דרושים » הנדסה » Senior Analog IC Design Engineer

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1 ימים
Location: Tel Aviv-Yafo
Job Type: Full Time
Design high-performance analog and mixed-signal ICs optimized for precision, power, and area, driving prototype and product iterations from architecture to silicon validation.

Responsibilities
Design and simulate analog and RF integrated circuits, including critical blocks such as amplifiers, mixers, PLLs, ADCs, DACs, and bias/reference circuits, with a focus on signal integrity, linearity, and precision.

Optimize circuits for power, area, and performance trade-offs, ensuring designs meet system-level requirements across process, voltage, and temperature (PVT) variations.

Collaborate closely with optics, simulation and PCB teams to define architecture and block-level specifications for successive prototypes and product iterations, ensuring tight alignment with overall performance and integration goals.

Work with layout engineers to guide floor-planning and physical design, minimizing parasitic effects and preserving analog precision in layout-sensitive blocks.

Support post-silicon validation and bring-up, defining test plans, analyzing lab measurements, and correlating results with simulation to refine future design iterations.

Language: English at a proficient level. French is a plus.
Requirements:
A sound mathematical understanding and deep physical intuition of analog electronics, as well as analog voltage-to-current and current-to-voltage conversion at low and high frequencies.

Experience in designing high-precision analog systems for signal processing or power electronics. Experience working with high-frequency analog signals is valued.

Extensive experience in IC design and post-layout design methodology using standard industry tools like Cadence Virtuoso.

Proficiency in designing and optimizing mixed-signal circuits, including DACs and ADCs at low (kHz-MHz) and high (>GHz) frequencies, and signal conditioning circuits, ensuring flawless integration between analog RF components and digital processors.

Strong understanding of signal integrity, crosstalk, and noise reduction techniques in mixed-signal environments, particularly in high-frequency RF systems interfacing with digital processors.

Advanced node experience required (<28nm).
This position is open to all candidates.
 
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לפני 14 שעות
דרושים בSpecial Job – חברת השמה בהייטק
Job Type: More than one
- Electronics Board & System Design: Own schematic design and component selection for all proprietary boards.
Design system-level wiring architecture and detailed technical drawings.
- Embedded Firmware Development: Write and architect low-level C/C++ firmware infrastructure
to control and interface sensors, multi-axis motors, high-precision components and lasers subsystems with the software.
- Hands-on Board Bring-Up, QC & Troubleshooting: Act as the primary lab problem solver for board debugging,
rework, and failure analysis. Establish QC procedures for newly received boards to support production.
- DFM & Cost Optimization: Apply strict Design for Manufacturability (DFM) principles to optimize PCB layouts,
streamline assembly, and aggressively reduce production and bill-of-materials (BOM) costs.
- PCB Layout Management: Drive physical board layout design,
Requirements:
- Education: B.Sc. in Electrical Engineering with at least 5 years of experience
- Hardware & Layout Expertise: 3+ years of experience in board design (mixed-signal, power management, microcontrollers)
and PCB layout tools (e.g., Altium, OrCAD, KiCad).
- Embedded Firmware Skills: Strong C/C++ programming skills for microcontrollers (STM32, ARM Cortex, etc.)
and deep familiarity with hardware protocols (SPI, I2C, UART, CAN, USB).
- Hands-on Capability: Excellent lab skills (soldering, prototyping, oscilloscope diagnostics)
and a natural problem-solving mindset.
- Proven DFM Focus: Demonstrated experience implementing DFM practices specifically targeted at price reduction,
cost optimization, and yield improvement in production.
This position is open to all candidates.
 
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24/09/2026
חברה חסויה
Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
As we expand our presence in Israel, we're seeking a visionary Expert IC Package Design Lead to help build our local engineering powerhouse from the ground up. This is a unique opportunity to take on meaningful product ownership in a new site, leading the physical implementation strategy for chips that power the world's largest AI clusters.

