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חברה חסויה
Location: Tel Aviv-Yafo
Job Type: Full Time
We are looking for a hands-on Hardware Design Engineer to own the full hardware lifecycle - schematic capture, PCB layout, mixed signal circuit design, power architecture, bring-up, and regulatory certification - across current and next-generation hardware.

Responsibilities

Digital Hardware Design - MCU, PHY, Ethernet & PoE

Design the complete digital hardware stack: NXP i.MX RT MCU schematic and BGA layout, Ethernet PHY circuit and controlled-impedance Ethernet routing. Design and validate the IEEE 802.3af PoE front-end : PD handshake, mid/end-span bridge rectifiers, isolated flywheel buck , and optocoupler feedback regulation; analyse cross-domain IO level margins across all MCU interfaces to confirm safe driver/receiver operation.

RF & Analog Circuit Design

Design the ISM transmit chain and 2.4 GHz AoA receive chain; simulate match networks with ADS or equivalent and validate with VNA S-parameter measurements.

PCB Design & Layout

PCB layout: Define stack-up and controlled-impedance rules; route high pin-count BGAs and high-speed peripherals with length tuning; partition RF, digital, and power domains for FCC/ETSI compliance.

Power, calibration & test: Design DCDC/LDO supplies and power distribution; define hardware test procedures for RF power and frequency calibration at production.

Production Support

Failure analysis (field & manufacturing)

Yield improvement

Cost reduction

Post-Silicon Verification Support
Requirements:
B.Sc. in Electrical Engineering - mixed-signal focus.

3-5 years of hands-on PCB design experience for production hardware of analog and digital design, including 2 years with RF circuits at 900 MHz and/or 2.4 GHz.

Proficiency in Altium Designer or OrCAD/Allegro for multi-layer high-density layout: controlled impedance, differential pairs, and RF routing.

Experience with multi-domain power architectures: DCDC converters, LDOs, power sequencing circuits, and IO level compatibility analysis.

Experience digital hardware stack: NXP i.MX RT MCU schematic and BGA layout, Ethernet PHY circuit.

Solid RF fundamentals: S-parameters, impedance matching, Smith chart, link budgets, directional couplers, as well as LNA and PA operation.

Hands on experience with lab equipment: oscilloscope, logic analyser, VNA, and spectrum analyser.

Familiarity with EMI/EMC design practices and experience supporting hardware through FCC, CE, or equivalent certification.


Advantage

Experience with angle of arrival concepts (such as BLE AoA) and the associated hardware design/constraints.

Experience with NXP MCUs hardware constraints.

Experience designing PoE (IEEE 802.3af/at) and isolated flywheel buck power delivery circuits.

Experience with HyperRAM and high-speed PCB design.

Experience with Ethernet hardware design and manufacturing RF test fixtures.
This position is open to all candidates.
 
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Job Type: Full Time
We are developing a next-generation high-performance hardware platform that combines advanced data acquisition, FPGA processing, and high-speed digital design.

We are looking for a senior engineer who can lead complex board development from architecture through production and take ownership of challenging hardware designs in a multidisciplinary environment.

What You'll Do
Design complex digital and mixed-signal boards from concept through bring-up and production
Develop systems based on advanced FPGA and SOC devices
Integrate high-speed memories, networking, Storage, and peripheral interfaces
Design around ADC, DAC, clocking, and synchronization components
Perform board-level validation, debugging, and optimization
Work closely with FPGA, Embedded, algorithm, and system engineers
Lead hardware bring-up and root-cause analysis of complex system issues
Requirements:
7+ years of digital board design experience
Proven experience designing high-speed digital systems
Strong experience with FPGA-based platforms (Xilinx and/or Intel)
Experience with DDR4/LPDDR4 and high-speed interfaces
Hands-on board bring-up and debugging experience
Experience taking products from architecture through production
Strong schematic capture and PCB development skills
Preferred Experience
High-speed communication systems
ADC/DAC-based designs
Signal Integrity and Power Integrity analysis
FPGA development (VHDL / Verilog)
Embedded Linux or SOC -based systems
Experience optimizing power, cost, and manufacturability
Ideal Candidate
You are a hands-on hardware expert who enjoys solving difficult system -level problems, owns designs end-to-end, and has successfully delivered complex high-speed products into production.
This position is open to all candidates.
 
