דרושים » חשמל ואלקטרוניקה » ASIC Physical Design CAD Engineer

You will work on physical synthesis, place and route, optimization, timing closure, and floor planning activities. Success in this role means delivering high-quality implementation results, learning quickly from senior engineers, and helping improve the flow and methodology used by the team.

Contribute to physical synthesis, place and route, optimization, and timing closure for complex VLSI designs.
Support design floor planning and implementation planning in collaboration with senior physical design engineers.
Analyze timing, congestion, power, area, and design-rule issues and help drive them toward closure.
Work with physical design verification flows, including LVS and DRC, to support clean implementation handoff.
Partner with cross-functional teams to debug implementation issues and improve backend flow quality.

As we expand our presence in Israel, we're seeking a highly skilled Chip Top Physical Design Engineer focusing on implementation to join our local engineering powerhouse from the ground up.
If you thrive on solving complex, unnamed challenges in deep-submicron processes, your place is with us.

As a Physical Design Engineer, you will be a key hands-on member of our PD Team in the Israel R&D center. You will execute the physical design of the SoC Top level for chips that drive the worlds largest AI clusters. You will be deeply involved in all PD disciplines of the chip, driving the tape-out (T.O.) GDS to meet strict signoff criteria (Timing, LVS, EMIR, DRC, PV, etc.), ensuring our silicon meets the extreme performance, power, and area (PPA) targets required for AI scale.

Key Responsibilities
Execute SoC Top-level physical design and actively drive full-chip convergence.
Perform Top-Level physical implementation, including floor-planning, Place & Route (P&R), Clock Tree Synthesis (CTS), Power/Clock distribution, Power Integrity, and Timing/Physical signoff.
Work closely with the Architecture, Design, DFT, and Product teams to achieve optimal Power, Performance, and Area (PPA). This involves participating in feasibility studies for new architectures and optimizing runs to ensure the best Quality of Results (QoR).
Resolve complex signal integrity, thermal, and power challenges inherent in high-speed connectivity silicon.
Collaborate closely with the Package team on Bump-map-to-Ballout design, taking all signal integrity aspects into consideration.

As the Physical Design Manager, you will provide strategic and technical leadership to a team of engineers, guiding them through the entire chip design lifecycle. You will be responsible for the group's output, including Definition, Physical Synthesis, Place and Route, Optimization, Timing Closure, Design Floor Planning.

We are looking for best-in-class Physical Design Engineers to join our outstanding Networking Silicon engineering team, developing the industry's best high-speed communication devices, delivering the highest throughput and lowest latency! Come and take a part in designing our groundbreaking and innovating chips, enjoy working in a meaningful, growing and highly professional environment where you make a significant impact in a technology-focused company.

What you'll be doing:
Physical design of blocks according to specifications under challenging constraints targeting for the best power, area, and performance.
Be exposed and work on a variety of challenging designs (including high cell count and HS blocks). Resolving complex timing and congestion problems.
Daily work involves all aspects of physical design chip development (RTL2GDS) - synthesis, power and clock distribution, place and route, timing closure, power and noise analysis, and physical verification.
Taking part inflows development.

As we expand our presence in Israel, we're seeking a visionary Junior Physical Design Engineer to help build our local engineering powerhouse from the ground up. This is a unique opportunity to take on meaningful product ownership in a new site, defining the backend execution and methodologies for chips that power the world's largest AI clusters.

As a Junior Physical Design Engineer, you will be a key architect of our silicon's physical reality. You won't just execute a flow-you will help establish our local execution culture and technical standards, owning the transformation of complex logic into high-performance silicon. You will drive the physical implementation journey from synthesis through signoff, ensuring our connectivity solutions meet the extreme performance, power, and area targets required for next-generation AI infrastructure. If you thrive on solving complex challenges in deep-submicron processes and want to shape the backend methodology for AI infrastructure connectivity, this is your opportunity.

Key Responsibilities

Physical Implementation & Execution
Be part of the founding Backend team in Israel, playing a critical role in establishing local execution culture and technical standards
Take full responsibility for physical implementation journey including Synthesis, Floorplanning, Place & Route, and Clock-Tree Synthesis (CTS)
Own macro-level implementation with deep hands-on experience in floorplanning and complex routing.

Signoff & Design Integrity
Drive final stages of design integrity, owning Timing signoff (STA), Physical Verification (DRC/LVS), and Reliability analysis (EMIR)
Ensure first-pass silicon success through rigorous signoff flows and analysis
Apply Logic Equivalence Checking (LEC) and other verification techniques to guarantee design correctness.

Methodology Development & Cross-Functional Collaboration
Participate in defining and refining Backend methodologies with autonomy to improve workflows and tool automation.
Work closely with Architecture, Design, and DFT teams to navigate challenges of advanced process nodes and high-speed connectivity.
Leverage scripting and automation to make engineering environment faster and more robust.

