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22/07/2026
משרה זו סומנה ע"י המעסיק כלא אקטואלית יותר
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30/08/2026
חברה חסויה
Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
Key job responsibilities
* Daily involvement in all aspects of physical design chip development (RTL2GDS), including floorplanning, synthesis, clock tree synthesis, place and route, static timing analysis, power and noise analysis, physical verification testing, and equivalence checks.
* Being actively engaged in design-backend convergence aspects and defining timing constraints.
* Taking full end-to-end responsibility for the physical design of macros and clusters level, according to specifications, under challenging constraints, with focus on optimizing power, area, and performance.
* Participation in the development of design flows, using a variety of EDA tools and vendors such as Synopsis and Cadence.
* Engaged in defining implementation and signoff methodologies.
Requirements:
Basic Qualifications
- Understanding the entire physical design flow (RTL to GDS).
- Deep understanding of sign-off activities (timing and physical verification).
- Experience in advanced nodes technologies and Implementation tools.
- Process and technology oriented.
- Leadership and mentoring skills.

Preferred Qualifications
- Full-chip experience (floor plan, layout, timing).
- Previous experience in high-speed designs, multi-voltage (low power) designs.
This position is open to all candidates.
 
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07/09/2026
חברה חסויה
Location: Tel Aviv-Yafo
Job Type: Full Time
We are looking for talented engineers to help us develop a semiconductor platform based on revolutionary architecture.
Take part in the development of cutting-edge products within a disruptive system architecture. Youll have the opportunity to work on the technologies that power the worlds largest cloud provider, within a dynamic, open, fast-paced environment. Our Web Services provides a highly reliable, scalable, low-cost infrastructure platform in the cloud, which powers hundreds of thousands of businesses in 190 countries around the world.
We are looking for excellent electrical engineering graduates to join our talented Physical Design team, which develops our next generation products for the cloud market.
We will be conducting a unique training program for three months, where where you will be studying the following with our technical experts and team leaders:
* Backend development flow and stages (RTL to GDS).
* A wide variety of relevant tools and knowledge.
* Practical experience with the most advanced technologies in the industry.

Key job responsibilities
Join our three-month training program where you'll work alongside technical experts and team leaders to gain:
*Backend development expertise (RTL to GDS flow).
*Hands-on experience with industry-leading tools and technologies.
*Practical skills in AI-driven innovations and cutting-edge methodologies.
You'll collaborate with cross-functional teams throughout the chip development cycle and become an essential part of our dynamic physical design team, playing a critical role in next-generation cloud computing solutions development.
Requirements:
Basic Qualifications
- BSc in Electrical/Computer Engineering. Please submit your grade sheet combined with your CV as a single PDF document.
- Recent graduates or students currently in their 8th semester (final year).
- Available to work full-time.

Preferred Qualifications
- Experience in the industry.
- Demonstrated passion for technological innovation.
- Ability to adapt and learn rapidly in a dynamic environment.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
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3 ימים
Location: Tel Aviv-Yafo
Job Type: Full Time
As we expand our presence in Israel, we're seeking a highly skilled Chip Top Physical Design Engineer focusing on implementation to join our local engineering powerhouse from the ground up.
If you thrive on solving complex, unnamed challenges in deep-submicron processes, your place is with us.

As a Physical Design Engineer, you will be a key hands-on member of our PD Team in the Israel R&D center. You will execute the physical design of the SoC Top level for chips that drive the worlds largest AI clusters. You will be deeply involved in all PD disciplines of the chip, driving the tape-out (T.O.) GDS to meet strict signoff criteria (Timing, LVS, EMIR, DRC, PV, etc.), ensuring our silicon meets the extreme performance, power, and area (PPA) targets required for AI scale.

