דרושים » חשמל ואלקטרוניקה » Senior Staff DSP Design Engineer, Cloud

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Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
Required Staff Embedded Firmware Engineer, High Speed DSP
About the job
In this role, youll work to shape the future of AI/ML hardware acceleration. You will have an opportunity to drive cutting-edge TPU (Tensor Processing Unit) technology that powers our most demanding AI/ML applications. Youll be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our TPU. You'll contribute to the innovation behind products loved by millions worldwide, and leverage your design and verification expertise to verify complex digital designs, with a specific focus on TPU architecture and its integration within AI/ML-driven systems.
As a Staff Embedded Firmware Engineer for High-Speed DSP, you will architect and define the low-level firmware and control loops powering the world's most advanced physical-layer communications silicon. Sitting at the critical intersection of digital signal processing (DSP), hardware-software co-design, and real-time systems, you will lead the development of adaptive algorithms, error correction (FEC), and link-telemetry frameworks. Your work will directly bridge the gap between high-performance hardware pipelines and our planetary-scale AI infrastructure, transforming complex communication systems theory into reliable, real-time silicon execution.
Responsibilities
Define the long-term firmware roadmap and hardware-software partitioning for physical-layer interfaces, determining the optimal balance between hardware-fixed logic and programmable firmwarm.
Architect advanced "in-situ" monitoring systems and firmware-driven diagnostics to track physical-layer link health, Bit Error Rate (BER) trends, and channel quality across millions of ports in real-time.
Design, model, and implement bare-metal or RTOS firmware to control high-speed transceivers, managing real-time adaptive loops, clock and data recovery (CDR), and physical-layer calibration.
Partner with TPU Systems, Networking Software, and High-Performance Computing (HPC) teams to ensure silicon firmware integrates seamlessly with global cluster management and collective communication frameworks.
Identify and de-risk hardware-software interface bottlenecks (e.g., register maps, driver latencies, and boot-up sequencing) that impact our AI infrastructure.
Requirements:
Minimum qualifications:
Bachelors degree in Electrical Engineering, Computer Engineering, a related technical field, or equivalent practical experience.
10 years of industry experience in embedded systems/firmware, communication systems engineering, or digital signal processing (DSP) development.
Experience developing embedded software (C/C++) for high-speed physical-layer interfaces (PHY), digital transceivers, or communication subsystems.
Preferred qualifications:
Master's degree or PhD in Electrical Engineering, Computer Engineering, or a related technical field.
Expertise in Forward Error Correction (FEC) algorithms and advanced modulation schemes.
Track record defining firmware framework specifications, register maps, and Silicon Lifecycle Management telemetry for high-volume networking or AI silicon.
Background in wireless communications with deep domain knowledge of channel modeling, noise mitigation, and digital transceiver architectures.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
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Location: Haifa
Job Type: Full Time
Required Senior RTL Design Engineer, Digital Signal Processing
About the job
In this role, youll work to shape the future of AI/ML hardware acceleration. You will have an opportunity to drive cutting-edge TPU (Tensor Processing Unit) technology that powers our most demanding AI/ML applications. Youll be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our TPU. You'll contribute to the innovation behind products loved by millions worldwide, and leverage your design and verification expertise to verify complex digital designs, with a specific focus on TPU architecture and its integration within AI/ML-driven systems.
As an RTL Design Engineer, you will be a key contributor to the physical implementation of next-generation TPU technology building ASICs for high-speed communication systems. You will take ownership of complex blocks, translating mathematical models into bit-exact silicon. Your expertise in front-end design flows will be vital in delivering the hardware that powers our advanced AI models and cloud services.
We're the driving force behind our groundbreaking innovations, empowering the development of our cutting-edge AI models, delivering unparalleled computing power to global services, and providing the essential platforms that enable developers to build the future. From software to hardware our teams are shaping the future of world-leading hyperscale computing, with key teams working on the development of our TPUs, Vertex AI for Cloud, Global Networking, Data Center operations, systems research, and much more.
