דרושים » חשמל ואלקטרוניקה » Hardware Failure Analysis Engineer - Physical Failure Analysis

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לפני 18 שעות
Location: Yokne`am
Job Type: Full Time
We are looking for a Hardware Failure Analysis Engineer to join the Interconnect Failure Analysis (FA) team. This role will be part of the Product Engineering organization supporting our advanced interconnect products used in AI and high-performance computing systems.

The ideal candidate is passionate about understanding how and why hardware fails at the physical level. You will develop and execute advanced physical failure analysis techniques to identify root causes in complex electronic and electro-optic assemblies. The role combines hands-on laboratory work, innovative sample preparation, materials characterization, and collaboration with multidisciplinary engineering teams to solve challenging hardware failures.

What you'll be doing:

Lead physical failure analysis investigations on advanced interconnect products, including PCBs, packages, optical modules, ASICs, and electro-mechanical assemblies.

Develop, optimize, and execute destructive and non-destructive sample preparation techniques to expose failure sites while preserving physical evidence.

Perform detailed failure analysis using advanced microscopy and analytical techniques, including: Scanning Electron Microscopy (SEM), Focused Ion Beam (FIB) cross-sectioning and circuit editing, Optical microscopy, X-ray imaging and CT, Cross-section analysis, Surface and fracture analysis

Correlate physical findings with electrical, optical, manufacturing, and reliability data to determine root cause.

Design new failure analysis methodologies and continuously improve laboratory capabilities, workflows, and best practices.

Partner with design, manufacturing, quality, reliability, packaging, and system engineering teams to drive corrective actions.

Generate clear technical reports documenting failure mechanisms, supporting evidence, and recommendations.

Evaluate and introduce new FA tools, sample preparation methods, and characterization techniques to improve investigation capability.
Requirements:
B.Sc., M.Sc., or Ph.D. in Materials Science, Mechanical Engineering, Electrical Engineering, Physics, or a related field.

3+ years of experience in hardware failure analysis, materials characterization, semiconductor analysis, or package analysis.

Hands-on experience with destructive sample preparation techniques including polishing, grinding, cross-sectioning, decapsulation, and precision material removal.

Strong experience operating analytical equipment such as: SEM, FIB, X-ray / CT, Optical microscopy

Strong understanding of hardware failure mechanisms in semiconductor devices, electronic packages, PCBs, solder joints, connectors, or optical assemblies.

Experience developing structured root cause investigations using physical evidence.

Excellent analytical, documentation, and communication skills.

Ability to independently drive complex investigations from initial failure through final root cause.
This position is open to all candidates.
 
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לפני 18 שעות
Location: Yokne`am
Job Type: Full Time
We are looking for a Hardware Failure Analysis Engineer to join the Interconnect FA team. This role will be part of the Product Engineering organization supporting our advanced high-speed interconnect and optical communication products.

The ideal candidate will lead failure investigations of complex hardware systems, including electro-optic modules, high-speed electrical interfaces, and optical interconnect components, supporting both production and customer-returned units. The role requires strong analytical skills, hands-on laboratory debugging, and the ability to drive root cause investigations across electrical, optical, and system domains.

What you'll be doing:

Lead failure analysis investigations on interconnect products including optical modules, AOCs, and high-speed hardware platforms.

Review architectural design aspects (electrical, optical, mechanical, process, and firmware) to identify potential design or integration issues.

Design, develop, and execute debug and validation test plans to identify root cause of hardware failures in production or customer-returned units.

Perform hands-on electrical and optical debugging using laboratory equipment and automated test systems.

Correlate electrical, optical, and system-level measurements to identify failure signatures.

Work closely with internal engineering teams (design, validation, manufacturing, reliability) and external partners to drive root cause and corrective actions.

Document investigation results and deliver clear technical FA reports summarizing findings and recommendations.
Requirements:
What we need to see:

B.Sc. or M.Sc. in Electrical Engineering, Electro-Optics, Applied Physics, or related field.

3+ years of experience in hardware debug, validation, or failure analysis of complex electronic systems.

Experience working with high-speed hardware or communication systems.

Hands-on experience reading schematics and using lab equipment such as oscilloscopes, DVMs, pattern generators, and signal analysis tools.

Strong analytical and problem-solving skills with ability to lead complex root cause investigations.

