דרושים » חשמל ואלקטרוניקה » Junior DFT Engineer- ETR- Israel

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לפני 1 שעות
Location: Tel Aviv-Yafo
Job Type: Full Time
The Design for Test (DFT) team is part of the design group, which focuses on logic design, RTL development, and running verification tests.

Their main role is to design test structures embedded within the chip to ensure proper functionality after manufacturing.

The goal is to detect potential manufacturing defects with maximum efficiency and filter out faulty units before they reach the market.



What You'll Do

Insert DFT logic, perform synthesis, and run Automatic Test Pattern Generation (ATPG) to ensure hardware testability.

Execute Gate Level Simulations, timing checks, and DRC checks to maintain rigorous design integrity and performance standards.

Run regressions and perform deep-dive debugging on simulation failures as part of the core verification process.

Work in a small, agile team with an intimate atmosphere that offers direct mentoring and broad professional growth.
Requirements:
B.Sc or M.Sc Electrical/Computer Engineer Graduate from leading Israeli Universities with average grades above 85.

Team players who enjoy big challenges.

People who can quickly ramp on multiple, interdisciplinary domains.
This position is open to all candidates.
 
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5 ימים
חברה חסויה
Location: Tel Aviv-Yafo
Job Type: Full Time
As we expand our presence in Israel, we're seeking a visionary DFT Engineer to help build our local engineering powerhouse from the ground up. This is a unique opportunity to take on meaningful product ownership in a new site, ensuring the reliability and testability of chips that power the world's largest AI clusters.

As a DFT Engineer, you will be at the intersection of architecture, design, and production. You won't just run tools-you will be a foundational member of the team responsible for the entire lifecycle of our silicon's reliability. From defining initial DFT architecture to supporting post-silicon bring-up, your work ensures that the backbone of AI infrastructure connectivity is flawless and scalable. If you thrive on solving complex challenges in deep-submicron processes and want to establish world-class DFT methodologies, this is your opportunity.

Key Responsibilities

DFT Architecture & Strategy
Be part of the DFT journey from high-level architecture definition and RTL design to backend implementation and post-production support
Develop comprehensive Design-for-Testability (DFT) strategies for next-generation connectivity platforms, ensuring chips meet the highest quality standards
Design and implement DFT architectures including JTAG/iJTAG, MBIST, Scan, and ATPG for high-end devices

Test Pattern Development & Optimization
Generate and optimize high-quality test and debug patterns for production
Perform Static Timing Analysis (STA) for DFT modes and conduct gate-level simulations to ensure robust performance
Drive test coverage and quality metrics to meet stringent manufacturing requirements

Cross-Functional Collaboration & Methodology Innovation
Act as a multidisciplinary bridge, collaborating closely with Architecture, Verification, and Backend teams to ensure seamless integration and optimal QoR
Participate in developing and maintaining cutting-edge DFT implementation flows
Automate and improve methodologies using advanced scripting and tools
Requirements:
Basic Qualifications
Bachelor's degree in Electrical Engineering or related technical field.
4+ years of hands-on experience in DFT roles at semiconductor companies.
Experience in DFT flows and architectures including JTAG/iJTAG, MBIST, Scan, and ATPG.
Good understanding of logic design, verification, debug, and Static Timing Analysis (STA).
Scripting proficiency in Tcl, Perl, Python, or Shell for automation and innovation.

Preferred Qualifications
Master's degree in Electrical Engineering or related field.
Experience with industry-standard EDA tools from Synopsys (TestMAX) or Siemens (Tessent).
Experience in chip bring-up and mass production activities.
Background in advanced process technologies (7nm and below).
Knowledge of high-speed interface protocols (PCIe, Ethernet, CXL, UALink) and their specific test requirements.
Excellent communication skills with ability to work effectively in global team environments.
This position is open to all candidates.
 
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5 ימים
חברה חסויה
Location: Tel Aviv-Yafo
Job Type: Full Time
As we expand our presence in Israel, we're seeking a visionary Staff DFT Engineer to help build our local engineering powerhouse from the ground up. This is a unique opportunity to take on meaningful product ownership in a new site, ensuring the reliability and testability of chips that power the world's largest AI clusters.

As a Staff DFT Engineer, you will be at the intersection of architecture, design, and production. You won't just run tools-you will be a foundational member of the team responsible for the entire lifecycle of our silicon's reliability. From defining initial DFT architecture to supporting post-silicon bring-up, your work ensures that the backbone of AI infrastructure connectivity is flawless and scalable. If you thrive on solving complex challenges in deep-submicron processes and want to establish world-class DFT methodologies, this is your opportunity.