Individual pay is determined by factors including job-related skills, experience, and relevant education or training.
Responsibilities
Design and implement high-speed blocks, taking end-to-end ownership of complex modules within the larger system.
Solve complex implementation issues related to GHz-frequency timing closure and advanced process nodes.
Transform high-level architectural specifications and communication theory models into efficient, bit-exact implementations.
Perform fixed-point analysis and micro-architectural trade-offs. Execute and optimize the front-end design flow for your assigned components to ensure, sign-off quality designs.
Collaborate closely with verification teams to develop bit-exact C++/SystemC models and ensure seamless integration.
Requirements:
Minimum qualifications:
Bachelor's degree in Electrical Engineering, Computer Engineering, or a related technical field.
8 years of experience in digital signal processing (DSP) design or high-speed digital logic design.
Experience implementing digital blocks for communication systems or PHY (Physical Layer) e.g., filters, interpolators, or timing recovery.
Experience in MATLAB, Python, or C++
Preferred qualifications:
Master's or PhD degree in Electrical Engineering, Computer Engineering, or a related technical field.
Experience taking complex DSP designs through the full front-end flow: Synthesis (Design Compiler/Genus), STA (PrimeTime/Tempus), and CDC/LEC (Spyglass/Conformal).
Experience with advanced FinFET process nodes (5nm, 3nm) and achieving timing closure at GHz frequencies.
Experience with high-speed serial links (SerDes) and FEC (Forward Error Correction) implementation.
Solid understanding of low-power design techniques and dynamic power optimization.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
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8782524
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Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
Technical Lead, Custom Digital Circuit Design, Mixed Signal
About the job
In this role, youll work to shape the future of AI/ML hardware acceleration. You will have an opportunity to drive cutting-edge TPU (Tensor Processing Unit) technology that powers our most demanding AI/ML applications. Youll be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our TPU. You'll contribute to the innovation behind products loved by millions worldwide, and leverage your design and verification expertise to verify complex digital designs, with a specific focus on TPU architecture and its integration within AI/ML-driven systems.
As the Lead Architect for our custom back-end solutions for high-speed internal connections, you will set the design standards for our custom silicon. You will ensure our physical design methods can support data speeds of 1.6T and above while maintaining high manufacturing reliability and performance. You will create the design framework for our future hardware, solving complex engineering challenges in the latest manufacturing processes.
Responsibilities
Define the global back-end and custom Physical Design methodology, driving the transition to automated Analog and Mixed-Signal (AMS) flows and "Layout-Aware" design.
Lead full custom digital circuit design at the transistor level optimized for low power.
Evaluate and de-risk new process features in GAA (Gate-All-Around) nodes (e.g., Backside Power Delivery, Buried Power Rails) for high-speed analog use cases.
Drive the long-term Roadmap for Area and Power density, ensuring our PHYs remain the most efficient in the industry.
Act as the primary liaison with foundries to optimize Design for Manufacturing (DFM) and maximize yield for massive TPU-scale chips.
Requirements:
Minimum qualifications:
Bachelor's degree in Electrical Engineering, Computer Engineering, a related technical field, or equivalent practical experience.
12 years of experience in Physical Design, Custom Digital Circuit Design, or Custom Layout.
Experience delivering GDS for advanced nodes.
Preferred qualifications:
Master's degree or PhD in Electrical Engineering, Computer Engineering, or a related technical field.
Experience in custom digital design and low power design techniques.
Experience with custom design tools and methods.
Experience in Electromagnetic Modeling (EM) and its impact on physical layout (Inductors, T-lines).
Experience in Co-Packaged Optics (CPO) physical implementation.
Ability to build strategic goals for the intersection of AI-driven layout and traditional custom design.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
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עדכון קורות החיים לפני שליחה
8785630
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Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
Required Signal/Power Integrity Engineer, PhD Graduate
About the job
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
The ML, Systems, & Cloud AI (MSCA) organization designs, implements, and manages the hardware, software, machine learning, and systems infrastructure for all our services (Search, YouTube, etc.) and Cloud.
