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21/06/2026
חברה חסויה
Location: Yokne`am and Tel Aviv-Yafo
Job Type: Full Time
Join our powerful Networking Silicon engineering team as a Synthesis Senior CAD Engineer! In this pivotal role, you'll be at the forefront of developing the industrys advanced high-speed communication devices, delivering outstanding efficiency and minimal latency. This is your chance to architect, build, and improve advanced RTL to PNR tools, flows and methodologies using the worlds latest process technologies. Be part of a group thats driving technology forward and pushing the frontiers of development.

What you will be doing:

Methodology Deployment: Design and refine sophisticated Synthesis flows to meet ambitious Power, Performance, and Area (PPA) objectives.

Partner closely with upstream Front-End Design and downstream Place & Route (P&R) flows development teams. Define boundaries, resolve design constraints, and bridge systemic execution gaps.

Develop robust and scalable scripts using Tcl/Python to improve Flow Turnaround Time (TAT). Integrate next-generation capabilities such as AI/ML automation into production runs.

Serve as a subject matter expert and trusted representative for adjacent project teams. Provide proactive support, deep-dive debugging of complex tool failures, and formal synthesis training to build teams.
Requirements:
What we need to see:

Academic Background: B.Sc./M.Sc. in Electrical Engineering, Computer Engineering, or a related technical field, or equivalent practical experience.

Core Synthesis Experience: 3+ years of hands-on experience in VLSI synthesis flows, with deep, proven expertise in Synopsys Fusion Compiler or Design Compiler (DC-Top/DC-Ultra).

Technical Skills: Strong proficiency in Tcl or Python scripting within a production-level CAD/EDA environment.

Attitude & Ownership: A highly enthusiastic, dedicated approach with a demonstrated "sense of ownership" to proactively step into process vacuums and drive complex tasks to completion.


Ways to stand out from the crowd:

Familiarity with synthesis, place and route, STA EDA tools from Synopsys (DC/FC/PT), Cadence (Genus/ Innovus/Tempus).

Experience in methodology definition / flow ownership of synthesis / Place and Route/ STA steps is an advantage.

Great teammate with strong ownership, self-learning skills, and the ability to work autonomously.
This position is open to all candidates.
 
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21/06/2026
Location: Tel Aviv-Yafo and Yokne`am
Job Type: Full Time
We are looking for best-in-class Physical Design Engineers to join our outstanding Networking Silicon engineering team, developing the industry's best high-speed communication devices, delivering the highest throughput and lowest latency! Come and take a part in designing our groundbreaking and innovating chips, enjoy working in a meaningful, growing and highly professional environment where you make a significant impact in a technology-focused company.

What you'll be doing:

You will be in charge of developing full-chip physical design methodologies, Physical Verification development and support through all the projects, Tapeout activities for implementation of networking chips and SOCs.

Work closely with Full Chip Layout owners and block owners, project managers to assure high quality and timely convergence.

Come up with unique and creative solutions to the state of the art FCL physical design problems that are needed for our chips.

We expect you to run, debug, and approve Physical Verification flows across multiple projects, ensuring strict adherence to our high standards.

Participating and developing flow and tool methodologies for fullchip, physical design verification across multiple projects.
Requirements:
What we need to see:

B.SC./ M.SC. in Electrical Engineering/Computer Engineering (or equivalent experience).

You should have at least 5+ years of hands-on Full-chip layout and Physical Verification experience, demonstrating your proven expertise.

A strong background in Physical Verification methodology, including DRC / LVS / ANT / ERC / DFM in advanced process nodes is necessary.

Proficiency using Python, Tcl, Shell, Make scripting.

Experience in Linux environments.

AI tools orientation or alternatively a desire to learn.

Familiarity with physical build EDA tools, including Synopsys (ICC2/FC) and Cadence (Innovus).

Familiarity with Physical Verification tools: Synopsys (ICV), Siemens (Calibre)

Self-motivation, attention to detail, and good interpersonal skills.


