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לפני 12 שעות
חברה חסויה
Location: Tel Aviv-Yafo
Job Type: Full Time
we are establishing a strategic R&D center in Israel to drive the development of complex semiconductor chips that solve the critical 'data bottlenecks' enabling the future of AI at scale. As we expand our presence in Israel, we're seeking a visionary DFT Engineer to help build our local engineering powerhouse from the ground up. This is a unique opportunity to take on meaningful product ownership in a new site, ensuring the reliability and testability of chips that power the world's largest AI clusters.
As a DFT Engineer at our company, you will be at the intersection of architecture, design, and production. You won't just run tools-you will be a foundational member of the team responsible for the entire lifecycle of our silicon's reliability. From defining initial DFT architecture to supporting post-silicon bring-up, your work ensures that the backbone of AI infrastructure connectivity is flawless and scalable. If you thrive on solving complex challenges in deep-submicron processes and want to establish world-class DFT methodologies, this is your opportunity.
Key Responsibilities
DFT Architecture & Strategy
Be part of the DFT journey from high-level architecture definition and RTL design to backend implementation and post-production support
Develop comprehensive Design-for-Testability (DFT) strategies for next-generation connectivity platforms, ensuring chips meet the highest quality standards
Design and implement DFT architectures including JTAG/iJTAG, MBIST, Scan, and ATPG for high-end devices
Test Pattern Development & Optimization
Generate and optimize high-quality test and debug patterns for production
Perform Static Timing Analysis (STA) for DFT modes and conduct gate-level simulations to ensure robust performance
Drive test coverage and quality metrics to meet stringent manufacturing requirements
Cross-Functional Collaboration & Methodology Innovation
Act as a multidisciplinary bridge, collaborating closely with Architecture, Verification, and Backend teams to ensure seamless integration and optimal QoR
Participate in developing and maintaining cutting-edge DFT implementation flows
Automate and improve methodologies using advanced scripting and tools.
Requirements:
Bachelor's degree in Electrical Engineering or related technical field
4+ years of hands-on experience in DFT roles at semiconductor companies
Experience in DFT flows and architectures including JTAG/iJTAG, MBIST, Scan, and ATPG
Good understanding of logic design, verification, debug, and Static Timing Analysis (STA)
Scripting proficiency in Tcl, Perl, Python, or Shell for automation and innovation
Preferred Qualifications
Master's degree in Electrical Engineering or related field
Experience with industry-standard EDA tools from Synopsys (TestMAX) or Siemens (Tessent)
Experience in chip bring-up and mass production activities
Background in advanced process technologies (7nm and below)
Knowledge of high-speed interface protocols (PCIe, Ethernet, CXL, UALink) and their specific test requirements
Excellent communication skills with ability to work effectively in global team environments.
This position is open to all candidates.
 
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1 ימים
חברה חסויה
Location: Tel Aviv-Yafo
Job Type: Full Time
we are establishing a strategic R&D center in Israel to drive the development of complex semiconductor chips that solve the critical 'data bottlenecks' enabling the future of AI at scale. As we expand our presence in Israel, we're seeking a visionary Staff DFT Engineer to help build our local engineering powerhouse from the ground up. This is a unique opportunity to take on meaningful product ownership in a new site, ensuring the reliability and testability of chips that power the world's largest AI clusters.
As a Staff DFT Engineer at our company Labs, you will be at the intersection of architecture, design, and production. You won't just run tools-you will be a foundational member of the team responsible for the entire lifecycle of our silicon's reliability. From defining initial DFT architecture to supporting post-silicon bring-up, your work ensures that the backbone of AI infrastructure connectivity is flawless and scalable. If you thrive on solving complex challenges in deep-submicron processes and want to establish world-class DFT methodologies, this is your opportunity.
