we are looking for a talented Hardware Board Designer to join our multidisciplinary R&D team. This is an exciting opportunity to take part in the design and development of advanced electronic systems, working alongside hardware, firmware, software, and system engineers from concept through integration.
We are looking for a creative, hands-on engineer with a passion for hardware design and a desire to work on cutting-edge technologies.
Responsibilities
Design and develop complex electronic boards from concept to production.
Perform hands-on schematic design and component selection.
Support and guide PCB layout activities.
Prepare and present design reviews.
Collaborate closely with firmware, software, RF, and system engineering teams to ensure successful system integration.
Develop advanced multidisciplinary systems incorporating:
CPUs / SoCs
FPGA-based designs
Analog and mixed-signal circuits
High-speed interfaces (DDR, PCIe, Ethernet, LVDS, etc.)
RF transmit and receive chains
Filters and amplifier circuits
Power supply and power management circuits
Support board bring-up, debugging, validation, and troubleshooting.

We are looking for a Senior Electrical Engineer to join our Sustaining Engineering team and play a key role in supporting the ongoing evolution of our company's innovative cancer treatment systems.
In this role, you will lead electrical engineering activities across design transfer and sustaining engineering, ensuring our products successfully transition from development into manufacturing while maintaining the highest standards of quality, reliability, manufacturability, and regulatory compliance.
Working closely with R&D, Manufacturing, Quality, and external suppliers, you will combine hands-on engineering with technical leadership to drive robust product solutions throughout the product lifecycle.
This is an excellent opportunity for an experienced engineer who enjoys solving complex technical challenges, mentoring others, and collaborating across multidisciplinary teams to bring life-changing medical technologies to patients worldwide.
What you will do:
Lead electrical engineering activities for Design Transfer and Sustaining Engineering projects.
Provide technical leadership and mentorship to electrical engineers within the DT & Sustaining Engineering team.
Serve as the company's subject matter expert for electrical design, supporting Design Transfer and Production activities.
Lead the transfer of electrical designs from R&D into manufacturing, ensuring manufacturability, quality, and reliability.
Partner with R&D teams to provide Design for Manufacturing (DFM) recommendations early in the development process.
Maintain and improve PCB and electrical board designs to support product robustness, manufacturability, and cost-effectiveness.
Define electrical project requirements, timelines, and budgets.
Generate and maintain complete production documentation, including PCB documentation, PCBA files, BOMs, assembly drawings, and work instructions.
Work closely with suppliers and manufacturing subcontractors throughout the product lifecycle.
Perform hands-on electrical design, testing, validation, and troubleshooting.
Develop and execute electrical test procedures and generate technical documentation and test reports.
Lead electrical design reviews and provide technical guidance to cross-functional teams.

Required Power and Signal Integrity Engineer
About the job
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
Our mission is to organize the world's information and make it universally accessible and useful. Our team combines the best of AI, Software, and Hardware to create radically helpful experiences. We research, design, and develop new technologies and hardware to make computing faster, seamless, and more powerful. We aim to make people's lives better through technology.
As a Power and Signal Integrity Engineer, you will be responsible for the design and characterization of signal and power integrity of our IC designs. You will design the external electrical interfaces of the device, from their Signal/Power-integrity and electrical usage perspectives.
You'll set up methodologies, perform simulations, silicon characterization and correlations to ensure our IC designs meet systems design budgets and achieve the highest performance. You will work with systems architects, ASIC design, systems engineers, and partner cross-functionally with teams and external vendors/partners.
The ML, Systems, & Cloud AI (MSCA) organization designs, implements, and manages the hardware, software, machine learning, and systems infrastructure for all services (Search, YouTube, etc.) and Cloud.
We prioritize security, efficiency, and reliability across everything we do - from developing our latest TPUs to running a global network, while driving towards shaping the future of hyperscale computing. Our global impact spans software and hardware, including Clouds Vertex AI, the leading AI platform for bringing Gemini models to enterprise customers.
Responsibilities:
Design and optimize power distribution networks (PDN) across chip, package, and board levels. This includes managing power/ground planes, decoupling capacitors, and power gating strategies.
Conduct both pre-layout and post-layout power integrity simulations to analyze power and ground noise (SSN/SSO), voltage drops (IR drop), and electromagnetic interference (EMI).
Implement and verify low-power design methodologies, such as multi-voltage designs and clock gating, using power intent formats like UPF/CPF.
Generate precise electrical models (e.g., S-parameters, SPICE models) for components such as packages, PCBs, and connectors for use in simulations.
Execute lab measurements utilizing test equipment like oscilloscopes, Vector Network Analyzers (VNA), Time Domain Reflectometers (TDR), Spectrum analyzers to validate simulation outcomes and debug signal and power-related issues on silicon prototypes and boards.