Key Responsibilities

DFT Architecture & Strategy
Own the DFT journey from high-level architecture definition and RTL design to backend implementation and post-production support.
Develop comprehensive Design-for-Testability (DFT) strategies for next-generation connectivity platforms, ensuring chips meet the highest quality standards.
​DFT architectures including JTAG/iJTAG, MBIST, Scan, and ATPG methodologies.

Test Pattern Development & Optimization
Generate and optimize high-quality test and debug patterns for production.
Perform Static Timing Analysis (STA) for DFT modes and conduct gate-level simulations to ensure robust performance.
Drive test coverage and quality metrics to meet stringent manufacturing requirements.

Cross-Functional Collaboration & Methodology Innovation
Act as a multidisciplinary bridge, collaborating closely with Architecture, Verification, and Backend teams to ensure seamless integration and optimal QoR.
Participate in developing and maintaining cutting-edge DFT implementation flows.
Automate and improve methodologies using advanced scripting and tools.
Requirements:
Basic Qualifications
Bachelor's degree in Electrical Engineering or related technical field.
8+ years of hands-on experience in DFT roles at semiconductor companies.
Deep expertise in DFT flows and architectures including JTAG/iJTAG, MBIST, Scan, and ATPG.
Proficiency with industry-standard EDA tools from Synopsys (TestMAX) or Mentor (Tessent).
Strong understanding of logic design, verification, debug, and Static Timing Analysis (STA).
Scripting proficiency in Tcl, Perl, Python, or Shell for automation and innovation.


Preferred Qualifications
Master's degree in Electrical Engineering or related field.
Knowledge of high-speed interface protocols (PCIe, Ethernet, CXL, UALink) and their specific test requirements.
Experience in chip bring-up and mass production activities.
Background in advanced process technologies (7nm and below).
Excellent communication skills with ability to work effectively in global team environments.
This position is open to all candidates.
 
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לפני 1 שעות
Location: Tel Aviv-Yafo and Caesarea
Job Type: Full Time
You'll be joining our Physical Design team within Cisco Silicon One, which is responsible for the entire backend methodology and flow development from RTL to GDS. This is a critical part of the group leading the development of high-quality VLSI designs.

Our Backend Engineers handle all aspects of chip design, including Definition, Physical Synthesis, Place and Route, Optimization, Timing Closure, Design Floor Planning.

You will be leveraging your backend and physical design experience to drive the development, optimization, and innovation of CAD methodologies and tools, ensuring the highest quality and efficiency in our chip design flows from RTL to GDS.
Requirements:
Minimum Qualifications
A VLSI Design Engineer with extensive experience in backend design

B.Sc./M.Sc. in Electrical Engineering or Computer Engineering with relevant background.

2+ years of hands-on experience in a relevant domain

Strong understanding of Place & Route flow
This position is open to all candidates.
 
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5 ימים
Location: Tel Aviv-Yafo
Job Type: Full Time
As we expand our presence in Israel, we're seeking a highly skilled Chip Top Physical Design Engineer focusing on implementation to join our local engineering powerhouse from the ground up.
If you thrive on solving complex, unnamed challenges in deep-submicron processes, your place is with us.

As a Physical Design Engineer, you will be a key hands-on member of our PD Team in the Israel R&D center. You will execute the physical design of the SoC Top level for chips that drive the worlds largest AI clusters. You will be deeply involved in all PD disciplines of the chip, driving the tape-out (T.O.) GDS to meet strict signoff criteria (Timing, LVS, EMIR, DRC, PV, etc.), ensuring our silicon meets the extreme performance, power, and area (PPA) targets required for AI scale.

Key Responsibilities
Execute SoC Top-level physical design and actively drive full-chip convergence.
Perform Top-Level physical implementation, including floor-planning, Place & Route (P&R), Clock Tree Synthesis (CTS), Power/Clock distribution, Power Integrity, and Timing/Physical signoff.
Work closely with the Architecture, Design, DFT, and Product teams to achieve optimal Power, Performance, and Area (PPA). This involves participating in feasibility studies for new architectures and optimizing runs to ensure the best Quality of Results (QoR).
Resolve complex signal integrity, thermal, and power challenges inherent in high-speed connectivity silicon.
Collaborate closely with the Package team on Bump-map-to-Ballout design, taking all signal integrity aspects into consideration.
Requirements:
Basic Qualifications
B.Sc. or M.Sc. in Electrical Engineering.
5+ years of hands-on experience in Chip Top Physical Design/Backend at leading semiconductor companies, working on advanced process technologies (5nm, 3nm, and below).
Proven experience executing complex block or chip-level projects with a proactive, "can-do" approach and excellent communication skills.
Deep hands-on expertise in RTL2GDS flows, including P&R, STA, Physical Verification (DRC/LVS), Formal Verification, low-power implementation (UPF/CPF), and EMIR.
Mastery of industry-standard EDA tools (Synopsys Fusion Compiler/ICC2 or Cadence Innovus).
Practical experience handling both complex macro/subsystem-level designs and Full-Chip integration.