Key Responsibilities
DFT Architecture & Strategy
Own the DFT journey from high-level architecture definition and RTL design to backend implementation and post-production support
Develop comprehensive Design-for-Testability (DFT) strategies for next-generation connectivity platforms, ensuring chips meet the highest quality standards
​DFT architectures including JTAG/iJTAG, MBIST, Scan, and ATPG methodologies
Test Pattern Development & Optimization
Generate and optimize high-quality test and debug patterns for production
Perform Static Timing Analysis (STA) for DFT modes and conduct gate-level simulations to ensure robust performance
Drive test coverage and quality metrics to meet stringent manufacturing requirements
Cross-Functional Collaboration & Methodology Innovation
Act as a multidisciplinary bridge, collaborating closely with Architecture, Verification, and Backend teams to ensure seamless integration and optimal QoR
Participate in developing and maintaining cutting-edge DFT implementation flows
Automate and improve methodologies using advanced scripting and tools.
Requirements:
Bachelor's degree in Electrical Engineering or related technical field
8+ years of hands-on experience in DFT roles at semiconductor companies
Deep expertise in DFT flows and architectures including JTAG/iJTAG, MBIST, Scan, and ATPG
Proficiency with industry-standard EDA tools from Synopsys (TestMAX) or Mentor (Tessent)
Strong understanding of logic design, verification, debug, and Static Timing Analysis (STA)
Scripting proficiency in Tcl, Perl, Python, or Shell for automation and innovation
Preferred Qualifications
Master's degree in Electrical Engineering or related field
Knowledge of high-speed interface protocols (PCIe, Ethernet, CXL, UALink) and their specific test requirements
Experience in chip bring-up and mass production activities
Background in advanced process technologies (7nm and below)
Excellent communication skills with ability to work effectively in global team environments.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
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לפני 12 שעות
חברה חסויה
Location: Tel Aviv-Yafo
Job Type: Full Time
we are establishing a strategic R&D center in Israel to drive the development of complex semiconductor chips that solve the critical 'data bottlenecks' enabling the future of AI at scale. As we expand our presence in Israel, we're seeking a visionary Principal DFT Engineer to help build our local engineering powerhouse from the ground up. This is a unique opportunity to take on meaningful product ownership in a new site, ensuring the reliability and testability of chips that power the world's largest AI clusters.
As a Principal DFT Engineer, you will provide technical leadership across the full DFT lifecycle-from architecture and specification through implementation, verification, and silicon bring-up. You will define and drive DFT strategy, establish robust methodologies, and lead execution to ensure high test quality and manufacturability. This role requires deep expertise, cross-functional influence, and the ability to drive DFT excellence across projects and teams.
This is a critical leadership position with high impact on first-pass silicon success and production quality for next-generation AI connectivity solutions.
Key Responsibilities
DFT Architecture & Technical Leadership
Define and own DFT architecture for complex SoCs, including Scan, MBIST, LBIST, JTAG/iJTAG, and ATPG strategies
Lead DFT planning, specification, and quality tracking across the project lifecycle
Provide technical leadership and drive DFT sign-off readiness to ensure successful tapeout
Execution Across the Full Lifecycle
Lead DFT implementation, integration, and verification at block, full-chip and chiplet levels
Own end-to-end DFT activities from specification through silicon bring-up and production support
Ensure high test coverage, robust pattern generation, and alignment with manufacturing requirements
Methodology & Cross-Functional Impact
Develop and drive scalable DFT methodologies, flows, and automation frameworks
Collaborate closely with RTL, Physical Design, STA, and Test Engineering teams to ensure design-for-test readiness
Optimize DFT integration across front-end and backend flows to improve quality, PPA, and turnaround time.
Requirements:
Bachelors degree in Electrical Engineering or related technical field (Masters preferred)
12+ years of experience in DFT design, implementation, and verification for complex ASIC/SoC designs
Proven experience in leading DFT activities across full chip development cycles
Deep expertise in DFT techniques including Scan, MBIST, LBIST, JTAG/iJTAG, and ATPG
Strong understanding of DFT and Physical Design flows, including timing implications and integration challenges
Experience with industry-standard DFT tools (Siemens Tessent, Synopsys TestMAX or equivalent)
Solid experience with DFT verification methodologies and coverage analysis
Strong scripting skills (Tcl, Python, or Perl) for automation and flow development
Preferred Qualifications
Experience with advanced process nodes (7nm and below)
Background in high-speed connectivity designs (PCIe, Ethernet, CXL, or similar)
Experience with hierarchical DFT methodologies and large multi-die or chiplet-based systems
Knowledge of silicon bring-up, production test flows, and yield optimization
Familiarity with STA, low-power design, and CDC as it relates to DFT integration
Strong leadership and communication skills, with ability to influence cross-functional teams globally.