we are looking for a Staff Systems Engineer.
As a Staff Systems Engineer, you will be a critical contributor on our Electrophysiology Systems Engineering team focused on delivering the future in Advanced Imaging. This role will involve a range of responsibilities including but not limited to collaborating and leading teams in the strategy, development and analysis of system architecture, system performance and system integration for our next generation products including various imaging modalities such as echocardiography, CT, MRI, and 3D cardiac mapping. In this role you will be a key member of product development team to bring systems from concept to launch.
Duties and Responsibilities:
Define and influence, and drive execution of technical strategy for system-level programs while partnering with cross-functional stakeholders on business strategy and product roadmaps.
Utilize multidisciplinary engineering knowledge and experience to design, develop, and troubleshoot new products specific to cardiac mapping and advanced imaging.
Provide system engineering leadership and take ownership for overall project success for new products and features from concept phase through launch.
Work with Product Marketing, Clinical Engineering, and Key Opinion Leaders to develop design input requirements from user and business needs.
Communicate with Sr. Management including technical presentations, status updates, and program reviews.
Lead project-level system architecture, system behavior definition, and tradeoff analysis activities utilizing Model-Based Systems Engineering (MBSE) methodologies, including use case modeling, requirements traceability, system architecture modeling, and interface definition.
Lead cross-functional working groups to solve complex problems, mitigate risks, and develop strategies to overcome challenges.
Plan, manage, and report on overall systems integration activities including root cause analysis and solution generation.
Identify, communicate, and proactively manage technical, integration, and program risks throughout the product development lifecycle.
Provide input into the technology and product roadmaps.
Be a strong team player and lead cross-functional teams to resolve issues and meet budget and schedule requirements.
Create a positive, collaborative culture amongst the technical teams while working to solve challenging engineering problems.
Mentor engineers across multiple disciplines and serve as a technical leader driving engineering excellence, sound systems thinking, and effective technical decision-making.
Ensure compliance with procedural and documentation requirements of , FDA, ISO and other regulatory bodies.

We are seeking a Package Layout Design Engineer to join our hardware team and contribute to the physical design of advanced IC packages for next-generation machine learning and data center ASICs.
In this role, you will execute package layout tasks from floor planning through tape out and manufacturing release, working closely with senior engineers, SI/PI, thermal, and manufacturing teams to deliver production-ready designs that meet performance, density, and reliability targets.

Key job responsibilities
- Execute package layout tasks across the design cycle: die floor planning, bump/pad assignment, RDL routing, substrate design, verification, and tape out release.
- Implement physical designs for advanced packaging architectures including 2.5D interposer, 3D-IC, fan-out wafer-level packaging, and silicon bridge technologies (e.g., CoWoS, EMIB, or similar).
- Support package floorplan development considering die placement, bump maps, power/ground distribution, signal escape routing, and decoupling capacitor placement.
- Perform RDL and substrate routing for high-density interconnects including microbumps, C4 bumps, TSVs, microvias, and PTH vias across multi-layer organic substrates or silicon interposers.
- Support die-level RDL routing and bump planning in coordination with ASIC physical design teams to help co-optimize the die-package interface.
- Contribute to cross-level layout co-optimization across die RDL, interposer/substrate, and PCB levels under guidance from senior engineers.
- Assist in maintaining package stack-up definitions in collaboration with SI/PI and materials engineering teams.
- Run physical verification checks (DRC, connectivity, shorts/opens) and support design closure.
- Follow and help refine package design rules and guidelines, working with OSAT partners and foundries to ensure DFM compliance.
- Collaborate with SI/PI engineers to incorporate electrical constraints into the physical layout - impedance-controlled routing, power plane optimization, and critical net shielding.

We're looking for exceptional engineers to join our Signal/Power-Integrity and Packaging team. A team that sits where the Silicon meets the Board, bridging the gap between what happens internally at the DIE and the overall system interconnect and the external memories and peer devices.
What sets us apart:
Small team, yet a one stop shop for IP electrical integration at the DIE level, Package design, SI/PI simulations, Layout, Board-design and advanced lab characterization.
Combining Signal-Integrity and Layout, to come up with optimized Package and PCB designs.
Holistic view of the entire interconnect, from the DIEs metals, through the Package, to the PCB traces, and all the way to the peer device.
In-depth post-silicon characterization, using advanced measurement techniques, far exceeding traditional compliance measurements.
Deep dive mentality, in both theory and the bolts and nuts that make the internal circuitry of the electrical interfaces.

The SIP (Signal-Integrity & Packaging) team is part of Annapurna-Labs Chip development team.
The team is dealing with the external electrical interfaces of the device, from their Signal/Power-integrity and electrical usage perspectives.
The teams work includes close work with the BackEnd team on integrating these interfaces to the Die, the package layout design of the BGAs substrate, Signal and power integrity simulations, and working with the system team to come up with optimal pin-out and optimal PCB breakout schemes.
We are looking for highly motivated Electrical Engineering graduates, or engineers with up to 3 years' experience in related fields, to join our growing team specializing in Signal Integrity and IC Package Design. The position offers a unique entry point into a diverse and multidisciplinary domain.

Key job responsibilities
Work on advanced high-speed interfaces such as PCIe, DDR and Ethernet.
End-to-end solution of high-speed interfaces; from floor-planning at the DIE level, through Package and PCB routing, addressing both robust SI/PI considerations as well as optimizing layout routing.
Signal and power integrity modeling and simulation of high-speed interconnects using advanced SI/PI simulation tools.