Preferred Qualifications
Deep understanding of Power & Noise analysis (EM/IR).
Experience with DFT (Design for Test) integration into the physical design flow.
Background in high-speed interfaces or data center protocols.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
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07/09/2026
חברה חסויה
Location: Tel Aviv-Yafo
Job Type: Full Time
As a DFT Engineer at Annapurna Labs (AWS), you'll take ownership of testability architectures and DFT logic, driving their development and verification through the full hardware lifecycle. Your responsibilities may include:
Define and implement DFT architectures for complex SoC designs.
Develop and integrate DFT logic including: MBIST (Memory Built-In Self-Test), JTAG/TAP, and boundary scan.
RTL coding and debug of DFT controllers and infrastructure using Verilog/SystemVerilog.
Drive gate-level simulations to validate DFT functionality and test patterns.
Develop and verify DFT logic using UVM-based testbenches, functional simulation, and coverage-driven verification.
Participate in design reviews, DFT sign-off processes, and tapeout preparation
Cross-functional collaboration with Design, Verification, Physical Design, and Production/Test teams.
Requirements:
Basic Qualifications
- Hands-on experience in RTL design using Verilog/System Verilog.
- Experience with chip design flows and gate-level simulations.

Preferred Qualifications
- Experience with DFT design and implementation (MBIST, JTAG/IEEE 1149.1, memory repair flows) and familiarity with industry-standard EDA tools such as Synopsys DFT Compiler and Tessent.
- Verification background including UVM testbenches, coverage-driven verification, FPGA, and emulator environments, with advanced scripting skills in Perl, Tcl, and/or Python.
- End-to-end chip development experience- from RTL design through synthesis, timing analysis, and physical design constraints to post-silicon validation, production, and memory fault debugging.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
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20/08/2026
חברה חסויה
Location: Tel Aviv-Yafo
Job Type: Full Time
Play a critical role in ensuring the functional integrity, performance, and reliability of next-generation optical chips.

Responsibilities
Develop robust verification plans for complex digital and mixed-signal optical chip designs.

Collaborate closely with architects, designers, and customers to understand logic requirements, translate them into verification strategies, and deliver clear, actionable feedback throughout the development process.

Perform netlist-level simulations with SDF back-annotation for timing-accurate verification

Support FPGA/ASIC bring-up and post-silicon validation as needed

Develop, maintain, and optimize testbenches and verification components using advanced SystemVerilog features, such as constrained random testing, assertions, and transaction-level modeling, to create robust coverage-driven environments.

Design scalable, reusable UVM-based environments and components (e.g., agents, monitors, scoreboards) for block- and system-level verification. Employ UVM to achieve regression automation, functional coverage closure, and high bug-detection efficiency.

Develop and execute verification strategies for digital blocks implementing or interfacing with PCI Express (PCIe). Apply protocol-checking, compliance validation, error injection, and debug skills for PCIe endpoints and root complex devices. Use protocol analyzers and simulation environments to validate correct implementation across all protocol layers.

Participate in the verification of RISC-V CPU cores and subsystems. Create test plans targeting processor modules (ALU, decoder, register file, control logic), with reference model comparisons, signature checks, and coverage of edge-case scenarios. Leverage formal verification and compliance suites for thorough design validation.

Plan and perform end-to-end ASIC verification, from block-level testbenches to full-chip integration. Execute functional and regression tests, formal verification, and coverage analysis. Debug and resolve design issues, ensuring pre-silicon reliability before manufacturing. Engage in design reviews and system-level protocol validation with cross-functional teams.
Requirements:
Bachelors, Masters, or PhD in Electrical Engineering, Computer Engineering, or a related field.

Proven fluency and hands-on expertise in SystemVerilog for verification.

Demonstrated prior experience with the UVM framework and modern verification environments.

Direct knowledge of standard protocols (AXI/AXIStream, APB/AHB, I2C, JTAG, PCIe) and experience verifying digital logic for high-speed interfaces.

Practical experience verifying RISC-V CPU designs or equivalent digital processor architectures within an ASIC context.