This position is open to all candidates.
 
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לפני 12 שעות
חברה חסויה
Location: Tel Aviv-Yafo
Job Type: Full Time
we are establishing a strategic R&D center in Israel to drive the development of complex semiconductor chips that solve the critical 'data bottlenecks' enabling the future of AI at scale. As we expand our presence in Israel, we're seeking a visionary Junior Physical Design Engineer to help build our local engineering powerhouse from the ground up. This is a unique opportunity to take on meaningful product ownership in a new site, defining the backend execution and methodologies for chips that power the world's largest AI clusters.
As a Junior Physical Design Engineer, you will be a key architect of our silicon's physical reality. You won't just execute a flow-you will help establish our local execution culture and technical standards, owning the transformation of complex logic into high-performance silicon. You will drive the physical implementation journey from synthesis through signoff, ensuring our connectivity solutions meet the extreme performance, power, and area targets required for next-generation AI infrastructure. If you thrive on solving complex challenges in deep-submicron processes and want to shape the backend methodology for AI infrastructure connectivity, this is your opportunity.
Key Responsibilities
Physical Implementation & Execution
Be part of the founding Backend team in Israel, playing a critical role in establishing local execution culture and technical standards
Take full responsibility for physical implementation journey including Synthesis, Floorplanning, Place & Route, and Clock-Tree Synthesis (CTS)
Own macro-level implementation with deep hands-on experience in floorplanning and complex routing
Signoff & Design Integrity
Drive final stages of design integrity, owning Timing signoff (STA), Physical Verification (DRC/LVS), and Reliability analysis (EMIR)
Ensure first-pass silicon success through rigorous signoff flows and analysis
Apply Logic Equivalence Checking (LEC) and other verification techniques to guarantee design correctness
Methodology Development & Cross-Functional Collaboration
Participate in defining and refining Backend methodologies with autonomy to improve workflows and tool automation
Work closely with Architecture, Design, and DFT teams to navigate challenges of advanced process nodes and high-speed connectivity
Leverage scripting and automation to make engineering environment faster and more robust.
Requirements:
Bachelors degree in Electrical Engineering or a related technical field
Foundational understanding of the RTL-to-GDS flow, with academic or internship exposure to areas such as floorplanning, placement, and routing
Familiarity with advanced process technologies (e.g., 7nm and below) through coursework or hands-on projects
Basic experience with signoff methodologies and tools, including STA, Logic Equivalence Checking (LEC), DRC, and EMIR analysis
Working knowledge of TCL or Python scripting for simple automation and support of EDA tool flows
Preferred Qualifications
Experience with full-chip level implementation and integration
Knowledge of Power and Noise analysis (SI/PI) to optimize high-performance silicon
Familiarity with Design-for-Test (DFT) requirements and their impact on physical layout
Experience with industry-standard EDA tools (Synopsys Fusion Compiler/ICC2, Cadence Innovus)
Background in high-speed interface designs or connectivity protocols.
This position is open to all candidates.
 
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מודים לך שלקחת חלק בשיפור התוכן שלנו :)
1 ימים
Location: Tel Aviv-Yafo
Job Type: Full Time
we are establishing a strategic R&D center in Israel to drive the development of complex semiconductor chips that solve the critical 'data bottlenecks' enabling the future of AI at scale. As we expand our presence in Israel, we're seeking a talented Staff / Principal ASIC Design Engineer to help build our local engineering powerhouse from the ground up. This is an exciting opportunity to take on meaningful product ownership in a new site, designing the digital blocks that sit at the heart of our most ambitious connectivity projects.
