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22/07/2026
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לפני 19 שעות
חברה חסויה
Location: Haifa
Job Type: Full Time
We are looking for talented engineers to help us develop the semiconductor platform which is based on revolutionary architecture.
Take part in the development of cutting edge products within disruptive system architecture. Youll have the opportunity to work on the technologies that power the worlds largest Cloud provider, within a dynamic, open, and fast-paced environment. Amazon Web Services provides a highly reliable, scalable, low-cost infrastructure platform in the cloud that powers hundreds of thousands of businesses in 190 countries around the world.

Exciting opportunity to join Amazon in developing its next generation products for the cloud market.
We are looking for talented people to join the team and help us technically lead the challenges of the next decade.
In this job you will be exposed and learn wide range of expertise such as: C++ programing, hardware design, data mining, Verilog simulations, working with various high end test equipment and more
If paving new roads on edge of technology within a strong and vibrant team is what you seek, your place is with us.
Requirements:
Basic Qualifications
- Bachelor's degree in Electrical Engineering.
- Experience working in a fast-paced, rapidly changing operations environment.

Preferred Qualifications
- Familiar with chip design processes and debug techniques.
- Deep understanding of DFT and DFM.
This position is open to all candidates.
 
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07/09/2026
חברה חסויה
Location: Tel Aviv-Yafo
Job Type: Full Time
We are looking for talented engineers to help us develop a semiconductor platform based on revolutionary architecture.
Take part in the development of cutting-edge products within a disruptive system architecture. Youll have the opportunity to work on the technologies that power the worlds largest cloud provider, within a dynamic, open, fast-paced environment. Our Web Services provides a highly reliable, scalable, low-cost infrastructure platform in the cloud, which powers hundreds of thousands of businesses in 190 countries around the world.
We are looking for excellent electrical engineering graduates to join our talented Physical Design team, which develops our next generation products for the cloud market.
We will be conducting a unique training program for three months, where where you will be studying the following with our technical experts and team leaders:
* Backend development flow and stages (RTL to GDS).
* A wide variety of relevant tools and knowledge.
* Practical experience with the most advanced technologies in the industry.

Key job responsibilities
Join our three-month training program where you'll work alongside technical experts and team leaders to gain:
*Backend development expertise (RTL to GDS flow).
*Hands-on experience with industry-leading tools and technologies.
*Practical skills in AI-driven innovations and cutting-edge methodologies.
You'll collaborate with cross-functional teams throughout the chip development cycle and become an essential part of our dynamic physical design team, playing a critical role in next-generation cloud computing solutions development.
Requirements:
Basic Qualifications
- BSc in Electrical/Computer Engineering. Please submit your grade sheet combined with your CV as a single PDF document.
- Recent graduates or students currently in their 8th semester (final year).
- Available to work full-time.

Preferred Qualifications
- Experience in the industry.
- Demonstrated passion for technological innovation.
- Ability to adapt and learn rapidly in a dynamic environment.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
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3 ימים
חברה חסויה
Location: Tel Aviv-Yafo
Job Type: Full Time
As we expand our presence in Israel, we're seeking a visionary DFT Engineer to help build our local engineering powerhouse from the ground up. This is a unique opportunity to take on meaningful product ownership in a new site, ensuring the reliability and testability of chips that power the world's largest AI clusters.

As a DFT Engineer, you will be at the intersection of architecture, design, and production. You won't just run tools-you will be a foundational member of the team responsible for the entire lifecycle of our silicon's reliability. From defining initial DFT architecture to supporting post-silicon bring-up, your work ensures that the backbone of AI infrastructure connectivity is flawless and scalable. If you thrive on solving complex challenges in deep-submicron processes and want to establish world-class DFT methodologies, this is your opportunity.

Key Responsibilities

DFT Architecture & Strategy
Be part of the DFT journey from high-level architecture definition and RTL design to backend implementation and post-production support
Develop comprehensive Design-for-Testability (DFT) strategies for next-generation connectivity platforms, ensuring chips meet the highest quality standards
Design and implement DFT architectures including JTAG/iJTAG, MBIST, Scan, and ATPG for high-end devices

Test Pattern Development & Optimization
Generate and optimize high-quality test and debug patterns for production
Perform Static Timing Analysis (STA) for DFT modes and conduct gate-level simulations to ensure robust performance
Drive test coverage and quality metrics to meet stringent manufacturing requirements