Ability to work independently, plan investigations, and drive tasks to completion.

Strong communication skills and ability to collaborate across multidisciplinary engineering teams.


Ways to stand out from the crowd:

Experience with electro-optic systems such as optical transceivers, lasers (VCSEL / EML), photodiodes, or optical modules.

Familiarity with high-speed signaling technologies (SerDes, PAM4, BER analysis, signal integrity).

Experience working with optical lab equipment (OSA, optical power meters, optical test systems).

Background working in Linux environments and Python scripting for test automation or data analysis.

Experience with networking hardware platforms (Switch CLI, NIC driver commands).
This position is open to all candidates.
 
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לפני 19 שעות
חברה חסויה
Location: Yokne`am
Job Type: Full Time
The System product engineer is responsible for stabilizing hardware products from the first build unit through ramp-up and transition to high-volume mass production. This role plays a critical part in ensuring product quality, yield, and test robustness for our cutting-edge platforms by leading debug infrastructure development, systematic failure analysis, and data-driven continuous improvement across the NPI lifecycle.

What you'll be doing:

Own end-to-end product stabilization from first article to production release.

Develop and maintain hardware debug infrastructures, tools, and methodologies to support efficient root cause analysis.

Monitor, analyze, and improve yield performance during NPI.

Perform deep-dive failure analysis and root cause investigations to improve product robustness, quality, and throughput.

Improve test stability, coverage, and repeatability while reducing false failures.

Collaborate closely with Mechanical NPI engineers, Test Development teams, R&D, and manufacturing partners.

Apply data analysis techniques to identify systemic issues, trends, and optimization opportunities.
Requirements:
What we need to see:

B.Sc. in Electrical Engineering.

4+ years of relevant experience in product engineering, failure analysis/debug, or HW/test design.

Proven hands-on experience in HW debugging.

Strong problem-solving abilities with a diligent approach.

Outstanding interpersonal and communication skills in English.

Ability to thrive in a collaborative and dynamic environment.



Ways to stand out from the crowd:

Background with test design and HW lab equipment.

Experience with data/yield analysis.

Background with JMP and/or other data analysis tools.

Experience working with a manufacturing environment.

Basic programming knowledge (C, Perl, Python) in Linux environment.
This position is open to all candidates.
 
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לפני 15 שעות
Location: Yokne`am
Job Type: Full Time
We are looking for a skilled Software Developer with strong hardware knowledge to join our team developing production test solutions for optical transceivers and networking products. Our team builds the software and test infrastructure used on production lines to validate our optical and interconnect products. The work combines instrument automation, low-level software development, and direct control of custom hardware. You will work with optical instruments such as power meters, variable optical attenuators, and laser sources, as well as custom test boards used to control and communicate with the device under test (DUT).

This is a hands-on, technically deep role that spans the entire development lifecycle-from hardware bring-up and debugging to validation, deployment, and production support. As a technical focal point, you will work at the intersection of hardware and software, collaborating with electrical, hardware, thermal, mechanical, and software engineers to deliver robust and scalable test solutions across multiple production lines and products.

What Youll Be Doing:

Design and develop production test systems for optical transceivers, networking hardware, and interconnect products.

Develop software that controls optical test instruments, custom test boards, and other hardware components.

Write low-level drivers and hardware-control software in C and C++, and integrate native code with higher-level C# applications through DLL wrappers.

Read and interpret electrical schematics, block diagrams, datasheets, timing requirements, and hardware specifications.

Lead hardware bring-up, validation, and deployment of test solutions in production environments.

Debug complex hardware-software integration issues using oscilloscopes, logic analyzers, software tools, and hardware communication interfaces such as I2C, SPI, and UART.

Investigate failures, identify root causes, and implement reliable corrective solutions.

Collaborate with cross-functional teams to translate hardware requirements into software interfaces and automated test procedures.

Take technical ownership of projects from initial concept and prototype development through production release and ongoing support.

Improve test coverage, system reliability, maintainability, and scalability across multiple products and production lines.
Requirements:
What We Need to See:

Bachelors or masters degree in Electrical Engineering, Computer Engineering, Software Engineering, or a related field with significant hardware, electronics, or software experience.

4+ years of hands-on experience in software development, hardware-software integration, low-level driver development, firmware, or automated hardware testing.