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חברה חסויה
Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
Required Senior Board Design Engineer
About the job
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of םור direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
As a Hardware Board Design Engineer, you will own the electrical design of complex High Performance Computing (HPC) systems. You will drive the development of next-generation AI accelerator boards, ensuring they meet signal integrity, power delivery, and thermal requirements. You will work cross-functionally with Silicon (ASIC), Signal Integrity, Power, Mechanical, and Manufacturing teams to bring products from concept to mass production.
Responsibilities
Lead the schematic capture and component selection for high-density, multi-layer Printed Circuit Boards (20+ layers) incorporating high-power ASICs (TPUs/CPUs), FPGAs, and high-speed memory (High Bandwidth Memory/DDR5).
Design and validate high-speed interfaces including Peripheral Component Interconnect Express (PCIe) Gen 6.0/7.0, 400G/800G/1.6T ethernet (PAM4). Collaborate with Signal Integrity (SI) engineers to define routing constraints and stack-up.
Design multi-phase power regulators (VRMs) capable of delivering 1000A currents with fast transient response for AI processors.
Work closely with PCB layout designers to guide placement and routing of critical signals and power planes.
Lead the lab bring-up of first-silicon/first-board. Debug complex hardware issues using oscilloscopes, Time-Domain Reflectometers (TDRs), and logic analyzers. Root-cause failures to component, assembly, or design issues.
Requirements:
Minimum qualifications:
Bachelor's degree in Electrical Engineering, or equivalent practical experience.
5 years of experience in board design (schematic and layout supervision) for server, networking, or high performance computing products.
Experience in designing with serial interfaces (e.g., SerDes, PCIe, Ethernet, DDR) and signal integrity (insertion loss, crosstalk, impedance matching).
Preferred qualifications:
Experience with DC-DC power converter design and power integrity concepts.
Experience bringing up complex SoCs and debugging interaction between hardware, firmware, and software.
Proficiency with Electronic Design Automation (EDA) tools (Cadence Concept/Allegro, or similar).
This position is open to all candidates.
 
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Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
Rק/וןרקג Power and Signal Integrity Engineer, PhD Graduate
About the job
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
As a Power and Signal Integrity Engineer, you will be responsible for the design and characterization of signal and power integrity of our IC designs. You will design the external electrical interfaces of the device, from their Signal/Power-integrity and electrical usage perspectives and set up methodologies, perform simulations, silicon characterization and correlations to ensure our IC designs meet systems design budgets and achieve the highest performance. You will work with systems architects, ASIC design, systems engineers, and partner cross-functionally with teams and external vendors/partners.
Responsibilities
Generate precise electrical models (e.g., S-parameters, SPICE models) for components such as packages, PCBs, and connectors for use in simulations.
Simulate high speed interface electrical behavior using HSPICE or other circuit simulators.
Execute lab measurements utilizing test equipment like oscilloscopes, Vector Network Analyzers (VNA), Time Domain Reflectometers (TDR), spectrum analyzers to validate simulation outcomes and debug signal and power-related issues on silicon prototypes and boards.
Establish design rules and guidelines for optimal signal/power integrity during PCB and package layout, ensuring high production yield and reliability.
Document design specifications, analysis results, and validation reports to ensure compliance with standards and for future reference, while collaborating extensively with cross-functional teams, including ASIC architects, digital/analog designers, physical design/layout engineers, and system engineers.
Requirements:
Minimum qualifications:
PhD degree in Electrical Engineering, Computer Engineering, Physics, a related field, or equivalent practical experience.
Experience in any signal and power integrity domain of electrical engineering through internships, academic research, or publications.
Preferred qualifications:
Experience with industry-standard Electronic Design Automation (EDA) tools for simulation and layout (e.g., Cadence Sigrity/Allegro, Ansys HFSS/PowerDC/Q3D, Keysight ADS, Synopsys HSPICE).
Experience with signal and power integrity modeling and simulation for high-speed interfaces (e.g., LPDDR, MIPI, UFS, PCIe, USB).
Experience with SerDes testing in a lab setting, and familiarity with Ethernet, PCIE, and DDR standards.
Experience in scripting languages such as Python, Perl, or Tcl for flow automation and data analysis.
Familiarity with high-speed testing equipment like VNAs, TDRs, and oscilloscopes for measurement and validation.
Knowledge of circuit analysis, electromagnetics, and transmission line theory.
This position is open to all candidates.
 