We prioritize security, efficiency, and reliability across everything we do - from developing our latest TPUs to running a global network, while driving towards shaping the future of hyperscale computing. Our global impact spans software and hardware, including Clouds Vertex AI, the leading AI platform for bringing Gemini models to enterprise customers.
Responsibilities
Simulate high speed interface electrical behavior using HSPICE or other circuit simulators.
Generate precise electrical models (e.g., S-parameters, SPICE models) for components such as packages, PCBs, and connectors for use in simulations.
Collaborate extensively with cross-functional teams, including ASIC architects, digital/analog designers, physical design/layout engineers, and system engineers, to define specifications and resolve integration challenges.
Execute lab measurements utilizing test equipment like oscilloscopes, Vector Network Analyzers (VNA), Time Domain Reflectometers (TDR) , Spectrum analyzers to validate simulation outcomes and debug signal and power-related issues on silicon prototypes and boards.
Establish robust design rules and guidelines for optimal signal/power integrity during PCB and package layout, ensuring high production yield and reliability.
Requirements:
Minimum qualifications:
PhD degree in Electrical Engineering, Computer Engineering, Physics, Materials Engineering, or Computer Science.
Relevant practical or internship experience, or personal project experience in hardware or electrical engineering.
Preferred qualifications:
Working knowledge of physical layer requirements for PCIe, Ethernet (IEEE 802.3).
Advanced proficiency in Python (NumPy, Pandas) for data analysis and instrument control.
Ability to correlate lab measurements with pre-silicon SI simulations (HSPICE, ADS, or Sigrity).
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
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Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
Required ASIC Design Verification Technical Lead, High-Speed DSP
About the job
In this role, youll work to shape the future of AI/ML hardware acceleration. You will have an opportunity to drive cutting-edge TPU (Tensor Processing Unit) technology that powers our most demanding AI/ML applications. Youll be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our TPU. You'll contribute to the innovation behind products loved by millions worldwide, and leverage your design and verification expertise to verify complex digital designs, with a specific focus on TPU architecture and its integration within AI/ML-driven systems.
As an ASIC Design Verification Technical Lead, you will define how we verifiy the physical-layer Digital Signal Processing (DSP) pipelines powering our next-generation AI hardware accelerators. You will drive the shift toward Emulation and Post-Silicon Correlation, ensuring that our architectural reference models and pre-silicon simulations perfectly match the physical behavior of the high-speed silicon in our planetary-scale AI data centers.
Responsibilities
Design, build, and scale constrained-random verification environments using SystemVerilog and UVM for high-speed physical-layer DSP blocks.
Build co-simulation frameworks and predictors to compare RTL implementation output against high-level algorithmic models.
Define and execute functional coverage plans, utilizing covergroups and SystemVerilog Assertions to verify architectural corner cases, fixed-point quantization effects, and numerical overflows.
Author dynamic stimulus sequences and virtual sequencers to stress-test adaptive feedback loops under realistic channel impairments, including noise, ISI, and high-frequency jitter profiles.
Lead the debugging of RTL and environment failures, collaborating closely with algorithm and DSP designers to isolate and resolve discrepancies between the RTL implementation and the specification.
Requirements:
Minimum qualifications:
Bachelor's degree in Electrical Engineering, Computer Engineering, or a related technical field.
12 years of experience in design verification.
Experience in high-speed PHY layers, high-speed interface subsystems, or mixed-signal verification.
Preferred qualifications:
Master's degree or PhD in Electrical Engineering, Computer Engineering, or a related technical field.
Experience defining verification architectures, methodologies, and roadmaps for AI accelerators, High-Performance Computing or high-bandwidth networking silicon.
Experience bridging the gap between Pre-Silicon verification (simulation and emulation) and Post-Silicon validation and correlation.