As an Expert IC Package Design Lead, you will be a core technical contributor in the development of advanced IC packaging solutions for high-performance connectivity silicon.
You will own package flow, architecture, design, and qualification from concept through production, working closely with silicon, signal integrity, power integrity, mechanical, manufacturing, and external OSAT partners. You will be responsible for defining package technologies that meet aggressive electrical, thermal, mechanical, and cost targets, enabling our products to operate reliably in the worlds most demanding AI and cloud environments.

Key Responsibilities
Own end-to-end IC package design, from early architecture and feasibility through detailed design, qualification, and high-volume manufacturing.
Define package architecture and technology selection (organic substrates, advanced laminate, interposers, multi-die/chiplet packaging, CoWoS - 2.5D/3D integration).
Lead signal integrity (SI), power integrity (PI), and thermal considerations at the package level for high-speed, high-power devices.
Drive package layout, substrate routing, bump/ball maps, stack-ups, materials selection, and mechanical constraints.
Collaborate closely with silicon design, SerDes, system, SI/PI, and reliability teams to optimize overall product performance.
Interface with OSATs, substrate vendors, and manufacturing partners to ensure design-for-manufacturability (DFM), yield, and cost targets.
Lead package-related risk assessment, failure analysis, and corrective actions during bring-up and production ramp.
Support NPI, qualification, and product sustainment activities, including vendor audits and technical reviews.
Requirements:
Basic Qualifications
10+ years of hands-on IC BIG package design experience for high-performance semiconductor products, with full ownership from concept through tape-out.
Expert proficiency in IC package design tools (Cadence APD / SiP or equivalent) and experience designing complex packages (BGA, FCBGA, FCCSP).
Strong package architecture & integration expertise, including stack-ups, ball/bump maps, constraints, SMT integration, and package BOM ownership.
Deep understanding of signal, power, and thermal integrity at the package level, with ability to drive design tradeoffs based on analysis.
Proven manufacturing and release experience, including DRC/LVS/DFM, OSAT engagement, and delivering production-ready package designs.

Preferred Qualifications
Experience with AI, networking, PCIe, CXL, or other high-speed data center interfaces.
Familiarity with package reliability standards and qualification (JEDEC, IPC, thermal cycling, HTOL, etc.).
Experience supporting chiplet-based architectures and heterogeneous integration.
Prior technical leadership or package ownership on high-volume products.
This position is open to all candidates.
 
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חברה חסויה
Location: Tel Aviv-Yafo and Caesarea
Job Type: Full Time
In this role, you will contribute to the development of complex ASIC package designs from early planning and exploration through implementation and tapeout. You will collaborate across package design, layout, SI/PI, and silicon teams to help deliver high‑speed, robust, and manufacturable package solutions.

You will participate in package architecture activities, design tradeoff discussions, and technical problem solving while growing your expertise in advanced packaging technologies and system-level integration. This role provides an opportunity to work on some of the most advanced networking silicon products in the industry within a highly collaborative engineering environment.

Responsibilities:
As a member of the Package Design team, you will:

Lead the package design activities including planning, floorplanning, pinout optimization, stack‑up definition, and high‑speed routing support.

Collaborate with SI/PI, silicon floorplanning, layout, and manufacturing teams to ensure high‑quality package solutions.

Support package implementation activities and work closely with layout designers to ensure alignment between design intent and physical implementation.

Participate in technical investigations, design reviews, and tradeoff discussions involving performance, manufacturability, and schedule considerations.

Assist in developing and improving package design methodologies, flows, and best practices.

Contribute to debugging, issue resolution, and package bring‑up activities as needed.
Requirements:
Bachelors degree in Electrical Engineering or a related field.

5+ years of experience in package, PCB, or high‑speed design engineering.

Strong understanding of high-speed signal design and power distribution networks (PDN).

Familiarity with industry-standard EDA tools for layout and design.

Strong communication skills with the ability to collaborate and coordinate effectively with cross-functional teams
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
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17/09/2026
חברה חסויה
Location: Tel Aviv-Yafo
Job Type: Full Time
We are looking for a hands-on FPGA Design Engineer, specialized in high-performance digital design and FPGA-based system development, as part of the QM-Platform team.