Ways to stand out from the crowd:

Experience with data collection and analysis

Experience in methodology definition / flow owner of Full-chip / Place and Route

Great teammate.

Ownership, self-learning skills, and ability to work autonomously.
This position is open to all candidates.
 
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24/06/2026
חברה חסויה
Location: Tel Aviv-Yafo
Job Type: Full Time
we are establishing a strategic R&D center in Israel to drive the development of complex semiconductor chips that solve the critical 'data bottlenecks' enabling the future of AI at scale. As we expand our presence in Israel, we're seeking a visionary Junior Physical Design Engineer to help build our local engineering powerhouse from the ground up. This is a unique opportunity to take on meaningful product ownership in a new site, defining the backend execution and methodologies for chips that power the world's largest AI clusters.
As a Junior Physical Design Engineer, you will be a key architect of our silicon's physical reality. You won't just execute a flow-you will help establish our local execution culture and technical standards, owning the transformation of complex logic into high-performance silicon. You will drive the physical implementation journey from synthesis through signoff, ensuring our connectivity solutions meet the extreme performance, power, and area targets required for next-generation AI infrastructure. If you thrive on solving complex challenges in deep-submicron processes and want to shape the backend methodology for AI infrastructure connectivity, this is your opportunity.
Key Responsibilities
Physical Implementation & Execution
Be part of the founding Backend team in Israel, playing a critical role in establishing local execution culture and technical standards
Take full responsibility for physical implementation journey including Synthesis, Floorplanning, Place & Route, and Clock-Tree Synthesis (CTS)
Own macro-level implementation with deep hands-on experience in floorplanning and complex routing
Signoff & Design Integrity
Drive final stages of design integrity, owning Timing signoff (STA), Physical Verification (DRC/LVS), and Reliability analysis (EMIR)
Ensure first-pass silicon success through rigorous signoff flows and analysis
Apply Logic Equivalence Checking (LEC) and other verification techniques to guarantee design correctness
Methodology Development & Cross-Functional Collaboration
Participate in defining and refining Backend methodologies with autonomy to improve workflows and tool automation
Work closely with Architecture, Design, and DFT teams to navigate challenges of advanced process nodes and high-speed connectivity
Leverage scripting and automation to make engineering environment faster and more robust.
Requirements:
Basic Qualifications
Bachelors degree in Electrical Engineering or a related technical field
Foundational understanding of the RTL-to-GDS flow, with academic or internship exposure to areas such as floorplanning, placement, and routing
Familiarity with advanced process technologies (e.g., 7nm and below) through coursework or hands-on projects
Basic experience with signoff methodologies and tools, including STA, Logic Equivalence Checking (LEC), DRC, and EMIR analysis
Working knowledge of TCL or Python scripting for simple automation and support of EDA tool flows
Preferred Qualifications
Experience with full-chip level implementation and integration
Knowledge of Power and Noise analysis (SI/PI) to optimize high-performance silicon
Familiarity with Design-for-Test (DFT) requirements and their impact on physical layout
Experience with industry-standard EDA tools (Synopsys Fusion Compiler/ICC2, Cadence Innovus)
Background in high-speed interface designs or connectivity protocols.
This position is open to all candidates.
 
