Design high-performance analog and mixed-signal ICs optimized for precision, power, and area, driving prototype and product iterations from architecture to silicon validation.

Responsibilities
Design and simulate analog and RF integrated circuits, including critical blocks such as amplifiers, mixers, PLLs, ADCs, DACs, and bias/reference circuits, with a focus on signal integrity, linearity, and precision.

Optimize circuits for power, area, and performance trade-offs, ensuring designs meet system-level requirements across process, voltage, and temperature (PVT) variations.

Collaborate closely with optics, simulation and PCB teams to define architecture and block-level specifications for successive prototypes and product iterations, ensuring tight alignment with overall performance and integration goals.

Work with layout engineers to guide floor-planning and physical design, minimizing parasitic effects and preserving analog precision in layout-sensitive blocks.

Support post-silicon validation and bring-up, defining test plans, analyzing lab measurements, and correlating results with simulation to refine future design iterations.

Language: English at a proficient level. French is a plus.

Required Signal/Power Integrity Engineer, PhD Graduate
About the job
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
Responsibilities:
Simulate high speed interface electrical behavior using HSPICE or other circuit simulators.
Generate precise electrical models (e.g., S-parameters, SPICE models) for components such as packages, PCBs, and connectors for use in simulations.
Collaborate extensively with cross-functional teams, including ASIC architects, digital/analog designers, physical design/layout engineers, and system engineers, to define specifications and resolve integration challenges.
Execute lab measurements utilizing test equipment like oscilloscopes, Vector Network Analyzers (VNA), Time Domain Reflectometers (TDR) , Spectrum analyzers to validate simulation outcomes and debug signal and power-related issues on silicon prototypes and boards.
Establish robust design rules and guidelines for optimal signal/power integrity during PCB and package layout, ensuring high production yield and reliability.

We are looking for exceptional talent to join our team as a Hardware Engineer.
Your Day to Day:
Lead end-to-end hardware development, from architecture and design to testing and production
Design and develop complex electronic systems, including schematics, PCB layout guidance, and component selection
Drive system integration, bring-up, debugging, and validation processes
Collaborate with firmware, software, mechanical, and product teams to ensure seamless system performance
Identify technical risks and propose effective mitigation strategies
Support manufacturing, including design for manufacturability (DFM) and design for testability (DFT)
Analyze and improve system performance, reliability, and cost
Mentor junior engineers and contribute to team knowledge sharing

As we expand our presence in Israel, we're seeking a visionary Expert IC Package Design Lead to help build our local engineering powerhouse from the ground up. This is a unique opportunity to take on meaningful product ownership in a new site, leading the physical implementation strategy for chips that power the world's largest AI clusters.

As an Expert IC Package Design Lead, you will be a core technical contributor in the development of advanced IC packaging solutions for high-performance connectivity silicon.
You will own package flow, architecture, design, and qualification from concept through production, working closely with silicon, signal integrity, power integrity, mechanical, manufacturing, and external OSAT partners. You will be responsible for defining package technologies that meet aggressive electrical, thermal, mechanical, and cost targets, enabling our products to operate reliably in the worlds most demanding AI and cloud environments.

Key Responsibilities
Own end-to-end IC package design, from early architecture and feasibility through detailed design, qualification, and high-volume manufacturing.
Define package architecture and technology selection (organic substrates, advanced laminate, interposers, multi-die/chiplet packaging, CoWoS - 2.5D/3D integration).
Lead signal integrity (SI), power integrity (PI), and thermal considerations at the package level for high-speed, high-power devices.
Drive package layout, substrate routing, bump/ball maps, stack-ups, materials selection, and mechanical constraints.
Collaborate closely with silicon design, SerDes, system, SI/PI, and reliability teams to optimize overall product performance.
Interface with OSATs, substrate vendors, and manufacturing partners to ensure design-for-manufacturability (DFM), yield, and cost targets.
Lead package-related risk assessment, failure analysis, and corrective actions during bring-up and production ramp.
Support NPI, qualification, and product sustainment activities, including vendor audits and technical reviews.

In this role, you will contribute to the development of complex ASIC package designs from early planning and exploration through implementation and tapeout. You will collaborate across package design, layout, SI/PI, and silicon teams to help deliver high‑speed, robust, and manufacturable package solutions.

You will participate in package architecture activities, design tradeoff discussions, and technical problem solving while growing your expertise in advanced packaging technologies and system-level integration. This role provides an opportunity to work on some of the most advanced networking silicon products in the industry within a highly collaborative engineering environment.