This role involves ownership of FPGA interfaces and connectivity logic, including high-speed communication blocks, platform integration, and close collaboration with embedded and hardware teams. You will work on complex FPGA/SoC platforms, enabling robust and scalable solutions for quantum control systems.

Responsibilities

Own the design and implementation of FPGA-based interfaces such as PCIe, I2C, SPI, and high-speed GT communication.
Develop and integrate FPGA logic on advanced platforms, including Xilinx UltraScale+ and Versal.
Collaborate closely with embedded, hardware, and system teams to ensure seamless HW/SW/FPGA integration.
Drive FPGA bring-up, debugging, and validation at both lab and system levels.
Participate in system architecture definition and cross-team design decisions.
Requirements:
3+ years of experience in FPGA design and digital system development.
Strong proficiency in Verilog/SystemVerilog RTL design.
Hands-on experience with Xilinx FPGA families (UltraScale+, Zynq, or Versal).
Experience implementing and debugging high-speed interfaces (PCIe, Ethernet, JESD, or similar).
Solid understanding of FPGA development flows, including synthesis, place & route, and timing closure.
Experience with lab debugging tools (e.g., ILA/ChipScope, oscilloscopes, logic analyzers).
Experience with simulation and verification methodologies (RTL and gate-level).
Strong problem-solving skills and attention to detail.
B.Sc. or higher in Electrical Engineering, Computer Engineering, or equivalent.
Strong communication skills and ability to collaborate across teams.
This position is open to all candidates.
 
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08/09/2026
חברה חסויה
Location: Tel Aviv-Yafo
Job Type: Full Time and Hybrid work
We are looking for a hands-on FPGA Design Engineer, specialized in high-performance digital design and FPGA-based system development, as part of the QM-Platform team.
This role involves ownership of FPGA interfaces and connectivity logic, including high-speed communication blocks, platform integration, and close collaboration with embedded and hardware teams. You will work on complex FPGA/SoC platforms, enabling robust and scalable solutions for control systems.
Responsibilities:
Own the design and implementation of FPGA-based interfaces such as PCIe, I2C, SPI, and high-speed GT communication.
Develop and integrate FPGA logic on advanced platforms, including Xilinx UltraScale+ and Versal.
Collaborate closely with embedded, hardware, and system teams to ensure seamless HW/SW/FPGA integration.
Drive FPGA bring-up, debugging, and validation at both lab and system levels.
Participate in system architecture definition and cross-team design decisions.
Requirements:
3+ years of experience in FPGA design and digital system development.
Strong proficiency in Verilog/SystemVerilog RTL design.
Hands-on experience with Xilinx FPGA families (UltraScale+, Zynq, or Versal).
Experience implementing and debugging high-speed interfaces (PCIe, Ethernet, JESD, or similar).
Solid understanding of FPGA development flows, including synthesis, place & route, and timing closure.
Experience with lab debugging tools (e.g., ILA/ChipScope, oscilloscopes, logic analyzers).
Experience with simulation and verification methodologies (RTL and gate-level).
Strong problem-solving skills and attention to detail.
B.Sc. or higher in Electrical Engineering, Computer Engineering, or equivalent.
Strong communication skills and ability to collaborate across teams.
Advantages:
Experience with Versal architecture, including NoC design and integration.
Background in ASIC design or verification.
Familiarity with FPGA backend flows and static timing analysis (STA).
Scripting experience (Python, TCL, Makefile) and/or C/C++ knowledge
This position is open to all candidates.
 
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17/09/2026
Location: Tel Aviv-Yafo
Job Type: Full Time
We are seeking an experienced Team Leader to lead our Failure Analysis engineering group within the Product Engineering team. You will be responsible for controlling and improving the quality of our hardware products through technical leadership, data-driven insights, and global production support. This role requires deep expertise in electronics systems, failure methodologies, production process control, and proven leadership capabilities across multiple geographies.