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03/05/2026
חברה חסויה
Location: Tel Aviv-Yafo
Job Type: Full Time
Were looking for a talented Hardware Engineer to join our innovative team.
Responsibilities:
Design, develop, and validate hardware boards for advanced radar and chip-based systems, with a strong focus on digital circuitry and power supply design.
Perform hands-on lab work (HO), including board bring-up, debugging, troubleshooting, repair, and continuous improvement of existing hardware.
Define, write, and execute comprehensive test plans and test setups for board-level validation.
Analyze test results, characterize performance, and document findings, including detailed test reports, failure analysis, and corrective actions.
Support schematic design activities and contribute to the development and maintenance of design environments and databases for EDA tools.
Experience with SI/PI simulation tools.
Collaborate closely with lab technicians, engineers, and cross-functional teams to ensure efficient execution of lab activities and project goals.
Take an active role in prioritizing tasks, driving technical decisions, and owning deliverables end-to-end.
Requirements:
B.Sc. in Electrical Engineering or a related field.
Hands-on experience in hardware development and board-level design.
Strong lab experience: debugging, measurements, and use of lab equipment (oscilloscopes, power supplies, etc.).
Experience with digital hardware and power systems (power supplies, regulators, etc.).
Experience writing and executing test plans and analyzing results.
Familiarity with schematic design tools and managing design environments/databases- an advantage.
Ability to work independently, set priorities, and operate in a hands-on, fast-paced environment.
Strong teamwork and communication skills, especially in lab-oriented collaboration.
This position is open to all candidates.
 
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Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
Required Power and Signal Integrity Engineer
About the job
As a Power and Signal Integrity Engineer, you will be responsible for the design and characterization of signal and power integrity of our IC designs. You will design the external electrical interfaces of the device, from their Signal/Power-integrity and electrical usage perspectives.
You'll set up methodologies, perform simulations, silicon characterization and correlations to ensure our IC designs meet systems design budgets and achieve the highest performance. You will work with systems architects, ASIC design, systems engineers, and partner cross-functionally with teams and external vendors/partners.
Responsibilities
Design and optimize power distribution networks (PDN) across chip, package, and board levels. This includes managing power/ground planes, decoupling capacitors, and power gating strategies.
Conduct both pre-layout and post-layout power integrity simulations to analyze power and ground noise (SSN/SSO), voltage drops (IR drop), and electromagnetic interference (EMI).
Implement and verify low-power design methodologies, such as multi-voltage designs and clock gating, using power intent formats like UPF/CPF.
Generate precise electrical models (e.g., S-parameters, SPICE models) for components such as packages, PCBs, and connectors for use in simulations.
Execute lab measurements utilizing test equipment like oscilloscopes, Vector Network Analyzers (VNA), Time Domain Reflectometers (TDR), Spectrum analyzers to validate simulation outcomes and debug signal and power-related issues on silicon prototypes and boards.
Requirements:
Minimum qualifications:
Bachelor's degree in Mechanical, Electrical Engineering, Material Science, or equivalent practical experience.
5 years of experience in signal or power integrity or hardware design.
Preferred qualifications:
Experience with industry-standard Electronic Design Automation (EDA) tools for simulation and layout (e.g., Cadence Sigrity/Allegro, Ansys HFSS/PowerDC/Q3D, Keysight ADS, Synopsys HSPICE).
Proficiency in scripting languages such as Python, Perl, or Tcl for flow automation and data analysis.
Familiarity with high-speed testing equipment like VNAs, TDRs, and oscilloscopes for measurement and validation.
Knowledge of circuit analysis, electromagnetics, and trans
This position is open to all candidates.
 