Key Responsibilities
Execute SoC Top-level physical design and actively drive full-chip convergence.
Perform Top-Level physical implementation, including floor-planning, Place & Route (P&R), Clock Tree Synthesis (CTS), Power/Clock distribution, Power Integrity, and Timing/Physical signoff.
Work closely with the Architecture, Design, DFT, and Product teams to achieve optimal Power, Performance, and Area (PPA). This involves participating in feasibility studies for new architectures and optimizing runs to ensure the best Quality of Results (QoR).
Resolve complex signal integrity, thermal, and power challenges inherent in high-speed connectivity silicon.
Collaborate closely with the Package team on Bump-map-to-Ballout design, taking all signal integrity aspects into consideration.
Requirements:
Basic Qualifications
B.Sc. or M.Sc. in Electrical Engineering.
5+ years of hands-on experience in Chip Top Physical Design/Backend at leading semiconductor companies, working on advanced process technologies (5nm, 3nm, and below).
Proven experience executing complex block or chip-level projects with a proactive, "can-do" approach and excellent communication skills.
Deep hands-on expertise in RTL2GDS flows, including P&R, STA, Physical Verification (DRC/LVS), Formal Verification, low-power implementation (UPF/CPF), and EMIR.
Mastery of industry-standard EDA tools (Synopsys Fusion Compiler/ICC2 or Cadence Innovus).
Practical experience handling both complex macro/subsystem-level designs and Full-Chip integration.


Preferred Qualifications
Deep understanding of Power & Noise analysis (EM/IR).
Experience with DFT (Design for Test) integration into the physical design flow.
Background in high-speed interfaces or data center protocols.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
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4 ימים
חברה חסויה
Location: Tel Aviv-Yafo
Job Type: Full Time
As we expand our presence in Israel, we're seeking a visionary Junior Physical Design Engineer to help build our local engineering powerhouse from the ground up. This is a unique opportunity to take on meaningful product ownership in a new site, defining the backend execution and methodologies for chips that power the world's largest AI clusters.

As a Junior Physical Design Engineer, you will be a key architect of our silicon's physical reality. You won't just execute a flow-you will help establish our local execution culture and technical standards, owning the transformation of complex logic into high-performance silicon. You will drive the physical implementation journey from synthesis through signoff, ensuring our connectivity solutions meet the extreme performance, power, and area targets required for next-generation AI infrastructure. If you thrive on solving complex challenges in deep-submicron processes and want to shape the backend methodology for AI infrastructure connectivity, this is your opportunity.

Key Responsibilities

Physical Implementation & Execution
Be part of the founding Backend team in Israel, playing a critical role in establishing local execution culture and technical standards
Take full responsibility for physical implementation journey including Synthesis, Floorplanning, Place & Route, and Clock-Tree Synthesis (CTS)
Own macro-level implementation with deep hands-on experience in floorplanning and complex routing.

Signoff & Design Integrity
Drive final stages of design integrity, owning Timing signoff (STA), Physical Verification (DRC/LVS), and Reliability analysis (EMIR)
Ensure first-pass silicon success through rigorous signoff flows and analysis
Apply Logic Equivalence Checking (LEC) and other verification techniques to guarantee design correctness.

Methodology Development & Cross-Functional Collaboration
Participate in defining and refining Backend methodologies with autonomy to improve workflows and tool automation.
Work closely with Architecture, Design, and DFT teams to navigate challenges of advanced process nodes and high-speed connectivity.
Leverage scripting and automation to make engineering environment faster and more robust.
Requirements:
Basic Qualifications
Bachelors degree in Electrical Engineering or a related technical field.
Foundational understanding of the RTL-to-GDS flow, with academic or internship exposure to areas such as floorplanning, placement, and routing
Familiarity with advanced process technologies (e.g., 7nm and below) through coursework or hands-on projects.
Basic experience with signoff methodologies and tools, including STA, Logic Equivalence Checking (LEC), DRC, and EMIR analysis.
Working knowledge of TCL or Python scripting for simple automation and support of EDA tool flows.