Key Responsibilities

Lead, mentor, and develop a team of failure analysis engineers while providing technical guidance on complex hardware issues.
Drive continuous improvement of quality KPIs through root cause analysis (RCA), statistical analysis, and yield optimization across all products.
Establish and implement standardized failure analysis methodologies, debug protocols, and quality control processes across global production sites.
Serve as the technical focal point for product design and functionality, supporting the team across RF, embedded, FPGA, high-speed communication, and mixed-signal systems.
Collaborate across Design, Manufacturing, Supply Chain, and Sales teams to resolve critical issues and prevent yield impact.
Manage vendor/supplier escalations and conduct design DFT/DFM (Design for Test/Manufacturability) analyses.
Lead investigation of production crises and manage critical path issues under time pressure.
Requirements:
6+ years in hardware design and failure analysis; minimum 2 years in a leadership role- Must.
Deep understanding of electronics production processes, DFT principles, and manufacturing constraints- Must.
Strong hands-on lab expertise: proficiency with oscilloscopes, logic analyzers, VNA, and automated test equipment-Must.
Demonstrated experience with production testing workflows, yield analysis, and statistical process control.
Proven ability to conduct systematic root cause analysis and communicate findings to senior management.
Excellent cross-functional collaboration and technical communication skills.
Bachelor's degree in Electronics Engineering or equivalent.
This position is open to all candidates.
 
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25/08/2026
Location: Tel Aviv-Yafo
Job Type: Full Time
We are looking for an experienced Senior System Integration Engineer to join our team.

The role involves planning and executing system integration activities across multiple subsystems, from development through production. You will work with complex systems combining software, computing, IP networks, communications, RF, navigation & control, algorithms, and computer vision.

Responsibilities
System operation and troubleshooting, planning and executing integration processes, writing integration test specifications, preparing performance validation tests, and analyzing system behavior and performance.
Requirements:
Requirements
Practical Engineer / B.Sc. in Electrical & Electronics Engineering, Systems Engineering, Software Engineering, Computer Science, or equivalent technological military background.
3+ years of hands-on experience in system integration and/or testing of complex multidisciplinary systems.
Hands-on experience with communication interfaces and protocols such as TCP/IP, UDP, RS-422, SNMP, WebSocket, REST API, or MIL-STD-1553.
Experience with network monitoring/sniffer tools, troubleshooting, traffic analysis, and system performance investigation.
Ability to plan and execute integration processes, analyze system-level issues, and work with complex test environments.
Good understanding of complex system development lifecycles.
Strong interpersonal skills, independent learning abilities, and a proactive approach.
Good English- reading and writing.

Advantages
Experience in RF, communications, radar, EW, or SIGINT, including RF test equipment.
Experience developing or working with test equipment.
Familiarity with switches, routers, and networking equipment.
Experience with production transfer processes.
Scripting experience with Python, MATLAB, C#, C, Bash, Perl, or similar.
Linux experience and familiarity with JIRA/TFS.
Experience using AI tools.
This position is open to all candidates.
 
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4 ימים
Location: Tel Aviv-Yafo and Yokne`am
Job Type: Full Time
We are looking for best-in-class Physical Design Engineers to join our outstanding Networking Silicon engineering team, developing the industry's best high-speed communication devices, delivering the highest throughput and lowest latency! Come and take a part in designing our groundbreaking and innovating chips, enjoy working in a meaningful, growing and highly professional environment where you make a significant impact in a technology-focused company.

What you'll be doing:

Perform physical layout for full-chip level, integration, pinning and bump route.

Work with block owners and project managers to assure high quality convergence in all layout aspects.

You will be responsible for chip layout from the floorplanning stage through tape-out.
Requirements:
What we need to see:

An Electronics Engineer certificate or a B.Sc. in Electrical Engineering.

You should have 5 years of hands-on Full-chip layout and Physical Verification experience, demonstrating your proven expertise.

A strong background in Physical Verification methodologies, including DRC, LVS, ANT, ERC, and DFM for advanced process nodes, is required.