As a Staff / Principal ASIC Design Engineer, you won't just build chips-you will be part of a team defining the next generation of AI infrastructure main components. The complex digital blocks under your micro-architecture and implementation responsibilities will power the world's largest AI clusters. You will own the journey from high-level definition through RTL implementation and backend support, transforming complex logic challenges into elegant, high-performance hardware. If you thrive on solving challenging problems in deep-submicron processes and want to contribute to the digital design foundation for AI infrastructure connectivity, this is your opportunity.
Key Responsibilities
Design Ownership & Implementation
Own the journey from high-level definition through micro-architecture, coding, and debug to backend implementation support
Tackle complex logic challenges and transform them into elegant, high-performance hardware solutions
Serve as the point of contact for your logic blocks, interacting with Architecture, Verification, and Backend teams
Quality Assurance & Design Optimization
Utilize industry-leading EDA tools (Lint, CDC, Synthesis, Timing, Power) and in-house quality assurance tools to ensure designs are robust, scalable, and power-efficient
Apply design techniques to meet PPA (Power, Performance, Area) targets
Contribute to design quality through verification and validation activities
Methodology Innovation & Collaboration
Participate in design methodology improvements and tool automation initiatives
Leverage AI assistance tools and contribute to in-house automation development to make engineering workflows faster and smarter
Collaborate effectively across teams to ensure seamless integration.
Requirements:
Bachelor's degree in Electrical Engineering or related technical field
5+ years of experience in logic design at semiconductor companies
Knowledge and experience in Verilog and/or SystemVerilog
Excellent communication skills with ability to work effectively across teams
Understanding of digital design principles and RTL coding best practices
Preferred Qualifications
Master's degree in Electrical Engineering or related field
Knowledge of DDR and PCIe protocols and implementation
Understanding of power management techniques for low-power design
Familiarity with Clock Domain Crossing, simulation, debugging, synthesis, and timing analysis
Proficiency in scripting languages such as Python or Perl
Experience with high-speed serial interface designs or connectivity protocols.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
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מודים לך שלקחת חלק בשיפור התוכן שלנו :)
1 ימים
Location: Tel Aviv-Yafo
Job Type: Full Time
we are establishing a strategic R&D center in Israel to drive the development of complex semiconductor chips that solve the critical 'data bottlenecks' enabling the future of AI at scale. As we expand our presence in Israel, we're seeking a highly skilled Static Timing Analysis (STA) Engineer to join our local engineering powerhouse from the ground up.
This is a unique opportunity to take on meaningful technical ownership in a new site, executing the sign-off methodology for chips that power the world's most advanced AI clusters. As an STA Engineer, you will be deeply involved in the STA activities from chip partition and time budgeting through to final sign-off. You will bridge the gap between Architecture, Design, DFT, and Physical Design to ensure our high-performance silicon meets the aggressive timing targets required for next-generation connectivity.
Key Responsibilities
Execute the STA flow and sign-off methodologies, ensuring our products meet rigorous timing criteria for the most demanding data center environments
Collaborate closely with Architecture, Design, DFT, and Backend teams, participating in timing reviews and working with block owners to navigate the path to sign-off convergence
Develop, optimize, and manage complex SDC constraints, ensuring they are accurate and robust across multi-scenario environments
Analyze and resolve challenges related to cross-chip clock distribution networks and apply sophisticated margining techniques to ensure robust silicon across all process corners
Participate in design methodology improvements and tool automation, utilizing both industry-standard EDA tools and custom scripts to make our sign-off process faster and more efficient.