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24/06/2026
Location: Tel Aviv-Yafo
Job Type: Full Time
we are establishing a strategic R&D center in Israel to drive the development of complex semiconductor chips that solve the critical 'data bottlenecks' enabling the future of AI at scale. As we expand our presence in Israel, We are looking for a Physical Design CAD Engineer with at least 3 years of hands-on experience in digital implementation flows. The ideal candidate is highly technical, curious, and eager to drive innovation by combining strong physical design knowledge with modern automation and GenAI-based methodologies.
This is a unique opportunity to take on meaningful technical ownership in a new site, implementing the parasitic extraction (PEX) methodologies and flows for chips that power the world's largest AI clusters. As a foundational member of the team, you will be responsible for the accuracy and efficiency of our extraction environment, ensuring that our high-speed designs are modeled with the highest precision from RTL to GDSII.
Key Responsibilities
The Engineer will develop, maintain, and improve CAD flows and methodologies for physical design teams, supporting advanced implementation stages from synthesis through place and route, timing closure, power optimization, and signoff readiness.
Key responsibilities include:
Develop and support physical design CAD flows using industry-standard EDA tools
Build automation infrastructure for implementation, analysis, reporting, and debug
Support design teams in areas such as synthesis, floorplanning, placement, CTS, routing, timing, power, and physical verification
Create scripts and utilities to improve productivity, quality of results, and flow robustness
Support and enhance flows based on Synopsys Fusion Compiler
Explore and integrate GenAI solutions to accelerate debug, automate repetitive tasks, improve reporting, and enhance engineering productivity
Analyze tool results, logs, QoR metrics, timing reports, congestion, utilization, power, and design-rule issues.
Requirements:
At least 3 years of experience in Physical Design, CAD, or implementation methodology
Strong understanding of digital physical design concepts, including synthesis, placement, CTS, routing, timing closure, and physical verification
Hands-on experience with Synopsys Fusion Compiler
Experience with scripting languages such as Tcl, Python
Ability to develop automation around EDA tools and large-scale design flows
Good understanding of timing, power, congestion, floorplanning, and QoR analysis
Strong debugging and problem-solving skills
Ability to work closely with multiple engineering teams and support complex design environments
High motivation to learn and apply GenAI technologies in semiconductor design flows.
Preferred Experience
Experience with additional tools such as PrimeTime, StarRC, ICC2, Innovus, Voltus, RedHawk, Calibre, or similar
Knowledge of STA, low-power design, UPF, EM/IR, extraction, or signoff flows
Experience building dashboards, regression systems, flow checkers, or automated report analyzers
Familiarity with LLMs, prompt engineering, AI agents, or GenAI-based coding/debug tools
Experience with Git, CI/CD, databases, or cloud-based compute environments.
This position is open to all candidates.
 
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21/06/2026
Location: Yokne`am
Job Type: Full Time
We are looking for best-in-class Physical Design Engineers to join our outstanding Networking Silicon engineering team, developing the industry's best high-speed communication devices, delivering the highest throughput and lowest latency! Come and take a part in designing our groundbreaking and innovating chips, enjoy working in a meaningful, growing and highly professional environment where you make a significant impact in a technology-focused company.

What you'll be doing:
Physical design of blocks according to specifications under challenging constraints targeting for the best power, area, and performance.
Be exposed and work on a variety of challenging designs (including high cell count and HS blocks). Resolving complex timing and congestion problems.
Daily work involves all aspects of physical design chip development (RTL2GDS) - synthesis, power and clock distribution, place and route, timing closure, power and noise analysis, and physical verification.
Taking part inflows development.
Requirements:
What we need to see:
B.SC./ M.SC. in Electrical Engineering/Computer Engineering or equivalent work experience.
Proven experience in RTL2GDS flows and methodologies.
Knowledge in physical design flows and methodologies (PNR, STA, physical verification).
Deep understanding of all aspects of Physical construction and Integration.
Knowledge in Physical Design Verification methodology LVS/DRC.
Familiarity with physical design EDA tools (such as Synopsys, Cadence, etc.).
Great teammate.
This position is open to all candidates.
 
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21/06/2026
חברה חסויה
Location: Yokne`am
Job Type: Full Time
We are looking for a driven and enthusiastic Senior VLSI Engineer to join our outstanding Networking Silicon engineering team! You will be joining our rapidly growing Interposer team-a highly specialized and deeply impactful domain shaping the future of advanced silicon packaging.

If you have a strong background in the physical aspects of VLSI but haven't worked with interposer technology before, this is a unique opportunity to pivot and learn a cutting-edge domain. You will join a highly experienced group of industry-leading experts, working on the most advanced technology nodes in the world. Come take part in designing our groundbreaking chips, and enjoy working in a meaningful, growing, and highly professional environment where you make a massive impact.