Knowledge in scripts' language: TCL, Unix and Shell.

Experience in Linux environments.

AI tools orientation or alternatively a desire to learn.

Familiarity with physical build EDA tools, including Synopsys (ICC2/FC) and Cadence (Innovus).

Familiarity with Physical Verification tools: Synopsys (ICV), Siemens (Calibre).

Self-motivation, attention to detail and good interpersonal skills.


Ways to stand out from the crowd:

Experience in methodology definition / flow owner of Full-chip / Place and Route.

Great teammate.

Ownership, self-learning skills and ability to work autonomously.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
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03/09/2026
חברה חסויה
Location: Tel Aviv-Yafo
Job Type: Full Time
we are looking for an experienced Electronics Engineer to join our growing R&D Hardware team and lead and deliver Hardware projects.
A day in the life and how youll make an impact:
Design & Build: Architect and develop electrical modules from concept through production, including PCB design for new systems and continuous improvement of existing ones.
Integrate & Innovate: Bring new components and sensors into our companys product line, working across power supply, communication protocols (I2C, Ethernet, UART), and supporting modules.
Troubleshoot & Lead: Serve as the go-to expert for diagnosing and resolving complex electrical faults - you set the standard for root-cause problem-solving.
Collaborate Cross-Functionally: Partner closely with systems engineers, mechanical engineers, and software teams to shape next-generation features and products from the ground up.
Own Vendor Relationships: Manage subcontractor relationships for end-to-end module delivery, ensuring quality and timelines stay on track.
Requirements:
BSc in Electrical Engineering or equivalent.
5+ years of experience as an Electrical engineer in a multidisciplinary company.
Proficiency in electronic circuit board design and development.
Proven experience in integrating new components into the system, including
power supply, communication (I2C, Ethernet, UART), and other supporting modules.
Experience in end-to-end module ownership, including work with subcontractors.
Experience working with programmable logic array modules.
Experience with development SW. (Altium advantage)
Experience with experiments and jig design
Highly motivated, determined, and a team player.
Able to own lead and deliver with a proactive approach.
Readiness to work in a challenging startup environment.
This position is open to all candidates.
 
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1 ימים
חברה חסויה
Location: Tel Aviv-Yafo
Job Type: Full Time
We are seeking a highly motivated and experienced Senior System Engineer to join our team and lead the development of sophisticated solutions that push the boundaries of flight.

Responsibilities:

Lead the development of innovative and complex airborne systems.
Develop system requirements that meet customer requirements and product definitions provided by other departments.
Facilitate PMO on developing integration plans identifying timelines, resources and equipment requirements to integrate engineering designs into higher level products.
Define and lead system level test plans to validate that the engineering designs meet requirements.
Collaborate with the R&D and Line of Business managers to ensure timely project delivery.
Define and lead experiments, tests and studies, and/or analytical investigations and provide clear and meaningful results and analysis.
Compile and assist in the presentation of test data collected during design validations to a peer group of engineers.
Work in collaboration with a multi-disciplined engineering team to develop engineering designs/solutions from initial POC to onsite customer implementation.
Contribute to documentation for use in the manufacture, installation, technical support and training related to the final design.
Support engineering products through entire life cycle including assist in installation at customer site, assist in product upgrades and improvements, support of service escalations and product EOL.
Provide regular status of projects to leadership.
Requirements:
B.Sc in engineering UAV related field (Mechanical, Aerospace, Electrical Engineering, or similar).
6 years project management of engineering/development projects.
2 years experience in design and project management of UAVs, or systems of similar complexity.
2 years experience designing and releasing parts for fabrication and mass production.
Experience with aircraft design, performance analysis, and/or construction.
Experience in deriving SW & HW requirements from product initiatives.
Experience creating production quality engineering documentation.
Experience creating and executing schedules in Jira, Microsoft Project, or similar.
Experience with Gated design development (PDR, CDR).
Strong people and communication skills.
Able to work cooperatively on a team.
This position is open to all candidates.
 
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