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Location: Haifa and Tel Aviv-Yafo
Job Type: Full Time
Required ASIC Design Verification Technical Lead, High-Speed DSP
About the job
In this role, youll work to shape the future of AI/ML hardware acceleration. You will have an opportunity to drive cutting-edge TPU (Tensor Processing Unit) technology that powers our most demanding AI/ML applications. Youll be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our TPU. You'll contribute to the innovation behind products loved by millions worldwide, and leverage your design and verification expertise to verify complex digital designs, with a specific focus on TPU architecture and its integration within AI/ML-driven systems.
As an ASIC Design Verification Technical Lead, you will define how we verifiy the physical-layer Digital Signal Processing (DSP) pipelines powering our next-generation AI hardware accelerators. You will drive the shift toward Emulation and Post-Silicon Correlation, ensuring that our architectural reference models and pre-silicon simulations perfectly match the physical behavior of the high-speed silicon in our planetary-scale AI data centers.
Responsibilities
Design, build, and scale constrained-random verification environments using SystemVerilog and UVM for high-speed physical-layer DSP blocks.
Build co-simulation frameworks and predictors to compare RTL implementation output against high-level algorithmic models.
Define and execute functional coverage plans, utilizing covergroups and SystemVerilog Assertions to verify architectural corner cases, fixed-point quantization effects, and numerical overflows.
Author dynamic stimulus sequences and virtual sequencers to stress-test adaptive feedback loops under realistic channel impairments, including noise, ISI, and high-frequency jitter profiles.
Lead the debugging of RTL and environment failures, collaborating closely with algorithm and DSP designers to isolate and resolve discrepancies between the RTL implementation and the specification.
Requirements:
Minimum qualifications:
Bachelor's degree in Electrical Engineering, Computer Engineering, or a related technical field.
12 years of experience in design verification.
Experience in high-speed PHY layers, high-speed interface subsystems, or mixed-signal verification.
Preferred qualifications:
Master's degree or PhD in Electrical Engineering, Computer Engineering, or a related technical field.
Experience defining verification architectures, methodologies, and roadmaps for AI accelerators, High-Performance Computing or high-bandwidth networking silicon.
Experience bridging the gap between Pre-Silicon verification (simulation and emulation) and Post-Silicon validation and correlation.
Experience driving advanced verification methodologies.
This position is open to all candidates.
 
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Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
Required Staff Embedded Firmware Engineer, High Speed DSP
About the job
In this role, youll work to shape the future of AI/ML hardware acceleration. You will have an opportunity to drive cutting-edge TPU (Tensor Processing Unit) technology that powers our most demanding AI/ML applications. Youll be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our TPU. You'll contribute to the innovation behind products loved by millions worldwide, and leverage your design and verification expertise to verify complex digital designs, with a specific focus on TPU architecture and its integration within AI/ML-driven systems.
As a Staff Embedded Firmware Engineer for High-Speed DSP, you will architect and define the low-level firmware and control loops powering the world's most advanced physical-layer communications silicon. Sitting at the critical intersection of digital signal processing (DSP), hardware-software co-design, and real-time systems, you will lead the development of adaptive algorithms, error correction (FEC), and link-telemetry frameworks. Your work will directly bridge the gap between high-performance hardware pipelines and our planetary-scale AI infrastructure, transforming complex communication systems theory into reliable, real-time silicon execution.
Responsibilities
Define the long-term firmware roadmap and hardware-software partitioning for physical-layer interfaces, determining the optimal balance between hardware-fixed logic and programmable firmwarm.
Architect advanced "in-situ" monitoring systems and firmware-driven diagnostics to track physical-layer link health, Bit Error Rate (BER) trends, and channel quality across millions of ports in real-time.
Design, model, and implement bare-metal or RTOS firmware to control high-speed transceivers, managing real-time adaptive loops, clock and data recovery (CDR), and physical-layer calibration.
Partner with TPU Systems, Networking Software, and High-Performance Computing (HPC) teams to ensure silicon firmware integrates seamlessly with global cluster management and collective communication frameworks.