Cross-Functional Collaboration & Methodology Innovation
Act as a multidisciplinary bridge, collaborating closely with Architecture, Verification, and Backend teams to ensure seamless integration and optimal QoR
Participate in developing and maintaining cutting-edge DFT implementation flows
Automate and improve methodologies using advanced scripting and tools
Requirements:
Basic Qualifications
Bachelor's degree in Electrical Engineering or related technical field.
4+ years of hands-on experience in DFT roles at semiconductor companies.
Experience in DFT flows and architectures including JTAG/iJTAG, MBIST, Scan, and ATPG.
Good understanding of logic design, verification, debug, and Static Timing Analysis (STA).
Scripting proficiency in Tcl, Perl, Python, or Shell for automation and innovation.

Preferred Qualifications
Master's degree in Electrical Engineering or related field.
Experience with industry-standard EDA tools from Synopsys (TestMAX) or Siemens (Tessent).
Experience in chip bring-up and mass production activities.
Background in advanced process technologies (7nm and below).
Knowledge of high-speed interface protocols (PCIe, Ethernet, CXL, UALink) and their specific test requirements.
Excellent communication skills with ability to work effectively in global team environments.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
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8831880
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דיווח על תוכן לא הולם או מפלה
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תודה על שיתוף הפעולה
מודים לך שלקחת חלק בשיפור התוכן שלנו :)
3 ימים
חברה חסויה
Location: Tel Aviv-Yafo
Job Type: Full Time
As we expand our presence in Israel, we're seeking a visionary Staff DFT Engineer to help build our local engineering powerhouse from the ground up. This is a unique opportunity to take on meaningful product ownership in a new site, ensuring the reliability and testability of chips that power the world's largest AI clusters.

As a Staff DFT Engineer, you will be at the intersection of architecture, design, and production. You won't just run tools-you will be a foundational member of the team responsible for the entire lifecycle of our silicon's reliability. From defining initial DFT architecture to supporting post-silicon bring-up, your work ensures that the backbone of AI infrastructure connectivity is flawless and scalable. If you thrive on solving complex challenges in deep-submicron processes and want to establish world-class DFT methodologies, this is your opportunity.

Key Responsibilities

DFT Architecture & Strategy
Own the DFT journey from high-level architecture definition and RTL design to backend implementation and post-production support.
Develop comprehensive Design-for-Testability (DFT) strategies for next-generation connectivity platforms, ensuring chips meet the highest quality standards.
​DFT architectures including JTAG/iJTAG, MBIST, Scan, and ATPG methodologies.

Test Pattern Development & Optimization
Generate and optimize high-quality test and debug patterns for production.
Perform Static Timing Analysis (STA) for DFT modes and conduct gate-level simulations to ensure robust performance.
Drive test coverage and quality metrics to meet stringent manufacturing requirements.

Cross-Functional Collaboration & Methodology Innovation
Act as a multidisciplinary bridge, collaborating closely with Architecture, Verification, and Backend teams to ensure seamless integration and optimal QoR.
Participate in developing and maintaining cutting-edge DFT implementation flows.
Automate and improve methodologies using advanced scripting and tools.
Requirements:
Basic Qualifications
Bachelor's degree in Electrical Engineering or related technical field.
8+ years of hands-on experience in DFT roles at semiconductor companies.
Deep expertise in DFT flows and architectures including JTAG/iJTAG, MBIST, Scan, and ATPG.
Proficiency with industry-standard EDA tools from Synopsys (TestMAX) or Mentor (Tessent).
Strong understanding of logic design, verification, debug, and Static Timing Analysis (STA).
Scripting proficiency in Tcl, Perl, Python, or Shell for automation and innovation.


Preferred Qualifications
Master's degree in Electrical Engineering or related field.
Knowledge of high-speed interface protocols (PCIe, Ethernet, CXL, UALink) and their specific test requirements.
Experience in chip bring-up and mass production activities.
Background in advanced process technologies (7nm and below).
Excellent communication skills with ability to work effectively in global team environments.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
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תודה על שיתוף הפעולה
מודים לך שלקחת חלק בשיפור התוכן שלנו :)
3 ימים
חברה חסויה
Location: Tel Aviv-Yafo
Job Type: Full Time
We are hiring a Manager Design Engineer to help architect and deliver the connectivity silicon powering the world's largest AI clusters. You'll own design execution on complex blocks across our purpose-built products, working at the cutting edge of PCIe, CXL, Ethernet, and emerging rack-scale interconnect technologies.