What You Will Be Doing:

Mastering New Technologies: Learning the intricacies of advanced Interposer technology, working shoulder-to-shoulder with highly experienced domain experts.

Meticulous Execution & Ownership: Taking a high level of ownership over interposer projects. You will act as the technical anchor, driving timelines, managing complex workflows, and ensuring highly accurate, detail-oriented execution.

Driving Physical Implementation: Overseeing the physical design and integration aspects of complex VLSI designs.

Cross-Functional Collaboration: Taking part in project definitions towards POR, working in close interaction with other domains such as Architecture, Front-End, Back End and Packaging

Problem Solving & Automation: Resolving complex technical challenges in groundbreaking technology nodes and taking an active part in flow and methodology development.
Requirements:
What We Need To See:

B.Sc. / M.Sc. or equivalent experience in Electrical Engineering/Computer Engineering.

5+ years of overall experience in VLSI development, with a strong orientation toward the physical aspects of design (Physical Design, Backend, Chip Integration, etc.).

Exceptional attention to detail and program management skills. You are highly organized, timeline-driven, and thrive on structure and accuracy.

Proactive and independent mindset. We are looking for a highly motivated self-starter who can take ownership of complex tasks and independently drive technical efforts forward.

A strong passion and proven ability to learn new, highly complex technical areas.

Familiarity with physical design methodologies, flows, and EDA tools.

A proactive, creative mindset and a fantastic teammate.


Ways to stand out from the crowd:

Scripting and coding skills are a strong plus.
This position is open to all candidates.
 
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Location: Tel Aviv-Yafo and Caesarea
Job Type: Full Time and Hybrid work
We are seeking a CAD Engineer to join the Silicon One Physical Design team.
Meet the Team:
You'll be part of the Silicon One team, which is at the heart of our software and ASIC design efforts.
As part of our team, youll contribute to the development of our next-generation network devices. Our team operates in a startup-like environment within a stable and leading corporation.
Our design center is uniquely equipped, hosting all silicon hardware and software development fields under one roof.
We are revolutionizing the industry by building a new internet for the 5G era, providing a unified, programmable silicon architecture that serves as the foundation for all of our future routing products. Our devices are designed to be universally adaptable across service providers and web-scale markets, catering to both fixed and modular platforms. They deliver high speed without compromising on programmability, buffering, power efficiency, scale, or feature flexibility.
We are a ground-breaking, groundbreaking technology that will serve our customers and end users for decades to come. The Internet now has a new, faster, better, and safer engine!
Your Impact:
You'll be joining our Physical Design team within Silicon One, which is responsible for the entire backend methodology and flow development from RTL to GDS. This is a critical part of the group leading the development of high-quality VLSI designs.
Our Backend Engineers handle all aspects of chip design, including Definition, Physical Synthesis, Place and Route, Optimization, Timing Closure, Design Floor Planning.
You will be the tech lead for CAD within the team, leveraging your extensive backend and physical design experience to drive the development, optimization, and innovation of CAD methodologies and tools, ensuring the highest quality and efficiency in our chip design flows from RTL to GDS.
We demonstrate the latest silicon technologies and processes to build the largest-scale and most complex devices, pushing the boundaries of feasibility.
Requirements:
Minimum Qualifications
A VLSI Design Engineer with extensive experience in backend design
B.Sc./M.Sc. in Electrical Engineering or Computer Engineering with relevent background.
5+ years of hands-on experience in a relevant domain
Strong understanding of Place & Route flow
Preferred Qualifications
Deep understanding of Physical construction and Integration.
Knowledge of Physical Design Verification methods like LVS/DRC and formal verification.
Experience with PD CAD and Physical Design EDA tools (e.g., Synopsys, Cadence).
Ability to support technology adoption and new tool integration.
Great teammate, self-learner, and able to work independently.
This position is open to all candidates.
 