Strong analytical and communication skills for customer-driven projects and interdisciplinary teamwork.

Language: English at a proficient level. French is a plus.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
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5 ימים
חברה חסויה
Location: Tel Aviv-Yafo
Job Type: Full Time
As we expand our presence in Israel, we're seeking a visionary Junior Physical Design Engineer to help build our local engineering powerhouse from the ground up. This is a unique opportunity to take on meaningful product ownership in a new site, defining the backend execution and methodologies for chips that power the world's largest AI clusters.

As a Junior Physical Design Engineer, you will be a key architect of our silicon's physical reality. You won't just execute a flow-you will help establish our local execution culture and technical standards, owning the transformation of complex logic into high-performance silicon. You will drive the physical implementation journey from synthesis through signoff, ensuring our connectivity solutions meet the extreme performance, power, and area targets required for next-generation AI infrastructure. If you thrive on solving complex challenges in deep-submicron processes and want to shape the backend methodology for AI infrastructure connectivity, this is your opportunity.

Key Responsibilities

Physical Implementation & Execution
Be part of the founding Backend team in Israel, playing a critical role in establishing local execution culture and technical standards
Take full responsibility for physical implementation journey including Synthesis, Floorplanning, Place & Route, and Clock-Tree Synthesis (CTS)
Own macro-level implementation with deep hands-on experience in floorplanning and complex routing.

Signoff & Design Integrity
Drive final stages of design integrity, owning Timing signoff (STA), Physical Verification (DRC/LVS), and Reliability analysis (EMIR)
Ensure first-pass silicon success through rigorous signoff flows and analysis
Apply Logic Equivalence Checking (LEC) and other verification techniques to guarantee design correctness.

Methodology Development & Cross-Functional Collaboration
Participate in defining and refining Backend methodologies with autonomy to improve workflows and tool automation.
Work closely with Architecture, Design, and DFT teams to navigate challenges of advanced process nodes and high-speed connectivity.
Leverage scripting and automation to make engineering environment faster and more robust.
Requirements:
Basic Qualifications
Bachelors degree in Electrical Engineering or a related technical field.
Foundational understanding of the RTL-to-GDS flow, with academic or internship exposure to areas such as floorplanning, placement, and routing
Familiarity with advanced process technologies (e.g., 7nm and below) through coursework or hands-on projects.
Basic experience with signoff methodologies and tools, including STA, Logic Equivalence Checking (LEC), DRC, and EMIR analysis.
Working knowledge of TCL or Python scripting for simple automation and support of EDA tool flows.

Preferred Qualifications
Experience with full-chip level implementation and integration.
Knowledge of Power and Noise analysis (SI/PI) to optimize high-performance silicon.
Familiarity with Design-for-Test (DFT) requirements and their impact on physical layout.
Experience with industry-standard EDA tools (Synopsys Fusion Compiler/ICC2, Cadence Innovus).
Background in high-speed interface designs or connectivity protocols.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
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לפני 2 שעות
חברה חסויה
Location: Tel Aviv-Yafo and Caesarea
Job Type: Full Time
Write and review micro-architecture specifications
Implement RTL (Verilog/SystemVerilog) to meet timing, performance, and power requirements
Contribute to full chip integration, timing methodology, and analysis
Collaborate with verification engineers to resolve bugs and achieve coverage closure
Work with the physical design team to close timing and PnR issues
Support design methodology evolution and best practices
Perform debug, root-cause analysis, and post-silicon validation in the lab
Requirements:
B.Sc./M.Sc. in Electrical Engineering from a top university
6+ years of experience in a relevant field
RTL design experience
Familiarity with UVM and functional verification methodologies
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
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5 ימים
Location: Tel Aviv-Yafo
Job Type: Full Time
As we expand our presence in Israel, we're seeking a talented Staff / Principal ASIC Design Engineer to help build our local engineering powerhouse from the ground up. This is an exciting opportunity to take on meaningful product ownership in a new site, designing the digital blocks that sit at the heart of our most ambitious connectivity projects.

As a Staff / Principal ASIC Design Engineer, you won't just build chips-you will be part of a team defining the next generation of AI infrastructure main components. The complex digital blocks under your micro-architecture and implementation responsibilities will power the world's largest AI clusters. You will own the journey from high-level definition through RTL implementation and backend support, transforming complex logic challenges into elegant, high-performance hardware. If you thrive on solving challenging problems in deep-submicron processes and want to contribute to the digital design foundation for AI infrastructure connectivity, this is your opportunity.