This is a high-impact technical role at a hyper-growth company. You'll partner closely with architecture, verification, DFT, and physical design teams to take features from spec to silicon, while contributing to the design methodology that scales with our roadmap. If you want to ship silicon that defines AI infrastructure, this is the team.

Key Responsibilities

RTL Design & Implementation
Own RTL design for assigned blocks from microarchitecture through synthesis sign-off.
Develop high-quality, synthesizable Verilog/SystemVerilog with strong attention to PPA.
Drive design reviews, lint, CDC, and timing closure activities to silicon-ready quality.

Cross-Functional Execution
Partner with architecture to translate specifications into implementation-ready microarchitecture.
Collaborate with verification on testplans, coverage closure, and bug triage.
Work with DFT and physical design teams on scan, BIST, floorplanning, and timing closure.

Technical Leadership & Quality
Mentor junior engineers and contribute to design methodology, scripts, and best practices.
Debug complex pre-silicon and post-silicon issues across RTL, gate-level, and emulation environments.
Drive structured, data-driven design decisions in support of aggressive tapeout schedules.
Requirements:
Basic Qualifications
Bachelor's degree in Electrical Engineering, Computer Engineering, or related field.
5+ years of digital design experience, including at least one full chip from spec to tapeout.
Strong proficiency in Verilog/SystemVerilog, RTL coding, and synthesis flows.
Hands-on experience with timing closure, CDC, lint, and low-power design techniques.
Solid understanding of high-speed serial interfaces (PCIe, Ethernet, or similar) and SoC integration.

Preferred Qualifications
MS or PhD in Electrical Engineering or Computer Engineering.
Experience with PCIe Gen5/Gen6, CXL, UALink, UCIe, or Ethernet MAC/PCS designs.
Familiarity with formal verification, emulation, or assertion-based methodologies.
Background in advanced process nodes (7nm, 5nm, or below).
Strong debug skills across pre-silicon and post-silicon environments.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
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מודים לך שלקחת חלק בשיפור התוכן שלנו :)
3 ימים
Location: Tel Aviv-Yafo
Job Type: Full Time
As we expand our presence in Israel, we're seeking a visionary Silicon Technical Program Manager to help build our local engineering powerhouse from the ground up. This is a unique opportunity to take on meaningful product ownership in a new site, leading the physical implementation strategy for chips that power the world's largest AI clusters.

As an Technical Program Manager, you will be the key architect of our silicons operational reality. You wont just track timelines - you will help establish our local execution culture and technical standards, owning the cross-functional journey of transforming complex logic into high-performance silicon.

Key Responsibilities
Drive and manage ASIC development and subsystems from concept through to production in collaboration with internal teams and external vendors.
Provide hands-on program management throughout the full development cycle of silicon and firmware, including concept, design, development, fabrication, validation, and production release.
Work closely with the software, hardware, and architecture teams to align with product requirements and ensure all constraints are met.
Lead process improvements across multiple teams and functions to drive better collaboration and efficiency.
Independently manage complex projects with minimal supervision, ensuring timelines and milestones are met.
Deliver high-quality ASIC solutions products while collaborating with product management and architecture teams.
Requirements:
Basic Qualifications
Bachelor's degree in Computer Science, Electrical Engineering, or a related technical field.
8+ years of experience in ASIC development and 3+ years in Program or Product Management or Technical/Engineering management.
Proven leadership skills, with the ability to manage projects from technical details to the big picture.
Experience in managing ASIC design flow, RTL, synthesis, functional verification, and physical layout.
Experience in pre-silicon testing (Emulation, FPGA) and post-silicon validation is preferred.
Excel in interpersonal communication, relationship building, and collaboration within cross-functional teams.
Excellent organizational and leadership skills, and are capable of multitasking in a fast-paced environment.

Preferred Qualifications
Familiarity with Networking technologies and concepts.
Excellent strategic planning and communication skills, with a self-motivated focus on execution.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
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תודה על שיתוף הפעולה
מודים לך שלקחת חלק בשיפור התוכן שלנו :)
3 ימים
Location: Haifa
Job Type: Full Time
As we expand our presence in Israel, we're seeking a visionary Physical Design Engineer to help build our local engineering powerhouse from the ground up. This is a unique opportunity to take on meaningful product ownership in a new site, defining the backend execution and methodologies for chips that power the world's largest AI clusters.