Strong programming experience in one or more of Python, C#, C, or C++, with practical experience developing software that interfaces with hardware.

Experience reading and interpreting electrical schematics, block diagrams, hardware datasheets, and technical specifications.

Hands-on experience debugging hardware and software using laboratory instruments and software debugging tools.

Strong problem-solving skills and the ability to diagnose sophisticated hardware-software interaction issues.

Demonstrated technical ownership of projects, including development, integration, validation, and production deployment.

Excellent communication and collaboration skills, with the ability to work effectively across hardware and software teams.

Ways To Stand Out from the Crowd:

Experience with optical test equipment such as power meters, variable optical attenuators, laser sources, optical switches, or similar instruments.

Hands-on experience with PCIe, I2C, SPI, UART, Ethernet, or other hardware communication protocols.

Experience developing device drivers or hardware-interface software for Windows or Linux.

Experience wrapping native C/C++ libraries for use in managed .NET or C# applications.
This position is open to all candidates.
 
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1 ימים
חברה חסויה
Location: Yokne`am
Job Type: Full Time
Are you ready to join a team that's continually reinventing itself with innovative technology? Our Networking unit is at the forefront of delivering End-to-End High-Speed Ethernet and InfiniBand Solutions. We are seeking a creative and independent Product Engineer to help us maintain our leadership in the market by pushing the boundaries of speed and bandwidth.

What You'll Be Doing:

Maintaining high-quality product deliveries to customers by performing data and failure analysis.

Improving product performance by solving complex problems with the Process, Mechanical, Hardware, Test, and Thermal teams.

Leading high-impact task forces and working groups to drive critical initiatives.

Crafting and enhancing factory test plans to improve coverage, time, cost, and yield.

Driving yield improvement and addressing the failure Pareto.

Managing Failure Analysis for field and production failures.

Collaborating with different teams, including Customer Support, Marketing, Engineering, Quality, and Reliability, to ensure flawless execution.
Requirements:
What We Need To See:

B.Sc. in Material Engineering, Chemical Engineering or equivalent.

At least 3+ years of proven experience.

Strong background in statistics and data analysis (JMP).

Good understanding of manufacturing line.

Basic knowledge in optics and microelectronics.

Excellent presentation and interpersonal skills.

Proven problem-solving and prioritization abilities.

Effective communication skills with complementary teams and functional groups.


Ways to stand out from the crowd:

Hands on experience working with AI tools.

Experience in PCB assembly processes.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
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1 ימים
חברה חסויה
Location: Yokne`am
Job Type: Full Time
As a Package Engineer, you will work closely with SI, layout, and ASIC design teams to develop complex, top-of-the-line ASIC packages. You will be responsible for planning schedules, resolving costs, packaging, manufacturing, and electrical design issues.

What you will be doing:

Leading development of cutting-edge microelectronics packaging of our Networking Business Units future products, evaluating our products for reliability and performance.

Review manufacturability readiness at each milestone.

Work with world leading vendors to develop highly challenging packaging solutions.

Leading the development of groundbreaking microelectronics packaging for our Networking Business Unit's future products.

Collaborating with world-leading vendors to develop highly ambitious packaging solutions.

Thriving in a dynamic and challenging environment.

Join and lead task forces to investigate and support production excursions, failure analysis and reliability issues and establish quality standards.

Monitor substrate and assembly production KPIs and collaborate with cross functional teams to define and monitor Yield Improvement Plans for continuous improvement and establish quality standards.

Lead process changes reviews, prepare and present data in Change Control Board meetings, lead technical reviews of product changes throughout the supply chain.
Requirements:
What we need to see:

BSc or equivalent Mechanical/Material Engineering degree, or any related equivalent experience.

2+ years of relevant work experience in the semiconductor packaging or equivalent experience, development and manufacturing.

Basic design skills, such as using 2D ArtiosCAD, and 3D NX/SolidWorks/Creo applications.

Experience in DFM, understand tooling design, manufacturing processes, material properties and metrology tools.

High awareness for quality, robustness, and manufacturability.

High self-learning and self-motivation skills, fostering a culture of continuous learning, ongoing process improvement and proactive approach.

Leadership skills, capability to lead cross company projects that involve cross functional teams in different locations.

Curious and creative problem solver, well organized and multi-tasker.


Ways to stand out of the crowd:

Hands-on FEA mechanical simulation experience - Advantage.