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Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
Required Staff Analog Design Engineer, Cloud
About the job
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
As a Staff Analog Design Engineer, you will design and integrate analog sub-systems. You will be responsible for ensuring the analog front-end (AFE) communicates with the digital signal processor (DSP), the package and silicon are a single electrical entity. Your work will bridge the analog and digital worlds to enable industry-leading performance.
The ML, Systems, & Cloud AI (MSCA) organization, implements, and manages the hardware, software, machine learning, and systems infrastructure for all our services (Search, YouTube, etc.).
We prioritize security, efficiency, and reliability across everything we do - from developing our latest TPUs to running a global network, while driving towards shaping the future of hyperscale computing. Our global impact spans software and hardware, including our Vertex AI, the leading AI platform for bringing Gemini models to enterprise customers.
Responsibilities
Own the architecture and implementation of a major sub-component, such as the entire receiver AFE or the clocking/phase-locked loop (PLL) distribution network.
Design the critical suspension system (e.g., equalization/continuous-time linear equalizer (CTLE), analog-to-digital converter (ADC) that allows the digital core to function perfectly despite a noisy, high-loss channel.
Lead the definition and design of test chips to prove out novel topologies and circuit techniques in next-generation gate-all-around (GAA) nodes.
Work with DSP, firmware, and system architects to define hardware/software partitioning and interface specifications.
Provide technical guidance and mentorship to engineers on the team.
Requirements:
Minimum qualifications:
Bachelor's degree in Electrical Engineering, Computer Engineering, or a related technical field or equivalent practical experience.
10 years of experience in analog/mixed-signal design.
Preferred qualifications:
Master's or PhD degree in Electrical Engineering, Computer Engineering, or a related technical field.
Experience leading a block or sub-system tape-out for high-speed Inputs/Outputs.
Experience with noise analysis/jitter decomposition/adaptive loops.
Experience with package and printed circuit board (PCB) co-design and their impact on signal integrity.
Experience in system-level modeling and simulation using tools like Matlab or Python.
This position is open to all candidates.
 
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20/05/2026
Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
We are seeking an exceptional an exceptional leader to build and lead our next-generation internal Analog IP design team. This is a unique opportunity to create a world-class analog design center from the ground up, developing the critical IP blocks that power all of our custom silicon products, including Graviton (server CPUs) and Nitro (networking/security accelerators).

Key job responsibilities
Build the team: Recruit, hire, and develop a world-class analog/mixed-signal design team from the ground up. Define the org structure, roles, and growth path.

Define the IP strategy: Own the analog IP roadmap across all Annapurna Labs products. Evaluate build vs. buy decisions and drive internal capability development.

Drive execution: Lead the full design cycle from architecture through silicon validation - spec, schematic, layout, simulation, tapeout, and bring-up.

Collaborate cross-functionally: Partner with SoC architecture, digital design, physical design, DFT, packaging, and system teams to integrate analog IP seamlessly.

Set technical direction: Define design methodologies, flows, and best practices. Evaluate and select EDA tools, PDKs, and foundry processes.

Innovate at scale: Develop IP that is reusable, portable across process nodes, and designed to meet the performance, power, and area (PPA) needs of multiple products simultaneously.

