דרושים » חשמל ואלקטרוניקה » Senior Board Design Engineer

we are a global leader in the development and manufacturing of advanced infrared detectors and electro-optical solutions for defense and commercial applications.
We are seeking a skilled board designer with extensive experience in high-speed digital design to join our Board Design R&D Team. In this role, you will define system and hardware requirements, design FPGA-based hardware platforms, and validate high-speed interfaces such as DDR4, USB3, Ethernet, MIPI, and Camera Link. You will work closely with firmware, software, and mechanical engineers to deliver robust, production-ready Embedded systems for advanced electro-optical products.
Key Responsibilities
Define hardware requirements and prepare detailed design documentation for FPGA-based boards, including power architecture, configuration, and peripheral circuitry.
Develop schematics and oversee PCB layout for complex, high-speed multilayer boards.
Perform hardware simulations and signal analysis using tools such as LTspice and Cadence.
Design and validate high-speed interfaces including DDR4, USB3, Ethernet, MIPI, and Camera Link.
Define and manage PCB stack-ups, impedance control, differential pair routing, and high-speed layout constraints.
Conduct Signal Integrity (SI) and Power Integrity (PI) analysis to ensure performance, robustness, and reliability.
Lead prototype bring-up, testing, and debugging using lab equipment (oscilloscopes, logic analyzers, VNAs).
Collaborate with firmware, software, and mechanical teams to ensure full system integration.
Participate in design reviews, DFM/DFT processes, and continuous design improvements.
Support production and NPI activities, and resolve hardware-related manufacturing issues.

we're seeking a visionary Package Design Engineer to help build our local engineering powerhouse from the ground up. This is a unique opportunity to take on meaningful product ownership in a new site, Driving the physical implementation strategy for chips that power the world's largest AI clusters.

As a Package Design Engineer, you will be a core technical contributor in the development of advanced IC packaging solutions for high-performance connectivity silicon. You will execute the package flow, design, and qualification from concept through production, working closely with silicon, signal integrity, power integrity, mechanical, manufacturing, and external OSAT partners. You will be responsible for implementing package technologies that meet aggressive electrical, thermal, mechanical, and cost targets, enabling products to operate reliably in the worlds most demanding AI and cloud environments.

Key Responsibilities


Execute end-to-end IC package design, from early feasibility and detailed design through to qualification and high-volume manufacturing
Implement package architecture and utilize advanced technologies (organic substrates, advanced laminate, interposers, multi-die/chiplet packaging, CoWoS - 2.5D/3D integration)
Drive signal integrity (SI), power integrity (PI), and thermal considerations at the package level for high-speed, high-power devices
Perform package layout, substrate routing, bump/ball maps, stack-ups, materials selection, and apply mechanical constraints
Collaborate closely with silicon design, SerDes, system, SI/PI, and reliability teams to optimize overall product performance
Interface directly with OSATs, substrate vendors, and manufacturing partners to ensure design-for-manufacturability (DFM), yield, and cost targets are met
Conduct package-related risk assessments, failure analysis, and corrective actions during bring-up and production ramp
Support NPI, qualification, and product sustainment activities, including vendor technical reviews

We are looking for a motivated Hardware Engineer to join our Hardware team in Raanana.

You will have the chance to develop your own skills in a flexible and energetic work atmosphere with friendly and experienced colleagues. You will have helpful supervision, opportunity to learn, modern tools and flexible work culture.

If you want to be a part of our growing company that is driven by innovation and is focused on building a future together with our employees, consider applying.

Principle duties and responsibilities:

Design hardware modules, subsystems and systems for synchronization products.

Develop schematics and guide PCB layout (high-speed, mixed-signal, power).

Select and evaluate components (ICs, power devices, oscillators, interfaces).

Design high-speed interfaces (e.g., 10G/25G Ethernet) with signal integrity considerations.

Contribute to hardware design specifications (HDS) and documentation.

Support system-level integration (HW, FPGA, SW).

Define and execute validation and integration test plans.

Debug complex board and system-level issues (mixed-signal, high-speed).

Perform lab bring-up, measurements, and performance characterization.

Support product transfer to manufacturing (NPI).

Collaborate with manufacturing and test teams for production readiness.

Investigate and resolve issues during production and field operation.

Ensure product reliability, quality, and compliance with applicable standards.

Functional Collaboration.

Work closely with FPGA, software, system, SIT/SVT and mechanical teams.

Participate in design reviews and technical discussions.

Interface with suppliers and external partners as required.

Evaluate and introduce new technologies and components.

Drive improvements in performance, power efficiency, and cost.

Contribute to system architecture discussions and design trade-offs.

we're seeking a visionary Expert IC Package Design Lead to help build our local engineering powerhouse from the ground up. This is a unique opportunity to take on meaningful product ownership in a new site, leading the physical implementation strategy for chips that power the world's largest AI clusters.

As an Expert IC Package Design Lead, you will be a core technical contributor in the development of advanced IC packaging solutions for high-performance connectivity silicon.
You will own package flow, architecture, design, and qualification from concept through production, working closely with silicon, signal integrity, power integrity, mechanical, manufacturing, and external OSAT partners.You will be responsible for defining package technologies that meet aggressive electrical, thermal, mechanical, and cost targets, enabling products to operate reliably in the worlds most demanding AI and cloud environments.