Requirements:
B.Sc. in Electrical Engineering or Computer Engineering
6+ years of hands-on experience in Static Timing Analysis (STA) at semiconductor companies, specifically working on advanced process technologies. (Note: Adjust years of experience based on the exact level you are targeting)
Deep expertise in multi-scenario STA, as well as timing and SDC constraint development and verification at the block and subsystem levels
Solid understanding of advanced margining methodologies, including OCV, AOCV, and POCV, from synthesis through to final sign-off
Solid knowledge of physical design flows (Synthesis, P&R, Physical Verification) and how they intersect with timing closure
Preferred Experience
Experience developing and validating constraints using industry-standard tools like Timing Constraints Manager (Synopsys) or TimeVision (Ausdia)
Proven track record of executing STA on complex Macro-level designs and supporting Full-Chip timing integration
Strong background in scripting (Tcl, Python, Perl) and automation to enhance timing closure efficiency.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
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לפני 13 שעות
חברה חסויה
Location: Tel Aviv-Yafo
Job Type: Full Time
we are establishing a strategic R&D center in Israel to drive the development of complex semiconductor chips that solve the critical 'data bottlenecks' enabling the future of AI at scale. As we expand our presence in Israel, we're seeking a talented Principal Emulation Engineer to help build our local engineering powerhouse from the ground up. This is an exciting opportunity to take on meaningful ownership in a new site, implementing the emulation strategy for chips that power the world's largest AI clusters.
As an Principal Emulation Engineer, you will be a core technical driver of our Israel R&D center, working at the intersection of hardware and software to ensure our silicon meets extreme quality and performance targets. You will execute end-to-end emulation flows, bridge the gap between RTL and functional validation, and partner with cross-functional teams to enable seamless hardware-software integration. If you thrive on solving complex technical challenges and want to play a key role in validating cutting-edge AI infrastructure connectivity solutions, this is your opportunity.
Key Responsibilities
Emulation Flow Execution & Implementation
Execute end-to-end emulation flow from high-level model generation and RTL synthesis to complex system-level testing and silicon-accurate debugging
Work directly with next-generation emulation platforms (Zebu, Palladium, or Veloce) to implement cutting-edge methodologies
Maintain and evolve emulation flows to reduce compile times and increase execution speed, directly impacting time-to-market
System-Level Debug & Validation
Drive initial model bring-up process in high-stakes environment, identifying and resolving complex bugs
Ensure rapid cycles from RTL to functional stability through systematic debug approaches
Own technical blocks and drive them to completion independently
Cross-Functional Collaboration
Partner with Firmware, Software, and Validation teams to debug complex system-level scenarios
Ensure seamless hardware-software integration for AI infrastructure connectivity
Collaborate with Design and Verification teams to optimize emulation strategies.
Requirements:
Bachelor's degree in Electrical Engineering, Computer Engineering, or related technical field
10+ years of hands-on experience in Emulation at semiconductor companies
Deep expertise in emulation flows for large-scale chips using industry-standard emulators (Zebu, Palladium, or Veloce)
Strong background in SystemVerilog for developing, testing, and debugging complex SoC designs
Experience developing and maintaining execution flows for building, running, and debugging emulation models
"Can-do" approach with ability to own technical blocks and drive them to completion independently
Preferred Qualifications
Master's degree in Electrical Engineering, Computer Engineering, or related field
Familiarity with EDA tools for Lint, Clock Domain Crossing (CDC), simulation, and synthesis
Proficiency in scripting languages such as Python or TCL for automation and flow enhancement
Experience with standard debug environments (e.g., Verdi)
Knowledge of high-speed interface protocols (PCIe, Ethernet, CXL, UALink)
Background in hardware-software co-verification methodologies.
This position is open to all candidates.
 
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1 ימים
Location: Tel Aviv-Yafo
Job Type: Full Time
we are establishing a strategic R&D center in Israel to drive the development of complex semiconductor chips that solve the critical 'data bottlenecks' enabling the future of AI at scale. As we expand our presence in Israel, we're seeking a highly skilled Chip Top Physical Design Engineer focusing on implementation to join our local engineering powerhouse from the ground up.
If you thrive on solving complex, unnamed challenges in deep-submicron processes, your place is with us.
As a Physical Design Engineer, you will be a key hands-on member of our PD Team in the Israel R&D center. You will execute the physical design of the SoC Top level for chips that drive the worlds largest AI clusters. You will be deeply involved in all PD disciplines of the chip, driving the tape-out (T.O.) GDS to meet strict signoff criteria (Timing, LVS, EMIR, DRC, PV, etc.), ensuring our silicon meets the extreme performance, power, and area (PPA) targets required for AI scale.