Experience driving advanced verification methodologies.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
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עדכון קורות החיים לפני שליחה
8786842
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חברה חסויה
Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
Required Senior DFT Lead
About the job
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
As the Design for Test (DFT) Engineer Lead, you will play a crucial role in DFT Architecture and DFT design, and support devices to production. You will be responsible for providing technical leadership in DFT, developing flows, automation, and methodology, planning DFT activities, tracking the DFT quality throughout the project life-cycle, and providing sign-off DFT to tapeout.
In this role, you will work to shape the future of an Edge-AI product, bringing high-performance intelligence to the edge. You will have an opportunity to drive distributed inference technology that powers real-time systems where latency and reliability are mission-critical.
You will be part of a team that pushes boundaries, developing autonomous solutions that define the next-generation of intelligent infrastructure and hardware for the edge. You will contribute to the innovation behind products that transform industries, leveraging your expertise in system-level integration and localized processing to deploy AI models across sophisticated hardware platforms, ensuring intelligence is embedded exactly where the action happens.
Responsibilities
Drive and execute DFT activities in the design, implementation, and verification solutions for application-specific integrated circuits (ASIC).
Develop DFT strategy and architecture, including hierarchical DFT, memory built-in self test (MBIST), and automatic test pattern generation (ATPG).
Collaborate with other Engineering teams (e.g., Design, Verification, Physical Design) to ensure that DFT requirements are met and mutual dependencies are managed.
Oversee DFT team planning, deliverables, and provide technical mentoring and guidance.
Lead DFT execution of a silicon project, planning, execution, tracking, quality, and signoff.
Requirements:
Minimum qualifications:
Bachelor's degree in Electrical Engineering, Computer Engineering, or a related field, or equivalent practical experience.
8 years of experience in Design For Test from DFT architecture to post-silicon production support.
4 years of experience with people management.
Experience with DFT design and verification for multiple projects, DFT specification, definition, architecture, and insertion.
Experience with DFT techniques and common industry tools, DFT and Physical Design flows, and DFT verification flow.
Experience in leading DFT activities throughout the ASIC development flow.
Preferred qualifications:
Master's degree in Electrical Engineering or a related field.
Experience in post-silicon Debug, test or product engineering.
Experience in Joint Test Action Group (JTAG) and Internal JTAG (iJTAG) protocols and architectures.
Experience in SoC cycles, silicon bring-up, and silicon debug activities.
Knowledge of fault modeling techniques.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
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8785707
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מודים לך שלקחת חלק בשיפור התוכן שלנו :)
Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
Required Senior Silicon Physical Design Engineer
About the job
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
As a SoC Physical Design Engineer, you will collaborate with functional design, Design for Testing (DFT), architecture, and packaging engineers. In this role, you will solve technical problems with innovative micro-architecture and practical logic circuits solutions, while evaluating design options with optimized performance, power, and area in mind.
The AI and Infrastructure team is redefining whats possible. We empower customers with breakthrough capabilities and insights by delivering AI and Infrastructure at unparalleled scale, efficiency, reliability and velocity.
We're the driving force behind our groundbreaking innovations, empowering the development of our cutting-edge AI models, delivering unparalleled computing power to global services, and providing the essential platforms that enable developers to build the future. From software to hardware our teams are shaping the future of world-leading hyperscale computing, with key teams working on the development of our TPUs, Vertex AI for Cloud, Global Networking, Data Center operations, systems research, and much more.
Responsibilities
Use problem-solving and simulation techniques to ensure performance, power, and area (PPA) are within defined requirements.
Collaborate with cross-functional teams to debug failures or performance shortfalls and meet program goals in lab or simulation.
Design chips, chip-subsystems, or partitions within subsystems from synthesis through place and route, and sign off convergence, ensuring that the design meets the architecture goals of power, performance, and area.
Develop, validate, and improve Electronic Design Automation (EDA) methodology for a specialized sign off or implementation domain to enable cross-functional teams to build and deliver blocks that are correct by construction and ease convergence efforts.
Requirements:
Minimum qualifications:
Bachelor's degree in Electrical Engineering, Computer Engineering, Computer Science, or a related field, or equivalent practical experience.