Key Responsibilities

Own end-to-end IC package design, from early architecture and feasibility through detailed design, qualification, and high-volume manufacturing
Define package architecture and technology selection (organic substrates, advanced laminate, interposers, multi-die/chiplet packaging, CoWoS - 2.5D/3D integration)
Lead signal integrity (SI), power integrity (PI), and thermal considerations at the package level for high-speed, high-power devices
Drive package layout, substrate routing, bump/ball maps, stack-ups, materials selection, and mechanical constraints
Collaborate closely with silicon design, SerDes, system, SI/PI, and reliability teams to optimize overall product performance
Interface with OSATs, substrate vendors, and manufacturing partners to ensure design-for-manufacturability (DFM), yield, and cost targets
Lead package-related risk assessment, failure analysis, and corrective actions during bring-up and production ramp
Support NPI, qualification, and product sustainment activities, including vendor audits and technical reviews

We are seeking a HW Board Design Engineer.
Meet the Team
Youll collaborate with top industry engineers within the fast-growing Silicon One group worldwide.
You will be part of a team driving our groundbreaking next-generation network devices-Silicon One. Our team operates in a startup-like atmosphere within a stable and leading corporation.
Our design center is unique, hosting all silicon hardware and software development disciplines under one roof. We are revolutionizing the industry and building a new internet for the 5G era, with a unified, programmable silicon architecture that will be the foundation of all our future routing products.
Our devices are designed to be adaptable across service providers and web-scale markets, crafted for both fixed and modular platforms. They deliver high speed without compromising programmability, buffering, power efficiency, scale, or feature flexibility. Silicon One is a transformative technology set to serve our customers and end-users for decades to come.
Your Impact
Spearhead innovative switch system design, guiding the process from concept through to mass production.
Collaborate with cross-functional teams in areas such as board design, mechanics, thermal, PCB layout, production, software/firmware, RTL, and more.
Act as the technical focal point and decision-maker for the project.
Conduct hands-on testing in a lab environment and support production and qualification stages.
Define product specifications, develop electrical schematics, and guide component selection and layout processes.

We are seeking a highly skilled and motivated Electrical Validation (EV) Team and System Testing / ATE Team Leader to join our team. This position is crucial in supporting the design, development, and implementation of Automated Test Equipment (ATE) and production test systems.
The Electrical Validation team Lead manages the electrical validation function across our company hardware platforms. This role owns the validation strategy, methodology, lab infrastructure, and execution across all high-speed and control interfaces. The manager ensures robust electrical performance from early prototypes through production release and drives cross-functional alignment between design, SI, firmware, and manufacturing.
The role involves close collaboration with the HW R&D team, Quality, DevOps, and Contract Manufacturing (CM) teams to ensure the delivery of high-quality, reliable products.
This group is part of the HW R&D group.
Key Responsibilities
Define the electrical validation strategy for our company hardware platforms.
Own validation methodology for: High-speed Ethernet (100M-1600G), PCIe Gen1 to Gen5+, SerDes architectures (NRZ/PAM4), Control and management buses (I2C, SPI, RS-232, MDIO, etc.)
Establish structured validation plans aligned with hardware release milestones.
Build and manage a high-performance validation team.
Define lab architecture, including: Equipment selection (oscilloscopes, BERTs, analyzers), Compliance platforms, Automation frameworks, Signal integrity validation environments
Drive early engagement with board design and SI teams to ensure design-for-validation.
Oversee: Compliance (IEEE, PCI-SIG, OIF), Interoperability testing, Stress and margin testing
Lead root cause analysis of electrical failures and systemic issues.
Support NPI, manufacturing bring-up, and yield improvement.
Develop automation and scalable validation methodologies.
Define validation documentation standards and sign-off criteria.
Collaborate with system architecture and software teams to ensure HW-SW integration robustness.
Manage external labs and certification processes where required.
Drive continuous improvement of validation coverage and efficiency.
Lead the full ATE development lifecycle from requirements definition to execution in production, including GUI design and Python scripting.
Develop and maintain boundary scan applications using JTAG Technologies.
Define and maintain test fixtures, including JIGs/Bed-of-Nails, etc., in collaboration with mechanical vendors.
Implement full test traceability systems for production yield and stability monitoring.
Collaborate with R&D and Quality teams to drive product quality and reliability improvements.
Provide onsite support at CM sites, including station setup, installation, training, maintenance, and debugging.
Perform in-depth failure analysis and troubleshooting at the system and component level.
Utilize and maintain a range of test equipment, including:
Work with various communication protocols: TCP/IP, Telnet, SSH, HTTP, SNMP, SFTP, SCP, FTP, RS232, GPIB, I2C, and NI-VISA.
Support testing of embedded systems running on Linux platforms.