Key Responsibilities
Execute SoC Top-level physical design and actively drive full-chip convergence
Perform Top-Level physical implementation, including floor-planning, Place & Route (P&R), Clock Tree Synthesis (CTS), Power/Clock distribution, Power Integrity, and Timing/Physical signoff
Work closely with the Architecture, Design, DFT, and Product teams to achieve optimal Power, Performance, and Area (PPA). This involves participating in feasibility studies for new architectures and optimizing runs to ensure the best Quality of Results (QoR)
Resolve complex signal integrity, thermal, and power challenges inherent in high-speed connectivity silicon
Collaborate closely with the Package team on Bump-map-to-Ballout design, taking all signal integrity aspects into consideration.
Requirements:
B.Sc. or M.Sc. in Electrical Engineering
5+ years of hands-on experience in Chip Top Physical Design/Backend at leading semiconductor companies, working on advanced process technologies (5nm, 3nm, and below)
Proven experience executing complex block or chip-level projects with a proactive, "can-do" approach and excellent communication skills
Deep hands-on expertise in RTL2GDS flows, including P&R, STA, Physical Verification (DRC/LVS), Formal Verification, low-power implementation (UPF/CPF), and EMIR
Mastery of industry-standard EDA tools (Synopsys Fusion Compiler/ICC2 or Cadence Innovus)
Practical experience handling both complex macro/subsystem-level designs and Full-Chip integration
Preferred Qualifications
Deep understanding of Power & Noise analysis (EM/IR)
Experience with DFT (Design for Test) integration into the physical design flow
Background in high-speed interfaces or data center protocols.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
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5 ימים
חברה חסויה
Location: Tel Aviv-Yafo and Yokne`am
Job Type: Full Time
Are you passionate about working on a team that is at the cutting and bleeding edge of hardware technology? Our Design-for-Test Engineering team works on groundbreaking innovations involving crafting creative solutions for DFT architecture, verification and post-silicon validation on some of the industry's most sophisticated semiconductor chips. We are looking for an experienced DFT Engineer to join the ATPG team. The position includes taking part in development of the next generation DFT technologies and working closely with a wide range of our groups and aspects - chip design, backend, verification, and production testing.

Working on the most advanced technologies and complex products, our DFT solution are unique and innovative internal developments, and we are continuously improving and evolving the solution to meet the challenging goals. If you find groundbreaking Technologies, and next generation products interesting, then this is the team for you. Take opportunity to join our team for an exciting and educational environment, where every individual has significant contribution to our products and achievements!

What youll be doing:
You will be in charge of state of the art Design for Test/ATPG flows and implementation.
Take full ATPG ownership end to end on a project, from Arch & planning to pattern generation, verification and post Silicon bring up and diagnosis.
Inventing and maintaining automation flows that provide the short test time to productionץ
Requirements:
What we need to see:
3+ years of hands on DFT/ATPG experience knowledge & technical experience in DFT ASIC Design and in ATPG tools.
Strong programming skills in scripting languages.
BSc. in Electrical Engineering or Computer engineering.
Quick learner, proactive and self-motivated, eager to learn and contribute, sense or ownership, commitment, and responsibility.

Ways to stand out from the crowd:
Knowledge of DFT including scan, BIST, on-chip scan compression, fault models, ATPG, and fault simulation.
Experience in Mentor TestKompress ATPG tool and retargeting flow.
Programming languages: TCL, PRL, Phyton & Unix shell scripts.
Experience with ATE and Silicon bring-up.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
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לפני 12 שעות
חברה חסויה
Location: Tel Aviv-Yafo
Job Type: Full Time
we are establishing a strategic R&D center in Israel to drive the development of complex semiconductor chips that solve the critical 'data bottlenecks' enabling the future of AI at scale. As we expand our presence in Israel, we're seeking a talented Junior ASIC Design Engineer to help build our local engineering powerhouse from the ground up. This is an exciting opportunity to take on meaningful product ownership in a new site, designing the digital blocks that sit at the heart of our most ambitious connectivity projects.