Key Responsibilities

Design Ownership & Implementation
Own the journey from high-level definition through micro-architecture, coding, and debug to backend implementation support.
Tackle complex logic challenges and transform them into elegant, high-performance hardware solutions.
Serve as the point of contact for your logic blocks, interacting with Architecture, Verification, and Backend teams.

Quality Assurance & Design Optimization
Utilize industry-leading EDA tools (Lint, CDC, Synthesis, Timing, Power) and in-house quality assurance tools to ensure designs are robust, scalable, and power-efficient.
Apply design techniques to meet PPA (Power, Performance, Area) targets.
Contribute to design quality through verification and validation activities.

Methodology Innovation & Collaboration
Participate in design methodology improvements and tool automation initiatives.
Leverage AI assistance tools and contribute to in-house automation development to make engineering workflows faster and smarter.
Collaborate effectively across teams to ensure seamless integration.
Requirements:
Basic Qualifications
Bachelor's degree in Electrical Engineering or related technical field.
5+ years of experience in logic design at semiconductor companies.
Knowledge and experience in Verilog and/or SystemVerilog.
Excellent communication skills with ability to work effectively across teams.
Understanding of digital design principles and RTL coding best practices.

Preferred Qualifications
Master's degree in Electrical Engineering or related field.
Knowledge of DDR and PCIe protocols and implementation.
Understanding of power management techniques for low-power design.
Familiarity with Clock Domain Crossing, simulation, debugging, synthesis, and timing analysis.
Proficiency in scripting languages such as Python or Perl.
Experience with high-speed serial interface designs or connectivity protocols.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
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5 ימים
חברה חסויה
Location: Tel Aviv-Yafo
Job Type: Full Time
As we expand our presence in Israel, we're seeking a visionary Principal DFT Engineer to help build our local engineering powerhouse from the ground up. This is a unique opportunity to take on meaningful product ownership in a new site, ensuring the reliability and testability of chips that power the world's largest AI clusters.

As a Principal DFT Engineer, you will provide technical leadership across the full DFT lifecycle-from architecture and specification through implementation, verification, and silicon bring-up. You will define and drive DFT strategy, establish robust methodologies, and lead execution to ensure high test quality and manufacturability. This role requires deep expertise, cross-functional influence, and the ability to drive DFT excellence across projects and teams.
This is a critical leadership position with high impact on first-pass silicon success and production quality for next-generation AI connectivity solutions.
Key Responsibilities

DFT Architecture & Technical Leadership
Define and own DFT architecture for complex SoCs, including Scan, MBIST, LBIST, JTAG/iJTAG, and ATPG strategies.
Lead DFT planning, specification, and quality tracking across the project lifecycle.
Provide technical leadership and drive DFT sign-off readiness to ensure successful tapeout.

Execution Across the Full Lifecycle
Lead DFT implementation, integration, and verification at block, full-chip and chiplet levels.
Own end-to-end DFT activities from specification through silicon bring-up and production support.
Ensure high test coverage, robust pattern generation, and alignment with manufacturing requirements.

Methodology & Cross-Functional Impact
Develop and drive scalable DFT methodologies, flows, and automation frameworks.
Collaborate closely with RTL, Physical Design, STA, and Test Engineering teams to ensure design-for-test readiness.
Optimize DFT integration across front-end and backend flows to improve quality, PPA, and turnaround time.
Requirements:
Basic Qualifications
Bachelors degree in Electrical Engineering or related technical field (Masters preferred).
12+ years of experience in DFT design, implementation, and verification for complex ASIC/SoC designs.
Proven experience in leading DFT activities across full chip development cycles.
Deep expertise in DFT techniques including Scan, MBIST, LBIST, JTAG/iJTAG, and ATPG.
Strong understanding of DFT and Physical Design flows, including timing implications and integration challenges.
Experience with industry-standard DFT tools (Siemens Tessent, Synopsys TestMAX or equivalent).
Solid experience with DFT verification methodologies and coverage analysis.
Strong scripting skills (Tcl, Python, or Perl) for automation and flow development.

Preferred Qualifications
Experience with advanced process nodes (7nm and below).
Background in high-speed connectivity designs (PCIe, Ethernet, CXL, or similar).
Experience with hierarchical DFT methodologies and large multi-die or chiplet-based systems.
Knowledge of silicon bring-up, production test flows, and yield optimization.
Familiarity with STA, low-power design, and CDC as it relates to DFT integration.
Strong leadership and communication skills, with ability to influence cross-functional teams globally.
This position is open to all candidates.
 
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עדכון קורות החיים לפני שליחה
עדכון קורות החיים לפני שליחה
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