As a Physical Design Engineer, you will be a key architect of our silicon's physical reality. You won't just execute a flow-you will help establish our local execution culture and technical standards, owning the transformation of complex logic into high-performance silicon. You will drive the physical implementation journey from synthesis through signoff, ensuring our connectivity solutions meet the extreme performance, power, and area targets required for next-generation AI infrastructure. If you thrive on solving complex challenges in deep-submicron processes and want to shape the backend methodology for AI infrastructure connectivity, this is your opportunity.

Key Responsibilities

Physical Implementation & Execution
Be part of the founding Backend team in Israel, playing a critical role in establishing local execution culture and technical standards
Take full responsibility for physical implementation journey including Synthesis, Floorplanning, Place & Route, and Clock-Tree Synthesis (CTS)
Own macro-level implementation with deep hands-on experience in floorplanning and complex routing

Signoff & Design Integrity
Drive final stages of design integrity, owning Timing signoff (STA), Physical Verification (DRC/LVS), and Reliability analysis (EMIR)
Ensure first-pass silicon success through rigorous signoff flows and analysis
Apply Logic Equivalence Checking (LEC) and other verification techniques to guarantee design correctness

Methodology Development & Cross-Functional Collaboration
Participate in defining and refining Backend methodologies with autonomy to improve workflows and tool automation
Work closely with Architecture, Design, and DFT teams to navigate challenges of advanced process nodes and high-speed connectivity
Leverage scripting and automation to make engineering environment faster and more robust
Requirements:
Basic Qualifications
Bachelor's degree in Electrical Engineering or related technical field.
3+ years of hands-on experience in Physical Design at semiconductor companies.
Proven expertise in the full RTL2GDS flow with deep hands-on experience in macro-level implementation, floorplanning, and complex routing.
Experience working with advanced process technologies (7nm and below).
Solid experience with signoff tools and flows including STA, Logic Equivalence Checking (LEC), DRC, and EMIR analysis.
Proficiency in TCL or Python scripting to drive EDA tool flows and automate repetitive tasks.

Preferred Qualifications
Experience with full-chip level implementation and integration.
Knowledge of Power and Noise analysis (SI/PI) to optimize high-performance silicon.
Familiarity with Design-for-Test (DFT) requirements and their impact on physical layout.
Experience with industry-standard EDA tools (Synopsys Fusion Compiler/ICC2, Cadence Innovus).
Background in high-speed interface designs or connectivity protocols.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
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30/08/2026
חברה חסויה
Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
We are looking for talented engineers to join the Pre-silicon Verification team and help us technically lead the challenges of the next decade, developing a semiconductor platform based on revolutionary architecture, and taking part in the development of cutting-edge products within a disruptive system architecture.

Youll have the opportunity to work on the technologies that power the worlds largest cloud provider, in a dynamic, open, and fast-paced environment.
Requirements:
Basic Qualifications
- Electrical/Computer Science engineer.
- 4+ years of experience with RTL verification.
- Knowledge of Hardware Verification concepts and tools (UVM , Coverage Driven verification),
- Sound understanding and knowledge of object-oriented programming concepts, Verilog/SystemVerilog/Specman.

Preferred Qualifications
- Knowledge of the following programming languages: Perl/Bash/TCl/Python.
- Knowledge of PCIe, Processors, Ethernet, DDR.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
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דיווח על תוכן לא הולם או מפלה
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תודה על שיתוף הפעולה
מודים לך שלקחת חלק בשיפור התוכן שלנו :)
3 ימים
Location: Tel Aviv-Yafo
Job Type: Full Time
As we expand our presence in Israel, we're seeking a highly skilled Chip Top Physical Design Engineer focusing on implementation to join our local engineering powerhouse from the ground up.
If you thrive on solving complex, unnamed challenges in deep-submicron processes, your place is with us.

As a Physical Design Engineer, you will be a key hands-on member of our PD Team in the Israel R&D center. You will execute the physical design of the SoC Top level for chips that drive the worlds largest AI clusters. You will be deeply involved in all PD disciplines of the chip, driving the tape-out (T.O.) GDS to meet strict signoff criteria (Timing, LVS, EMIR, DRC, PV, etc.), ensuring our silicon meets the extreme performance, power, and area (PPA) targets required for AI scale.