Required Senior Package Layout Engineer
Our Networking unit has continuously reinvented itself over two decades. Our high-speed products are leading in the markets with innovative ways to improve speed and bandwidth from one generation to another. Today, we are increasingly known as the place for getting End-to-End High-Speed Ethernet and InfiniBand Solutions. We're looking to grow our company and build our teams with smart people who can join us at the forefront of technological advancement. Our IC Packaging design team is looking for a Senior IC Packaging Design Engineer to join our package team. and focus on delivering and designing state of the art high-speed Interconnect systems for Supercomputers and Datacenters. This position will collaborate with Technical Package Lead and cooperation with different design teams and development of complex, detailed layout of IC substrates for our products.
What you'll be doing:
As part of a IC Packaging design team, you will collaborate to implement high speed and PDN design for ASIC packages.
Develop symbols, pad stack and perform substrate package routing, placement, stack-up, reference plane, power distribution using Cadence APD (Allegro) or SiP tools.
Optimize package pin out incorporating system level trade-offs of pins assignment.
Develop methodologies to improve layout environment, productivity, reliability, and schedule considerations.
In close co-operation with the SI/PI/HW design teams and product teams
Planning, ensuring stakeholder management and leading projects from start to finish.

We are seeking a HW Board Design Engineer.
Meet the Team
Youll collaborate with top industry engineers within the fast-growing Silicon One group worldwide.
You will be part of a team driving our groundbreaking next-generation network devices-Silicon One. Our team operates in a startup-like atmosphere within a global, leading corporation.
Our design center is unique, hosting all silicon hardware and software development fields under one roof. Our Networking Chips deliver high speed without compromising programmability, buffering, power efficiency, scale, or feature flexibility. They are strategically placed in critical AI infrastructure, powering next-generation network devices and supporting advanced AI workloads. They deliver high speed without compromising programmability, buffering, power efficiency, scale, or feature flexibility.
Your Impact
Spearhead innovative switch system design, guiding the process from concept through to mass production.
Act as the technical decision-maker for the project and collaborate with cross-functional teams in mechanics, thermal, PCB layout, and software/RTL.
Define product specifications, develop electrical schematics, and guide component selection.
Conduct hands-on testing in a lab environment and drive the PCB bring-up, characterization, and debugging stages.

We are looking for a HW Lead Engineer to define, shape, and integrate cutting-edge solutions for the next generation of our cloud platforms.

As a HW Lead Engineer on the Nitro team, you'll own the hardware for Annapurna Labs' Network Interface Cards (NICs) used in compute and storage servers. You'll drive development and validation of Nitro cards from concept through mass production, ensuring they're ready to scale.

You'll lead new hardware interface technologies and bring them to large-scale deployment. This fast-paced role puts you at the intersection of technical innovation and customer experience. You'll collaborate with technical experts, senior leaders, and teams across multiple technology areas.

Key job responsibilities
- Design the Nitro Smart Network Interface Card for CMRI vertical use cases.
- Define Nitro card architecture that meets our server integration requirements.
- Partner with design teams and manufacturing sites to enable healthy mass production.
- Review, identify, and qualify second-source electrical components to ensure supply continuity.
- Debug design, manufacturing, and integration issues.
- Assess process capabilities and innovate to simplify processes, reduce costs, and shorten development cycles.
- Collaborate with cross-functional teams to improve product design, processes, and quality.
- Work with customers to optimize the value stream and create joint processes that reduce time and cost.
- Travel internationally 1-2 times per year for week-long trips.

We are seeking a highly skilled and motivated Electrical Validation (EV) and System Testing Engineer to join our team. This position is crucial in supporting the design, development and full testing.
The Electrical Validation team Lead manages the electrical validation function across our company hardware platforms. This role owns the validation strategy, methodology, lab infrastructure, and execution across all high-speed and control interfaces. The manager ensures robust electrical performance from early prototypes through production release and drives cross-functional alignment between design, SI, firmware, and manufacturing.
The role involves close collaboration with the HW R&D team, Quality, DevOps, and Contract Manufacturing (CM) teams to ensure the delivery of high-quality, reliable products.
This group is part of the HW R&D group.
Key Responsibilities
Define the electrical validation strategy for our company hardware platforms.
Own validation methodology for: High-speed Ethernet (100M-1600G), PCIe Gen1 to Gen5+, SerDes architectures (NRZ/PAM4), Control and management buses (I2C, SPI, RS-232, MDIO, etc.)
Build and manage a high-performance validation team.
Define lab architecture, including: Equipment selection (oscilloscopes, BERTs, analyzers), Compliance platforms, Automation frameworks, Signal integrity validation environments
Drive early engagement with board design and SI teams to ensure design-for-validation.
Oversee: Compliance (IEEE, PCI-SIG, OIF), Interoperability testing, Stress and margin testing
Lead root cause analysis of electrical failures and systemic issues.
Define validation documentation standards and sign-off criteria.
Implement full test traceability systems for production yield and stability monitoring.
Collaborate with R&D and Quality teams to drive product quality and reliability improvements.
Utilize and maintain a range of test equipment, including:
Work with various communication protocols: TCP/IP, Telnet, SSH, HTTP, SNMP, SFTP, SCP, FTP, RS232, GPIB, I2C, and NI-VISA.
Support testing of embedded systems running on Linux platforms.