Preferred Qualifications
Experience with full-chip level implementation and integration.
Knowledge of Power and Noise analysis (SI/PI) to optimize high-performance silicon.
Familiarity with Design-for-Test (DFT) requirements and their impact on physical layout.
Experience with industry-standard EDA tools (Synopsys Fusion Compiler/ICC2, Cadence Innovus).
Background in high-speed interface designs or connectivity protocols.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
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מודים לך שלקחת חלק בשיפור התוכן שלנו :)
3 ימים
Location: Haifa
Job Type: Full Time
As we expand our presence in Israel, we're seeking a visionary Physical Design Engineer to help build our local engineering powerhouse from the ground up. This is a unique opportunity to take on meaningful product ownership in a new site, defining the backend execution and methodologies for chips that power the world's largest AI clusters.

As a Physical Design Engineer, you will be a key architect of our silicon's physical reality. You won't just execute a flow-you will help establish our local execution culture and technical standards, owning the transformation of complex logic into high-performance silicon. You will drive the physical implementation journey from synthesis through signoff, ensuring our connectivity solutions meet the extreme performance, power, and area targets required for next-generation AI infrastructure. If you thrive on solving complex challenges in deep-submicron processes and want to shape the backend methodology for AI infrastructure connectivity, this is your opportunity.

Key Responsibilities

Physical Implementation & Execution
Be part of the founding Backend team in Israel, playing a critical role in establishing local execution culture and technical standards
Take full responsibility for physical implementation journey including Synthesis, Floorplanning, Place & Route, and Clock-Tree Synthesis (CTS)
Own macro-level implementation with deep hands-on experience in floorplanning and complex routing

Signoff & Design Integrity
Drive final stages of design integrity, owning Timing signoff (STA), Physical Verification (DRC/LVS), and Reliability analysis (EMIR)
Ensure first-pass silicon success through rigorous signoff flows and analysis
Apply Logic Equivalence Checking (LEC) and other verification techniques to guarantee design correctness

Methodology Development & Cross-Functional Collaboration
Participate in defining and refining Backend methodologies with autonomy to improve workflows and tool automation
Work closely with Architecture, Design, and DFT teams to navigate challenges of advanced process nodes and high-speed connectivity
Leverage scripting and automation to make engineering environment faster and more robust
Requirements:
Basic Qualifications
Bachelor's degree in Electrical Engineering or related technical field.
3+ years of hands-on experience in Physical Design at semiconductor companies.
Proven expertise in the full RTL2GDS flow with deep hands-on experience in macro-level implementation, floorplanning, and complex routing.
Experience working with advanced process technologies (7nm and below).
Solid experience with signoff tools and flows including STA, Logic Equivalence Checking (LEC), DRC, and EMIR analysis.
Proficiency in TCL or Python scripting to drive EDA tool flows and automate repetitive tasks.

Preferred Qualifications
Experience with full-chip level implementation and integration.
Knowledge of Power and Noise analysis (SI/PI) to optimize high-performance silicon.
Familiarity with Design-for-Test (DFT) requirements and their impact on physical layout.
Experience with industry-standard EDA tools (Synopsys Fusion Compiler/ICC2, Cadence Innovus).
Background in high-speed interface designs or connectivity protocols.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
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3 ימים
Location: Tel Aviv-Yafo
Job Type: Full Time
As we expand our presence in Israel, we're seeking a highly skilled Static Timing Analysis (STA) Engineer to join our local engineering powerhouse from the ground up.

This is a unique opportunity to take on meaningful technical ownership in a new site, executing the sign-off methodology for chips that power the world's most advanced AI clusters. As an STA Engineer, you will be deeply involved in the STA activities from chip partition and time budgeting through to final sign-off. You will bridge the gap between Architecture, Design, DFT, and Physical Design to ensure our high-performance silicon meets the aggressive timing targets required for next-generation connectivity.