Key job responsibilities
* Daily involvement in all aspects of physical design chip development (RTL2GDS), including floorplanning, synthesis, clock tree synthesis, place and route, static timing analysis, power and noise analysis, physical verification testing, and equivalence checks.
* Being actively engaged in design-backend convergence aspects and defining timing constraints.
* Taking full end-to-end responsibility for the physical design of macros and clusters level, according to specifications, under challenging constraints, with focus on optimizing power, area, and performance.
* Participation in the development of design flows, using a variety of EDA tools and vendors such as Synopsis and Cadence.
* Engaged in defining implementation and signoff methodologies.

As a Digital Backend Design Engineer, you will be responsible for the physical implementation of digital designs from RTL to GDSII, leveraging cutting-edge EDA tools and methodologies. You will collaborate closely with RTL design, DFT, and packaging teams to achieve optimal performance, power, and area (PPA), while meeting stringent timing and yield targets.

Responsibilities
Execute full-chip and block-level physical design tasks including floorplanning, placement, clock tree synthesis, routing, and physical verification.

Develop and optimize the digital backend flow.

Drive timing closure, power optimization, and physical verification (LVS/DRC/ERC).

Collaborate with front-end designers to address timing and logical/physical interface issues.

Support tapeout preparation and final signoff processes.

As we expand our presence in Israel, we're seeking a talented Senior ASIC Design Engineer to help build our local engineering powerhouse from the ground up. This is an exciting opportunity to take on meaningful product ownership in a new site, designing the digital blocks that sit at the heart of our most ambitious connectivity projects.

As a Senior ASIC Design Engineer, you won't just build chips-you will be part of a team defining the next generation of AI infrastructure main components. The complex digital blocks under your micro-architecture and implementation responsibilities will power the world's largest AI clusters. You will own the journey from high-level definition through RTL implementation and backend support, transforming complex logic challenges into elegant, high-performance hardware. If you thrive on solving challenging problems in deep-submicron processes and want to contribute to the digital design foundation for AI infrastructure connectivity, this is your opportunity.

Key Responsibilities

Design Ownership & Implementation
Own the journey from high-level definition through micro-architecture, coding, and debug to backend implementation support
Tackle complex logic challenges and transform them into elegant, high-performance hardware solutions
Serve as the point of contact for your logic blocks, interacting with Architecture, Verification, and Backend teams

Quality Assurance & Design Optimization
Utilize industry-leading EDA tools (Lint, CDC, Synthesis, Timing, Power) and in-house quality assurance tools to ensure designs are robust, scalable, and power-efficient
Apply design techniques to meet PPA (Power, Performance, Area) targets
Contribute to design quality through verification and validation activities

Methodology Innovation & Collaboration
Participate in design methodology improvements and tool automation initiatives
Leverage AI assistance tools and contribute to in-house automation development to make engineering workflows faster and smarter
Collaborate effectively across teams to ensure seamless integration

We are looking for best-in-class Physical Design Engineers to join our outstanding Networking Silicon engineering team, developing the industry's best high-speed communication devices, delivering the highest throughput and lowest latency! Come and take a part in designing our groundbreaking and innovating chips, enjoy working in a meaningful, growing and highly professional environment where you make a significant impact in a technology-focused company.

What you'll be doing:

Perform physical layout for full-chip level, integration, pinning and bump route.

Work with block owners and project managers to assure high quality convergence in all layout aspects.

You will be responsible for chip layout from the floorplanning stage through tape-out.

We are looking for talented engineers to help us develop a semiconductor platform based on revolutionary architecture.
Take part in the development of cutting-edge products within a disruptive system architecture. Youll have the opportunity to work on the technologies that power the worlds largest cloud provider, within a dynamic, open, fast-paced environment. Our Web Services provides a highly reliable, scalable, low-cost infrastructure platform in the cloud, which powers hundreds of thousands of businesses in 190 countries around the world.
We are looking for excellent electrical engineering graduates to join our talented Physical Design team, which develops our next generation products for the cloud market.
We will be conducting a unique training program for three months, where where you will be studying the following with our technical experts and team leaders:
* Backend development flow and stages (RTL to GDS).
* A wide variety of relevant tools and knowledge.
* Practical experience with the most advanced technologies in the industry.

Key job responsibilities
Join our three-month training program where you'll work alongside technical experts and team leaders to gain:
*Backend development expertise (RTL to GDS flow).
*Hands-on experience with industry-leading tools and technologies.
*Practical skills in AI-driven innovations and cutting-edge methodologies.
You'll collaborate with cross-functional teams throughout the chip development cycle and become an essential part of our dynamic physical design team, playing a critical role in next-generation cloud computing solutions development.