Engage with leadership: Communicate strategy, progress, and risk to senior leadership. Influence the overall silicon roadmap with analog capabilities and constraints.
Requirements:
Basic Qualifications
- B.Sc. in Electrical Engineering.
- 15+ years of hands-on analog/mixed-signal design experience in advanced CMOS nodes (7nm and below).
- 5+ years of proven engineering management experience, including building and scaling teams.
- Deep expertise in one or more: high-speed SerDes/PHY, PLL/DLL, data converters, LDOs/power management, or I/O interfaces.
- Track record of successful tapeouts and silicon bring-up in volume production.
- Experience with design methodologies for IP portability and reuse across multiple process nodes.
- Strong understanding of semiconductor physics, device modeling, and process technology.

Preferred Qualifications
- Experience with die-to-die interfaces (UCIe, HBI) or advanced packaging (2.5D/3D).
- Experience with integrated voltage regulators (IVR) for high-performance compute.
- Experience leading analog IP development in a hyperscaler or large semiconductor company.
- Familiarity with GPIO design for multi-standard (LPDDR, PCIe, CXL) compatibility.
- Background in developing reusable IP platforms with configurable/parameterized architectures.
- Experience in cloud/data center silicon or high-performance computing.
- Strong publication record or patents in analog IC design.
This position is open to all candidates.
 
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חברה חסויה
Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
Required RTL Design Engineer, Cloud
About the job
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
In this role, you will use Application-Specific Integrated Circuit (ASIC) design experience to be part of a team that develops complex ASIC System-on-Chip (SoC) intellectual property from proof-of-concept to production. This includes creating IP Level microarchitecture definitions, Register-Transfer Level (RTL) coding and all RTL quality checks. You will also have the opportunity to contribute to design flow and methodologies, including design generation automation. You will collaborate with members of architecture, software, verification, power, timing, synthesis design for testing etc. You will develop/define design options for performance, power and area.
Responsibilities
Define the IP microarchitecture level design document such as interface protocol, block diagram, transaction flow, pipeline etc.
Perform RTL development (coding and debug in Verilog, SystemVerilog).
Conduct function/performance simulation debug and Lint/CDC/FV/UPF checks.
Engage in synthesis, timing/power closure, and ASIC silicon bring-up.
Contribute to verification test plan and coverage analysis of block and SoC-level.
Requirements:
Minimum qualifications:
Bachelor's degree in Electrical Engineering, Computer Engineering, Computer Science, or a related field, or equivalent practical experience.
4 years of experience with digital logic design principles, Register-Transfer Level (RTL) design concepts, and languages such as Verilog or System Verilog.
Experience in logic design and debug with Design Verification (DV).
Experience with microarchitecture and specifications.
Preferred qualifications:
Experience with logic synthesis techniques to optimize Register-Transfer Level (RTL) code, performance and power as well as low-power design techniques.
Experience with design sign off and quality tools (Lint, CDC, VCLP etc.).
Experience in a scripting language like Python or Perl.
Knowledge of SoC architecture and assertion-based formal verification.
Knowledge of one of these areas, PCIe, UCIe, DDR, AXI, ARM processors family.
Knowledge of high performance and low power design techniques.
This position is open to all candidates.
 