5 years of experience with System on a Chip (SoC) cycles.
Experience with advanced design, including clock/voltage domain crossing, DFT, and low power designs.
Experience in high-performance, high-frequency, and low-power designs.
Preferred qualifications:
Master's degree or PhD in Electrical Engineering, Computer Engineering or Computer Science, with an emphasis on computer architecture.
Experience with scripting languages such as Perl, Python, or Tcl.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
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עדכון קורות החיים לפני שליחה
8782492
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תודה על שיתוף הפעולה
מודים לך שלקחת חלק בשיפור התוכן שלנו :)
Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
Required Junior SoC IP Design Engineer, Cloud
About the job
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
Our Platforms Infrastructure Engineering team designs and builds the
hardware and software technologies that power all of our services. Our computational challenges are complex and unique, enabled by custom hardware designed and made in-house. As a hardware engineer, you will design and build the systems that are the heart of the world's largest and most powerful computing infrastructure. You will see those systems from concepts all the way through to high-volume manufacturing. Your work has the potential to shape the machinery that goes into our data centers, affecting millions of users.
Responsibilities
Define the SoC/block level design document such as interface protocol, block diagram, transaction flow, pipeline etc.
Perform RTL development (coding and debug in Verilog, SystemVerilog), function/performance simulation debug and Lint/CDC/FV/UPF checks.
Participate in synthesis, timing/power closure and ASIC silicon bring-up.
Participate in test plan and coverage analysis of the block and SOC-level verification.
Communicate and work with multi-disciplined and multi-site teams.
Requirements:
Minimum qualifications:
Bachelor's degree in Electrical Engineering, Computer Engineering, Computer Science, or a related field, or equivalent practical experience.
1 year of experience with digital logic design principles, RTL design concepts, and languages such as Verilog or SystemVerilog.
Experience with design sign off and quality tools (Lint, CDC , etc.).
Preferred qualifications:
Master's degree or PhD in Computer Science, or a related technical field.
Knowledge in one of these areas: Peripheral Component Interconnect Express (PCIe), Universal Chiplet Interconnect Express (UCIe), Double Data Rate (DDR), Advanced eXtensible Interface (AXI), Advanced RISC Machine (ARM) processors family.
Knowledge of high performance and low power design techniques.
Knowledge of assertion-based formal verification.
Knowledge of SOC architecture.
Excellent problem-solving and debugging skills.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
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עדכון קורות החיים לפני שליחה
8783541
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תודה על שיתוף הפעולה
מודים לך שלקחת חלק בשיפור התוכן שלנו :)
Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
Required Silicon Test and DFT Engineer, Cloud
About the job
In this role, youll work to shape the future of AI/ML hardware acceleration. You will have an opportunity to drive cutting-edge TPU (Tensor Processing Unit) technology that powers our most demanding AI/ML applications. Youll be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our TPU. You'll contribute to the innovation behind products loved by millions worldwide, and leverage your design and verification expertise to verify complex digital designs, with a specific focus on TPU architecture and its integration within AI/ML-driven systems.The AI and Infrastructure team is redefining whats possible. We empower customers with breakthrough capabilities and insights by delivering AI and Infrastructure at unparalleled scale, efficiency, reliability and velocity.
We're behind groundbreaking innovations, empowering the development of AI models, delivering unparalleled computing power to global services, and providing the essential platforms that enable developers to build the future. From software to hardware our teams are shaping the future of world-leading hyperscale computing, with key teams working on the development of our TPUs, Vertex AI for Cloud, Global Networking, Data Center operations, systems research, and much more.
Responsibilities
Collaborate with Architecture, Design and Verification teams to develop new product bring-up, validation, characterization, and qualification strategies and manufacturing test solutions for new High Performance Computing (HPC) products in advanced process technologies.
Verify test solutions on pre-silicon models (simulation or emulation) and develop Automated Test Equipment (ATE) test modules and binning flows.
Develop and validate test programs on Automated Test Equipment (ATE) platforms for new product integration (NPI) in preparation for high-volume manufacturing (HVM), working with ATE vendors and internal cross-functional teams.