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21/06/2026
חברה חסויה
Location: More than one
Job Type: Full Time
We are looking for best-in-class Physical Design Engineers to join our outstanding Networking Silicon engineering team, developing the industry's best high-speed communication devices, delivering the highest throughput and lowest latency! Come and take a part in designing our groundbreaking and innovating chips, enjoy working in a meaningful, growing and highly professional environment where you make a significant impact in a technology-focused company.

What you'll be doing:
You will be responsible for complex physical design unit designs, ensuring integration within our innovative builds.
We expect you to run, debug, and approve PnR and verification flows across multiple projects, ensuring strict adherence to our high standards.
You will perform physical design implementation, planning and optimization, contributing to the development of our groundbreaking chips.
Requirements:
What we need to see:
B.SC./ M.SC. in Electrical Engineering.
You should have at least 5+ years of hands-on Physical Design 'Place and Route' experience, demonstrating your proven expertise.
A strong background in Physical Design methodology, including Synthesis, Floorplan, CTS and Routing, is necessary.
Sign-off stages experince such as , 'STA', 'PV', 'LEC' and 'EMIR'.
In-depth knowledge of advanced silicon process technologies.
Familiarity with physical build EDA tools, including Synopsys and Cadence.
A great teammate who thrives in a collaborative environment.
AI tools orientation or alternatively a desire to learn.

Ways to stand out from the crowd:
AI prompting experience.
Experience in Linux environments.
TCL, Python, shell scripting abilities.
Experience with data collection and analysis.
Understanding of the chip and die verification process.
This position is open to all candidates.
 
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22/06/2026
Location: Yokne`am
Job Type: Full Time
We are looking for a talented and experienced Team Manager to join our CAD Sign-Off group, sitting at the intersection of CAD development and circuit engineering. Our team drives both the development of CAD flows and tools as well as circuit studies and design methodologies, supporting world-class silicon sign-off for our most advanced chips. The role combines internal development work with close collaboration across multiple groups worldwide. You will lead a team responsible for tracking and executing these activities end-to-end, ensuring quality, alignment, and delivery across all fronts. Come be part of a highly professional, impactful environment where your leadership shapes the way we design and sign off our chips.

What you'll be doing:

Own the tracking and execution of team activities spanning both internal CAD flow development and circuit-level studies and design methodologies.

Lead and coordinate engineers working across CAD sign-off, circuit analysis, and design methodology domains.

Drive collaboration with chip design teams, full-chip engineers, and other CAD and design groups globally, ensuring timely and high-quality sign-off convergence.

Serve as a key interface between the team and other groups, aligning priorities, sharing methodologies, and driving cross-group initiatives.

Identify risks and bottlenecks early, propose mitigation plans, and keep projects on track.

Foster a culture of ownership, technical excellence, and continuous improvement within the team.
Requirements:
What we need to see:

B.Sc./M.Sc. in Electrical Engineering, Computer Engineering, or equivalent experience.

8+ overall years of experience in engineering or software development, with a solid technical foundation in CAD, EDA, or circuit design environments.

3+ years of experience in team management roles in CAD or Backend design domains.

Proven ability to track, manage, and complete complex engineering activities across multiple workstreams.

Strong organizational skills, attention to detail, and excellent written and verbal communication.

Demonstrated ability to work effectively both within a focused engineering team and in cross-group, cross-site collaborative settings.

Ways to stand out from the crowd:

Background in circuit design or analysis - familiarity with sign-off domains such as STA, power integrity, IR-drop, or EM is a strong plus.

Prior experience in a formal management or team lead role.

Experience conducting or reviewing circuit studies, feasibility analyses, or design methodology evaluations.

Familiarity with EDA tools such as PrimeTime, RedHawk, or similar sign-off platforms.

Track record of successful collaboration across multiple engineering teams or organizations.
This position is open to all candidates.
 