Identify and de-risk hardware-software interface bottlenecks (e.g., register maps, driver latencies, and boot-up sequencing) that impact our AI infrastructure.
Requirements:
Minimum qualifications:
Bachelors degree in Electrical Engineering, Computer Engineering, a related technical field, or equivalent practical experience.
10 years of industry experience in embedded systems/firmware, communication systems engineering, or digital signal processing (DSP) development.
Experience developing embedded software (C/C++) for high-speed physical-layer interfaces (PHY), digital transceivers, or communication subsystems.
Preferred qualifications:
Master's degree or PhD in Electrical Engineering, Computer Engineering, or a related technical field.
Expertise in Forward Error Correction (FEC) algorithms and advanced modulation schemes.
Track record defining firmware framework specifications, register maps, and Silicon Lifecycle Management telemetry for high-volume networking or AI silicon.
Background in wireless communications with deep domain knowledge of channel modeling, noise mitigation, and digital transceiver architectures.
This position is open to all candidates.
 
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Location: Haifa
Job Type: Full Time
Required Senior RTL Design Engineer, Digital Signal Processing
About the job
In this role, youll work to shape the future of AI/ML hardware acceleration. You will have an opportunity to drive cutting-edge TPU (Tensor Processing Unit) technology that powers our most demanding AI/ML applications. Youll be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our TPU. You'll contribute to the innovation behind products loved by millions worldwide, and leverage your design and verification expertise to verify complex digital designs, with a specific focus on TPU architecture and its integration within AI/ML-driven systems.
As an RTL Design Engineer, you will be a key contributor to the physical implementation of next-generation TPU technology building ASICs for high-speed communication systems. You will take ownership of complex blocks, translating mathematical models into bit-exact silicon. Your expertise in front-end design flows will be vital in delivering the hardware that powers our advanced AI models and cloud services.
We're the driving force behind our groundbreaking innovations, empowering the development of our cutting-edge AI models, delivering unparalleled computing power to global services, and providing the essential platforms that enable developers to build the future. From software to hardware our teams are shaping the future of world-leading hyperscale computing, with key teams working on the development of our TPUs, Vertex AI for Cloud, Global Networking, Data Center operations, systems research, and much more.
Individual pay is determined by factors including job-related skills, experience, and relevant education or training.
Responsibilities
Design and implement high-speed blocks, taking end-to-end ownership of complex modules within the larger system.
Solve complex implementation issues related to GHz-frequency timing closure and advanced process nodes.
Transform high-level architectural specifications and communication theory models into efficient, bit-exact implementations.
Perform fixed-point analysis and micro-architectural trade-offs. Execute and optimize the front-end design flow for your assigned components to ensure, sign-off quality designs.
Collaborate closely with verification teams to develop bit-exact C++/SystemC models and ensure seamless integration.
Requirements:
Minimum qualifications:
Bachelor's degree in Electrical Engineering, Computer Engineering, or a related technical field.
8 years of experience in digital signal processing (DSP) design or high-speed digital logic design.
Experience implementing digital blocks for communication systems or PHY (Physical Layer) e.g., filters, interpolators, or timing recovery.
Experience in MATLAB, Python, or C++
Preferred qualifications:
Master's or PhD degree in Electrical Engineering, Computer Engineering, or a related technical field.
Experience taking complex DSP designs through the full front-end flow: Synthesis (Design Compiler/Genus), STA (PrimeTime/Tempus), and CDC/LEC (Spyglass/Conformal).
Experience with advanced FinFET process nodes (5nm, 3nm) and achieving timing closure at GHz frequencies.
Experience with high-speed serial links (SerDes) and FEC (Forward Error Correction) implementation.
Solid understanding of low-power design techniques and dynamic power optimization.
This position is open to all candidates.
