לוח משרות דרושים Board Design בתל אביב יפו

we are seeking talented researchers to join our industry-leading Digital Intelligence Security Research Labs.
As a security researcher on our team, you will focus on identifying vulnerabilities within Apples ecosystem and developing innovative exploit strategies to gain access to iPhones and other devices, enabling the extraction of crucial evidence for law enforcements.
Key responsibilities:
Research on territories with little-explored vulnerability
Work on the production of world-unique capabilities to extract evidence from phones and other embedded devices.
iPhones and other iOS devices present tough challenges from a forensics perspective and involve hardware-backed encryption (SiDP), secure crypto coprocessor (SEP), and secured boot chain (SecureROM).
New iPhones present state-of-the-art exploit mitigations such as PAC, KTRR, and PPL.
Become a member of Labs Group, focusing on Security Research for mobile devices.
Execute your own (shell) code on top-notch technology mobile platforms hardened with challenging mitigations
Collaborate with a team of passionate researchers dedicated to solving modern digital intelligence challenges, years ahead of others in the industry.
Take part in world-class research results, assisting law enforcement by enabling lawful evidence extraction, and putting criminals behind bars every day.

Required Senior Board Design Engineer
About the job
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of םור direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
As a Hardware Board Design Engineer, you will own the electrical design of complex High Performance Computing (HPC) systems. You will drive the development of next-generation AI accelerator boards, ensuring they meet signal integrity, power delivery, and thermal requirements. You will work cross-functionally with Silicon (ASIC), Signal Integrity, Power, Mechanical, and Manufacturing teams to bring products from concept to mass production.
Responsibilities
Lead the schematic capture and component selection for high-density, multi-layer Printed Circuit Boards (20+ layers) incorporating high-power ASICs (TPUs/CPUs), FPGAs, and high-speed memory (High Bandwidth Memory/DDR5).
Design and validate high-speed interfaces including Peripheral Component Interconnect Express (PCIe) Gen 6.0/7.0, 400G/800G/1.6T ethernet (PAM4). Collaborate with Signal Integrity (SI) engineers to define routing constraints and stack-up.
Design multi-phase power regulators (VRMs) capable of delivering 1000A currents with fast transient response for AI processors.
Work closely with PCB layout designers to guide placement and routing of critical signals and power planes.
Lead the lab bring-up of first-silicon/first-board. Debug complex hardware issues using oscilloscopes, Time-Domain Reflectometers (TDRs), and logic analyzers. Root-cause failures to component, assembly, or design issues.