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5 ימים
Location: Tel Aviv-Yafo
Job Type: Full Time
We're looking for an exceptional senior Chip Design Engineer to join our Nitro team and help shape what comes next. You'll work alongside a world-class, fast-moving engineering team, take full ownership of critical IP blocks, and see your work deployed at a scale no other platform can match- powering hundreds of thousands of businesses across 190 countries.

If you want to build silicon that leads the cloud world, this is where it happens.

As a Senior Chip Design Engineer on the Nitro team, you will take full end-to-end ownership of one or more critical IP blocks within the product, guiding them from micro-architecture definition through RTL design, debug, synthesis, timing closure, and final sign-off before tape-out. Your work will ship in silicon that powers AWS at global scale.
You'll partner closely with the Verification and Emulation teams to shape test plans, review coverage, and close gaps early in the design cycle. Beyond your own IP, you'll collaborate across disciplines with Product Definition, Software, Physical Design, and Verification teams to deliver a fully integrated, production-ready chip.

Key job responsibilities
* Full ownership of one or more IPs within the product:
Micro-architecture definition.
RTL coding and debug.
Synthesis and timing closure.
Sign-off before tape-out.
* Supporting the Verification and Emulation teams: Test plan development, coverage review.
* Ensuring the chip meets quality and reliability standards.
* Collaborating with cross-functional teams, including Product Definition, Verification, Software, and Physical Design.
Requirements:
Basic Qualifications:
- 6+ years of experience in chip design.
- Hands-on experience in micro-architecture and RTL design (Verilog / System Verilog).
- Scripting expertise in C*, Perl, Python, or TCL.
- BSc in Computer/Electrical Engineering.
- Strong communication and collaboration skills.
- Strong leadership skills and ability to own complex units.

Preferred Qualifications:
- Strong knowledge of protocols (AXI, CHI, DDR, Networking, PCIe).
- Experience with Network-on-Chip (NOC) architecture.
- knowledge with coherent and non-coherent fabric design.
- Comprehensive SoC development cycle expertise (Synthesis, STA, CDC, Lint).
- Knowledge of Design Automation tools and techniques.
- Advanced degree in related technical field.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
עדכון קורות החיים לפני שליחה
עדכון קורות החיים לפני שליחה
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Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
Required Senior Silicon Physical Design Engineer
Note: By applying to this position you will have an opportunity to share your preferred working location from the following: Tel Aviv, Israel; Haifa, Israel.
About the job
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
As a SoC Physical Design Engineer, you will collaborate with functional design, Design for Testing (DFT), architecture, and packaging engineers. In this role, you will solve technical problems with innovative micro-architecture and practical logic circuits solutions, while evaluating design options with optimized performance, power, and area in mind.
Responsibilities
Use problem-solving and simulation techniques to ensure performance, power, and area (PPA) are within defined requirements.
Collaborate with cross-functional teams to debug failures or performance shortfalls and meet program goals in lab or simulation.
Design chips, chip-subsystems, or partitions within subsystems from synthesis through place and route, and sign off convergence, ensuring that the design meets the architecture goals of power, performance, and area.
Develop, validate, and improve Electronic Design Automation (EDA) methodology for a specialized sign off or implementation domain to enable cross-functional teams to build and deliver blocks that are correct by construction and ease convergence efforts.
Requirements:
Minimum qualifications:
Bachelor's degree in Electrical Engineering, Computer Engineering, Computer Science, or a related field, or equivalent practical experience.
5 years of experience with System on a Chip (SoC) cycles.
Experience with advanced design, including clock/voltage domain crossing, DFT, and low power designs.
Experience in high-performance, high-frequency, and low-power designs.
Preferred qualifications:
Master's degree or PhD in Electrical Engineering, Computer Engineering or Computer Science, with an emphasis on computer architecture.
Experience with scripting languages such as Perl, Python, or Tcl.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
עדכון קורות החיים לפני שליחה
עדכון קורות החיים לפני שליחה
8717512
סגור
שירות זה פתוח ללקוחות VIP בלבד