 
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Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
Required Silicon Test and DFT Engineer, Cloud
About the job
In this role, youll work to shape the future of AI/ML hardware acceleration. You will have an opportunity to drive cutting-edge TPU (Tensor Processing Unit) technology that powers our most demanding AI/ML applications. Youll be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our TPU. You'll contribute to the innovation behind products loved by millions worldwide, and leverage your design and verification expertise to verify complex digital designs, with a specific focus on TPU architecture and its integration within AI/ML-driven systems.The AI and Infrastructure team is redefining whats possible. We empower customers with breakthrough capabilities and insights by delivering AI and Infrastructure at unparalleled scale, efficiency, reliability and velocity.
We're behind groundbreaking innovations, empowering the development of AI models, delivering unparalleled computing power to global services, and providing the essential platforms that enable developers to build the future. From software to hardware our teams are shaping the future of world-leading hyperscale computing, with key teams working on the development of our TPUs, Vertex AI for Cloud, Global Networking, Data Center operations, systems research, and much more.
Responsibilities
Collaborate with Architecture, Design and Verification teams to develop new product bring-up, validation, characterization, and qualification strategies and manufacturing test solutions for new High Performance Computing (HPC) products in advanced process technologies.
Verify test solutions on pre-silicon models (simulation or emulation) and develop Automated Test Equipment (ATE) test modules and binning flows.
Develop and validate test programs on Automated Test Equipment (ATE) platforms for new product integration (NPI) in preparation for high-volume manufacturing (HVM), working with ATE vendors and internal cross-functional teams.
Manage product sustainment support, including analyzing volume data, improving test time and yield, assessing test escapees and return merchandise authorizations (RMAs), localizing failures, implementing containment measures, and partnering with design, manufacturing, and quality and reliability teams to identify root causes and implement corrective actions.
Build tools, flows and methodologies to continuously improve and automate the testing life-cycle.
Requirements:
Minimum qualifications:
Bachelor's degree in Engineering, Computer Science, a related field, or equivalent practical experience.
10 years of experience in test engineering.
Experience in pre-silicon validation, test content generation, automatic test equipment (ATE) program development, and post-silicon enabling from new product introduction (NPI) through high-volume manufacturing.
Experience with ASIC test methodologies (MBIST, ATPG, DFT, SerDes, and sensors).
Experience with Python, Java, C# or C/C++ and Advantest or Teradyne ATE platforms.
Preferred qualifications:
Masters in Electrical Engineering, Computer Engineering, Computer Science, or a related field.
10 years of experience in test engineering, including product engineering.
Experience with CPU/GPU SoC architecture, design, validation and debug.
Experience in advanced testing methodologies and data analysis, including system to tester correlation, yield and test time analysis and improvement, etc.
Demonstrated expertise in developing automations for pre-silicon verification and post-silicon test-generation/test-program domains.
Inquisitive and motivated to venture into, and improve, all aspects of post-silicon testing from definition to realization.
This position is open to all candidates.
 
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Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
Required Senior Verification Engineer, Digital Signal Processing, Cloud
About the job
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
In this role, you own the verification strategy for high-speed Physical Layer (PHY). You aren't just looking for RTL bugs, you are looking for system-level failures. You will lead the effort to verify how the digital DSP interacts with the analog front-end.
The ML, Systems, & Cloud AI (MSCA) organization designs, implements, and manages the hardware, software, machine learning, and systems infrastructure for all our services (Search, YouTube, etc.) and Cloud.
We prioritize security, efficiency, and reliability across everything we do - from developing our latest TPUs to running a global network, while driving towards shaping the future of hyperscale computing. Our global impact spans software and hardware, including Clouds Vertex AI, the leading AI platform for bringing Gemini models to enterprise customers.
Responsibilities:
Lead the verification strategy for high-speed PHYs (112G/224G), defining the test plan for top-level integration and mixed-signal boundaries.
Architect and implement mixed-signal verification flows using Real Number Modeling (RNM) or SystemVerilog-AMS to verify the interaction between Analog Front Ends (AFE) and digital DSP.
Design specialized testbenches to verify the stability, convergence time, and tracking capabilities of adaptive algorithms (e.g., LMS, Zero-Forcing) across Process, Voltage, Temperature (PVT) corners.