As a Junior ASIC Design Engineer, you won't just build chips - you will be part of a team defining the next generation of AI infrastructure main components. The complex digital blocks under your micro-architecture and implementation responsibilities will power the world's largest AI clusters. You will own the journey from high-level definition through RTL implementation and backend support, transforming complex logic challenges into elegant, high-performance hardware. If you thrive on solving challenging problems in deep-submicron processes and want to contribute to the digital design foundation for AI infrastructure connectivity, this is your opportunity.
Key Responsibilities
Design Ownership & Implementation
Own the journey from high-level definition through micro-architecture, coding, and debug to backend implementation support
Tackle complex logic challenges and transform them into elegant, high-performance hardware solutions
Serve as the point of contact for your logic blocks, interacting with Architecture, Verification, and Backend teams
Quality Assurance & Design Optimization
Utilize industry-leading EDA tools (Lint, CDC, Synthesis, Timing, Power) and in-house quality assurance tools to ensure designs are robust, scalable, and power-efficient
Apply design techniques to meet PPA (Power, Performance, Area) targets
Contribute to design quality through verification and validation activities
Methodology Innovation & Collaboration
Participate in design methodology improvements and tool automation initiatives
Leverage AI assistance tools and contribute to in-house automation development to make engineering workflows faster and smarter
Collaborate effectively across teams to ensure seamless integration.
Requirements:
Education: Bachelors degree in Electrical Engineering, Computer Engineering, or a related technical field.
Experience: 0-2 years of experience in logic design (relevant internships, university labs, or hands-on academic projects are highly valued).
Technical Skills:
Foundational knowledge of Verilog and/or SystemVerilog.
Strong understanding of digital design principles and fundamental RTL coding concepts.
Soft Skills: Excellent communication skills with a strong motivation to learn, adapt, and collaborate effectively within cross-functional teams.
Preferred Qualifications
Master's degree in Electrical Engineering or related field.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
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דיווח על תוכן לא הולם או מפלה
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תודה על שיתוף הפעולה
מודים לך שלקחת חלק בשיפור התוכן שלנו :)
חברה חסויה
Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
Required Senior Silicon DFT Lead
Note: By applying to this position you will have an opportunity to share your preferred working location from the following: Tel Aviv, Israel; Haifa, Israel.
About the job
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
As the Design for Test (DFT) Engineer Lead, you will play a crucial role in DFT Architecture and DFT design, and support devices to production. You will be responsible for providing technical leadership in DFT, developing flows, automation, and methodology, planning DFT activities, tracking the DFT quality throughout the project life-cycle, and providing sign-off DFT to tapeout.
Responsibilities
Lead and execute DFT activities in the design, implementation, and verification solutions for Application-Specific Integrated Circuits (ASIC).
Develop DFT strategy and architecture, including hierarchical DFT, Memory Built-In Self Test (MBIST), and Automatic Test Pattern Generation (ATPG).
Work with other Engineering teams (e.g., Design, Verification, Physical Design) to ensure that DFT requirements are met and mutual dependencies are managed.
Manage a DFT team planning, deliverables, and provide technical mentoring and guidance.
Lead DFT execution of a silicon project, planning, execution, tracking, quality, and signoff.
Requirements:
Minimum qualifications:
Bachelor's degree in Electrical Engineering, Computer Engineering, or a related field, or equivalent practical experience.
8 years of experience in Design For Test from DFT architecture to post silicon production support.
4 years of experience with people management.
Experience with DFT design and verification for multiple projects, DFT specification, definition, architecture, and insertion.
Experience with DFT techniques and common industry tools, DFT and Physical Design flows, and DFT verification flow.
Experience in leading DFT activities throughout the whole ASIC development flow.
Preferred qualifications:
Master's degree in Electrical Engineering or a related field.
Experience in post-silicon Debug, test or product engineering.
Experience in Joint Test Action Group (JTAG) and Internal JTAG (iJTAG) protocols and architectures.
Experience in SoC cycles, silicon bring-up, and silicon debug activities.
Knowledge of fault modeling techniques.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
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