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03/05/2026
חברה חסויה
Location: Tel Aviv-Yafo
Job Type: Full Time
we are looking for a Chip Test Engineer.
The Chip Test Engineer plays a crucial role in designing, developing, and implementing automated test for IC chips and systems for Automotive industry. The Test Engineer is responsible to define and develop tests, design test features, program test scripts, and analyze test results to ensure the quality and functionality of products. The Test Engineer collaborates with cross-functional teams to troubleshoot issues, improve test processes, and support product development efforts.
Responsibilities:
Develop and implement test strategies, plans, and procedures for ATE systems to ensure comprehensive testing of ICs.
Design and develop test features, test programs, and test scripts for automated test environment (ATE) based on product specifications and requirements.
Collaborate with design engineers, product manager, production vendors and manufacturing teams to understand product functionality, performance requirements, and testability considerations.
Conduct feasibility studies and risk assessments to identify potential challenges and develop mitigation strategies for test development and implementation.
Develop test program based on code languages C++ ,Java and Python.
Debug, troubleshoot, and resolve issues with ATE hardware, software, and test scripts to ensure reliable and accurate test results.
Analyze test data and results to identify trends, anomalies, and potential defects, and provide feedback to design and development teams for product improvement.
Develop and maintain documentation for test procedures, specifications, and configurations.
Collaborate with vendors and suppliers to evaluate and select ATE equipment, components, and software tools that meet project requirements and performance standards.
Stay abreast of industry trends, advancements in test technologies, and best practices in automated testing to drive continuous improvement in test processes and methodologies.
Requirements:
Bachelor's degree in electrical engineering, computer engineering, or a related field.
Proven 5+ years of experience in automated test development, preferably in the semiconductor or electronics industry.
Experience in programming languages such as C/C++/JAVA/Python.
knowledge of ATE hardware platforms (e.g., Advantest or Teradyne) and test methodologies (e.g., parametric testing, functional testing).
Familiarity with electronic measurement instruments (e.g., oscilloscopes, multimeters, signal generators) and test techniques for analog and digital circuits. Advantage RF test.
Excellent problem-solving skills and the ability to troubleshoot complex issues with ATE systems and test setups.
Strong communication and interpersonal skills, with the ability to work effectively in cross-functional teams.
Detail-oriented with a focus on quality, accuracy, and efficiency in test development and execution.
Ability to work independently, prioritize tasks, and manage multiple projects simultaneously in a fast-paced environment.
Preferred Qualifications
Experience in Mix-signals, high-speed interfaces testing fields.
Experience with test data analysis tools (e.g JMP, Spotfire, Yield HUB, Silicon Dash).
This position is open to all candidates.
 
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03/05/2026
חברה חסויה
Location: Tel Aviv-Yafo
Job Type: Full Time
Were looking for a Hardware Team Lead to join us.
Responsibilities:
Lead, mentor, and grow a team of hardware engineers, driving execution, ownership, and professional development.
Own end-to-end hardware development, including design, bring-up, debugging, validation, and release.
Drive hardware activities across the full product lifecycle- from concept and development through production and customer deployment.
Provide hands-on technical leadership in the lab, supporting complex debugging, measurements, and system-level problem solving.
Ensure successful transition to production, including resolving manufacturing issues and supporting yield, reliability, and quality improvements.
Collaborate cross-functionally with R&D, Systems, and Operations to deliver robust, scalable, and high-performance hardware solutions.
Interface directly with customers, providing technical leadership, troubleshooting support, and clear communication on hardware-related topics.
Requirements:
B.Sc. in Electrical Engineering (or equivalent). Highly experienced practical engineers (technicians) will also be considered.
Strong hands-on experience in hardware development, including board-level design, bring-up, debugging, and lab measurements.
Proven experience leading projects and/or managing hardware engineers.
Solid experience in hardware validation, system integration, and troubleshooting.
Experience working with production and manufacturing processes, including mechanical and thermal considerations.
Background in RF, automotive, or radar systems- advantage.
Ability to work effectively across multiple teams and stakeholders in a fast-paced environment.
Strong leadership, communication, and interpersonal skills, with a proactive and hands-on mindset.
Preferred Qualifications
Experience in taking products from prototype to mass production.
Familiarity with automotive standards and qualification processes (e.g., AEC-Q).
Experience with high-frequency/RF systems or radar architectures.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
עדכון קורות החיים לפני שליחה
עדכון קורות החיים לפני שליחה
8633924
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