Develop tests that simulate real-world data center conditions, including link bring-up, auto-negotiation, and error-recovery protocols.
Act as the primary verification interface for the Signal integrity and Power Integrity (SI/PI) and Analog teams, ensuring that physical channel impairments (loss, crosstalk, reflections) are accurately reflected in the Design Verification (DV) environment.
Requirements:
Minimum qualifications:
Bachelor's degree in Electrical Engineering, Computer Engineering, or a related technical field, or equivalent practical experience.
8 years of experience in design verification with a focus on mixed-signal, PHY layers, DSP, communication systems, or arithmetic logic blocks.
Experience with scripting in Python, Perl, or Makefile for automation.
Preferred qualifications:
Master's degree or PhD in Electrical Engineering, Computer Engineering, or a related technical field.
Experience with mixed-signal verification tools (e.g., verilog-AMS, Real Number Modeling (RNM), or SystemVerilog-AMS).
Experience leading verification through a full silicon life cycle (plan to tape-out).
Experience with performance verification (throughput, latency, and power modeling).
Experience in formal verification (JasperGold or similar) for complex state machines.
Understanding of adaptive algorithms (FFE/DFE) and how to verify loop stability in a digital environment.
This position is open to all candidates.
 
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Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
Technical Lead, Custom Digital Circuit Design, Mixed Signal
About the job
In this role, youll work to shape the future of AI/ML hardware acceleration. You will have an opportunity to drive cutting-edge TPU (Tensor Processing Unit) technology that powers our most demanding AI/ML applications. Youll be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our TPU. You'll contribute to the innovation behind products loved by millions worldwide, and leverage your design and verification expertise to verify complex digital designs, with a specific focus on TPU architecture and its integration within AI/ML-driven systems.
As the Lead Architect for our custom back-end solutions for high-speed internal connections, you will set the design standards for our custom silicon. You will ensure our physical design methods can support data speeds of 1.6T and above while maintaining high manufacturing reliability and performance. You will create the design framework for our future hardware, solving complex engineering challenges in the latest manufacturing processes.
Responsibilities
Define the global back-end and custom Physical Design methodology, driving the transition to automated Analog and Mixed-Signal (AMS) flows and "Layout-Aware" design.
Lead full custom digital circuit design at the transistor level optimized for low power.
Evaluate and de-risk new process features in GAA (Gate-All-Around) nodes (e.g., Backside Power Delivery, Buried Power Rails) for high-speed analog use cases.
Drive the long-term Roadmap for Area and Power density, ensuring our PHYs remain the most efficient in the industry.
Act as the primary liaison with foundries to optimize Design for Manufacturing (DFM) and maximize yield for massive TPU-scale chips.
Requirements:
Minimum qualifications:
Bachelor's degree in Electrical Engineering, Computer Engineering, a related technical field, or equivalent practical experience.
12 years of experience in Physical Design, Custom Digital Circuit Design, or Custom Layout.
Experience delivering GDS for advanced nodes.
Preferred qualifications:
Master's degree or PhD in Electrical Engineering, Computer Engineering, or a related technical field.
Experience in custom digital design and low power design techniques.
Experience with custom design tools and methods.
Experience in Electromagnetic Modeling (EM) and its impact on physical layout (Inductors, T-lines).
Experience in Co-Packaged Optics (CPO) physical implementation.
Ability to build strategic goals for the intersection of AI-driven layout and traditional custom design.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
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Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
Required SoC Quality and Reliability Engineer, Cloud
About the job
In this role, youll work to shape the future of AI/ML hardware acceleration. You will have an opportunity to drive cutting-edge TPU (Tensor Processing Unit) technology that powers our most demanding AI/ML applications. Youll be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our TPU. You'll contribute to the innovation behind products loved by millions worldwide, and leverage your design and verification expertise to verify complex digital designs, with a specific focus on TPU architecture and its integration within AI/ML-driven systems.
Our data centers are the most advanced in the world. In this role, you will help build the state-of-the art SoCs that power these data centers by driving quality and reliability processes from the Integrated Circuit perspective. This is an opportunity to create silicon and follow it into the field (and back!) to drive improvements for the next-generations of chips.