Key Responsibilities
Execute the STA flow and sign-off methodologies, ensuring our products meet rigorous timing criteria for the most demanding data center environments.
Collaborate closely with Architecture, Design, DFT, and Backend teams, participating in timing reviews and working with block owners to navigate the path to sign-off convergence.
Develop, optimize, and manage complex SDC constraints, ensuring they are accurate and robust across multi-scenario environments.
Analyze and resolve challenges related to cross-chip clock distribution networks and apply sophisticated margining techniques to ensure robust silicon across all process corners.
Participate in design methodology improvements and tool automation, utilizing both industry-standard EDA tools and custom scripts to make our sign-off process faster and more efficient.
Requirements:
Basic Qualifications
B.Sc. in Electrical Engineering or Computer Engineering.
6+ years of hands-on experience in Static Timing Analysis (STA) at semiconductor companies, specifically working on advanced process technologies. (Note: Adjust years of experience based on the exact level you are targeting).
Deep expertise in multi-scenario STA, as well as timing and SDC constraint development and verification at the block and subsystem levels.
Solid understanding of advanced margining methodologies, including OCV, AOCV, and POCV, from synthesis through to final sign-off.
Solid knowledge of physical design flows (Synthesis, P&R, Physical Verification) and how they intersect with timing closure.


Preferred Experience
Experience developing and validating constraints using industry-standard tools like Timing Constraints Manager (Synopsys) or TimeVision (Ausdia).
Proven track record of executing STA on complex Macro-level designs and supporting Full-Chip timing integration.
Strong background in scripting (Tcl, Python, Perl) and automation to enhance timing closure efficiency.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
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חברה חסויה
Location: Haifa
Job Type: Full Time
Were looking for a Physical Design Engineer to join our growing team, and take a key role in developing our next-generation SoC from definition to Tape-Out.
What will your job look like:
Hands-on physical design block owner, leading the process from RTL to GDS.
Lead floorplan exploration in collaboration with Front-End and Architecture teams.
STA: Partner with FE and floor planners to manage block and top-level constraints and perform 1st-level timing analysis.
Synthesis: Conduct synthesis exploration and deliver final netlists, including scan insertion, UPF, and clean Lint/Spyglass checks.
Place & Route: Drive the flow from synthesis netlist to final layout and signoff verification, with a focus on optimizing PPA (Power, Performance, and Area).
Signoff: on all physical design domains- STA, IR/EM, Physical Verification, Logic Equivalent Checking, Low Power Verification.
Requirements:
BSc or MSc in Computer Engineering or Electrical Engineering.
0-2 years of experience in the industry.
Proficiency in scripting languages (Tcl, Python, Perl, or tcsh).
A team player with excellent communication skills and a can-do attitude.
Nice to have:
Experience in developing or maintaining implementation tools and design flows.
Experience with high-speed interfaces (DDR/PCIE).
Experience with advanced nodes (5nm and below).
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
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מודים לך שלקחת חלק בשיפור התוכן שלנו :)
Location: Haifa
Job Type: Full Time
Were looking for an Experienced Physical Design Engineer to join our growing team, and take a key role in developing our next-generation SoC from definition to Tape-Out.
What will your job look like:
Hands-on physical design block owner, leading the process from RTL to GDS.
Lead floorplan exploration in collaboration with Front-End and Architecture teams.
STA: Partner with FE and floor planners to manage block and top-level constraints and perform 1st-level timing analysis.
Synthesis: Conduct synthesis exploration and deliver final netlists, including scan insertion, UPF, and clean Lint/Spyglass checks.
Place & Route: Drive the flow from synthesis netlist to final layout and signoff verification, with a focus on optimizing PPA (Power, Performance, and Area).
Signoff : on all physical design domains- STA, IR/EM, Physical Verification, Logic Equivalent Checking, Low Power Verification.
Requirements:
BSc or MSc in Computer Engineering or Electrical Engineering.
5+ years of experience in the Physical Design field
Proficiency in scripting languages (Tcl, Python, Perl, or tcsh).
A team player with excellent communication skills and a can-do attitude.
Nice to have:
Experience in developing or maintaining implementation tools and design flows.
Experience with high-speed interfaces (DDR/PCIE).
Experience with advanced nodes (5nm and below).
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
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מודים לך שלקחת חלק בשיפור התוכן שלנו :)
4 ימים
חברה חסויה
Location: Tel Aviv-Yafo
Job Type: Full Time
We are hiring a Manager Design Engineer to help architect and deliver the connectivity silicon powering the world's largest AI clusters. You'll own design execution on complex blocks across our purpose-built products, working at the cutting edge of PCIe, CXL, Ethernet, and emerging rack-scale interconnect technologies.