Team / Group / Project management - Advantage.

Experience with manufacturing environment and manufacturing statistics tools.

Background in engineering semiconductor manufacturing processes.
This position is open to all candidates.
 
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לפני 16 שעות
Location: Yokne`am
Job Type: Full Time
We are looking for a Host and Systems Performance Manager to join ur Networking Performance team!

In this role, you will lead a team of engineers who measure, analyze, and improve NIC, host, DOCA networking stack, and system-level performance across our networking products and platforms. We work across the full product lifecycle, from early architecture and pre-silicon modeling through post-silicon bring-up, validation, characterization, and GA readiness.

We are looking for someone who enjoys building teams, turning complex performance data into clear direction, and partnering across engineering groups to improve products that support AI, HPC, cloud, and accelerated networking workloads.

What Youll Be Doing:
Lead, coach, and develop a team focused on NIC, host, DOCA networking stack, and system-level performance. You will define performance test plans, methodologies, metrics, and success criteria for our new networking technologies.
Guide pre-silicon and post-silicon performance planning, analysis, reporting, and readiness reviews. Your team will benchmark and profile workloads across RDMA, RoCE, InfiniBand, Ethernet, MPI, NCCL, DOCA, storage, security, and host networking stacks.
Identify bottlenecks across NIC, DPU, CPU, memory, PCIe, firmware, drivers, Linux networking, DOCA, and full-system architecture. We will look to you to lead root-cause analysis, coordinate mitigation plans, and help hardware, firmware, software, architecture, validation, and product teams align on performance goals.
Requirements:
What We Need To See:
B.Sc. or M.Sc. in Computer Science, Computer Engineering, Electrical Engineering, or equivalent experience.
Experience in performance analysis, systems engineering, networking, or HPC/AI infrastructure.
10+ years of software engineering experience, including 4+ years in a leadership or management role.
Experience with high-performance networking technologies such as RDMA, RoCE, InfiniBand, Ethernet, MPI or NCCL.
Hands-on experience with system performance analysis, benchmarking, profiling, and root-cause analysis.
Understanding of host architecture, including CPUs, memory hierarchy, NUMA, PCIe, Linux OS, drivers, firmware, and DPU/NIC interactions.
Experience creating performance test plans for pre-silicon or post-silicon phases.
Programming or scripting experience with Python and Bash; C/C++ experience is helpful.
Ability to communicate technical findings clearly and work across engineering teams.

Ways To Stand Out from the Crowd
Experience with NICs or DPU architecture, networking offloads, host datapath behavior, networking services, or DPU offloads.
Experience with AI/HPC cluster performance, distributed training, inference workloads, collective communication libraries, telemetry pipelines, benchmark automation, CUDA, NCCL internals.
Linux kernel networking, DPDK, OVS, storage acceleration, or security offloads can also help you succeed in this role.
This position is open to all candidates.
 
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לפני 16 שעות
Location: More than one
Job Type: Full Time
We are looking for a dedicated SoC Clocks Design Automation Engineer to join our Networking Silicon team. In this role, youll focus on developing and supporting clock-related design flows and methodologies for SoC and networking chips, ensuring efficient and high-quality design implementation. Youll also chip in to SoC top-level automation and integration activities, building on existing flow infrastructure to improve efficiency and consistency across projects. Introduction

What you'll be doing:

Develop and maintain design automation and methodologies for SoC and networking clock flows.

Collaborate with design, STA, and project teams to ensure timely and high-quality design closure.

Develop and improve SoC top-level automation scripts and flows built upon existing infrastructure and tools.

Support SoC integration and construction flow activities across multiple projects.

Assist in timing, power, and noise analysis to ensure efficient performance.
Requirements:
What we need to see:

B.Sc. or M.Sc. in Electrical or Computer Engineering, or relevant professional experience.

At least 2 years of confirmed experience in SoC design, design automation, or methodology development.

Strong programming or scripting skills in at least one language (Python preferred; Perl, Tcl, or Make are advantages).

Understanding of physical design concepts including placement, routing, timing closure, and ECO implementation.

Familiarity with EDA tools for synthesis, place-and-route, and timing analysis (Synopsys or Cadence flows).

Strong analytical, problem-solving, and soft skills.


Way to stand out from the crowd:

Experience developing or maintaining SoC design or automation flows.