In this role, you will understand Integrated circuit (IC) flows, wafer processing, testing, qualification, yield, reliability, and failure analysis. You will work with various cross-functional teams to develop quality and reliability specifications, develop and deploy design guidelines, and develop and execute and test plans. Within the larger organization you will collaborate with global hardware quality and reliability teams, silicon design, validation and engineering teams.The AI and Infrastructure team is redefining whats possible. We empower customers with breakthrough capabilities and insights by delivering AI and Infrastructure at unparalleled scale, efficiency, reliability and velocity.
Responsibilities
Drive the strategic definition and development of Design-for-Reliability (DfR) guidelines, collaborating with cross-functional subject matter experts to integrate reliability into early design stages.
Define and lead the development of qualification hardware and test methodologies, managing internal teams and external vendors to ensure robust silicon and package verification.
Execute comprehensive silicon and package qualification programs (including HTOL, ELFR, ESD/LU, b/HAST, etc.) and conduct in-depth failure analysis to resolve quality issues.
Extract and analyze large-scale data from qualification programs, high-volume manufacturing, and field returns to identify failure mechanisms and trends for yield and reliability optimization.
Develop and implement physics-based statistical Quality and Reliability models (e.g., ELF, TDDB, NBTI) to predict device failure mechanisms and lifetime behaviors.
Requirements:
Minimum qualifications:
Bachelor's degree in Electrical Engineering, Materials Science, Physics, or a related field or equivalent practical experience.
8 years of experience in IC silicon quality or reliability.
Experience leading the product reliability life-cycle from post-tapeout through manufacturing.
Experience with semiconductor Complementary Metal-Oxide-Semiconductor (CMOS) technology, device physics, and failure mechanisms.
Preferred qualifications:
Master's degree in Electrical Engineering, Materials Science, or related fields.
Experience in statistical data analysis using tools such as JMP, Python, or JSL.
Familiarity with Electrical Failure Analysis (EFA) and Physical Failure Analysis (PFA) techniques.
Knowledge of Design-for-Reliability (DfR) rules and implementation techniques.
Track record with silicon reliability on process nodes and advanced packaging technologies.
This position is open to all candidates.
 
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Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
Required SOC Quality and Reliability Engineer, Cloud
About the job
In this role, youll work to shape the future of AI/ML hardware acceleration. You will have an opportunity to drive cutting-edge TPU (Tensor Processing Unit) technology that powers our most demanding AI/ML applications. Youll be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our TPU. You'll contribute to the innovation behind products loved by millions worldwide, and leverage your design and verification expertise to verify complex digital designs, with a specific focus on TPU architecture and its integration within AI/ML-driven systems.
Our data centers are the most advanced in the world. In this role, you will help build the SoCs that power these data centers by driving quality and reliability processes from the integrated circuit perspective. You will create silicon and follow it into the field (and back) to drive improvements for the next generations of chips.
You will have an understanding of IC flows, wafer processing, testing, qualification, yield, reliability, and failure analysis. You will work with various cross functional teams to develop quality and reliability specifications, develop and deploy design guidelines, and develop and execute and test plans. Within the larger organization you will collaborate with global hardware quality and reliability teams, silicon design, validation and engineering teams.

Responsibilities
Drive the strategic definition and development of design-for-reliability (DfR) guidelines, collaborating with cross-functional subject matter experts to integrate reliability into early design stages.
Define and lead the development of qualification hardware and test methodologies, managing internal teams and external vendors to ensure silicon and package verification.
Execute comprehensive silicon and package qualification programs (including high-temperature operating life (HTOL), early life failure rate (ELFR), electrostatic discharge/latch-up (ESD/LU), biased highly accelerated stress test (b/HAST), etc.) and conduct failure analysis to resolve quality issues.
Extract and analyze data from qualification programs, high-volume manufacturing, and field returns to identify failure mechanisms and trends for yield and reliability optimization.