Responsibilities:
As a member of the Package Design team, you will:

Lead the package design activities including planning, floorplanning, pinout optimization, stack‑up definition, and high‑speed routing support.

Collaborate with SI/PI, silicon floorplanning, layout, and manufacturing teams to ensure high‑quality package solutions.

Support package implementation activities and work closely with layout designers to ensure alignment between design intent and physical implementation.

Participate in technical investigations, design reviews, and tradeoff discussions involving performance, manufacturability, and schedule considerations.

Assist in developing and improving package design methodologies, flows, and best practices.

Contribute to debugging, issue resolution, and package bring‑up activities as needed.

We are looking for a hands-on FPGA Design Engineer, specialized in high-performance digital design and FPGA-based system development, as part of the QM-Platform team.

This role involves ownership of FPGA interfaces and connectivity logic, including high-speed communication blocks, platform integration, and close collaboration with embedded and hardware teams. You will work on complex FPGA/SoC platforms, enabling robust and scalable solutions for quantum control systems.

Responsibilities

Own the design and implementation of FPGA-based interfaces such as PCIe, I2C, SPI, and high-speed GT communication.
Develop and integrate FPGA logic on advanced platforms, including Xilinx UltraScale+ and Versal.
Collaborate closely with embedded, hardware, and system teams to ensure seamless HW/SW/FPGA integration.
Drive FPGA bring-up, debugging, and validation at both lab and system levels.
Participate in system architecture definition and cross-team design decisions.

Required Senior DDR Design Verification Engineer, Cloud
About the job
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
In this role, you will work as part of a Research and Development team. You will build verification components, constrained-random testing, and system testing. You will verify digital designs, collaborate closely with colleagues on projects, and perform direct validation. You will construct testbenches that exercise hardware through corner-cases and expose bugs. You will manage the full life-cycle from planning and execution to closing coverage.
Responsibilities
Plan the verification of digital design blocks by fully understanding the design specification and interacting with design engineers to identify important verification scenarios.
Create and enhance constrained-random verification environments using SystemVerilog and UVM, or formally verify designs with SVA and industry leading formal tools.
Identify and write all types of coverage measures for corner-cases.
Debug tests with design engineers to deliver functionally correct design blocks.
Close coverage measures to identify verification holes and to show progress towards tape-out.

Required RTL Design Technical Lead, Networking, Cloud
About the job
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
As part of our Server Chip Design team, you will use your ASIC design experience to be part of a team that creates the SoC VLSI design cycle from start to finish. You will collaborate closely with design and verification engineers in active projects, creating architecture definitions with RTL coding, and running block level simulations.
In this role, you will contribute in all phases of Application-Specific Integrated Circuit (ASIC) designs from design specification to production. You will collaborate with members of architecture, software, verification, power, timing, synthesis, etc. to specify and deliver high quality SoC/RTL. You will solve technical problems with innovative micro-architecture and practical logic solutions, and evaluate design options with complexity, performance, power and area in mind.
Responsibilities:
Define the block level design documents such as interface protocol, block diagram, transaction flow, pipeline, and more.
Perform RTL development (e.g., coding and debug in Verilog, SystemVerilog, VHDL), function/performance simulation debug, and Lint/CDC/FV/UPF checks.
Participate in synthesis, timing/power, and FPGA/silicon bring-up.
Participate in test plan and coverage analysis of the block and SOC-level verification.
Communicate and work with multi-disciplined and multi-site teams.

Required Hardware/Electrical Engineering BS/MS Intern, 2027
Please complete your application before November 13, 2026. We encourage you to apply as early as possible as we review applications on a rolling basis.
About the job
The Cloud and AI Infrastructure team in Israel focuses on building our next-generation systems. The team's work is grounded in creating custom hardware, and as an Intern, you'll get to collaborate with engineers from various parts of the organization to influence the future of Cloud and the AI infrastructure by working on the foundational technology that makes it all possible. This is the hardware that powers everything, from Cloud to our most advanced models like Gemini.
As an Electrical Engineering Intern in the domain of Very Large-Scale Integration (VLSI), you will work on designing, developing and verifying next generation chips for our Cloud Compute Infrastructure. You will have the opportunity to collaborate with engineers from various parts of the organisation to help develop our next generation systems on chip (SOC).
Responsibilities:
Responsibilities and detailed projects will be determined based on your educational background, interest and skills.