Knowledge of timing-related analysis (crosstalk, noise, delay).

Background in power or timing optimization techniques.

Collaborative attitude with the ability to work effectively across multi-functional teams.

Self-motivated and eager to learn while improving existing design flows.
This position is open to all candidates.
 
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חברה חסויה
Location: Yokne`am
Job Type: Full Time
We are looking for a talented Process Electronics Engineer to join our Engineering team and lead the transition of innovative electronic products from development to production.

What youll do:
Lead New Product Introduction (NPI) and transfer products from R&D to manufacturing.
Develop, optimize, and improve manufacturing processes for electronic and electromechanical products.
Drive Design for Manufacturing (DFM), Design for Assembly (DFA), and Design for Testability (DFT) activities.
Investigate production issues, perform root cause analysis, and implement corrective actions.
Lead process validation, qualification, automation, tooling, and continuous improvement projects.
Collaborate closely with R&D, Production, Quality, Supply Chain, and Manufacturing teams.
Requirements:
B.Sc. in Electronics, Electrical, Mechatronics, Industrial Engineering, or related field.
5+ years of experience in Process/Manufacturing/NPI Engineering within an electronics production environment.
Strong knowledge of electronic manufacturing processes, PCBA technologies, SMT/THT, soldering, and IPC standards.
Experience with Lean Manufacturing, SPC, PFMEA, Control Plans, Six Sigma methodologies, and process validation.
Hands-on, analytical, and proactive approach with excellent problem-solving and teamwork skills.
This position is open to all candidates.
 
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חברה חסויה
Location: Yokne`am
Job Type: Full Time
We are looking for an experienced NPI Process Engineer to join our Engineering team and lead the transfer of new products from R&D to production, while driving process improvements across manufacturing lines.

Key Responsibilities
Lead NPI activities and serve as focal point between R&D and production.
Define, maintain, and improve production processes and work instructions.
Provide hands-on support and troubleshooting to production lines.
Lead root cause analysis and implement corrective actions.
Drive yield improvement, scrap reduction, and cycle time optimization.
Manage process validation, qualifications, and engineering changes (ECO).
Work closely with cross-functional teams: R&D, Quality, Maintenance, and Operations.
Requirements:
B.Sc. in Mechanical / Mechatronics Engineering (or related field).

5+ years of experience in Process / Production / NPI Engineering.

Strong background in manufacturing environments.

Knowledge of Lean, SPC, PFMEA, and problem-solving methodologies.

Hands-on, analytical, and detail-oriented with strong ownership.

Excellent communication and teamwork skills.
This position is open to all candidates.
 
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1 ימים
חברה חסויה
Location: Tel Aviv-Yafo and Yokne`am
Job Type: Full Time
We are looking for a Chip Design Verification Engineer to develop the next generation of DFT technologies.

As a Chip Design Verification Engineer in the DFT team at NVIDIA, you will verify the design and implementation of our DFT technologies in various projects. This position offers the opportunity to have real impact in a dynamic, technology-focused company impacting Switches, Nic and SoC product lines. We are working closely with a wide range of aspects - chip design, backend, verification and production testing. We are working on the most advanced technologies and complex products. Our DFT solutions are unique, innovative, and we are continuously looking for new and creative solutions to meet the challenging goals.

What you'll be doing:

In this position, you will be responsible for verification of the DFT design, architecture and micro-architecture using sophisticated verification methodologies.

As a member of our DFT verification team, you'll understand the design & implementation, define the verification scope, develop the verification infrastructure (Testbenches, BFMs, Checkers, Monitors), execute test/coverage plans, and verify the correctness of the design.

Collaborate with architects, designers, emulation, production testing and silicon verification teams to accomplish your tasks.
Requirements:
BSc. in Electrical Engineering or Computer engineering, or equivalent experience.

3+ years of practical verification experience.

Experience in developing verification environments and random based verification for unit level and system level using verification tools (simulation tools, Verilog, debug tools like Simvision/Debussy).

Experience with Specman is a plus.

Good understanding of RTL design (Verilog).

Strong debugging, problem solving and analytical skills.

Excellent communication and social skills.

Ability to work in a geographically diverse team environment.

Self motivated, independent and target oriented.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
עדכון קורות החיים לפני שליחה
עדכון קורות החיים לפני שליחה
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