Develop and implement physics-based statistical Quality and Reliability models (e.g., ELF, time-dependent dielectric breakdown (TDDB), negative bias temperature instability (NBTI) to predict device failure mechanisms and lifetime behaviors.
Requirements:
Minimum qualifications:
Bachelor's degree in Electrical Engineering, Materials Science, Physics, or a related field or equivalent practical experience.
8 years of experience in IC silicon quality or reliability.
Experience leading the product reliability lifecycle from post-tapeout through high-volume manufacturing.
Experience with semiconductor complementary metal-oxide-semiconductor (CMOS) technology, device physics, and failure mechanisms.

Preferred qualifications:
Master's degree in Electrical Engineering, Materials Science, or related field.
Expertise in statistical data analysis using tools such as JMP, Python, or JSL.
Knowledge of design-for-reliability (DfR) rules and implementation techniques.
Familiarity with electrical failure analysis (EFA) and physical failure analysis (PFA) techniques.
Track record with silicon reliability on process nodes and advanced packaging technologies.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
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Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
Required Senior CPU Design Verification Engineer, Cloud
About the job
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
In this role, you will work as part of a Research and Development team. You will build verification components, constrained-random testing, and system testing, and drive verification closure. You will verify digital designs, collaborate closely with design and verification engineers on projects, and perform direct verification. You will build constrained-random verification environments that exercise designs through their corner-cases and expose all types of bugs. You will manage the full life-cycle of verification, which can range from verification planning and test execution to collecting and closing coverage.
We're the driving force behind groundbreaking innovations, empowering the development of our cutting-edge AI models, delivering unparalleled computing power to global services, and providing the essential platforms that enable developers to build the future. From software to hardware our teams are shaping the future of world-leading hyperscale computing, with key teams working on the development of our TPUs, Vertex AI for Cloud, Global Networking, Data Center operations, systems research, and much more.
Responsibilities
Plan the verification of digital design blocks by fully understanding the design specification and interacting with design engineers to identify important verification scenarios.
Create and enhance constrained-random verification environments using SystemVerilog and UVM, or formally verify designs with SystemVerilog Assertions (SVA) and industry leading formal tools.
Identify and write all types of coverage measures for corner-cases.
Debug tests with design engineers to deliver functionally correct design blocks.
Close coverage measures to identify verification holes and to show progress towards tape-out.
Requirements:
Minimum qualifications:
Bachelor's degree in Electrical Engineering or equivalent practical experience.
8 years of experience with creating and using verification components and environments in standard verification methodology.
Experience verifying digital logic at RTL level using SystemVerilog or Specman/E for FPGAs or ASICs.
Preferred qualifications:
Master's degree or PhD in Electrical Engineering, or a related field.
3 years of experience creating and using verification components and environments in standard verification methodology.
Experience with verification techniques, and the full verification life cycle.
Experience with performance verification of ASICs and ASIC components.
Experience with Application-Specific Integrated Circuit (ASIC) standard interfaces and memory system architecture.
Knowledge of CPU/Processor architectures (e.g., pipeline, cache, memory subsystem, instruction sets, exceptions) like ARM, X86 or RISC-V, is highly beneficial for verifying processor cores or IP blocks.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
עדכון קורות החיים לפני שליחה
עדכון קורות החיים לפני שליחה
8782626
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מודים לך שלקחת חלק בשיפור התוכן שלנו :)
Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
Required Edge-AI Verification Lead, Cloud
About the job
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
In this role, you will work to shape the future of an edge-AI product, bringing high-performance intelligence to the edge. You will have an opportunity to drive distributed inference technology that powers real-time systems where latency and reliability are mission-critical.
You will be part of a team that pushes boundaries, developing autonomous solutions that define the next generation of intelligent infrastructure and hardware for the edge. You will contribute to the innovation behind products that transform industries, leveraging your expertise in system-level integration and localized processing to deploy complex AI models across sophisticated hardware platforms, ensuring intelligence is embedded exactly where the action happens.
