance, power, and area (PPA) targets required for AI scale.

Key Responsibilities


Execute SoC Top-level physical design and actively drive full-chip convergence
Perform Top-Level physical implementation, including floor-planning, Place & Route (P&R), Clock Tree Synthesis (CTS), Power/Clock distribution, Power Integrity, and Timing/Physical signoff
Work closely with the Architecture, Design, DFT, and Product teams to achieve optimal Power, Performance, and Area (PPA). This involves participating in feasibility studies for new architectures and optimizing runs to ensure the best Quality of Results (QoR)
Resolve complex signal integrity, thermal, and power challenges inherent in high-speed connectivity silicon
Collaborate closely with the Package team on Bump-map-to-Ballout design, taking all signal integrity aspects into consideration

we're seeking a highly skilled Front-End CAD Engineer to join our local engineering powerhouse from the ground up.

As a Front-End CAD Engineer, you will be the backbone of our chip design ecosystem. You wont just be using tools; youll be architecting the methodologies, automation scripts, and design flows that enable our hardware teams to push the limits of silicon performance. Your work directly impacts the productivity of the design team and the time-to-market for our next-generation processors.


Key Responsibilities

Develop, maintain, and optimize RTL generation tools, building automated IPs and SoC schemes
Create robust applications using Python and Tcl to automate models build, regression and analysis tools and other assisting tools for all disciplines in front-end flows
Evaluate and integrate Electronic Design Automation (EDA) tools from vendors like Cadence, Synopsys, and Mentor Graphics
Define the methodologies of usage and integrate AI tools in this fast-growing field impacting all VLSI development flows

we're seeking a visionary Package Design Engineer to help build our local engineering powerhouse from the ground up. This is a unique opportunity to take on meaningful product ownership in a new site, Driving the physical implementation strategy for chips that power the world's largest AI clusters.

As a Package Design Engineer, you will be a core technical contributor in the development of advanced IC packaging solutions for high-performance connectivity silicon. You will execute the package flow, design, and qualification from concept through production, working closely with silicon, signal integrity, power integrity, mechanical, manufacturing, and external OSAT partners. You will be responsible for implementing package technologies that meet aggressive electrical, thermal, mechanical, and cost targets, enabling products to operate reliably in the worlds most demanding AI and cloud environments.

Key Responsibilities


Execute end-to-end IC package design, from early feasibility and detailed design through to qualification and high-volume manufacturing
Implement package architecture and utilize advanced technologies (organic substrates, advanced laminate, interposers, multi-die/chiplet packaging, CoWoS - 2.5D/3D integration)
Drive signal integrity (SI), power integrity (PI), and thermal considerations at the package level for high-speed, high-power devices
Perform package layout, substrate routing, bump/ball maps, stack-ups, materials selection, and apply mechanical constraints
Collaborate closely with silicon design, SerDes, system, SI/PI, and reliability teams to optimize overall product performance
Interface directly with OSATs, substrate vendors, and manufacturing partners to ensure design-for-manufacturability (DFM), yield, and cost targets are met
Conduct package-related risk assessments, failure analysis, and corrective actions during bring-up and production ramp
Support NPI, qualification, and product sustainment activities, including vendor technical reviews

we're seeking a highly skilled Physical Design CAD Engineer specializing in CAD Automation and Signoff to join our local engineering powerhouse from the ground up.

This is a unique opportunity to take on meaningful technical ownership in a new site, implementing the backend execution environment and methodologies for chips that power the world's largest AI clusters. As a foundational member of the team, you will be responsible for the physical implementation environment. Your primary mission is to develop, optimize, and support automated flows from RTL to manufacturable GDSII tape-out, ensuring a methodical and efficient work environment for the entire PD team.


Key Responsibilities


Develop and maintain automated flows for Synthesis, Place & Route (P&R), and Floor-planning to ensure seamless design transitions
Implement and manage robust environments for Static Timing Analysis (STA), Power Analysis, and Physical Verification (DRC/LVS/ERC)
Write and maintain custom plug-ins and scripts (Tcl/Python) to extend vendor tool capabilities, tailoring them to specific process node constraints
Build automated "dashboards" and feedback loops to track and improve Power, Performance, and Area (PPA) metrics across design iterations
Own the design database structure and version control to ensure team alignment and data integrity
Collaborate directly with EDA vendors (Synopsys, Cadence, Siemens/Mentor) to troubleshoot flow issues and analyze tool results
Provide technical support to the broader PD team, helping them optimize individual blocks for power, performance, and timing

we're seeking a highly skilled Physical Design CAD Engineer specializing in CAD Extraction to join our local engineering powerhouse from the ground up.

This is a unique opportunity to take on meaningful technical ownership in a new site, implementing the parasitic extraction (PEX) methodologies and flows for chips that power the world's largest AI clusters. As a foundational member of the team, you will be responsible for the accuracy and efficiency of our extraction environment, ensuring that our high-speed designs are modeled with the highest precision from RTL to GDSII.

Key Responsibilities

Develop, qualify, and maintain automated RC extraction flows for high-performance AI SoCs
Own the setup and validation of foundry technology files (e.g., StarRC/Quantus techfiles, TLU+, ITF) across various process corners
Perform correlation studies between different extraction tools and 3D field solvers (e.g., Raphael, QuickCap) to ensure modeling accuracy
Collaborate closely with the Signal Integrity (SI) and Power Integrity (PI) teams to provide accurate parasitic data for critical high-speed nets and power grids
Implement automated scripts (Tcl/Python) to streamline extraction regressions, data parsing, and PEX-to-STA (Static Timing Analysis) handoffs
Analyze the impact of layout effects (LDE) and parasitics on timing and power, providing feedback to the implementation team to optimize PPA
Interface with EDA vendors and foundries to resolve extraction tool bugs and methodology gaps related to advanced nodes (5nm/3nm)

we're seeking a highly skilled Static Timing Analysis (STA) Engineer to join our local engineering powerhouse from the ground up.

This is a unique opportunity to take on meaningful technical ownership in a new site, executing the sign-off methodology for chips that power the world's most advanced AI clusters. As an STA Engineer, you will be deeply involved in the STA activities from chip partition and time budgeting through to final sign-off. You will bridge the gap between Architecture, Design, DFT, and Physical Design to ensure our high-performance silicon meets the aggressive timing targets required for next-generation connectivity.

Key Responsibilities


Execute the STA flow and sign-off methodologies, ensuring our products meet rigorous timing criteria for the most demanding data center environments
Collaborate closely with Architecture, Design, DFT, and Backend teams, participating in timing reviews and working with block owners to navigate the path to sign-off convergence
Develop, optimize, and manage complex SDC constraints, ensuring they are accurate and robust across multi-scenario environments
Analyze and resolve challenges related to cross-chip clock distribution networks and apply sophisticated margining techniques to ensure robust silicon across all process corners
Participate in design methodology improvements and tool automation, utilizing both industry-standard EDA tools and custom scripts to make our sign-off process faster and more efficient