This is a high-impact technical role at a hyper-growth company. You'll partner closely with architecture, verification, DFT, and physical design teams to take features from spec to silicon, while contributing to the design methodology that scales with our roadmap. If you want to ship silicon that defines AI infrastructure, this is the team.

Key Responsibilities

RTL Design & Implementation
Own RTL design for assigned blocks from microarchitecture through synthesis sign-off.
Develop high-quality, synthesizable Verilog/SystemVerilog with strong attention to PPA.
Drive design reviews, lint, CDC, and timing closure activities to silicon-ready quality.

Cross-Functional Execution
Partner with architecture to translate specifications into implementation-ready microarchitecture.
Collaborate with verification on testplans, coverage closure, and bug triage.
Work with DFT and physical design teams on scan, BIST, floorplanning, and timing closure.

Technical Leadership & Quality
Mentor junior engineers and contribute to design methodology, scripts, and best practices.
Debug complex pre-silicon and post-silicon issues across RTL, gate-level, and emulation environments.
Drive structured, data-driven design decisions in support of aggressive tapeout schedules.
Requirements:
Basic Qualifications
Bachelor's degree in Electrical Engineering, Computer Engineering, or related field.
5+ years of digital design experience, including at least one full chip from spec to tapeout.
Strong proficiency in Verilog/SystemVerilog, RTL coding, and synthesis flows.
Hands-on experience with timing closure, CDC, lint, and low-power design techniques.
Solid understanding of high-speed serial interfaces (PCIe, Ethernet, or similar) and SoC integration.

Preferred Qualifications
MS or PhD in Electrical Engineering or Computer Engineering.
Experience with PCIe Gen5/Gen6, CXL, UALink, UCIe, or Ethernet MAC/PCS designs.
Familiarity with formal verification, emulation, or assertion-based methodologies.
Background in advanced process nodes (7nm, 5nm, or below).
Strong debug skills across pre-silicon and post-silicon environments.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
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מודים לך שלקחת חלק בשיפור התוכן שלנו :)
לפני 22 שעות
חברה חסויה
Location: Haifa
Job Type: Full Time
We are looking for talented engineers to help us develop the semiconductor platform which is based on revolutionary architecture.
Take part in the development of cutting edge products within disruptive system architecture. Youll have the opportunity to work on the technologies that power the worlds largest Cloud provider, within a dynamic, open, and fast-paced environment. Amazon Web Services provides a highly reliable, scalable, low-cost infrastructure platform in the cloud that powers hundreds of thousands of businesses in 190 countries around the world.

Exciting opportunity to join Amazon in developing its next generation products for the cloud market.
We are looking for talented people to join the team and help us technically lead the challenges of the next decade.
In this job you will be exposed and learn wide range of expertise such as: C++ programing, hardware design, data mining, Verilog simulations, working with various high end test equipment and more
If paving new roads on edge of technology within a strong and vibrant team is what you seek, your place is with us.
Requirements:
Basic Qualifications
- Bachelor's degree in Electrical Engineering.
- Experience working in a fast-paced, rapidly changing operations environment.

Preferred Qualifications
- Familiar with chip design processes and debug techniques.
- Deep understanding of DFT and DFM.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
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