Key Responsibilities
Execute SoC Top-level physical design and actively drive full-chip convergence.
Perform Top-Level physical implementation, including floor-planning, Place & Route (P&R), Clock Tree Synthesis (CTS), Power/Clock distribution, Power Integrity, and Timing/Physical signoff.
Work closely with the Architecture, Design, DFT, and Product teams to achieve optimal Power, Performance, and Area (PPA). This involves participating in feasibility studies for new architectures and optimizing runs to ensure the best Quality of Results (QoR).
Resolve complex signal integrity, thermal, and power challenges inherent in high-speed connectivity silicon.
Collaborate closely with the Package team on Bump-map-to-Ballout design, taking all signal integrity aspects into consideration.
Requirements:
Basic Qualifications
B.Sc. or M.Sc. in Electrical Engineering.
5+ years of hands-on experience in Chip Top Physical Design/Backend at leading semiconductor companies, working on advanced process technologies (5nm, 3nm, and below).
Proven experience executing complex block or chip-level projects with a proactive, "can-do" approach and excellent communication skills.
Deep hands-on expertise in RTL2GDS flows, including P&R, STA, Physical Verification (DRC/LVS), Formal Verification, low-power implementation (UPF/CPF), and EMIR.
Mastery of industry-standard EDA tools (Synopsys Fusion Compiler/ICC2 or Cadence Innovus).
Practical experience handling both complex macro/subsystem-level designs and Full-Chip integration.


Preferred Qualifications
Deep understanding of Power & Noise analysis (EM/IR).
Experience with DFT (Design for Test) integration into the physical design flow.
Background in high-speed interfaces or data center protocols.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
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סגור
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תודה על שיתוף הפעולה
מודים לך שלקחת חלק בשיפור התוכן שלנו :)
3 ימים
חברה חסויה
Location: Tel Aviv-Yafo
Job Type: Full Time
As we expand our presence in Israel, we're seeking a visionary Junior Physical Design Engineer to help build our local engineering powerhouse from the ground up. This is a unique opportunity to take on meaningful product ownership in a new site, defining the backend execution and methodologies for chips that power the world's largest AI clusters.

As a Junior Physical Design Engineer, you will be a key architect of our silicon's physical reality. You won't just execute a flow-you will help establish our local execution culture and technical standards, owning the transformation of complex logic into high-performance silicon. You will drive the physical implementation journey from synthesis through signoff, ensuring our connectivity solutions meet the extreme performance, power, and area targets required for next-generation AI infrastructure. If you thrive on solving complex challenges in deep-submicron processes and want to shape the backend methodology for AI infrastructure connectivity, this is your opportunity.

Key Responsibilities

Physical Implementation & Execution
Be part of the founding Backend team in Israel, playing a critical role in establishing local execution culture and technical standards
Take full responsibility for physical implementation journey including Synthesis, Floorplanning, Place & Route, and Clock-Tree Synthesis (CTS)
Own macro-level implementation with deep hands-on experience in floorplanning and complex routing.

Signoff & Design Integrity
Drive final stages of design integrity, owning Timing signoff (STA), Physical Verification (DRC/LVS), and Reliability analysis (EMIR)
Ensure first-pass silicon success through rigorous signoff flows and analysis
Apply Logic Equivalence Checking (LEC) and other verification techniques to guarantee design correctness.

Methodology Development & Cross-Functional Collaboration
Participate in defining and refining Backend methodologies with autonomy to improve workflows and tool automation.
Work closely with Architecture, Design, and DFT teams to navigate challenges of advanced process nodes and high-speed connectivity.
Leverage scripting and automation to make engineering environment faster and more robust.
Requirements:
Basic Qualifications
Bachelors degree in Electrical Engineering or a related technical field.
Foundational understanding of the RTL-to-GDS flow, with academic or internship exposure to areas such as floorplanning, placement, and routing
Familiarity with advanced process technologies (e.g., 7nm and below) through coursework or hands-on projects.
Basic experience with signoff methodologies and tools, including STA, Logic Equivalence Checking (LEC), DRC, and EMIR analysis.
Working knowledge of TCL or Python scripting for simple automation and support of EDA tool flows.

Preferred Qualifications
Experience with full-chip level implementation and integration.
Knowledge of Power and Noise analysis (SI/PI) to optimize high-performance silicon.
Familiarity with Design-for-Test (DFT) requirements and their impact on physical layout.
Experience with industry-standard EDA tools (Synopsys Fusion Compiler/ICC2, Cadence Innovus).
Background in high-speed interface designs or connectivity protocols.
This position is open to all candidates.
 
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עדכון קורות החיים לפני שליחה
עדכון קורות החיים לפני שליחה
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