Our mission is to organize the world's information and make it universally accessible and useful. Our team combines the best of AI, Software, and Hardware to create radically helpful experiences. We research, design, and develop new technologies and hardware to make computing faster, seamless, and more powerful. We aim to make people's lives better through technology.
Responsibilities
Lead the verification of an edge AI IP, to be used in our edge-AI products.
Lead a team of chip verification engineers. Plan tasks, allocate people, hold verification design/code reviews, and drive verification execution.
Plan the verification of digital design blocks, including writing test plans, and other verification documents.
Code development of verification features and capabilities, and participate in RTL debug.
Work closely with Architecture, Software, Design, and Physical Design stakeholders to make technical decisions and represent project status throughout the development process.
Requirements:
Minimum qualifications:
Bachelor's degree in Electrical Engineering, a related technical field, or equivalent practical experience.
10 years of experience working with hardware verification languages (e.g., System Verilog/Specman), design verification methodologies (e.g., UVM) and chip design flow.
Experience in leading chip verification teams through the full lifecycle from concept to delivery.
Experience in creating chip or subsystem design verification strategies and plans.
Preferred qualifications:
15 years of experience in verification of complex SoC/ASIC.
8 years of experience managing verification teams.
Experience in verification of complex ISP (Image Signal Processing) designs.
Experience in chip design/verification of AI/ML logic.
Experience in Low Power Verification.
Experience with industry verification techniques, including complementary techniques such as Formal Verification, and Emulation.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
עדכון קורות החיים לפני שליחה
עדכון קורות החיים לפני שליחה
8785616
סגור
שירות זה פתוח ללקוחות VIP בלבד
סגור
דיווח על תוכן לא הולם או מפלה
מה השם שלך?
תיאור
שליחה
סגור
v נשלח
תודה על שיתוף הפעולה
מודים לך שלקחת חלק בשיפור התוכן שלנו :)
Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
Required Physical Design Engineer, SoC Static Timing Analysis
About the job
In this role, youll work to shape the future of AI/ML hardware acceleration. You will have an opportunity to drive cutting-edge TPU (Tensor Processing Unit) technology that powers our most demanding AI/ML applications. Youll be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our TPU. You'll contribute to the innovation behind products loved by millions worldwide, and leverage your design and verification expertise to verify complex digital designs, with a specific focus on TPU architecture and its integration within AI/ML-driven systems.
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our direct-to-consumer products. In this role, you will contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering exceptional performance, efficiency, and integration.
We're the driving force behind our groundbreaking innovations, empowering the development of our cutting-edge AI models, delivering unparalleled computing power to global services, and providing the essential platforms that enable developers to build the future. From software to hardware our teams are shaping the future of world-leading hyperscale computing, with key teams working on the development of our TPUs, Vertex AI for Cloud, Global Networking, Data Center operations, systems research, and much more.
Responsibilities
Drive the sign-off timing convergence for high-performance designs.
Set up the timing constraints, define the overall static timing analysis (STA) methodology, set up the STA infrastructure and sign-off convergence flows, and work closely with block owners throughout the project for sign-off timing convergence.
Work with logic designers to drive architectural feasibility studies, develop timing, and explore RTL/design trade-offs for physical design closure.
Requirements:
Minimum qualifications:
Bachelor's degree in Electrical Engineering, a related technical field, or equivalent practical experience.
8 years of Physical Design experience including 2 years of experience with Static Timing Analysis (STA), including sign-off corner definitions, process margining, interface timing constraints, timing convergence, and setting frequency goals with technology scaling.
Experience in constraints development for subsystems or full System-on-Chip (SoC) architectures.
Preferred qualifications:
Proficiency with scripting languages commonly used in hardware automation (e.g., Tcl, Python, or Perl).
Deep familiarity with ASIC physical design flows and methodologies, including synthesis, place and route (P&R), formal verification, and clock domain crossing (CDC).
Solid fundamental knowledge of semiconductor device physics and transistor characteristics.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
עדכון קורות החיים לפני שליחה
עדכון קורות החיים לפני שליחה
8783553
סגור
שירות זה פתוח ללקוחות VIP בלבד