Manage product sustainment support, including analyzing volume data, improving test time and yield, assessing test escapees and return merchandise authorizations (RMAs), localizing failures, implementing containment measures, and partnering with design, manufacturing, and quality and reliability teams to identify root causes and implement corrective actions.
Build tools, flows and methodologies to continuously improve and automate the testing life-cycle.
Requirements:
Minimum qualifications:
Bachelor's degree in Engineering, Computer Science, a related field, or equivalent practical experience.
10 years of experience in test engineering.
Experience in pre-silicon validation, test content generation, automatic test equipment (ATE) program development, and post-silicon enabling from new product introduction (NPI) through high-volume manufacturing.
Experience with ASIC test methodologies (MBIST, ATPG, DFT, SerDes, and sensors).
Experience with Python, Java, C# or C/C++ and Advantest or Teradyne ATE platforms.
Preferred qualifications:
Masters in Electrical Engineering, Computer Engineering, Computer Science, or a related field.
10 years of experience in test engineering, including product engineering.
Experience with CPU/GPU SoC architecture, design, validation and debug.
Experience in advanced testing methodologies and data analysis, including system to tester correlation, yield and test time analysis and improvement, etc.
Demonstrated expertise in developing automations for pre-silicon verification and post-silicon test-generation/test-program domains.
Inquisitive and motivated to venture into, and improve, all aspects of post-silicon testing from definition to realization.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
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חברה חסויה
Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
Required Senior Silicon DFT Lead
About the job
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
As the Design for Test (DFT) Engineer Lead, you will play a crucial role in DFT Architecture and DFT design, and support devices to production. You will be responsible for providing technical leadership in DFT, developing flows, automation, and methodology, planning DFT activities, tracking the DFT quality throughout the project life-cycle, and providing sign-off DFT to tapeout.
The AI and Infrastructure team is redefining whats possible. We empower customers with breakthrough capabilities and insights by delivering AI and Infrastructure at unparalleled scale, efficiency, reliability and velocity.
We're the driving force behind our groundbreaking innovations, empowering the development of our cutting-edge AI models, delivering unparalleled computing power to global services, and providing the essential platforms that enable developers to build the future. From software to hardware our teams are shaping the future of world-leading hyperscale computing, with key teams working on the development of our TPUs, Vertex AI for Cloud, Global Networking, Data Center operations, systems research, and much more.
Responsibilities
Lead and execute DFT activities in the design, implementation, and verification solutions for Application-Specific Integrated Circuits (ASIC).
Develop DFT strategy and architecture, including hierarchical DFT, Memory Built-In Self Test (MBIST), and Automatic Test Pattern Generation (ATPG).
Work with other Engineering teams (e.g., Design, Verification, Physical Design) to ensure that DFT requirements are met and mutual dependencies are managed.
Manage a DFT team planning, deliverables, and provide technical mentoring and guidance.
Lead DFT execution of a silicon project, planning, execution, tracking, quality, and signoff.
Requirements:
Minimum qualifications:
Bachelor's degree in Electrical Engineering, Computer Engineering, or a related field, or equivalent practical experience.
8 years of experience in Design For Test from DFT architecture to post silicon production support.
4 years of experience with people management.
Experience with DFT design and verification for multiple projects, DFT specification, definition, architecture, and insertion.
Experience with DFT techniques and common industry tools, DFT and Physical Design flows, and DFT verification flow.
Experience in leading DFT activities throughout the whole ASIC development flow.
Preferred qualifications:
Master's degree in Electrical Engineering or a related field.
Experience in post-silicon Debug, test or product engineering.
Experience in Joint Test Action Group (JTAG) and Internal JTAG (iJTAG) protocols and architectures.
Experience in SoC cycles, silicon bring-up, and silicon debug activities.
Knowledge of fault modeling techniques.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
עדכון קורות החיים לפני שליחה
עדכון קורות החיים לפני שליחה
8786709
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